CN106531874A - Novel heat dissipation insulating composite material and preparation method therefor - Google Patents
Novel heat dissipation insulating composite material and preparation method therefor Download PDFInfo
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- CN106531874A CN106531874A CN201611076787.5A CN201611076787A CN106531874A CN 106531874 A CN106531874 A CN 106531874A CN 201611076787 A CN201611076787 A CN 201611076787A CN 106531874 A CN106531874 A CN 106531874A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Abstract
The invention belongs to the technical field of a functional material, and relates to a novel heat dissipation insulating composite material and a preparation method therefor. Specifically, the novel heat dissipation insulating composite material consists of graphite, aluminum and ceramic, and adopts a sandwich structure, wherein a ceramic sheet layer is positioned in the middle, and graphite/aluminum composite sheet layers are positioned on the two sides; and the graphite/aluminum composite sheet layers consist of a graphite sheet layer with pores and aluminum for filling the pores. Integral forming of the graphite, metal aluminum and ceramic is realized by a high-pressure forging method to form the brand new composite material; the composite material has high thermal conduction, high insulativity and enhanced mechanical strength; and raw materials are low in coat, and the preparation method is simple and easy to implement, so that the composite material has high market competitiveness.
Description
Technical field
The invention belongs to technical field of function materials, is related to a kind of heat sinking insulating composite material and preparation method thereof.
Background technology
For the development in the fields such as semiconductor integrated circuit chip, LED illumination, IGBT, heat dissipation problem has perplexed
Industry is for many years.With chip integration more and more higher, how to solve heat dissipation problem becomes increasingly to project.Due to by using empty
Between and chip size constraint, be doomed, to dissipate by adopting that is, after heater produces heat using passive radiating strategy
The preferable material of hot property efficiently and quickly takes away heat, it is ensured that chip normal work within the temperature upper limit that can bear
Make.
For LED illumination industry, just using high-power COB (Chip on Board), used as development trend, radiating is asked at present
Topic thus seem more prominent.Cost for radiating already takes up the proportion of system cost about 20%～30%, therefore seeks
The Cooling Solution of high performance-price ratio is asked to be always the target that insider pursues.LED heat radiation substrate typically requires to lead with height
Hot and insulating properties.At present, in the production of LED illumination light source and light fixture, develop more ripe predominantly conventional metals aluminium
Or the cooling system (heat-radiating substrate+radiator) of ceramic material, both material initial thermal conductivity function admirables.But, metallic aluminium
The moulding process cycle of material is long, and material itself is conductive, is unfavorable for the design of illuminating product, also increases and reach peace
The full design cost for requiring.Although and ceramic material itself insulate, mass production higher than great, molding difficulty is difficult reality
It is existing, use cost is also improved, range of application is limited.Japanese Patent Laid P5335339 discloses the stone of Suzuki et al. invention
Ink-aluminium composite material, although the composite has high-termal conductivity and low thermal expansion characteristics, but itself is conductive, needs additional
Insulant, greatly reduces existing high thermal conductivity, limits its extensive application.
In a word, there are the following problems for existing LED-baseplate heat sink material：
(1) LED core sheet material includes gallium nitride (GaN), aluminium oxide (Al2O3), the material such as sapphire, its thermal coefficient of expansion
For 7ppm/K or so, therefore it is required that the heat-radiating substrate material matched with which is preferably provided with identical thermal coefficient of expansion, and it is traditional
Metal material (such as aluminum, copper etc.) thermal coefficient of expansion be respectively 25ppm/K and 17ppm/K, be far longer than 7ppm/K, temperature liter
Gao Shihui occurs to rupture in junction, causes thermal resistance to increase, and reduces LED life；Although ceramic material is with close thermal expansion
Coefficient (7.2ppm/K), but heat conductivility is not high, and application is still limited；
(2) the heat-radiating substrate material requirements of LED has higher heat conductivity, and traditional metal material is (as heat conductivity is
Copper of the aluminum and heat conductivity of 220W/m K for 390W/m K) although with higher heat conductivility, due to not possessing
Insulating properties, needs are used together with other insulant, can thus substantially reduce its heat conductivity；Although ceramic material has exhausted
Edge, but heat conductivility is not universal high, and for example aluminium oxide ceramics are (with Al2O3For main body) heat conductivity there was only 30W/m K,
Other ceramic materials such as silicon nitride ceramics is (with Si3N4For main body), aluminium nitride ceramics (based on AlN) although etc. heat conductivity
Can make moderate progress, but still be not sufficiently stable, and it is relatively costly；
(3) the heat-radiating substrate material requirements of LED has an insulating properties, low power LED COB modules (<Can 50W) adopt
Insulating resin (such as FR4) is realizing, and high-power LED COB modules (its insulating properties require resistance to be pressed in more than 1000V) are then needed
Add certain thickness insulating barrier；It is Sanming City of FR4 resins or ceramics that traditional PCB, DBC substrate is exactly two sides copper facing, centre
Structure is controlled, between layers by welding or heat-conducting silicone grease bonding, heat conductivility decreases.
The content of the invention
The heat of chip is mainly radiated with heat exchange pattern by Heat Conduction Material.Conduction of heat is referred to and is directly connect when object
When tactile, the heat transfer form produced by the warm-up movement of the microcosmic particles such as molecule, atom and free electron.Show in Fig. 1
One-dimensional heat transfer model.After thermal balance is reached, conduction of heat follows the Fourier heat transfer law as shown in formula (1)：
Q=K A (T1-T2)/L (1)
In formula：Q is conduction heat (W)；K is heat conductivity (W/m K)；A is heat transfer area (m2)；L is heat conduction length
(m)；(T1-T2) for temperature difference (K).Heat conductivity is bigger, and expression can conduct more heats under identical thermograde.
Thermal resistance R is unit area, the ability of the material of unit thickness prevention heat flowing, its computing formula such as formula (2) institute
Show.
R=(T1-T2)/Q=L/ (K A) (2)
On the other hand, during object is heated the Unsteady Heat Transfer of intensification, there is the following relation as shown in formula (3)：
K=α c ρ (3)
In formula：α is thermal diffusivity (cm2/ s) or thermal diffusion coefficient；ρ is density (g/cm3)；C is specific heat capacity (J/g K).
Thermal diffusivity is the index that material propagates temperature change capabilities size, thus has the title of temperature diffusivity.α is bigger, temperature in materials
The speed of propagation is faster.
From formula (2) and formula (3), for single homogeneous material, the thermal resistance of material is directly proportional to the thickness of material；
For non-homogenous material, general trend is that the thermal resistance of material increases with the increase of material thickness, but is not pure
Linear dependence.On the other hand, in conduction process, thermal resistance is inversely proportional to the thermal diffusivity of material, and the thermal diffusivity of material is bigger,
The thermal resistance of heat dissipation path is less.Therefore, in thermal design, it is desirable to which heat sink material will not only have high thermal conductivity, but also will have
There is high thermal diffusivity, i.e., will not only have the ability for taking away heat, also rapidly heat will be taken away, and latter point is in radiating
During it is more important.
At present, in nature material, only diamond can meet above-mentioned requirements simultaneously, but which is expensive, be difficult plus
Work, it is impossible to promote.Therefore, in real process, the radiating of the device such as chip is substantially by by several different radiating materials
Expect the radiating subassembly constituted (such as metallic aluminium, copper and nonmetal graphite piece) to complete.But, above-mentioned radiating subassembly can bring in addition
One problem, i.e., when several different materials are combined together, as the thermal expansion character of material is different, the change of temperature can make
Radiating subassembly deforms in junction, causes air to enter, and makes thermal resistance become big, eventually affects stability and the longevity of chip
Life.
In consideration of it, a kind of it is an object of the invention to provide heat sinking insulating composite material and preparation method thereof.Pass through
The method of high pressure forging, graphite, metal, ceramics is realized being integrally formed, is formed a kind of with the brand-new of sandwich structure feature
Composite radiating insulant, the material has high-termal conductivity, low heat expansion and insulating properties, solves current radiating well
The defect that material is present, provides leading for high-termal conductivity, high withstand voltage insulating properties and low heat expansion for LED illumination, electronic component
Thermal medium so that the heat that pyrotoxin is produced quickly can be conducted to radiator, reduce thermal resistance.
To achieve these goals, the present invention is adopted the following technical scheme that：
A kind of heat sinking insulating composite material, which is made up of graphite, aluminum and ceramics, and the percentage by weight of wherein aluminum exists
Less than 25%；The heat sinking insulating composite material has sandwich structure, wherein ceramic lamella is located at sandwich structure
Centre, graphite/aluminum compact layer are located at the both sides of sandwich structure；The graphite/aluminum compact layer is by the graphite with hole
Lamella and the aluminum being filled in hole are constituted, and pore filling rate is more than 95%；The graphite flake layer with hole is simultaneously
Meet following requirements：A, density are 1.6～2.0g/cm3；B, average interplanar spacing d002 are in below 0.34nm；C, pore diameter
For 1～3 μm；D, porosity are 5%～25%.
Preferably, in above-mentioned composite, the ceramics used by the ceramic lamella are selected from aluminium oxide (Al2O3) ceramics,
Aluminium nitride (AlN) ceramics, silicon nitride (Si3N4) ceramics in any one.
Preferably, in above-mentioned composite, the ceramic lamella and the graphite/aluminum compact layer have identical chi
It is very little.
A kind of preparation method of heat sinking insulating composite material, which comprises the following steps：
1) graphite is made into blocky graphite prefabricated component, the blocky graphite prefabricated component meets following technical specification simultaneously will
Ask：A, density are 1.6～2.0g/cm3；B, average interplanar spacing d002 are in below 0.34nm；C, pore diameter are 1～3 μm；d、
Porosity is 5%～25%；
2) blocky graphite prefabricated component is cut into into lamellar, and the mode for 1 ceramic lamella being pressed from both sides according to 2 graphite flake layers is arranged
Into sandwich structure, it is placed in casting mold mould after fixing；
3) aluminum is heated to into fusing, 710～860 DEG C is continuously heating to after being completely melt and 5～15 minutes (temperature mistakes are kept
Low that metal filled rate can be caused relatively low, temperature is too high to make graphite that chemical reaction occur with metal, generate the carbon with hygroscopy
Compound), then the aluminum of fusing is poured in the casting mold mould containing sandwich structure, and covers whole sandwich structure；
4) aluminum to covering the fusing of whole sandwich structure pressurizes, and pressurization weight is 1200～1800 tons, pressing time
For 20～40 minutes so that constitute in the hole of the aluminum of fusing immersion graphite flake graphite/aluminum compact layer (due to impressed pressure with
The pore diameter of graphite is inversely proportional to, and the surface tension between solid phase and liquid phase is directly proportional, and impregnating speed and impregnating metal
Viscosity, the relating to parameters such as density, it is therefore desirable to precise control pressure, it is ensured that higher metal filled rate in graphite hole gap), hole
Gap filling rate is more than 95%, and is formed for the two is bonded in one on the surface of graphite/aluminum compact layer and ceramic lamella
The liquid phase surface tension for rising；
5), after pressurization is finished, external pressure is removed, after cooling, the demoulding, composite blank is obtained, is located after routine
Science and engineering sequence obtains heat sinking insulating composite material.
Preferably, in above-mentioned preparation method, step 2) described in fix using metal frame to complete；The metal frame
The preferred chase of body.
Preferably, in above-mentioned preparation method, in step 2) described in it is fixed before, using metallic plate by multiple described three
Mingzhi's structure is isolated, to realize that mass is processed；The preferred iron plate of the metallic plate.
Preferably, in above-mentioned preparation method, step 3) in aluminum be completely melt after be continuously heating to 750 DEG C and kept for 10 points
Clock.
Preferably, in above-mentioned preparation method, step 3) described in heat using following replacement schemes to complete：Direct handle
Aluminum is placed in the casting mold mould containing sandwich structure, and is heated to 860 DEG C (i.e. 660 DEG C+200 DEG C of fusing points of aluminum).The program is kept away
The transfer of the aluminum of fusing is exempted from, has simplified processing step, reduce operational risk.
Preferably, in above-mentioned preparation method, step 4) described in pressurize using High pressure casting machine to complete, weight of pressurizeing
For 1500 tons, pressing time is 30 minutes.
Preferably, in above-mentioned preparation method, step 5) described in conventional postprocessing working procedures include resetting, polish, punching press
With cutting etc. operation.
Compared with prior art, there are following advantages using the present invention of above-mentioned technical proposal：
(1) for deficiencies such as the existing not high, poor insulativities of heat sink material heat conductivity, the side that the present invention is forged by high pressure
Method realizes graphite, metallic aluminium, ceramics and is integrally formed, and forms a kind of brand-new composite with sandwich structure；
(2) although graphite has, heat conductivity is good, wear-resistant, the low excellent physicochemical property of thermal coefficient of expansion, in industry neck
Domain tool has been widely used, but which belongs to typical porous media, there is substantial amounts of micro-pore, it is necessary to pass through in microstructure
Impregnate the processing procedure of closely knit or Filtration Adsorption, can just become the engineering material of excellent performance, and graphite have it is each to different
Property thermal conduction characteristic, and thermal diffusivity in a thickness direction is relatively low, is unfavorable for the conduction of heat, therefore the present invention by stone
Metallic aluminium is immersed in ink, more than 95% graphite hole gap filling rate is realized, is defined with high thermal conductivity (425W/m K)
Graphite-based metal aluminium composite material；
(3) graphite-based metal aluminium composite material is mutually bondd by liquid phase surface tension with ceramic material, is defined and was both had
There is the high-termal conductivity sandwich structure composite with high-insulativity again；
(4) as the intermediate layer of sandwich structure composite is ceramic material, its mechanical strength is greatly enhanced；
(5) for preparing raw material (such as graphite, metallic aluminium etc.) the cheap, low cost of the composite of the present invention,
Preparation method adopts traditional high pressure forging method, and simple, equipment requirements are low, the great market competitiveness.
Description of the drawings
Fig. 1 is One-dimensional heat transfer model schematic.
Fig. 2 is the structural representation of the radiating insulating composite with sandwich structure of the present invention, wherein 1 represents stone
Ink/aluminum compact layer, 2 represent ceramic lamella.
Fig. 3 is the micro-structure diagram of graphite/aluminum compact layer in radiating insulating composite of the invention.
Fig. 4 is the preparation technology flow chart of the radiating insulating composite of the present invention.
Fig. 5 is structural representation of the graphite flake/potsherd sandwich structure Jing after metal frame fixation, wherein 1 represents stone
Ink/aluminum compact layer, 2 represent ceramic lamella, and 3 represent metal partion (metp), and 4 represent metal frame.
Specific embodiment
Illustrate technical scheme below in conjunction with the drawings and specific embodiments, the following example be merely intended to into
One step explains the present invention, and is not limiting as protection scope of the present invention.In addition, unless otherwise stated, made in the following example
Instrument, reagent, material etc. can pass through conventional commercial means and obtain.
Embodiment：The preparation and performance test of heat sinking insulating composite material.
Pretreatment is carried out using conventional method to the electrographite bought on market, and be cut into 300mm × 240mm ×
(density is 1.8g/cm to the blocky graphite prefabricated component of 140mm3；Average interplanar spacing d002 is 0.32nm；Pore diameter is 2 μm；
15%) porosity is.
Above-mentioned blocky graphite prefabricated component is cut into into 240mm (length) × 140mm (width) × 1.5mm (thickness) along 300mm directions
Graphite flake (200), the commercially alumina ceramic plate of 240mm (length) × 140mm (width) × 0.38mm (thickness)
(100), and the mode for pressing from both sides 1 layer of alumina ceramic plate according to 2 layers of graphite flake is arranged in sandwich structure, using iron plate (thickness
For 0.2mm) multiple sandwich structures to be isolated, after entirety metal frame is fixed, (as shown in Figure 5) is positioned over casting mold
In mould.
Metallic aluminium is placed in crucible furnace and is heated to fusing (fusing point of aluminum is 660 DEG C), be continuously heating to after being completely melt
750 DEG C and kept for 10 minutes, the aluminum of fusing is poured into into casting mold mould then, and covers whole fixed structure.
1500 tons of heavy pressure are applied to the aluminum of the fusing of the whole fixed structure of above-mentioned covering using High pressure casting machine, is continued
Pressurization 30 minutes so that molten metal aluminum constitutes graphite/aluminum composite sheet in being dipped into the hole of graphite flake, and multiple in graphite/aluminum
The surface that piece is closed with potsherd forms liquid phase surface tension, so that graphite/aluminum composite sheet is bonded together with potsherd.
After pressurization is finished, external pressure is removed, the demoulding after being cooled to 200 DEG C, after cutting away surrounding aluminium ingot and extracting isolation plate out, is obtained
To both sides be graphite/aluminum composite sheet, centre be potsherd composite blank, Jing resets, polishing, punching press, cutting etc. add
Work operation, obtains final heat sinking insulating composite material.
Following performance test and evaluation are carried out to gained composite：
(1) pore filling rate and distribution situation test：Using scanning electron microscope (more than 500X) in composite
The pore filling rate of metallic aluminium and distribution situation carry out O＆A, as a result show filling rate of the metallic aluminium in graphite hole gap
For 96%, metallic aluminium accounts for the 20% of composite gross weight, and presents equally distributed state.
(2) compare Thermal test：Tested in helium gas jet using DSC methods, as a result shown that the specific heat capacity of composite is
395J/kg·K。
(3) density measurement：Using electronic analytical balance, measured using Archimedes method at room temperature, as a result shown
The density of composite is 2.7g/cm3。
(4) strength test：Strength test is carried out to print using multiple-purpose tester AG-500, composite is as a result shown
Intensity is 85MPa.
(5) thermal diffusivity test：Tested using laser pulse method at room temperature, as a result shown the thermal expansion of composite
Scattered rate is 1.57cm2/ s, higher than copper (1.1cm2/ s) and aluminum (0.9cm2/s).The thickness of the graphite on composite both sides/aluminum composite sheet
Spend for 1.5mm, heat conductivity is 400W/m K；The thickness of middle potsherd is 0.38mm, and heat conductivity is 30W/m K,
The heat conductivity of the sandwich structure composite after compound is calculated as follows：(1.5+0.38+1.5)×[1/(1.5/400+
0.38/30+1.5/400)]=167.6W/m K.The composite of the present invention is by graphite, metallic aluminium by high pressure casting
And ceramics are integrally formed, without the need for being used together with other materials, its heat conductivity is in more than 100W/m K, although from numerically
Say less than copper (390W/m K) and aluminum (237W/m K), it is however noted that, if copper and aluminum are made heat-radiating substrate
If, to also coordinate other insulant (such as FR4 resins etc.) to be used together, overall heat conductivity then can be in 100W/m K
Below.
(6) coefficient of thermal expansion test：Using thermal analyzer, measured within the temperature range of 300 DEG C by room temperature, as a result
The coefficient of thermal expansion of composite is shown in below 7.1ppm/K, it is close with ceramic (7.2ppm/K), effectively prevent composite
Deform in graphite/junction between aluminum composite sheet and potsherd.
(7) pressure insulating properties test result shows that composite is resistant to the voltage of more than 1000V, presents excellent
Insulating properties.
Claims (9)
1. a kind of heat sinking insulating composite material, which is made up of graphite, aluminum and ceramics, and the wherein percentage by weight of aluminum is 25%
Below；
The heat sinking insulating composite material has sandwich structure, wherein ceramic lamella is located at the centre of sandwich structure,
Graphite/aluminum compact layer is located at the both sides of sandwich structure；
The graphite/aluminum compact layer is made up of the graphite flake layer with hole and the aluminum being filled in hole, pore filling
Rate is more than 95%；
The graphite flake layer with hole meets following requirements simultaneously：A, density are 1.6～2.0g/cm3；Between b, average interplanar
Away from d002 in below 0.34nm；C, pore diameter are 1～3 μm；D, porosity are 5%～25%.
2. heat sinking insulating composite material according to claim 1, it is characterised in that：
The ceramics used by the ceramic lamella are selected from any one in aluminium oxide ceramics, aluminium nitride ceramics, silicon nitride ceramics.
3. heat sinking insulating composite material according to claim 1, it is characterised in that：
The ceramic lamella and the graphite/aluminum compact layer are of the same size.
4. a kind of preparation method of heat sinking insulating composite material according to any one of claim 1 to 3, which includes
The following steps：
1) graphite is made into blocky graphite prefabricated component, the blocky graphite prefabricated component meets following technical requirement simultaneously：a、
Density is 1.6～2.0g/cm3；B, average interplanar spacing d002 are in below 0.34nm；C, pore diameter are 1～3 μm；D, hole
Rate is 5%～25%；
2) by step 1) in the blocky graphite prefabricated component that obtains cut into lamellar, and press from both sides 1 ceramic lamella according to 2 graphite flake layers
Mode be arranged in sandwich structure, it is fixed after be placed in casting mold mould；
3) aluminum is heated to into fusing, 710～860 DEG C is continuously heating to after being completely melt and is kept for 5～15 minutes, then will fusing
Aluminum pour into containing step 2) in the casting mold mould of sandwich structure that obtains, and cover whole sandwich structure；
4) to step 3) in the aluminum pressurization of the fusing of the whole sandwich structure of covering that obtains, pressurization weight is 1200～1800
Ton, pressing time are 20～40 minutes so that constitute graphite/aluminum compact layer, hole in the hole of the aluminum immersion graphite flake of fusing
Gap filling rate is more than 95%, and is formed for the two is bonded in one on the surface of graphite/aluminum compact layer and ceramic lamella
The liquid phase surface tension for rising；
5), after pressurization is finished, external pressure is removed, composite blank is obtained after cooling, the demoulding, by conventional post processing work
Sequence obtains heat sinking insulating composite material.
5. preparation method according to claim 4, it is characterised in that：
Step 2) described in fix using metal frame completing.
6. preparation method according to claim 4, it is characterised in that：
In step 2) described in it is fixed before, using metallic plate will multiple sandwich structures isolation, to realize mass
Process.
7. preparation method according to claim 4, it is characterised in that：
Step 3) described in heat using following replacement schemes to complete：Directly aluminum is placed in containing step 2) in Sanming City for obtaining
Control in the casting mold mould of structure, and be heated to 860 DEG C.
8. preparation method according to claim 4, it is characterised in that：
Step 4) described in pressurize using High pressure casting machine to complete.
9. preparation method according to claim 4, it is characterised in that：
Step 5) described in conventional postprocessing working procedures include resetting, polish, punching press and cutting.
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| CN109808282A (en) * | 2017-11-21 | 2019-05-28 | 中兴通讯股份有限公司 | A kind of graphite aluminum matrix composite and preparation method thereof |
| CN109996423A (en) * | 2017-12-29 | 2019-07-09 | 萨摩亚商奈创国际控股有限公司 | Composite multi-layer graphite flake structure and manufacturing method, radiator structure and electronic device |
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| CN112339359A (en) * | 2020-09-23 | 2021-02-09 | 中国电子科技集团公司第二十九研究所 | Aluminum-graphite aluminum composite material structure for enhancing longitudinal heat conductivity coefficient |
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