CN106543440A - Annular oligomeric silsesquioxanes, its modified organic silicon packaging plastic and preparation method thereof - Google Patents

Annular oligomeric silsesquioxanes, its modified organic silicon packaging plastic and preparation method thereof Download PDF

Info

Publication number
CN106543440A
CN106543440A CN201610927462.7A CN201610927462A CN106543440A CN 106543440 A CN106543440 A CN 106543440A CN 201610927462 A CN201610927462 A CN 201610927462A CN 106543440 A CN106543440 A CN 106543440A
Authority
CN
China
Prior art keywords
moss
component
modified organic
packaging plastic
mass ratio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610927462.7A
Other languages
Chinese (zh)
Other versions
CN106543440B (en
Inventor
贺英
刘为成
吴孙奏
戴颖
程念何
雷鹏斗
王均安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Shanghai for Science and Technology
Original Assignee
University of Shanghai for Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Shanghai for Science and Technology filed Critical University of Shanghai for Science and Technology
Priority to CN201610927462.7A priority Critical patent/CN106543440B/en
Publication of CN106543440A publication Critical patent/CN106543440A/en
Application granted granted Critical
Publication of CN106543440B publication Critical patent/CN106543440B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • C09J183/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • C08L2203/206Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Silicon Polymers (AREA)

Abstract

The present invention relates to a kind of annular oligomeric silsesquioxanes, its modified organic silicon packaging plastic and preparation method thereof.The annular oligomeric silsesquioxanes of present invention synthesis(MOSS)(Component A), synthesis terminal hydroxy ethylene polysiloxanes(Component B), then A, B component is according to 1:The mass ratio mixing of (1 ~ 5), recycles chloroplatinic acid catalyst to carry out Si―H addition reaction solidification and prepares LED encapsulation MOSS modified organic silicon packaging plastics.Preparation process is simple of the present invention, synthetic yield are high;The packaging plastic has good heat stability and higher refractive index, and light transmission preferably, can solidify at a lower temperature.The MOSS modified organic silicons packaging plastic of preparation 500 nm wavelength light transmittance more than 90%, refractive index at a temperature of 25 DEG C is 1.535, thermal gravimetric analysis results show that the heat decomposition temperature of the packaging plastic is 416 DEG C, it is 57% in 700 DEG C of residual rates, show preferable heat resistance, the tensile strength and elongation at break of the packaging plastic is respectively 1.88 MPa and 157%, Shore A hardness 36.

Description

Annular oligomeric silsesquioxanes, its modified organic silicon packaging plastic and preparation method thereof
Technical field
The present invention relates to a kind of annular oligomeric silsesquioxanes, its modified organic silicon packaging plastic and preparation method thereof.
Background technology
Light emitting diode (Lighting-Emitting Diode, LED) is because have efficient, environmental protection, life-span length etc. excellent Point, the application prospect in fields such as illumination, display, electronic equipment backlight, and decorations get most of the attention, and LED has become the whole world The trend and trend of change.The fast development of LED technology, luminous efficiency are stepped up.With LED towards high brightness, high-weatherability, The directions such as high uniformity of luminance, high reliability are developed, and it is also proposed higher performance to the macromolecular material for LED encapsulation will Ask.The encapsulating material of great power LED must possess high index of refraction, high transmission rate, preferable heat resistance, sealing property and good Good mechanical property and adhesive property.China encapsulates big country as LED, during the LED component encapsulation in the whole world 80% is all concentrated on State.But China but lags far behind the major countries such as the U.S., Japan, power type LED encapsulation in the research of LED encapsulation material Material market is captured by Japan and U.S.'s product completely so that our product cost is raised, and profit margin is little, more crucial It is that development is seriously restricted.
The LED encapsulation material being widely used at present mainly has epoxy resin and organic siliconresin.Wherein, epoxy resin is present The defect that crosslink density is excessive after solidification, toughness of material is poor, in addition, aging xanthochromia easily occurs in epoxy encapsulation glue asking Topic, causes light transmittance and luminance-reduction, reduction of service life;Although traditional organic siliconresin packaging plastic refractive index and light transmittance It is higher, but it is difficult to the defect for overcoming its mechanical property not enough.And add nanometer particle-modified organo-mineral complexing packaging plastic, though Can so have at a relatively high refractive index, while can also improve the heat-resisting and mechanical performance of packaging plastic, but encapsulating material can be affected The transparency, cause light output efficiency to decline.
The content of the invention
In order to solve problems of the prior art, an object of the present invention is to provide a kind of New Ring-like Type oligomerisation Silsesquioxane (MOSS).
The second object of the present invention is organic silica gel to be modified by annular oligomeric silsesquioxanes (MOSS), system A kind of new MOSS modified organic silicon packaging plastics were obtained, the refractive index of the packaging plastic is up to 1.535, and light transmittance is more than 90%, Heat decomposition temperature is 415 DEG C, and elongation at break is 160%, and solidification temperature is low, packaging plastic and commercially available phase obtained in the present invention Close product and compare and have the advantages that high folding, heat-resisting, preferable mechanical property and solidification temperature are low.
The third object of the present invention is the preparation method for providing the packaging plastic.
For achieving the above object, the present invention adopts following mechanism:
A. the synthetic method of annular oligomeric silsesquioxanes (MOSS):The method referred to as metal inducement is self-assembled into around-France. It is characterized in that the polysiloxanes complexation of the hydrolyzed trialkoxysilanes generation metal ion under transition metal and alkali metal induction Then the complex and a chlorosilane are reacted, are peeled off in complex by the metal of thing --- three-dimensional oligomerisation-polysiloxanes complex Metal ion, finally give MOSS.It is PhSi (OR) first in course of reaction3, NaOH, water, alcohol cohydrolysis have obtained saddle The crystalline complex of shape.The crystalline complex outer layer is phenyl ring-type silicone layer, their negative charge by internal layer copper from Son and sodium ion neutralization, also contain alcohol and water molecule in crystalline complex.Crystal is reacted with chlorosilane, by copper ion and sodium ion Peel off and generate CuCl2And NaCl, while generating MOSS.
B. the synthetic method of terminal hydroxy ethylene polysiloxanes:The synthetic method is characterized in that selection potassium hydroxide as anti- The catalyst answered, from toluene as reaction dissolvent, octamethylcy-clotetrasiloxane D4Enter with methylvinyldimethoxysilane Row open loop condensation reaction, prepares terminal hydroxy ethylene polysiloxanes.
The curing of c.MOSS modified organic silicon packaging plastics:The method is by silicon hydrogen component annular oligomeric silsesquioxanes Si―H addition reaction curing reaction between MOSS and vinyl component terminal hydroxy ethylene polysiloxanes, prepares MOSS modified organic silicons Packaging plastic.
According to above-mentioned reaction mechanism, the present invention is adopted the following technical scheme that:
A kind of annular oligomeric silsesquioxanes, it is characterised in that the structural formula of annular oligomeric silsesquioxanes MOSS is:
A kind of LED encapsulation MOSS modified organic silicon packaging plastics, the packaging plastic is double-component, it is characterised in that described group A is divided to adopt above-mentioned annular oligomeric silsesquioxanes MOSS, component B is terminal hydroxy ethylene polysiloxanes, during use, by component A and component B are according to 1:The mass ratio of (1~5) is sufficiently mixed uniformly, and adds chloroplatinic acid catalyst, and its addition is mixed for reaction The 0.1%~0.3% of compound gross mass, after excluding bubble, solidifies 1~2h at a temperature of 60 DEG C~80 DEG C, or in room temperature 48~72h of lower solidification, can obtain the LED encapsulation MOSS modified organic silicon packaging plastics for solidifying.
The structural formula of above-mentioned component B terminal hydroxy ethylene polysiloxanes is:
Wherein x:Y is 1:1~1:2.
A kind of method for preparing above-mentioned LED encapsulation MOSS modified organic silicon packaging plastics, its levy be the method tool Body step is as follows:
A. sodium hydrate solid is dissolved in the mixed solvent of n-butyl alcohol and deionized water, heating for dissolving, add with Sodium hydroxide mass ratio is 2:1~6:1 trimethoxy-benzene base silane, at 100 DEG C~130 DEG C, is heated to reflux 20~60min; Then will be 1 with sodium hydroxide mass ratio:1~2:1 Copper dichloride dihydrate is dissolved in n-butyl alcohol, by the Copper dichloride dihydrate Butanol solution is added drop-wise in above-mentioned reaction system, after being added dropwise to complete, and continues 30~60min of backflow.After reaction terminates, will be anti- Answer solution filtered while hot, concentrating filter liquor, stand still for crystals, filter, obtain blue colored crystal, obtain ten hexichol basic rings, 12 silanol Copper/sodium complex crystal;
B. by ten hexichol basic ring obtained by step a, 12 silanol copper/sodium complex crystal and pyridine according to mass ratio 1:1~4: 1 is dissolved in normal hexane, and 30~60min of reaction is stirred at room temperature;Then the hexane solution of dimethylchlorosilane is slowly added dropwise, it is described The mass ratio of ten hexichol basic rings, 12 silanol copper/sodium complex crystal and dimethylchlorosilane be 1:1~3:1, it is stirred at room temperature After 20~60min, 1.5~3h of back flow reaction, after reaction terminates, is cooled to room temperature, filters, and is washed with deionized, anhydrous Magnesium sulfate is dried, and removes solvent, obtains colourless viscous liquid and is annular oligomeric silsesquioxanes;
C. by octamethylcy-clotetrasiloxane and methylvinyldimethoxysilane according to 2:1~5:1 mass ratio is dissolved in In toluene, and add the potassium hydroxide of catalytic amount as the catalyst of reaction, stirring 3~6h of lower back flow reaction, add from Sub- water, continues to be heated to reflux 1~3h, after reaction terminates, is cooled to room temperature, and it is 7 that deionized water is washed till pH, then micro- with 0.45 The membrane filtration in metre hole footpath, removes solvent, obtains colorless transparent viscous liquid and is terminal hydroxy ethylene polysiloxanes;
During use, by component A and component B according to 1:The mass ratio of (1~5) is sufficiently mixed uniformly, and adds chloroplatinic acid to urge Agent, its addition for reactant mixture gross mass 0.1%~0.3%, after excluding bubble, at a temperature of 60 DEG C~80 DEG C 1~2h of solidification, or solidify 48~72h at room temperature, the LED encapsulation MOSS modified organic silicons encapsulation for solidifying can be obtained Glue.
The cubic cage and the higher bond energy of siliconoxygen bond of the annular oligomeric silsesquioxanes of the present invention so that ring itself The addition that shape oligomeric silsesquioxanes have excellent heat resistance, annular oligomeric silsesquioxanes causes packaging plastic to have very well Heat stability;At the same time, the phenyl ring with higher Lorentz-Lorenz molar refraction is introduced in annular oligomeric silsesquioxanes so that Annular oligomeric silsesquioxanes modified organic silicon packaging plastic has higher refractive index, 500nm wavelength light transmittance 90% More than, the refractive index at a temperature of 25 DEG C is 1.535, and thermal gravimetric analysis results show that the heat decomposition temperature of the packaging plastic is 416 DEG C, It is 57% in 700 DEG C of residual rates, shows preferable heat resistance, the tensile strength of the packaging plastic and elongation at break difference For 1.88MPa and 157%, Shore A hardness 36.The inventive method preparation process is simple, synthetic yield are high simultaneously.
Specific embodiment
After now be specified in the specific embodiment of the present invention.
Embodiment one:
1) synthesis of ten hexichol basic rings, 12 silanol copper/sodium complex crystal
Appropriate sodium hydrate solid is weighed first, the heating for dissolving in n-butanol solvent and a small amount of deionized water.To It is 2 wherein to add with sodium hydroxide mass ratio:Reaction temperature is increased to 100 DEG C, is heated back by 1 trimethoxy-benzene base silane Stream 60min.Then according to sodium hydroxide mass ratio 1:1 proportioning weighs Copper dichloride dihydrate, and is dissolved in appropriate In n-butyl alcohol, it is slowly added in above-mentioned reaction system.After being added dropwise to complete, continue backflow 30min.After backflow terminates, will be anti- Answer solution sucking filtration while hot.After by filtrate, vacuum distillation goes out the n-butanol solvent of half volume at a temperature of 70 DEG C, it is stored in relatively low At a temperature of stand still for crystals.Finally filter, obtain blue colored crystal, the blue colored crystal is dried to constant weight in 80 DEG C of baking ovens, is obtained To ten hexichol basic rings, 12 silanol copper/sodium complex crystal.
2) synthesis of component A annular oligomeric silsesquioxanes (MOSS)
By 12 silanol copper of obtained ten hexichol basic ring/sodium complex crystal with pyridine according to mass ratio 1:1 is mixed, Appropriate normal hexane is being added thereto to as reaction dissolvent, 30min after mixing, is being stirred at room temperature.Then according to ten diphenyl 12 silanol copper of ring/sodium complex crystal mass compares 1:1 weighs dimethylchlorosilane, and is made in being dissolved in normal hexane molten Liquid, and be slowly added in above-mentioned reaction system, after 30min is stirred at room temperature, temperature is increased to into 70 DEG C of 1.5~3h of backflow. After backflow terminates, room temperature is cooled to, filters, and be washed with deionized three times and remove inorganic ionss therein, add suitable The anhydrous magnesium sulfate of amount is dried, and vacuum distillation after filtration removes solvent, obtains colourless viscous liquid and is annular oligomerisation sesquialter silicon Oxygen alkane MOSS.
3) synthesis of component B terminal hydroxy ethylene polysiloxanes
Octamethylcy-clotetrasiloxane (D is weighed respectively4) and methylvinyldimethoxysilane (VDMMS), according to quality Than 2:1 mixing, and add a small amount of potassium hydroxide as the catalyst of reaction, add appropriate toluene and do reaction dissolvent.Room After warm mix homogeneously, reaction temperature is increased to into 100 DEG C of heated and stirred 4~6h of backflow, appropriate deionized water is added, is continued It is heated to reflux 2h.After reaction terminates, treat that solution is cooled down, it is 7 that deionized water is washed till pH, then with poly- the four of 0.45 micron pore size Fluoride film is filtered, then filtrate decompression distillation is removed after solvent and water, is obtained colorless transparent viscous liquid and is terminal hydroxy group Vinyl polysiloxane.
4) solidification of MOSS modified organic silicons packaging plastic
By component A annular oligomeric silsesquioxanes MOSS and component B terminal hydroxy ethylene polysiloxanes of synthesis according to matter Amount compares 1:4 are sufficiently mixed and stir, and are subsequently adding a small amount of chloroplatinic acid catalyst and are mixed with, and the addition of catalyst is The 0.1%~0.3% of mixture gross mass.Decompression excludes bubble, after excluding bubble, at a temperature of 60~80 DEG C solidification 1~ 2h, or solidify 48~72h at room temperature.The LED encapsulation MOSS modified organic silicon packaging plastics for solidifying can be obtained.
The MOSS modified organic silicons packaging plastic that the present embodiment is prepared is 90% in the light transmittance of visible light wave range, 25 Refractive index at a temperature of DEG C is 1.516, and thermal gravimetric analysis results show that the heat decomposition temperature of the packaging plastic is 408 DEG C, at 700 DEG C Residual rate is 53%, shows preferable heat resistance, and the tensile strength and elongation at break of the packaging plastic are respectively 1.87MPa With 162%, Shore A hardness 32.
Embodiment two:
1) synthesis of ten hexichol basic rings, 12 silanol copper/sodium complex crystal
Appropriate sodium hydrate solid is weighed first, the heating for dissolving in n-butanol solvent and a small amount of deionized water.To It is 4 wherein to add with sodium hydroxide mass ratio:Reaction temperature is increased to 110 DEG C, is heated back by 1 trimethoxy-benzene base silane Stream 40min.Then according to sodium hydroxide mass ratio 3:2 proportioning weighs Copper dichloride dihydrate, and is dissolved in appropriate In n-butyl alcohol, it is slowly added in above-mentioned reaction system.After being added dropwise to complete, continue backflow 40min.After backflow terminates, will be anti- Answer solution sucking filtration while hot.After by filtrate, vacuum distillation goes out the n-butanol solvent of half volume at a temperature of 80 DEG C, it is stored in relatively low At a temperature of stand still for crystals.Finally filter, obtain blue colored crystal, the blue colored crystal is dried to constant weight in 90 DEG C of baking ovens, is obtained To ten hexichol basic rings, 12 silanol copper/sodium complex crystal.
2) synthesis of component A annular oligomeric silsesquioxanes (MOSS)
By 12 silanol copper of obtained ten hexichol basic ring/sodium complex crystal with pyridine according to mass ratio 2:1 is mixed, Appropriate normal hexane is being added thereto to as reaction dissolvent, 40min after mixing, is being stirred at room temperature.Then according to ten diphenyl 12 silanol copper of ring/sodium complex crystal mass compares 2:1 weighs dimethylchlorosilane, and is made in being dissolved in normal hexane molten Liquid, and be slowly added in above-mentioned reaction system, after 40min is stirred at room temperature, temperature is increased to into 80 DEG C of 1.5~3h of backflow. After backflow terminates, room temperature is cooled to, filters, and be washed with deionized three times and remove inorganic ionss therein, add suitable The anhydrous magnesium sulfate of amount is dried, and vacuum distillation after filtration removes solvent, obtains colourless viscous liquid and is annular oligomerisation sesquialter silicon Oxygen alkane MOSS.
3) synthesis of component B terminal hydroxy ethylene polysiloxanes
Octamethylcy-clotetrasiloxane (D4) and methylvinyldimethoxysilane (VDMMS) are weighed respectively, according to quality Than 3:1 mixing, and add a small amount of potassium hydroxide as the catalyst of reaction, add appropriate toluene and do reaction dissolvent.Room After warm mix homogeneously, reaction temperature is increased to into 115 DEG C of heated and stirred 3~5h of backflow, appropriate deionized water is added, is continued It is heated to reflux 2h.After reaction terminates, treat that solution is cooled down, it is 7 that deionized water is washed till pH, then with poly- the four of 0.45 micron pore size Fluoride film is filtered, then filtrate decompression distillation is removed after solvent and water, is obtained colorless transparent viscous liquid and is terminal hydroxy group Vinyl polysiloxane.
4) solidification of MOSS modified organic silicons packaging plastic
By component A annular oligomeric silsesquioxanes MOSS and component B terminal hydroxy ethylene polysiloxanes of synthesis according to matter Amount compares 1:3 are sufficiently mixed and stir, and are subsequently adding a small amount of chloroplatinic acid catalyst and are mixed with, and the addition of catalyst is The 0.1%~0.3% of mixture gross mass.Decompression excludes bubble, after excluding bubble, at a temperature of 60~80 DEG C solidification 1~ 2h, or solidify 48~72h at room temperature.The LED encapsulation MOSS modified organic silicon packaging plastics for solidifying can be obtained.
The MOSS modified organic silicons packaging plastic that the present embodiment is prepared is 90% in the light transmittance of visible light wave range, 25 Refractive index at a temperature of DEG C is 1.527, and thermal gravimetric analysis results show that the heat decomposition temperature of the packaging plastic is 415 DEG C, at 700 DEG C Residual rate is 56%, shows preferable heat resistance, and the tensile strength and elongation at break of the packaging plastic are respectively 1.90MPa With 159%, Shore A hardness 34.
Embodiment three:
1) synthesis of ten hexichol basic rings, 12 silanol copper/sodium complex crystal
Appropriate sodium hydrate solid is weighed first, the heating for dissolving in n-butanol solvent and a small amount of deionized water.To It is 6 wherein to add with sodium hydroxide mass ratio:Reaction temperature is increased to 130 DEG C, is heated back by 1 trimethoxy-benzene base silane Stream 30min.Then according to sodium hydroxide mass ratio 2:1 proportioning weighs Copper dichloride dihydrate, and is dissolved in appropriate In n-butyl alcohol, it is slowly added in above-mentioned reaction system.After being added dropwise to complete, continue backflow 40min.After backflow terminates, will be anti- Answer solution sucking filtration while hot.After by filtrate, vacuum distillation goes out the n-butanol solvent of half volume at a temperature of 80 DEG C, it is stored in relatively low At a temperature of stand still for crystals.Finally filter, obtain blue colored crystal, the blue colored crystal is dried to constant weight in 90 DEG C of baking ovens, is obtained To ten hexichol basic rings, 12 silanol copper/sodium complex crystal.
2) synthesis of component A annular oligomeric silsesquioxanes (MOSS)
By 12 silanol copper of obtained ten hexichol basic ring/sodium complex crystal with pyridine according to mass ratio 3:1 is mixed, Appropriate normal hexane is being added thereto to as reaction dissolvent, 40min after mixing, is being stirred at room temperature.Then according to ten diphenyl 12 silanol copper of ring/sodium complex crystal mass compares 3:1 weighs dimethylchlorosilane, and is made in being dissolved in normal hexane molten Liquid, and be slowly added in above-mentioned reaction system, after 40min is stirred at room temperature, temperature is increased to into 90 DEG C of 1.5~3h of backflow. After backflow terminates, room temperature is cooled to, filters, and be washed with deionized three times and remove inorganic ionss therein, add suitable The anhydrous magnesium sulfate of amount is dried, and vacuum distillation after filtration removes solvent, obtains colourless viscous liquid and is annular oligomerisation sesquialter silicon Oxygen alkane MOSS.
3) synthesis of component B terminal hydroxy ethylene polysiloxanes
Octamethylcy-clotetrasiloxane (D4) and methylvinyldimethoxysilane (VDMMS) are weighed respectively, according to quality Than 5:1 mixing, and add a small amount of potassium hydroxide as the catalyst of reaction, add appropriate toluene and do reaction dissolvent.Room After warm mix homogeneously, reaction temperature is increased to into 130 DEG C of heated and stirred 3~5h of backflow, appropriate deionized water is added, is continued It is heated to reflux 2h.After reaction terminates, treat that solution is cooled down, it is 7 that deionized water is washed till pH, then with poly- the four of 0.45 micron pore size Fluoride film is filtered, then filtrate decompression distillation is removed after solvent and water, is obtained colorless transparent viscous liquid and is terminal hydroxy group Vinyl polysiloxane.
4) solidification of MOSS modified organic silicons packaging plastic
By component A annular oligomeric silsesquioxanes MOSS and component B terminal hydroxy ethylene polysiloxanes of synthesis according to matter Amount compares 1:2 are sufficiently mixed and stir, and are subsequently adding a small amount of chloroplatinic acid catalyst and are mixed with, and the addition of catalyst is The 0.1%~0.3% of mixture gross mass.Decompression excludes bubble, after excluding bubble, at a temperature of 60~80 DEG C solidification 1~ 2h, or solidify 48~72h at room temperature.The LED encapsulation MOSS modified organic silicon packaging plastics for solidifying can be obtained.
The MOSS modified organic silicons packaging plastic that the present embodiment is prepared is 90% in the light transmittance of visible light wave range, 25 Refractive index at a temperature of DEG C is 1.535, and thermal gravimetric analysis results show that the heat decomposition temperature of the packaging plastic is 416 DEG C, at 700 DEG C Residual rate is 57%, shows preferable heat resistance, and the tensile strength and elongation at break of the packaging plastic are respectively 1.88MPa With 157%, Shore A hardness 36.

Claims (4)

1. a kind of annular oligomeric silsesquioxanes, it is characterised in that the structural formula of annular oligomeric silsesquioxanes MOSS is:
2. a kind of LED is encapsulated and is used MOSS modified organic silicon packaging plastics, and the packaging plastic is double-component, it is characterised in that described component A adopts annular oligomeric silsesquioxanes MOSS according to claim 1, and component B is terminal hydroxy ethylene polysiloxanes, is made Used time, by component A and component B according to 1:The mass ratio of (1~5) is sufficiently mixed uniformly, and adds chloroplatinic acid catalyst, its addition 0.1%~0.3% for reactant mixture gross mass is measured, after excluding bubble, solidifies 1~2h at a temperature of 60 DEG C~80 DEG C, Or solidify 48~72h at room temperature, the LED encapsulation MOSS modified organic silicon packaging plastics for solidifying can be obtained.
3. LED according to claim 2 is encapsulated with MOSS modified organic silicon packaging plastics, it is characterised in that described component B The structural formula of terminal hydroxy ethylene polysiloxanes is:
Wherein x:Y is 1:1~1:2.
4. a kind of method of the LED encapsulation MOSS modified organic silicon packaging plastics prepared described in Claims 2 or 3, which is levied and is The method is comprised the following steps that:
A. sodium hydrate solid is dissolved in the mixed solvent of n-butyl alcohol and deionized water, heating for dissolving is added and hydrogen-oxygen It is 2 to change sodium mass ratio:1~6:1 trimethoxy-benzene base silane, at 100 DEG C~130 DEG C, is heated to reflux 20~60min;Then To be 1 with sodium hydroxide mass ratio:1~2:1 Copper dichloride dihydrate is dissolved in n-butyl alcohol, by the positive fourth of the Copper dichloride dihydrate Alcoholic solution is added drop-wise in above-mentioned reaction system, after being added dropwise to complete, and continues 30~60min of backflow.After reaction terminates, will react molten Liquid filtered while hot, concentrating filter liquor, stands still for crystals, filters, and obtains blue colored crystal, obtains ten hexichol basic rings, 12 silanol copper/sodium Complex Crystal;
B. by ten hexichol basic ring obtained by step a, 12 silanol copper/sodium complex crystal and pyridine according to mass ratio 1:1~4:1 is molten In normal hexane, 30~60min of reaction is stirred at room temperature;Then the hexane solution of dimethylchlorosilane is slowly added dropwise, it is described Ten hexichol basic rings, 12 silanol copper/sodium complex crystal is 1 with the mass ratio of dimethylchlorosilane:1~3:1, it is stirred at room temperature 20 After~60min, 1.5~3h of back flow reaction, after reaction terminates, is cooled to room temperature, filters, and is washed with deionized, anhydrous sulfur Sour magnesium is dried, and removes solvent, obtains colourless viscous liquid and is annular oligomeric silsesquioxanes;
C. by octamethylcy-clotetrasiloxane and methylvinyldimethoxysilane according to 2:1~5:1 mass ratio is dissolved in toluene In, and the potassium hydroxide of catalytic amount is added as the catalyst of reaction, the lower 3~6h of back flow reaction of stirring adds deionized water, Continue to be heated to reflux 1~3h, after reaction terminates, be cooled to room temperature, it is 7 that deionized water is washed till pH, then uses 0.45 micron openings The membrane filtration in footpath, removes solvent, obtains colorless transparent viscous liquid and is terminal hydroxy ethylene polysiloxanes;
During use, by component A and component B according to 1:The mass ratio of (1~5) is sufficiently mixed uniformly, and adds chloroplatinic acid catalyst, Its addition for reactant mixture gross mass 0.1%~0.3%, after excluding bubble, solidifies 1 at a temperature of 60 DEG C~80 DEG C ~2h, or solidify 48~72h at room temperature, the LED encapsulation MOSS modified organic silicon packaging plastics for solidifying can be obtained.
CN201610927462.7A 2016-10-31 2016-10-31 Annular oligomeric silsesquioxanes, its modified organic silicon packaging plastic and preparation method thereof Active CN106543440B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610927462.7A CN106543440B (en) 2016-10-31 2016-10-31 Annular oligomeric silsesquioxanes, its modified organic silicon packaging plastic and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610927462.7A CN106543440B (en) 2016-10-31 2016-10-31 Annular oligomeric silsesquioxanes, its modified organic silicon packaging plastic and preparation method thereof

Publications (2)

Publication Number Publication Date
CN106543440A true CN106543440A (en) 2017-03-29
CN106543440B CN106543440B (en) 2019-08-20

Family

ID=58392432

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610927462.7A Active CN106543440B (en) 2016-10-31 2016-10-31 Annular oligomeric silsesquioxanes, its modified organic silicon packaging plastic and preparation method thereof

Country Status (1)

Country Link
CN (1) CN106543440B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110194946A (en) * 2019-05-16 2019-09-03 上海大学 Organic silicon packaging glue and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102634027A (en) * 2012-03-20 2012-08-15 上海交通大学 Preparation method of MOSS (macrocyclic oligomeric silsesquioxanes) containing 12-epoxy group
CN102827477A (en) * 2011-06-16 2012-12-19 日东电工株式会社 Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device
CN104893310A (en) * 2015-06-29 2015-09-09 山东东岳有机硅材料有限公司 Polysilsesquioxane-contained liquid silicone rubber for LED packaging and preparation method of polysilsesquioxane-contained liquid silicone rubber

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102827477A (en) * 2011-06-16 2012-12-19 日东电工株式会社 Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device
CN102634027A (en) * 2012-03-20 2012-08-15 上海交通大学 Preparation method of MOSS (macrocyclic oligomeric silsesquioxanes) containing 12-epoxy group
CN104893310A (en) * 2015-06-29 2015-09-09 山东东岳有机硅材料有限公司 Polysilsesquioxane-contained liquid silicone rubber for LED packaging and preparation method of polysilsesquioxane-contained liquid silicone rubber

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
韩金: "含环形齐聚倍半硅氧烷聚合物的合成及其结构与性能研究", 《中国博士学位论文全文数据库》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110194946A (en) * 2019-05-16 2019-09-03 上海大学 Organic silicon packaging glue and preparation method thereof

Also Published As

Publication number Publication date
CN106543440B (en) 2019-08-20

Similar Documents

Publication Publication Date Title
CN101891893B (en) Preparation method of phenyl-based hydrogen-based silicone resin for encapsulating LED
CN103739848B (en) Additional organosilicon packaging plastic tackifier and its preparation method
CN103122149B (en) Optical package high refractive index High-transparency silicon rubber and its preparation method
CN103131189B (en) Inorganic or organic hybridization nanocomposite for packaging light emitting diode (LED) and preparation method thereof
CN102936414B (en) High refractive power, high-adhesion high-power LED encapsulation organosilicon material and preparation method thereof
CN101608068B (en) Organ silicon material for encapsulating power-type LED and synthetic method thereof
CN103627178B (en) A kind of LED encapsulation liquid silicon rubber composition and preparation method thereof
CN101343365A (en) Preparation method for methyl phenyl vinyl polysiloxane for packaging LED
CN102807676B (en) Phenyl modified epoxy organic silicon resin and preparation method thereof, organic silicon packaging adhesive and LED lamp
CN102532900B (en) Organosilicon lens material for power type light-emitting diode (LED) packaging
CN104974349B (en) A kind of preparation method of silicones
CN102634026B (en) Hydrogen-based silicone resin containing trifunctional group chain element and preparation method thereof
CN101665572B (en) Organic silicon resin for encapsulating LED and preparation method thereof
CN104788488B (en) A kind of preparation method of naphthyl alkoxy silane
CN104892939A (en) Preparation method for phenyl silicon resin
CN102433005B (en) Liquid phenyl silica gel for LED and preparation method thereof
CN103896978B (en) A kind of method for preparing high-purity methyl phenyidimethoxysilane
CN103044918A (en) Organosilicone resin/epoxy resin hybrid materials for packaging light emitting diodes
CN103834178B (en) Organic silicon resin as well as preparation method and application thereof
CN105295387A (en) Preparation method of organic/inorganic composite luminous silica gel with integrated functions of luminescence and encapsulation and application of silica gel on LED light source
CN106543440B (en) Annular oligomeric silsesquioxanes, its modified organic silicon packaging plastic and preparation method thereof
CN103145993A (en) Silicon oil for packaging LED (light-emitting diode) and preparation method thereof
CN104031392A (en) Addition-type silica gel, and preparation method and application thereof
CN100556954C (en) Light emitting diode encapsulates the organic silicon epoxy resin composition with anti-ultraviolet and high temperature ageing
CN109679350A (en) A kind of optical grade silica gel for optical device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant