CN106531756B - Detector anode assembly - Google Patents
Detector anode assembly Download PDFInfo
- Publication number
- CN106531756B CN106531756B CN201610963911.3A CN201610963911A CN106531756B CN 106531756 B CN106531756 B CN 106531756B CN 201610963911 A CN201610963911 A CN 201610963911A CN 106531756 B CN106531756 B CN 106531756B
- Authority
- CN
- China
- Prior art keywords
- plate
- anode
- signal
- array
- electronics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001514 detection method Methods 0.000 claims abstract description 12
- 238000003491 array Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14641—Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Measurement Of Radiation (AREA)
Abstract
An embodiment of the present invention provides a kind of detector anode assembly, including：First anode plate, first anode plate have the first signal array；Second plate plate, the area of second plate plate is less than first anode plate, and in first anode plate, second plate plate has secondary signal array；First asic chip is connected with first anode plate, when electronics is beaten in first anode plate, the first signal of detection first anode plate generation；Second asic chip is connected with second plate plate, when electronics is beaten in second plate plate, the secondary signal of detection second plate plate generation；Electronics processor is connected with the first asic chip and the second asic chip, and obtaining electronics according to the first signal and the second signal beats position in first anode plate or second plate plate.Detector anode assembly of the embodiment of the present invention using two pieces of different anode plates, realizes the electronic position detection of different accuracy.
Description
Technical field
The present invention relates to a kind of anode assembly more particularly to a kind of detector anode assemblies.
Background technology
At present, the anode plate of existing detector only has one piece, no matter which kind of resolution ratio, thus can only be into a resolution ratio
Image, if necessary to change resolution ratio, can only just use other detectors instead because can not by the anode plate of detector carry out more
It changes.
Therefore, the setting underaction of existing anode assembly.
The content of the invention
The defects of the purpose of the present invention is being directed to the prior art, provides a kind of detector anode assembly, utilizes two pieces of differences
Anode plate, realize different accuracy electronic position detection.
To achieve the above object, an embodiment of the present invention provides a kind of detector anode assembly, the detector anode dresses
Put including：
First anode plate, the first anode plate have the first signal array；
Second plate plate, the area of the second plate plate are less than first anode plate, and positioned at the first anode plate
Interior, the second plate plate has secondary signal array；
First asic chip is connected with the first anode plate, when electronics is beaten in the first anode plate, detects institute
State the first signal of first anode plate generation；
Second asic chip is connected with the second plate plate, when electronics is beaten in the second plate plate, detects institute
State the secondary signal of second plate plate generation；
Electronics processor is connected with first asic chip and the second asic chip, according to first signal
Electronics, which is obtained, with secondary signal beats position in the first anode plate or second plate plate.
Further, first signal array is N M array, and N is the first array line number, and M is the first array columns.
Further, first asic chip is inputted with N+M roads signal.
Further, the secondary signal array is P × Q arrays, and P is the second array line number, and Q is the second array columns.
Further, second asic chip is inputted with P+Q roads signal.
Further, the electronics processor obtains the row of the electronics with specific reference to the first signal and the second signal
Position and column position beat position in the first anode plate or second plate plate so as to obtain the electronics.
Further, the electronics processor includes FPGA, is connected with first asic chip and the second asic chip
It connects.
Detector anode assembly of the embodiment of the present invention using two pieces of different anode plates, realizes the electronics of different accuracy
Position detection.
Description of the drawings
Fig. 1 is the schematic diagram of detector anode assembly provided in an embodiment of the present invention；
Fig. 2A is one of electronic array schematic diagram of detector anode assembly provided in an embodiment of the present invention；
Fig. 2 B are the two of the electronic array schematic diagram of detector anode assembly provided in an embodiment of the present invention；
Fig. 2 C are the three of the electronic array schematic diagram of detector anode assembly provided in an embodiment of the present invention.
Specific embodiment
Below by drawings and examples, technical scheme is described in further detail.
Fig. 1 is the schematic diagram of detector anode assembly provided in an embodiment of the present invention, as shown in the figure, the embodiment of the present invention
Detector anode assembly includes：First anode plate 11, second plate plate 12, the first application-specific integrated circuit (Application
Specific Integrated Circuits, ASIC) chip 21, the second asic chip 22 and electronics processor 3.
First anode plate 11 has the first signal array.The area of second plate plate 12 is less than first anode plate 11, and
In first anode plate 11, second plate plate 12 has secondary signal array.
First asic chip 21 is connected with first anode plate 11, when electronics is beaten in the first anode plate 11, detection
The first signal that first anode plate 11 generates；Second asic chip 22 is connected with second plate plate 12, when electronics is beaten second
During anode plate 12, the secondary signal of 12 generation of detection second plate plate.
Electronics processor 3 is connected with the first asic chip 21 and the second asic chip 22, according to the first signal and
Binary signal obtains electronics and beats position in first anode plate 11 or second plate plate 12.
Specifically, the first array of first anode plate 11 is N M array, N is the first array line number, and M is the first array column
Number.Optionally, M and N is 64.Because the first asic chip 21 needs detection, electronics is beaten in the position of the first array, the
One asic chip 21 is exported with N+M roads, that is, 64+64 roads signal output needs the first asic chip 21 to handle.
Similarly, the second array of second plate plate 12 is P × Q arrays, and P is the second array line number, and Q arranges for the second array
Number.Optionally, P and Q is 64.Because the second asic chip 22 needs detection, electronics is beaten in the position of the second array, the
Two asic chips 22 are exported with P+Q roads, that is, 64+64 roads signal output needs the second asic chip 22 to handle.
Electronics processor 3 obtains the row position and column position of electronics with specific reference to the first signal and the second signal, so as to
It obtains electronics and beats position in the first anode plate or second plate plate.
Fig. 2A and Fig. 2 B are respectively the electronic array schematic diagram of detector anode assembly provided in an embodiment of the present invention, are such as schemed
It is shown, for example, electronics is beaten on array (4,4), then the 4 of array line number Y and the 4 of columns X can all generate signal, pass through X4, Y4
The first signal generated determines that electronics is beaten on pad (4,4), it follows that electronics is beaten on first anode plate 21.
Fig. 2 C are the three of the electronic array schematic diagram of detector anode assembly provided in an embodiment of the present invention.For example, electronics
Beat on array (6,6), then the 6 of array line number Y and the 6 of columns X can all generate signal, pass through X6, Y6 generate secondary signal
Determine that electronics is beaten on pad (6,6), it follows that electronics is beaten on second plate plate 22.
Optionally, electronics processor 3 includes field programmable gate array (Field-Programmable Gate
Array, FPGA), it is connected with the first asic chip and the second asic chip.The area of first anode plate 11 is more than second plate
Plate 12, optional first anode board size are (200X200) mm, and the size of second plate plate is (43.3X43.3) mm, and first is positive
The number of arrays of pole plate is identical with the number of arrays of second plate plate, is 64X64=128 roads, second plate plate 12 in unit area
Pixel be 11 pixel of first anode plate 4.6 times of 200/43.3 ≈, when an equal amount of hot spot is respectively radiated to first
When anode plate 11 and second plate plate 12, hot spot covered pixel of institute on second plate plate 12 is about hot spot in the first sun
Pole plate can cover 4.6 times of pixel, and the precision of second plate plate 32 is 4.6 times of first anode plate precision, so as to reach
The purpose of same detector different accuracy electronic position detection is arrived.
Professional should further appreciate that, be described with reference to the embodiments described herein each exemplary
Unit and algorithm steps can be realized with the combination of electronic hardware, computer software or the two, hard in order to clearly demonstrate
The interchangeability of part and software generally describes each exemplary composition and step according to function in the above description.
These functions are performed actually with hardware or software mode, specific application and design constraint depending on technical solution.
Professional technician can realize described function to each specific application using distinct methods, but this realization
It is it is not considered that beyond the scope of this invention.
The step of method or algorithm for being described with reference to the embodiments described herein, can use hardware, processor to perform
The combination of software module or the two is implemented.Software module can be placed in random access memory (RAM), memory, read-only memory
(ROM), electrically programmable ROM, electrically erasable ROM, register, hard disk, moveable magnetic disc, CD-ROM or technical field
In any other form of storage medium well known to interior.
Above-described specific embodiment has carried out the purpose of the present invention, technical solution and advantageous effect further
It is described in detail, it should be understood that the foregoing is merely the specific embodiments of the present invention, is not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution, improvement and etc. done should all include
Within protection scope of the present invention.
Claims (3)
1. a kind of detector anode assembly, which is characterized in that the detector anode assembly includes：
First anode plate, the first anode plate have the first signal array；
Second plate plate, the area of the second plate plate are less than first anode plate, and in the first anode plate, institute
Second plate plate is stated with secondary signal array；
First asic chip is connected with the first anode plate, when electronics is beaten in the first anode plate, detection described the
The first signal that one anode plate generates；
Second asic chip is connected with the second plate plate, when electronics is beaten in the second plate plate, detection described the
The secondary signal that two anode plates generate；
Electronics processor is connected with first asic chip and the second asic chip, according to first signal and
Binary signal obtains electronics and beats position in the first anode plate or second plate plate；
Wherein, first signal array is N M array, and N is the first array line number, and M is the first array columns；
First asic chip is inputted with N+M roads signal；
Wherein, the secondary signal array is P × Q arrays, and P is the second array line number, and Q is the second array columns；
Second asic chip is inputted with P+Q roads signal.
2. detector anode plate device according to claim 1, which is characterized in that the electronics processor with specific reference to
The first signal and the second signal obtain the row position and column position of the electronics, are beaten so as to obtain the electronics described
The position of one anode plate or second plate plate.
3. detector anode plate device according to claim 1, which is characterized in that the electronics processor includes scene
Programmable gate array FPGA is connected with first asic chip and the second asic chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610963911.3A CN106531756B (en) | 2016-10-28 | 2016-10-28 | Detector anode assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610963911.3A CN106531756B (en) | 2016-10-28 | 2016-10-28 | Detector anode assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106531756A CN106531756A (en) | 2017-03-22 |
| CN106531756B true CN106531756B (en) | 2018-05-18 |
Family
ID=58326958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610963911.3A Expired - Fee Related CN106531756B (en) | 2016-10-28 | 2016-10-28 | Detector anode assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106531756B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298793A (en) * | 2010-11-29 | 2013-09-11 | 埃吉斯药物股份公开有限公司 | Method for the preparation of high-purity pharmaceutical intermediates |
| CN206339245U (en) * | 2016-10-28 | 2017-07-18 | 中国计量科学研究院 | Detector anode assembly |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008227430A (en) * | 2007-03-16 | 2008-09-25 | Sharp Corp | Photodetector for position detection, production process thereof, sensor, and electronic instrument |
-
2016
- 2016-10-28 CN CN201610963911.3A patent/CN106531756B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103298793A (en) * | 2010-11-29 | 2013-09-11 | 埃吉斯药物股份公开有限公司 | Method for the preparation of high-purity pharmaceutical intermediates |
| CN206339245U (en) * | 2016-10-28 | 2017-07-18 | 中国计量科学研究院 | Detector anode assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106531756A (en) | 2017-03-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9599730B2 (en) | Counting digital X-ray detector and method for recording an X-ray image | |
| JP5800966B2 (en) | Semiconductor image sensor | |
| Bolotnikov et al. | A 4× 4 array module of position-sensitive virtual Frisch-grid CdZnTe detectors for gamma-ray imaging spectrometers | |
| CN103860184A (en) | Photon-counting detector and readout circuit | |
| D'Ascenzo et al. | Silicon avalanche pixel sensor for high precision tracking | |
| US20180164445A1 (en) | Circuit arrangement for acquisition of signals from an apparatus for measuring beams of charged particles for external radiotherapy | |
| US6839407B2 (en) | Arrangement of sensor elements | |
| CN106531756B (en) | Detector anode assembly | |
| CN206339245U (en) | Detector anode assembly | |
| Födisch et al. | Charge-sensitive front-end electronics with operational amplifiers for CdZnTe detectors | |
| Riedler et al. | First results from the ALICE silicon pixel detector prototype | |
| EP3399345B1 (en) | Read network topology | |
| Bieniosek et al. | Compact pulse width modulation circuitry for silicon photomultiplier readout | |
| Ballin et al. | Design and performance of a CMOS study sensor for a binary readout electromagnetic calorimeter | |
| JPH08507181A (en) | Electron radiation image forming device | |
| Hoff et al. | An on-chip charge cluster reconstruction technique in the miniVIPIC pixel readout chip for X-ray counting and timing | |
| CN106547015B (en) | Detector | |
| WO2020007850A1 (en) | Detection device and method for detecting sensor signals in a grid of sensor elements | |
| Youn et al. | Energy calibration of energy-resolved photon-counting pixel detectors using laboratory polychromatic x-ray beams | |
| Gallin-Martel et al. | Data read out and formatting for PMT-based rich detectors | |
| Ciciriello et al. | A new Front-End ASIC for GEM detectors with time and charge measurement capabilities | |
| Cerbone et al. | Monte Carlo and experimental evaluation of a Timepix4 compact gamma camera for coded aperture nuclear medicine imaging with depth resolution | |
| Tamma et al. | The CHESS-2 prototype in AMS 0.35 μm process: A high voltage CMOS monolithic sensor for ATLAS upgrade | |
| Manazza et al. | Vertical integration approach to the readout of pixel detectors for vertexing applications | |
| EP4070132B1 (en) | Sub-pixel time skew correction for positron emission tomography (pet) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180518 Termination date: 20211028 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |