CN106535026A - Earmuff type headset - Google Patents
Earmuff type headset Download PDFInfo
- Publication number
- CN106535026A CN106535026A CN201611254510.7A CN201611254510A CN106535026A CN 106535026 A CN106535026 A CN 106535026A CN 201611254510 A CN201611254510 A CN 201611254510A CN 106535026 A CN106535026 A CN 106535026A
- Authority
- CN
- China
- Prior art keywords
- ear
- cavity
- front cavity
- muff
- type earphone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
- H04R2201/105—Manufacture of mono- or stereophonic headphone components
Abstract
The present invention relates to the technical field of headsets and provides an earmuff type headset which comprises an earmuff and a headset assembly. The earmuff comprises a front cavity and a back cavity. The front cavity is connected to the back cavity and is flexible. The front cavity has a sound diffusion cavity for the sound diffusion of the headset assembly. The back cavity has an accommodating cavity which communicates with the sound diffusion cavity. The headset assembly is arranged in the accommodating cavity, and the out sound of a headset assembly amplifier is transmitted into a human ear through the sound diffusion cavity. In this way, the arrangement of the headset assembly at the outside of the earmuff is avoided, the overall volume of the earmuff type headset is reduced, at the same time, the front cavity of the earmuff is worn in an ear canal, the characteristic of flexibility of the front cavity is used, the earmuff type headset can be adapted to ear canals of different people, and the versatility of the earmuff type headset is improved.
Description
Technical field
The present invention relates to ear phone technology field, more particularly to a kind of ear-muff type earphone.
Background technology
With the high speed development of ear phone technology, according to earphone wearing mode can be divided into headphone, In-Ear Headphones with
And supra-aural earphone.At present, In-Ear Headphones include headset main body and the ear muff on the outside of headset main body, by ear during use
Owner's body is filled in duct, also, ear muff is close on duct, intercepts external noise.But, existing In-Ear Headphones entirety
Volume is larger, it is impossible to adapt to different crowd, and versatility is low.
The content of the invention
In sum, it is an object of the invention to provide a kind of ear-muff type earphone, it is intended to solve of the prior art pleasant
Formula earphone overall volume is excessive, the problem that versatility is low.
The present invention is achieved in that ear-muff type earphone, including ear muff and headset assembly, and the ear muff includes front cavity
And it is connected to the rear chamber of the front cavity, the front cavity has a flexibility, and the rear chamber has and houses the headphone set
The accommodating cavity of part, with for going out the scattered sound cavity of sound for the headset assembly, the scattered sound cavity is connected the front cavity
In the accommodating cavity, the front cavity being deformed upon with the duct profile of different users and being mutually adapted.
Specifically, the front cavity is hemispherical, and scattered sound mouth is offered in the front cavity, and the front cavity is by hollow
Pipe box is connected to the rear chamber.
Further, also including contractile ring band, the contractile ring band is sheathed on the outside of the hollow bush.
Further, the endless metal belt that can be deformed upon is provided with end of the front cavity away from the rear chamber.
Specifically, the headset assembly includes loudspeaker, horn base, inner cap body and outer cover, and the inner cap body is located at institute
State in back cavity body, the horn base is covered in the inner cap body, and enclose the accommodation space to form the accommodating loudspeaker, it is described
Outer cover is located at the outside of the rear chamber, and is connected to the inner cap body by buckle structure.
Specifically, the buckle structure include it is some located at the outer cover towards the buckle on the side of the inner cap body
And the blocked hole being opened in the inner cap body, the buckle passes through the rear chamber, and is connected in the corresponding clamping
Hole.
Specifically, scattered sound hole structure is offered on the horn base.
Further, also including sponges cover, the sponges cover is covered on the outside of the horn base.
Further, also including supporting pad, the supporting pad is located between the loudspeaker and the outer cover.
Or, scattered sound mouth structure is offered in the outer cover.
Compared with prior art, the ear-muff type earphone that the present invention is provided, including ear muff and headset assembly.Before ear muff includes
Cavity and rear chamber, front cavity are connected to rear chamber, and front cavity has a flexibility, and front cavity is with for going out sound for headset assembly
Scattered sound cavity, rear chamber have accommodating cavity, and accommodating cavity is communicated in scattered sound cavity, also, headset assembly is arranged at accommodating
In cavity, the outer sound of headset assembly power amplifier is then transferred in human ear by dissipating sound cavity.So, it is to avoid headset assembly is located at ear
The outside of set, reduces the overall volume of ear-muff type earphone, meanwhile, the front cavity of ear muff is worn in duct, using front cavity
The characteristics of with flexibility, the duct profile of different crowd is adaptable to, its versatility is improved.
Description of the drawings
Fig. 1 is the profile of ear-muff type earphone provided in an embodiment of the present invention;
Fig. 2 is the enlarged drawing in Fig. 1 at A;
Fig. 3 is another profile of ear-muff type earphone provided in an embodiment of the present invention;
Fig. 4 is the structural representation of ear muff provided in an embodiment of the present invention;
Fig. 5 is the explosive view of headset assembly provided in an embodiment of the present invention.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, it is below in conjunction with drawings and Examples, right
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, and
It is not used in the restriction present invention.
It should be noted that when element is referred to as on " being fixed on " or " being arranged at " another element, it can be direct
On another element or it is connected on another element.When an element is known as " connection " another element, it can
Being to be directly connected to another element or be indirectly connected on another element.
Also, it should be noted that the orientation term such as left and right, upper and lower, top, bottom in the present embodiment, is only relatively general each other
Read or be reference with the normal operating condition of product, and should not be regarded as restrictive.
It is described in detail below in conjunction with realization of the specific embodiment to the present invention.
Fig. 1 to Fig. 5 is refer to, ear-muff type earphone provided in an embodiment of the present invention includes ear muff 1 and headset assembly 2.Ear
Set 1 includes front cavity 11 and is connected to the rear chamber 12 of front cavity 11, and front cavity 11 has flexibility, for example, can adopt silica gel
Support etc. material, rear chamber 12 has the accommodating cavity 121 of accommodating headset assembly 2, front cavity 11 has for for headset assembly 2
Go out the scattered sound cavity 111 of sound, the scattered sound cavity 111 is communicated in accommodating cavity 121, front cavity 11 can be according to the ear of different users
Road profile is deformed upon and is mutually adapted.
Ear-muff type earphone provided in an embodiment of the present invention, including ear muff 1 and headset assembly 2.Ear muff 1 includes front cavity 11
With rear chamber 12, front cavity 11 is connected to rear chamber 12, and front cavity 11 has flexibility, and front cavity 11 has for supplying headset assembly
The 2 scattered sound cavitys 111 for going out sound, rear chamber 12 have accommodating cavity 121, and accommodating cavity 121 is communicated in scattered sound cavity 111, also,
Headset assembly 2 is arranged in accommodating cavity 121, the outer sound of 2 power amplifier of headset assembly is then transferred to human ear by dissipating sound cavity 111
It is interior.So, it is to avoid headset assembly 2 reduces the overall volume of ear-muff type earphone located at the outside of ear muff 1, meanwhile, by ear muff
1 front cavity 11 is worn in duct, the characteristics of have flexible using front cavity 11, is adaptable to the duct of different crowd, improves
Its versatility.
It should be noted that ear muff 1 only front cavity 11 there can be flexibility, also can integrally have flexibility, i.e. rear chamber 12
With flexibility.
Specifically, Fig. 1 and Fig. 2 is refer to, in the present embodiment, front cavity 11 is hemispherical, offers in front cavity 11
Scattered sound mouth 112, the sound that 2 power amplifier of headset assembly goes out are transferred in human ear by dissipating sound mouth 112.Front cavity 11 passes through hollow bush
13 are connected to rear chamber 12, i.e. hollow bush 13 for transition linkage section.Fig. 3 is refer to, here, the another of ear-muff type earphone is also provided
A kind of wearing mode, by front cavity 11 away from rear chamber 12 one end with hollow bush 13 as broken line, turn over towards rear chamber 12
Folding, also, allow scattered sound mouth 112 through rear chamber 12, finally, the madial wall of front cavity 11 outwardly, rear chamber 12 is wrapped, i.e.,
Whole rear chamber 12 now, the front cavity 11 after turnover is worn at duct in front cavity 11, and headset assembly 2 is then by power amplifier
Sound be transferred directly in human ear.
Further, refer to Fig. 1 to Fig. 5, in the present embodiment, in order to prevent headset assembly 2 from scattered sound cavity 111 with
The connectivity part of accommodating cavity 121 is sliding out to rear chamber 12, is arranged with contractile ring band 14, contractile ring in the outside of hollow bush 13
Prevent hollow bush 13 from extending out with 14 effect.
Further, Fig. 1 to Fig. 5 is refer to, in the present embodiment, is set in end of the front cavity 11 away from rear chamber 12
There is the endless metal belt 15 that can be deformed upon, for example, endless metal belt 15 can prick annulus for aluminium, and here, front cavity 11 is away from rear chamber
12 end is that front cavity 11 has the end for dissipating sound mouth 112.Front cavity 11 is changed by the shape of adjustment endless metal belt 15
Scattered sound mouth 112 profile, formed hanger structure, to adapt to different crowds.
Specifically, Fig. 1 to Fig. 5 is refer to, in the present embodiment, headset assembly 2 includes loudspeaker 21, horn base 22, inner cap
Body 23, outer cover 24.The loudspeaker 21 start or cut out the loudspeaker 21 by way of outside directly wiring or Bluetooth transmission.
In rear chamber 12, specifically, inner cap body 23 is sutured in rear chamber 12 inner cap body 23 by heating ultrasonic technique.By loudspeaker
Seat 22 is covered in inner cap body 23, and the lid of loudspeaker 21 encloses to form accommodation space with inner cap body 23, and loudspeaker 21 are installed on the appearance
In being empty.Outer cover 24 is located at the outside of rear chamber 12, and is connected to inner cap body 23 by buckle structure.
Specifically, in the present embodiment, buckle structure include it is some located at outer cover 24 towards on the side of inner cap body 23
Buckle 241 and the blocked hole 231 being opened in inner cap body 23.Buckle 241 is passed through into rear chamber 12, and is connected in corresponding
In blocked hole 231.Preferably, Fig. 5 is refer to, in the present embodiment, outer cover 24 is rounded, and inner cap body 23 is also rounded,
Outer cover 24 is provided with three buckles 241, point centered on the center of circle of 241 outer cover 24 of each buckle, equally circumferential array, together
Sample ground, is provided with three blocked holes 231 in 23 corresponding position of inner cap body.Certainly, also blocked hole can be opened up in outer cover 24
231, buckle 241 is set in inner cap body 23, similarly outer cover 24 and inner cap body 23 can be linked together.
Further, 1 and Fig. 5 is refer to, in the present embodiment, scattered sound hole structure 221, loudspeaker is offered on horn base 22
21 sound is transferred in the scattered sound cavity 111 of front cavity 11 by the scattered sound hole structure 221.Preferably, in the present embodiment
In, it is multiple manholes being arranged in array to dissipate sound hole structure 221.
Further, Fig. 1 and Fig. 5 is refer to, in the present embodiment, in order to increase the low frequency audio of loudspeaker 21, in loudspeaker
The outside of seat 22 is provided with a sponges cover 25, using sponges cover 25 by scattered sound hole structure 221, to obtain low frequency audio effect.
Further, Fig. 1 and Fig. 5 is refer to, in the present embodiment, also including supporting pad 26, the supporting pad 26 is located at loudspeaker
Between 21 and outer cover 24, for filling unnecessary space, prevent loudspeaker 21 from sliding in the accommodation space.
Or, do not show in figure, in the present embodiment, also provide alternative wearing mode, when opening up in outer cover 24
During scattered sound mouth structure (not shown), placing direction of the loudspeaker 21 in accommodation space is adjusted so that by dissipating in outer cover 24
Sound mouth structure goes out sound, now, rear chamber 12 is worn in duct, and the outside of front cavity 11 is then blocked at duct hole.
Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all essences in the present invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (10)
1. ear-muff type earphone, it is characterised in that including ear muff and headset assembly, the ear muff includes front cavity and is connected to
The rear chamber of the front cavity, the front cavity have flexibility, and the rear chamber has the accommodating sky for housing the headset assembly
Chamber, with for going out the scattered sound cavity of sound for the headset assembly, the scattered sound cavity is communicated in described accommodating the front cavity
Cavity, the front cavity being deformed upon with the duct profile of different users and being mutually adapted.
2. ear-muff type earphone as claimed in claim 1, it is characterised in that the front cavity is hemispherical, in the front cavity
Scattered sound mouth is offered, the front cavity is connected to the rear chamber by hollow bush.
3. ear-muff type earphone as claimed in claim 2, it is characterised in that also including contractile ring band, the contractile ring band is arranged
In the outside of the hollow bush.
4. ear-muff type earphone as claimed in claim 2, it is characterised in that in end of the front cavity away from the rear chamber
It is provided with the endless metal belt that can be deformed upon.
5. the ear-muff type earphone as described in any one of Claims 1-4, it is characterised in that the headset assembly includes loudspeaker, loudspeaker
Seat, inner cap body and outer cover, in the back cavity body, the horn base is covered on the inner cap body to the inner cap body
On, and the accommodation space to form the accommodating loudspeaker is enclosed, the outer cover is located at the outside of the rear chamber, and passes through buckle
Structure is connected to the inner cap body.
6. ear-muff type earphone as claimed in claim 5, it is characterised in that the buckle structure includes some located at the enclosing cover
Body passes through described towards the buckle and the blocked hole being opened in the inner cap body on the side of the inner cap body, the buckle
Rear chamber, and it is connected in the corresponding blocked hole.
7. ear-muff type earphone as claimed in claim 5, it is characterised in that scattered sound hole structure is offered on the horn base.
8. ear-muff type earphone as claimed in claim 7, it is characterised in that also including sponges cover, the sponges cover is covered on institute
State the outside of horn base.
9. ear-muff type earphone as claimed in claim 5, it is characterised in that also including supporting pad, the supporting pad is located at described
Between loudspeaker and the outer cover.
10. ear-muff type earphone as claimed in claim 5, it is characterised in that scattered sound mouth structure is offered in the outer cover.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611254510.7A CN106535026B (en) | 2016-12-30 | 2016-12-30 | Earmuff type earphone |
PCT/CN2017/078134 WO2018120467A1 (en) | 2016-12-30 | 2017-03-24 | Earmuff-type headphone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611254510.7A CN106535026B (en) | 2016-12-30 | 2016-12-30 | Earmuff type earphone |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106535026A true CN106535026A (en) | 2017-03-22 |
CN106535026B CN106535026B (en) | 2020-06-05 |
Family
ID=58335908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611254510.7A Active CN106535026B (en) | 2016-12-30 | 2016-12-30 | Earmuff type earphone |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN106535026B (en) |
WO (1) | WO2018120467A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018120467A1 (en) * | 2016-12-30 | 2018-07-05 | 深圳市冠旭电子股份有限公司 | Earmuff-type headphone |
CN108646414A (en) * | 2018-05-15 | 2018-10-12 | 歌尔股份有限公司 | A kind of virtual reality or augmented reality equipment |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2688009Y (en) * | 2004-03-16 | 2005-03-23 | 拍档科技股份有限公司 | Size-adjustable earphone |
CN201674629U (en) * | 2010-05-20 | 2010-12-15 | 聂浩 | In-ear headphone |
CN103747386A (en) * | 2013-12-31 | 2014-04-23 | 赖俊波 | Earplug type half in-ear closed earphone |
CN204090093U (en) * | 2014-08-29 | 2015-01-07 | 颜卓泳 | A kind of In-Ear elastic soft earphone |
US20150312672A1 (en) * | 2014-04-24 | 2015-10-29 | Earskinz, Llc | Flexible Earphone Cover |
CN206332815U (en) * | 2016-12-30 | 2017-07-14 | 深圳市冠旭电子股份有限公司 | Ear-muff type earphone |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106535026B (en) * | 2016-12-30 | 2020-06-05 | 深圳市冠旭电子股份有限公司 | Earmuff type earphone |
-
2016
- 2016-12-30 CN CN201611254510.7A patent/CN106535026B/en active Active
-
2017
- 2017-03-24 WO PCT/CN2017/078134 patent/WO2018120467A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2688009Y (en) * | 2004-03-16 | 2005-03-23 | 拍档科技股份有限公司 | Size-adjustable earphone |
CN201674629U (en) * | 2010-05-20 | 2010-12-15 | 聂浩 | In-ear headphone |
CN103747386A (en) * | 2013-12-31 | 2014-04-23 | 赖俊波 | Earplug type half in-ear closed earphone |
US20150312672A1 (en) * | 2014-04-24 | 2015-10-29 | Earskinz, Llc | Flexible Earphone Cover |
CN204090093U (en) * | 2014-08-29 | 2015-01-07 | 颜卓泳 | A kind of In-Ear elastic soft earphone |
CN206332815U (en) * | 2016-12-30 | 2017-07-14 | 深圳市冠旭电子股份有限公司 | Ear-muff type earphone |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018120467A1 (en) * | 2016-12-30 | 2018-07-05 | 深圳市冠旭电子股份有限公司 | Earmuff-type headphone |
CN108646414A (en) * | 2018-05-15 | 2018-10-12 | 歌尔股份有限公司 | A kind of virtual reality or augmented reality equipment |
CN108646414B (en) * | 2018-05-15 | 2021-07-30 | 歌尔光学科技有限公司 | Virtual reality or augmented reality equipment |
Also Published As
Publication number | Publication date |
---|---|
CN106535026B (en) | 2020-06-05 |
WO2018120467A1 (en) | 2018-07-05 |
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