CN101891893B - Preparation method of phenyl-based hydrogen-based silicone resin for encapsulating LED - Google Patents
Preparation method of phenyl-based hydrogen-based silicone resin for encapsulating LED Download PDFInfo
- Publication number
- CN101891893B CN101891893B CN2010102358126A CN201010235812A CN101891893B CN 101891893 B CN101891893 B CN 101891893B CN 2010102358126 A CN2010102358126 A CN 2010102358126A CN 201010235812 A CN201010235812 A CN 201010235812A CN 101891893 B CN101891893 B CN 101891893B
- Authority
- CN
- China
- Prior art keywords
- hydrogen
- phenyl
- silicone resin
- preparation
- organoalkoxysilane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Silicon Polymers (AREA)
Abstract
The invention relates to a preparation method of phenyl-based hydrogen-based silicone resin for encapsulating LED. The preparation method comprises the following steps of: (A) mixing alkoxy silane, blocking agent, solvent and catalyst, stirring the mixture at the temperature of 40 DEG C to 50 DEG C, dropwise adding water for reaction, and making the mixture continue to react for 1 to 3 hours at the temperature of 50 DEG C; (B) adding hydrogen-based alkyl oxygen-based silicon and/or hydrogen-based siloxane, stirring and dropwise adding acetic acid, and raising the temperature to 50 DEG C to 80 DEG C to carry out condensation polymerization for 1 to 3 hours; and (C) adding solvent and water and stirring for mixing, standing the mixture, separating an organic layer and a water layer, repeatedly washing the separated organic layer until the separated organic layer is neutral, drying decompressing and distilling to remove low molecular weight. In the method, hydrogen chloride and other by-products which are not easy to recover for processing are not produced, silicone resin with any appropriate viscosity and phenyl content can be produced, and the hydrogen content of the silicone resin can be adjusted.
Description
Technical field
The present invention relates to a kind of preparation method of silicone resin, relate in particular to a kind of preparation method who is used as the phenyl-based hydrogen-based silicone resin of photodiode (LED) packaged material.
Background technology
The LED Application Areas is quite extensive now, and electronic product, household appliances, automobile, traffic sign, billboard etc. need pointolite or area source occasion such as, all are the LED application markets.And great power LED as the 4th generation electric light source, have little, the safe low voltage of volume, good characteristics such as the life-span is long, electro-optical efficiency is high, response speed is fast, energy-saving and environmental protection, possessed the title of " green illumination light source " especially.
LED encapsulating structure and complex process directly have influence on use properties and the life-span of LED, and the packaged material of its use is a hot research in recent years always.Silicone resin is used widely in high-power LED encapsulation with its high transmission rate, high refractive index, Heat stability is good, characteristics such as stress is little, water absorbability is low.And silicone resin high temperature resistant (can cross Reflow Soldering), can directly be used for packaging LED chips.Therefore silicone resin is replacing the main packaged material that traditional epoxy resin becomes LED.
Main in the world great power LED device production producer competitively drops into huge fund and research and development strength; Strengthen the research and development of organosilicon encapsulating material; Attempt to utilize advantages such as organosilicon material high-low temperature resistant, ageing-resistant, UV resistant, radiation hardness to solve the technical barrier that the LED encapsulation is faced; Obtained very big progress, existing procucts are put on market at present.Phenyl-based hydrogen-based silicone resin or containing hydrogen silicone oil are as the important composition of this type organosilicon encapsulating material; It prepares majority is the method that adopts organochlorosilane to reset through hydrolytic condensation and multiviscosisty, for example discloses a kind of employing in the document US 20050006794 (A1) and has contained the method that silicon hydride chlorid and alkyl chlorosilane hydrolysis prepare methyl and phenyl hydrogen-containing silicon oil.But this method as raw material, can produce a large amount of hydrochloric acid in the production with chlorosilane, needs recycling, otherwise can cause more serious pollution to environment.One Chinese patent application CN101215381A has reported with ring body open loops such as hydrogeneous ring body, aminomethyl phenyl ring bodies and has prepared containing hydrogen silicone oil, but this type ring body is difficult to obtain, and the containing hydrogen silicone oil viscosity of preparation is low, generally can only be used as linking agent.
Summary of the invention
Above deficiency to prior art; The present invention provides a kind of method for preparing the LED phenyl-based hydrogen-based silicone resin for encapsulating of simple possible; This method does not produce the by product of difficult recyclings such as hydrogenchloride; And can accomplish the silicone resin of any appropriate viscosity and phenyl content, its hydrogen content also can be regulated.
The present invention adopts following technical scheme: a kind of preparation method of LED used for packing material phenyl-based hydrogen-based silicone resin, and said phenyl-based hydrogen-based silicone resin has following general structural formula:
(SiO
2)
A1(PhSiO
3/2)
A2(MeSiO
3/2)
A3(Me
2SiO)
B1(Ph
2SiO)
B2(MePhSiO)
B3(HMeSiO)
C1(HMe
2SiO
1/2)
C2(Me
3SiO
1/2)
D1(Ph
3SiO
1/2)
D2, a1, a2, a3, b1, b2, b3, c1, c2, d1, d2 are more than or equal to 0 and less than 1 number, 0＜a1+a2+a3＜1 in the formula; 0＜c1+c2＜1; 0＜c2+d1+d2＜1,0＜a2+b2+b3+d2＜1, a1+a2+a3+b1+b2+b3+c1+c2+d1+d2=1; Wherein Ph representes phenyl, and Me representes methyl.
Said preparation method comprises following step of carrying out successively:
(A), with organoalkoxysilane, end-capping reagent, solvent and catalyst mix, under 40 ℃～50 ℃ temperature, stir and drip the water reaction, after dripping, continue reaction 1～3 hour down at 50 ℃;
(B), add hydrogen base organoalkoxysilane and/or hydrogen radical siloxane, stir and drip acetate down, after dripping off, being warming up to 50 ℃～80 ℃ carried out the polycondensation polyreaction 1～3 hour;
(C), add solvent and water and mix, leave standstill then and separate organic layer and water layer, with organic layer repeated water washing to the neutral after drying after separating, underpressure distillation removes low molecule again.
As preferably: (A) in the step, said organoalkoxysilane comprises at least and is selected from phenyltrimethoxysila,e, phenyl triethoxysilane, methyltrimethoxy silane, Union carbide A-162, tetraethoxysilane, the tetramethoxy-silicane one or more;
Said end-capping reagent is selected from one or more in SWS-F 221, hexaphenyl sily oxide, triphenyl silanol, the tetramethyl disiloxane;
And has a kind of phenyl that contains in said organoalkoxysilane or the end-capping reagent at least;
(B) in the step, hydrogen base organoalkoxysilane is selected from one or both in methyl hydrogen dimethoxy silane, the methyl hydrogen diethoxy silane; The hydrogen radical siloxane is selected tetramethyl disiloxane for use.
Preferably: (A) in the step, said organoalkoxysilane also comprises and is selected from dimethoxydiphenylsilane, dimethyldimethoxysil,ne, aminomethyl phenyl diethoxy silane, the dimethyldiethoxysilane one or more.
Preferred: (A) in the step, said organoalkoxysilane is selected from one or both in tetraethoxysilane, the tetramethoxy-silicane.
Preferred: (A) in the step, said organoalkoxysilane is selected from one or more in phenyltrimethoxysila,e, phenyl triethoxysilane, methyltrimethoxy silane, the Union carbide A-162.
Preferred: (A) in the step, said organoalkoxysilane be selected from phenyltrimethoxysila,e, the phenyl triethoxysilane one or both and be selected from dimethoxydiphenylsilane, the dimethyldimethoxysil,ne one or both.
Further preferred: the catalyzer in said (A) step is trifluoromethayl sulfonic acid, hydrochloric acid or strong acidic ion resin.
Further preferred: the solvent in said (A) step is toluene, YLENE or hexanaphthene.
Further preferred: the vacuum distillation temperature in said (C) step is 140 ℃～160 ℃.
Preparing method's simple possible of the present invention does not use chlorosilane to make raw material, and adopts organoalkoxysilane and/or siloxanes hydrolytic condensation method, does not produce hydrogenchloride, and is environment friendly and pollution-free; And the phenyl-based hydrogen-based silicone resin refractive index of this method preparation is high; Can accomplish the viscosity and the phenyl content of any appropriate; Hydrogen content also can be regulated; Not only can be used for preparing the linking agent in the LED packaged material, also be applicable to the polymer basis glue in the preparation packaged material, yet can be used for preparing organosilicon materials such as sealer, joint sealant and sizing agent.
Embodiment
Preparing method's of the present invention title product phenyl-based hydrogen-based silicone resin can be represented with following general structural formula:
(SiO
2)
a1(PhSiO
3/2)
a2(MeSiO
3/2)
a3(Me
2SiO)
b1(Ph
2SiO)
b2(MePhSiO)
b3(HMeSiO)
c1(HMe
2SiO
1/2)
c2(Me
3SiO
1/2)
d1(Ph
3SiO
1/2)
d2，
Siloxane unit SiO in the formula
2Represent four sense chain links, PhSiO
3/2, MeSiO
3/2Siloxane unit is represented trifunctional chain link, Me
2SiO, Ph
2SiO, MePhSiO, HMeSiO siloxane unit are represented difunctionality chain link, HMe
2SiO
1/2, Me
3SiO
1/2,Ph
3SiO
1/2Siloxane unit is represented the simple function chain link, the shared mole number of each siloxane unit when whole siloxane units that a1, a2, a3, b1, b2, b3, c1, c2, d1, d2 represent to constitute silicone resin are 1mol.According to different needs; Each sense chain link is selectable; But to comprise the siloxane unit that contains the hydrogen base, the siloxane unit that contains phenyl and simple function chain link at least; And trifunctional chain link or four sense chain links to be arranged at least, that is to say that this silicone resin is a kind of tridimensional network.For example, include only the hydrogen base MQ resin of four sense chain links and simple function chain link, its structural formula is: (SiO
2)
A1(HMe
2SiO
1/2)
C2(Me
3SiO
1/2)
D1(Ph
3SiO
1/2)
D2, 0＜a1＜1,0＜c2＜1,0＜d2＜1 wherein, a1+c2+d1+d2=1; Include only the MT resin of trifunctional chain link and simple function chain link, its structural formula is: (PhSiO
3/2)
A2(MeSiO
3/2)
A3(HMe
2SiO
1/2)
C2(Me
3SiO
1/2)
D1(Ph
3SiO
1/2)
D2, 0＜a2+a3＜1,0＜c2＜1,0＜a2+d2＜1 wherein, a2+a3+c2+d1+d2=1; Comprise the MDT resin of simple function chain link, difunctionality chain link and trifunctional chain link, its structural formula is: (PhSiO
3/2)
A2(MeSiO
3/2)
A3(Me
2SiO)
B1(Ph
2SiO)
B2(MePhSiO)
B3(HMeSiO)
C1(HMe
2SiO
1/2)
C2(Me
3SiO
1/2)
D1(Ph
3SiO
1/2)
D2, 0＜a2+a3＜1,0＜b1+b2+b3+c1＜1,0＜c1+c2＜1,0＜c2+d1+d2＜1,0＜a2+b2+b3+d2＜1 wherein, a1+a2+a3+b1+b2+b3+c1+c2+d1+d2=1; It for example can also be MDQ resin that comprises simple function chain link, difunctionality chain link and four sense chain links or the like.
Preparing method of the present invention comprises following step of carrying out successively:
(A), with organoalkoxysilane, end-capping reagent, solvent and catalyst mix, under 40 ℃～50 ℃ temperature, stir and drip the water reaction, after dripping, continue reaction 1～3 hour down at 50 ℃;
(B), add hydrogen base organoalkoxysilane and/or hydrogen radical siloxane, stir and drip acetate down, after dripping off, being warming up to 50 ℃～80 ℃ carried out the polycondensation polyreaction 1～3 hour;
(C), add solvent and water and mix, leave standstill then and separate organic layer and water layer, with organic layer repeated water washing to the neutral after drying after separating, underpressure distillation removes low molecule again.
Through selecting different raw materials can prepare dissimilar phenyl-based hydrogen-based silicone resins; For example; In (A) step; Organoalkoxysilane comprises and is selected from phenyltrimethoxysila,e, phenyl triethoxysilane, methyltrimethoxy silane, the Union carbide A-162 one or more, and is selected from dimethoxydiphenylsilane, dimethyldimethoxysil,ne, aminomethyl phenyl diethoxy silane, the dimethyldiethoxysilane one or more; End-capping reagent is selected from one or more in SWS-F 221, hexaphenyl sily oxide, triphenyl silanol, the tetramethyl disiloxane; In (B) step, hydrogen base organoalkoxysilane is selected from one or both in methyl hydrogen dimethoxy silane, the methyl hydrogen diethoxy silane; The hydrogen radical siloxane is selected tetramethyl disiloxane for use; Wherein to there be a kind of raw material to contain phenyl at least; It is hydrogen base MDT resin that present method can prepare title product.
Perhaps; In (A) step; Organoalkoxysilane comprises and is selected from tetraethoxysilane, the tetramethoxy-silicane one or both, and is selected from dimethoxydiphenylsilane, dimethyldimethoxysil,ne, aminomethyl phenyl diethoxy silane, the dimethyldiethoxysilane one or more; End-capping reagent is selected from one or more in SWS-F 221, hexaphenyl sily oxide, triphenyl silanol, the tetramethyl disiloxane; In (B) step, hydrogen base organoalkoxysilane is selected from one or both in methyl hydrogen dimethoxy silane, the methyl hydrogen diethoxy silane; The hydrogen radical siloxane is selected tetramethyl disiloxane for use; Wherein to there be a kind of raw material to contain phenyl at least; It is hydrogen base MDQ resin that present method can prepare title product.
Again for example, in (A) step, organoalkoxysilane is selected from one or both in tetraethoxysilane, the tetramethoxy-silicane; End-capping reagent is selected from one or more in SWS-F 221, hexaphenyl sily oxide, triphenyl silanol, the tetramethyl disiloxane; In (B) step, hydrogenation base organoalkoxysilane not, the hydrogen radical siloxane is selected tetramethyl disiloxane for use; Wherein to there be a kind of raw material to contain phenyl at least; It is hydrogen base MQ resin that present method can prepare title product.If this kind situation is added with hydrogen base organoalkoxysilane in (B) step, as be selected from methyl hydrogen dimethoxy silane, the methyl hydrogen diethoxy silane one or both, then also can be prepared into the MDQ resin.
Perhaps, in (A) step, organoalkoxysilane is selected from one or more in phenyltrimethoxysila,e, phenyl triethoxysilane, methyltrimethoxy silane, the Union carbide A-162; End-capping reagent is selected from one or more in SWS-F 221, hexaphenyl sily oxide, triphenyl silanol, the tetramethyl disiloxane; In (B) step, hydrogenation base organoalkoxysilane not, the hydrogen radical siloxane is selected tetramethyl disiloxane for use; Wherein to there be a kind of raw material to contain phenyl at least; It is hydrogen base MT resin that present method can prepare title product.If this kind situation is added with hydrogen base organoalkoxysilane in (B) step, as be selected from methyl hydrogen dimethoxy silane, the methyl hydrogen diethoxy silane one or both, then also can be prepared into the MDT resin.
This preparation method, (A) catalyzer in the step is preferably trifluoromethayl sulfonic acid, hydrochloric acid or strong acidic ion resin, more preferably trifluoromethayl sulfonic acid.Solvent is preferably toluene, YLENE or hexanaphthene, more preferably toluene.(B) preferred polycondensation polymeric reaction temperature is 70 ℃～80 ℃ in the step, and the reaction times is 2 hours.(C) vacuum distillation temperature in the step is 140 ℃～160 ℃, more preferably 150 ℃.
This preparation method as improving viscosity, then can strengthen the content of the siloxane unit of three, four sense chain links, or the content of the siloxane unit of simple function chain link reduces i.e. a1, a2, the increase of a3 sum or C2, d1, the minimizing of d2 sum; As will improve refractive index and then can strengthen the content of the siloxane unit that contains phenyl, promptly a2, b2, b3, d2 sum increase; C1, C2 increase then hydrogen content raising, and C1, C2 reduce then hydrogen content reduction, adjust composition of raw materials thus to obtain the phenyl-based hydrogen-based silicone resin of different viscosity, different phenyl, hydrogen base content.
Provide several specific embodiment of the present invention below, can further be well understood to the present invention through these embodiment.The measuring method of embodiment medium viscosity adopts standard GB/T 2794-1995 " mensuration of tackiness agent viscosity ", and the measuring method of refractive index adopts standard GB/T 614-2006 " chemical reagent index determination universal method ".
Embodiment 1
Accurately weighing toluene 400g, triphenyl silanol 27.6g, dimethyldimethoxysil,ne 12g, phenyltrimethoxysila,e 475.2g and trifluoromethayl sulfonic acid 0.40g add in the 2L four-hole boiling flask, under 40 ℃, drip the water reaction while stirring, and the dropping water yield is 43.2g; After dripping, be heated to 50 ℃ and continue reaction 3 hours, add tetramethyl disiloxane 107.2g then; Stir and dropping acetate 100g, after dripping off, reacted 3 hours down at 50 ℃; Be chilled to room temperature, add toluene and water, thorough mixing is even; Leave standstill then and separate organic layer and water layer, with organic layer repeated water washing to the neutral after drying after separating, underpressure distillation removes low molecules such as solvent again.Get (PhSiO
3/2)
0.57(Me
2SiO)
0.025(Ph
3SiO
1/2)
0.025(HMe
2SiO
1/2)
0.38High phenyl vinyl based hydrogen-based silicone resin 365g, viscosity 7500mPas (25 ℃), refractive index 1.527.
Embodiment 2
Accurately weighing toluene 400g, triphenyl silanol 55.2g, dimethoxydiphenylsilane 24.4g, phenyltrimethoxysila,e 475.2g and trifluoromethayl sulfonic acid 0.40g add in the 2L four-hole boiling flask, under 45 ℃, drip the water reaction while stirring, and the dropping water yield is 43.2g; After dripping, be heated to 50 ℃ and continue reaction 1.5 hours, add tetramethyl disiloxane 107.2g then; Stir and dropping acetate 100g, after dripping off, be warming up to 80 ℃ of reactions 2 hours; Be chilled to room temperature, add toluene and water, thorough mixing is even; Leave standstill then and separate organic layer and water layer, with organic layer repeated water washing to the neutral after drying after separating, underpressure distillation removes low molecule again.Get (PhSiO
3/2)
0.56(Ph
2SiO)
0.02(Ph
3SiO
1/2)
0.05(HMe
2SiO
1/2)
0.37Phenyl-based hydrogen-based silicone resin 376g, viscosity is 9300mPas (25 ℃), refractive index is 1.541.
Embodiment 3
Accurately weighing toluene 400g, SWS-F 221 24.3g, dimethyldimethoxysil,ne 12g, phenyltrimethoxysila,e 475.2g and trifluoromethayl sulfonic acid 0.40g add in the 2L four-hole boiling flask, under 50 ℃, drip the water reaction while stirring, and the dropping water yield is 42.8g; After dripping, reacted 1 hour down, add tetramethyl disiloxane 80.4g then at 50 ℃; Stir and dropping acetate 100g, after dripping off, be warming up to 70 ℃ of reactions 2 hours; Be chilled to room temperature, add toluene and water, mix; Leave standstill then and separate organic layer and water layer, with organic layer repeated water washing to the neutral after drying after separating, underpressure distillation removes low molecule again.Get (PhSiO
3/2)
0.60(Me
2SiO)
0.025(Me
3SiO
1/2)
0.075(HMe
2SiO
1/2)
0.30High phenyl-based hydrogen-based silicone resin 389g, viscosity 18000mPas (25 ℃), refractive index 1.531.
Embodiment 4
Accurately weighing toluene 400g, SWS-F 221 24.3g, dimethyldimethoxysil,ne 48g, phenyltrimethoxysila,e 475.2g and trifluoromethayl sulfonic acid 0.40g add in the 2L four-hole boiling flask, under 42 ℃, drip the water reaction while stirring, and the dropping water yield is 42.8g; After dripping, be heated to 50 ℃ and continue reaction 2 hours, add tetramethyl disiloxane 100.5g then; Stir down and drip acetate 100g, after dripping off, be warming up to 60 ℃ of reactions 2.5 hours; Be chilled to room temperature, add toluene and water, mix; Leave standstill then and separate organic layer and water layer, with organic layer repeated water washing to the neutral after drying after separating, underpressure distillation removes low molecule again.Get (PhSiO
3/2)
0.52(Me
2SiO)
0.09(Me
3SiO
1/2)
0.07(HMe
2SiO
1/2)
0.33Phenyl-based hydrogen-based silicone resin 381g, viscosity 1600mPas (25 ℃), refractive index 1.518.
The above is merely preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of within spirit of the present invention and principle, being done, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the preparation method of a LED used for packing material phenyl-based hydrogen-based silicone resin, said phenyl-based hydrogen-based silicone resin has following general structural formula:
(SiO
2)
A1(PhSiO
3/2)
A2(MeSiO
3/2)
A3(Me
2SiO)
B1(Ph
2SiO)
B2(MePhSiO)
B3(HMeSiO)
C1(HMe
2SiO
1/2)
C2(Me
3SiO
1/2)
D1(Ph
3SiO
1/2)
D2, a1, a2, a3, b1, b2, b3, c1, c2, d1, d2 are more than or equal to 0 and less than 1 number, 0＜a1+a2+a3＜1 in the formula; 0＜c1+c2＜1; 0＜c2+d1+d2＜1,0＜a2+b2+b3+d2＜1, a1+a2+a3+b1+b2+b3+c1+c2+d1+d2=1;
Said preparation method comprises following step of carrying out successively:
(A), with organoalkoxysilane, end-capping reagent, solvent and catalyst mix, under 40 ℃～50 ℃ temperature, stir and drip the water reaction, after dripping, continue reaction 1～3 hour down at 50 ℃;
(B), add hydrogen base organoalkoxysilane and/or hydrogen radical siloxane, stir and drip acetate down, after dripping off, being warming up to 50 ℃～80 ℃ carried out the polycondensation polyreaction 1～3 hour;
(C), add solvent and water and mix, leave standstill then and separate organic layer and water layer, with organic layer repeated water washing to the neutral after drying after separating, underpressure distillation removes low molecule again.
2. the preparation method of LED used for packing material phenyl-based hydrogen-based silicone resin according to claim 1; It is characterized in that: (A) in the step, said organoalkoxysilane comprises at least and is selected from phenyltrimethoxysila,e, phenyl triethoxysilane, methyltrimethoxy silane, Union carbide A-162, tetraethoxysilane, the tetramethoxy-silicane one or more;
Said end-capping reagent is selected from one or more in SWS-F 221, hexaphenyl sily oxide, triphenyl silanol, the tetramethyl disiloxane;
And has a kind of phenyl that contains in said organoalkoxysilane or the end-capping reagent at least;
(B) in the step, hydrogen base organoalkoxysilane is selected from one or both in methyl hydrogen dimethoxy silane, the methyl hydrogen diethoxy silane; The hydrogen radical siloxane is selected tetramethyl disiloxane for use.
3. the preparation method of LED used for packing material phenyl-based hydrogen-based silicone resin according to claim 2; It is characterized in that: (A) in the step, said organoalkoxysilane also comprises and is selected from dimethoxydiphenylsilane, dimethyldimethoxysil,ne, aminomethyl phenyl diethoxy silane, the dimethyldiethoxysilane one or more.
4. the preparation method of LED used for packing material phenyl-based hydrogen-based silicone resin according to claim 2 is characterized in that: (A) in the step, said organoalkoxysilane is selected from one or both in tetraethoxysilane, the tetramethoxy-silicane.
5. the preparation method of LED used for packing material phenyl-based hydrogen-based silicone resin according to claim 2; It is characterized in that: (A) in the step, said organoalkoxysilane is selected from one or more in phenyltrimethoxysila,e, phenyl triethoxysilane, methyltrimethoxy silane, the Union carbide A-162.
6. the preparation method of LED used for packing material phenyl-based hydrogen-based silicone resin according to claim 3; It is characterized in that: (A) in the step, said organoalkoxysilane be selected from phenyltrimethoxysila,e, the phenyl triethoxysilane one or both and be selected from dimethoxydiphenylsilane, the dimethyldimethoxysil,ne one or both.
7. according to the preparation method of each described LED used for packing material phenyl-based hydrogen-based silicone resin of claim 1 to 6, it is characterized in that: the catalyzer in said (A) step is trifluoromethayl sulfonic acid, hydrochloric acid or strong acidic ion resin.
8. according to the preparation method of each described LED used for packing material phenyl-based hydrogen-based silicone resin of claim 1 to 6, it is characterized in that: the solvent in said (A) step is toluene, YLENE or hexanaphthene.
9. according to the preparation method of each described LED used for packing material phenyl-based hydrogen-based silicone resin of claim 1 to 6, it is characterized in that: the vacuum distillation temperature in said (C) step is 140 ℃～160 ℃.
10. the preparation method of LED used for packing material phenyl-based hydrogen-based silicone resin according to claim 9 is characterized in that: the vacuum distillation temperature in said (C) step is 150 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102358126A CN101891893B (en) | 2010-07-23 | 2010-07-23 | Preparation method of phenyl-based hydrogen-based silicone resin for encapsulating LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102358126A CN101891893B (en) | 2010-07-23 | 2010-07-23 | Preparation method of phenyl-based hydrogen-based silicone resin for encapsulating LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101891893A CN101891893A (en) | 2010-11-24 |
| CN101891893B true CN101891893B (en) | 2012-01-04 |
Family
ID=43101261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102358126A Expired - Fee Related CN101891893B (en) | 2010-07-23 | 2010-07-23 | Preparation method of phenyl-based hydrogen-based silicone resin for encapsulating LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101891893B (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102408565B (en) * | 2011-09-09 | 2013-04-24 | 汕头市骏码凯撒有限公司 | Preparation method for phenyl hydrogen-containing silicone oil |
| CN102634026B (en) * | 2012-04-01 | 2014-01-29 | 北京康美特科技有限公司 | Hydrogen-based silicone resin containing trifunctional group chain element and preparation method thereof |
| CN102643627B (en) * | 2012-05-04 | 2013-04-17 | 浙江润禾有机硅新材料有限公司 | Light emitting diode (LED) encapsulation adhesive composition |
| CN102898650B (en) * | 2012-05-11 | 2015-04-22 | 杭州师范大学 | MTQ silicon resin with T-chain unit containing phenyl and preparation method thereof |
| CN102898648B (en) * | 2012-05-11 | 2014-12-17 | 杭州师范大学 | Chemical crosslinking-curable phenyl MDQ-type silicone resin and preparation method thereof |
| CN102875810B (en) * | 2012-09-29 | 2014-07-16 | 中昊晨光化工研究院有限公司 | Phenyl-containing MT type resin and preparation method thereof |
| CN103059301B (en) * | 2012-12-11 | 2015-02-25 | 曹坚林 | Phenyl hydrogenous reticular silicone resin for encapsulating LED (Light Emitting Diode) and preparation method thereof |
| CN103232601B (en) * | 2013-04-28 | 2015-08-05 | 成都硅宝科技股份有限公司 | Phenyl MDT silicon resin and preparation method thereof |
| CN103242531B (en) * | 2013-05-09 | 2015-04-22 | 成都硅宝新材料有限公司 | Preparation method of phenyl hydrogen-containing MT silicone resin |
| CN103232600B (en) * | 2013-05-23 | 2015-01-28 | 汕头市骏码凯撒有限公司 | Method for preparing phenyl silicone resin with high-refractive index |
| CN104277222A (en) * | 2013-07-10 | 2015-01-14 | 成都大蓉新材料有限责任公司 | Phenyl hydrogen-containing silicone resin for LED encapsulation and preparation method of phenyl hydrogen-containing silicone resin |
| CN103755964B (en) * | 2013-12-27 | 2016-03-30 | 深圳市安品有机硅材料有限公司 | Polysiloxane tackifying resin and preparation method thereof |
| CN103865065B (en) * | 2014-03-26 | 2017-01-04 | 苏州桐力光电股份有限公司 | A kind of preparation method of MT resin |
| CN103951827B (en) * | 2014-05-08 | 2016-10-05 | 山东省科学院新材料研究所 | A kind of phenyl-based hydrogen-based MQ silicones and preparation method thereof |
| CN104086771A (en) * | 2014-07-15 | 2014-10-08 | 广东万木新材料科技有限公司 | Preparation method of low-water-absorptivity phenyl hydrogen-containing silicon resin |
| CN104231273B (en) * | 2014-09-16 | 2016-09-14 | 上海应用技术学院 | A kind of high viscosity self-cross linking type LED packaging plastic resin and preparation method thereof |
| CN104263278B (en) * | 2014-09-16 | 2016-12-07 | 上海应用技术学院 | A kind of cross-linking agent used by LED packaging plastic and preparation method thereof |
| CN104448318B (en) * | 2014-11-27 | 2016-02-24 | 深圳市森日有机硅材料有限公司 | A kind of MDQ type phenyl vinyl polysiloxane and preparation method thereof |
| CN104788677B (en) * | 2015-04-16 | 2017-08-25 | 广州惠利电子材料有限公司 | Phenyl-based hydrogen-based silicone resin of T chain links base containing H and preparation method thereof |
| CN105367797A (en) * | 2015-10-26 | 2016-03-02 | 山东东岳有机硅材料有限公司 | Methyl hydrogen-containing silicon resin capable of being used as crosslinking agent for low-refractive-index LED liquid packaging glue and preparation method thereof |
| CN108219479A (en) * | 2017-12-31 | 2018-06-29 | 广州硅碳新材料有限公司 | A kind of organically-modified castor-oil plant oil dispersant of carrier model and preparation method thereof |
| CN110092913A (en) * | 2019-02-01 | 2019-08-06 | 莱芜市雅达电子材料有限公司 | A kind of MQ resin of the base containing Si-H and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2401846C2 (en) * | 2006-04-25 | 2010-10-20 | Учреждение Российской академии наук Институт синтетических полимерных материалов им. Н.С. Ениколопова РАН (ИСПМ РАН) | Functional polyorganosiloxanes and curable composition based on said polyorganosiloxanes |
| JP2008019285A (en) * | 2006-07-10 | 2008-01-31 | Sekisui Chem Co Ltd | Method for producing metal-containing polymer, metal-containing polymer, photosensitive resin composition and semiconductor element |
| KR20100114075A (en) * | 2008-01-15 | 2010-10-22 | 다우 코닝 코포레이션 | Silsesquioxane resins |
| CN101665571B (en) * | 2009-10-18 | 2012-04-11 | 山东宏艺科技股份有限公司 | Polyphenyl methylsiloxane modified epoxy resin and manufacturing method of high performance electronic packaging material thereof |
| CN101712800B (en) * | 2009-11-06 | 2012-10-03 | 陈俊光 | Organic silicon resin encapsulant of large power LED and preparing method thereof |
-
2010
- 2010-07-23 CN CN2010102358126A patent/CN101891893B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101891893A (en) | 2010-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101891893B (en) | Preparation method of phenyl-based hydrogen-based silicone resin for encapsulating LED | |
| CN101215381B (en) | Method for preparing methylphenyl hydrogen-containing silicone oil | |
| CN102391529B (en) | Preparation method of silicone resin type organic/inorganic hybrid material for packaging | |
| CN103122149B (en) | Optical package high refractive index High-transparency silicon rubber and its preparation method | |
| CN104045831B (en) | A kind of siloxanes abutting ladder poly-siloxane and preparation method thereof | |
| CN103012798B (en) | Preparation method of methyl phenyl vinyl silicone resin | |
| CN102181159B (en) | Polysilsesquioxane reinforced light emitting diode (LED) encapsulation organic silicon rubber and preparation method thereof | |
| CN101717584B (en) | Organic silica gel packaging material of large-power LED and preparation method thereof | |
| CN101899159B (en) | Silicone resin for one-component LED packaging materials and preparation method thereof | |
| CN103805128B (en) | A kind of synthetic method of high refractive index LED glue caking agent | |
| CN104892942A (en) | Tackifier for addition-type organic silicon rubber and preparation method thereof | |
| CN102898649B (en) | Refractive index-adjustable MDT silicone resin and preparation method thereof | |
| CN103059306B (en) | High-refractive index transparent silicone resin and preparation method thereof | |
| CN105802532A (en) | Silicon boron tackifier, preparation method thereof and application thereof in double-component LED packaging gel | |
| CN104629057B (en) | A kind of methyl phenyl vinyl borosilicate resin, preparation method and its usage | |
| CN101343365A (en) | Preparation method for methyl phenyl vinyl polysiloxane for packaging LED | |
| CN104449552B (en) | Adhesion type Single-component addition-type silicone rubber adhesive and preparation method thereof | |
| CN104961897B (en) | A kind of preparation method of phenylalkyl silicone oil | |
| CN104877138A (en) | Silicon resin with adhesive properties and preparation method of silicon resin | |
| CN103965481A (en) | Epoxy function group-containing silicone resin preparation method | |
| CN104232015B (en) | The list packaging organic silicon rubber packaging plastic of a kind of high-power type white light LEDs and preparation method | |
| CN103265703A (en) | High refractive index titanium hybrid silicon resin and preparation method thereof | |
| CN109880101A (en) | A kind of LED packaging plastic epoxidation modification phenyl polysiloxane and preparation method thereof | |
| CN101619170A (en) | Preparation and application of silica gel for LED packaging | |
| CN102532900A (en) | Organosilicon lens material for power type light-emitting diode (LED) packaging |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120104 Termination date: 20210723 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |