CN106531716A - Integrated circuit substrate - Google Patents
Integrated circuit substrate Download PDFInfo
- Publication number
- CN106531716A CN106531716A CN201611182408.0A CN201611182408A CN106531716A CN 106531716 A CN106531716 A CN 106531716A CN 201611182408 A CN201611182408 A CN 201611182408A CN 106531716 A CN106531716 A CN 106531716A
- Authority
- CN
- China
- Prior art keywords
- substrate
- cannelure
- substrate according
- ring
- copper coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
Abstract
The invention relates to an integrated circuit substrate. The substrate comprises a copper coated core board, wherein the circuit function of the integrated circuit package substrate is favorably improved or extended by forming an annular groove for accommodating a magnetic ring in the copper coated core board, i.e., a micro transformer can be integrated in the integrated circuit substrate by winding connection on via holes which are internally and externally distributed along the magnetic ring, the copper coated core board is characterized by comprising a substrate body, the substrate body comprises the copper coated core board, the copper coated core board comprises a core board, an upper copper coated layer and a lower copper coated layer, the upper copper coated layer is combined with a surface of the core board, the lower copper coated layer is combined with a bottom surface of the core board, the annular groove is formed in the core board and is provided with an opening facing upwards, and the opening extends out of the upper copper coated layer.
Description
Technical field
The present invention relates to integrated antenna package technology, particularly a kind of ic substrate, the substrate include covering copper core
Plate, by the cannelure for accommodating magnet ring is arranged in overlying copper core, is conducive to improving or extending the electricity of IC substrate package
Road function, for example, can carry out coiling by the via to being distributed inside and outside magnet ring and connect so that micro-transformer is integrated in integrated electricity
In base board.
Background technology
Due to greatly developing for new forms of energy, isolation applications require more and more and isolation voltage more and more higher, and quasiconductor
The traditional optocoupler technical efficiency of isolation technology replacement is higher, and integrated level is higher, supports higher transfer rate, meets the need of industry development
Ask.Base plate for packaging is becoming that one, integrated antenna package field is important and industry that is quickly growing, and organic substrate technique is big
Batch is used and is encapsulated in BGA ball arrays, in multi-chip package technique.Employing micro-transformer scheme of the prior art, power supply work(
Rate only has 0.5W, and efficiency only has 35%.Due to inductance value it is not big enough, the modulated signal that signal transmission is had to using 180MHz,
Circuit is extremely complex, and the magnetic circuit in circuit is not closed, and leakage field is big, and EMI electromagnetic interference space radiations are big.Crinis Carbonisatus of the present invention
Existing, for the semiconductor isolation technology using micro-transformer scheme, due to micro-transformer scheme inductance value, the coefficient of coup is too low,
The complexity of transmission circuit is also increased, integrated power-efficient is poor.Some condenser type isolators, user need additional transformation
Device.In addition, condenser type isolation can not be internally integrated the power supply of switch, client in-convenience in use.
The content of the invention
The present invention is for defect or deficiency present in prior art, there is provided a kind of ic substrate, the substrate bag
Overlying copper core is included, by the cannelure for accommodating magnet ring is arranged in overlying copper core, is conducive to improving or is extended integrated antenna package
The circuit function of substrate, for example, can carry out coiling by the via to being distributed inside and outside magnet ring and connect so that transformator to be integrated in
In ic substrate.
Technical solution of the present invention is as follows：
A kind of ic substrate, it is characterised in that including substrate body, the substrate body include overlying copper core,
The overlying copper core includes central layer and being incorporated into the upper copper clad layers of core plate surface and being incorporated into the lower copper clad layers of central layer bottom surface, institute
State and on central layer, be provided with opening up cannelure, the opening is extended to outside the upper copper clad layers.
The cannelure is controlled depth milling groove, and it is etching opening that the opening is located at the part of the upper copper clad layers.
Magnet ring is fixed with the cannelure.
Some outer vias are provided with the outside of the outer ring of the cannelure, if being provided with the inside of the inner ring of the cannelure
Via in dry.
The outer via and interior via adopt laser boring.
Some outer vias include the outer via of armature winding and the outer via of secondary windings, and some interior vias are included just
Via in via and secondary windings in level winding.
Armature winding and secondary windings are formed by the way of track connection via.
Pressing in the upper copper clad layers has prepreg.
The stitching surface of the prepreg is provided with windowing towards the corresponding position of the cannelure.
The magnetic ring transformer for connecting via coiling by track is built in the insulation of the substrate body in vivo, no air
The path of creep age distance, can reach the pressure of 5.7 kilovolts.
The technology of the present invention effect is as follows：A kind of ic substrate of the present invention, accommodates magnetic by arranging in overlying copper core
The cannelure of ring, is conducive to improving or extending the circuit function of IC substrate package, for example can be by along magnet ring
The via of outer distribution carries out coiling and connects so that micro-transformer is integrated in ic substrate.
The present invention has the special feature that：By implementing the present invention, can be adopted in integrated circuit organic substrate sheet in vivo and bury magnetic
Technology prefabricated one or many magnet rings, realize transformator by laser vias technology, and inductance value and the coefficient of coup are all very
Height, is conducive to the power output and efficiency of power supply.Again using the integrated Die of SIP techniques and discrete device come kinds of surface process side
Formula completes allomeric function, such as insulating power supply, isolation signals transmission to facilitate wire bonding, flip-chip or mixed type connection
Etc. circuit function.
By the coiling that transformer coil is realized using track and the accurate punched mode of laser, hand wound is instead of
Difficulty, the particularly smaller magnetic ring transformer of diameter do not support machine coiling, can only labour cost when coiling.The present invention gram
The nonuniformity of coiling, discreteness are taken；Conveniently go out pin, the para-position of SMT electroplating equipment wielding machines and concordance；The change of hand wound
Depressor must have collet, and pin must have sustenance, also be exactly that SMT welding can not draw (as magnet ring is hollow).This
It is bright to have saved cost, with fine copper enamel-covered wire coiling, 50% cost of overall saving.The present invention is due to being built in insulation by micro-transformer
In vivo, do not have the path of air creepage distance, high withstand voltage primary and secondary is realized in the space of very little and will reach 5.7 kilovolts
It is pressure.
Description of the drawings
Fig. 1 is to implement a kind of structural representation of ic substrate of the invention.
Fig. 2 is the overlook direction schematic diagram of Fig. 1.
Reference lists as follows：1- central layers；The upper copper clad layers of 2-；Copper clad layers under 3-；The first magnet rings of 4-；The second magnet rings of 5-；
The 3rd magnet rings of 6-；The first annular grooves of 7-；The second cannelures of 8-；The 3rd cannelures of 9-；The outer via of the first rings of 10- armature winding；11-
Via in first ring armature winding；Via in 12- the first ring secondary windings；The outer via of the first rings of 13- secondary windings；14- second
The outer via of ring armature winding；Via in 15- the second ring armature windings；Via in 16- the second ring secondary windings；The second rings of 17-
The outer via of level winding；The outer via of the 3rd ring armature windings of 18-；Via in the 3rd ring armature windings of 19-；The 3rd rings of 20- it is secondary around
Via in group；The outer via of the 3rd ring secondary windings of 21-.
Specific embodiment
Below in conjunction with the accompanying drawings (Fig. 1-Fig. 2) the present invention will be described.
Fig. 1 is to implement a kind of structural representation of ic substrate of the invention, and Fig. 1 performances are cross section structures.Fig. 2 is
The overlook direction schematic diagram of Fig. 1.As shown in Figure 1 to Figure 2, a kind of ic substrate, including substrate body, the substrate body
Include overlying copper core, the overlying copper core includes central layer 1 and is incorporated into the upper copper clad layers 2 on 1 surface of central layer and is incorporated into core
The lower copper clad layers 3 of 1 bottom surface of plate, are provided with opening up cannelure (such as first annular groove 7 on the central layer 1；Second is annular
Groove 8；9), the opening is extended to outside the upper copper clad layers 2 3rd cannelure.The cannelure (is adopted for controlled depth milling groove
Milling process simultaneously controls groove depth, keeps certain thickness of groove bottom), the opening is to etch open positioned at the part of the upper copper clad layers
Mouth (for example, etches Copper Foil, the overlying copper core residing for magnetic core in other words magnet ring is etched away near the Copper Foil on the inside of circuit board).Institute
Magnet ring (for example, the first magnet ring 4 of each cannelure of correspondence, the second magnet ring 5, the 3rd magnet ring 6 etc.) is fixed with stating cannelure.Along institute
State
Outer mistake 13, crosses 14 outside the second ring armature winding, the outer via 17 of the second ring secondary windings crosses the 18, the 3rd outside the 3rd ring armature winding
Outer via 21 of ring secondary windings etc.), some interior vias are provided with the inside of the inner ring of the cannelure, and (for example, the first ring is secondary
Via 11 in winding, via 12 in the first ring secondary windings, via 15 in the second ring armature winding, mistake in the second ring secondary windings
16, via 19 in the 3rd ring armature winding crosses 20 etc. in the 3rd ring secondary windings).The outer via and interior via are using sharp
Light punching (for example, laser vias technology realizes accurate punching).
Some outer vias include the outer via of armature winding and outer via (for example, the first ring armature winding of secondary windings
Outer via 10, excessively 13 outside the first ring secondary windings, excessively 14 outside the second ring armature winding, the outer via 17 of the second ring secondary windings, the
18 are crossed outside three ring armature windings, outer via 21 of the 3rd ring secondary windings etc.), some interior vias include via in armature winding
With via in secondary windings (for example at the beginning of, via 11 in the first ring secondary windings, via 12 in the first ring secondary windings, the second ring
Via 15 in level winding, excessively 16 in the second ring secondary windings, via 19 in the 3rd ring armature winding, mistake in the 3rd ring secondary windings
20 etc.).Armature winding and secondary windings are formed (that is, the present invention can be adopted by the way of track connection via
The coiling of transformer coil is realized with track and the accurate punched mode of laser).Pressing in the upper copper clad layers has semi-solid preparation
Piece.The stitching surface of the prepreg is provided with windowing towards the corresponding position of the cannelure, and (prepreg opens a window, by magnetic core institute
The prepreg correspondence magnetic core groove windowing between the overlying copper core layer being in, the magnet ring that so thickness can be adopted thicker；
Pressing, is put into magnet ring during lamination in magnetic core groove and the windowing, and then overlying copper core is pressed with prepreg).By printing
The magnetic ring transformer of line connection via coiling is built in the insulation of the substrate body in vivo, does not have the road of air creepage distance
Footpath, can reach the pressure of 5.7 kilovolts.
The present invention can be produced the advantage that：Realize more high-power, the IC integrated power supplies of higher efficiency；Led to minimum
Road realizes the transmission of two-way signaling；Substrate integrated Packaging Technology one-shot forming, cost are lower.
It is hereby stated that, it is described above to contribute to skilled artisan understands that the invention, but not limit the present invention
The protection domain of creation.It is any equivalent described above, modification to be improved without departing from the invention flesh and blood
And/or the enforcement deleted numerous conforming to the principle of simplicity and carry out, each fall within the protection domain of the invention.
Claims (10)
1. a kind of ic substrate, it is characterised in that including substrate body, the substrate body includes overlying copper core, institute
Stating overlying copper core includes central layer and is incorporated into the upper copper clad layers of core plate surface and is incorporated into the lower copper clad layers of central layer bottom surface, described
Opening up cannelure is provided with central layer, the opening is extended to outside the upper copper clad layers.
2. ic substrate according to claim 1, it is characterised in that the cannelure is controlled depth milling groove, described to open
It is etching opening that mouth is located at the part of the upper copper clad layers.
3. ic substrate according to claim 1, it is characterised in that be fixed with magnet ring in the cannelure.
4. ic substrate according to claim 3, it is characterised in that be provided with the outside of the outer ring of the cannelure
Some outer vias, are provided with some interior vias on the inside of the inner ring of the cannelure.
5. ic substrate according to claim 4, it is characterised in that the outer via and interior via adopt laser
Punching.
6. ic substrate according to claim 4, it is characterised in that some outer vias are included outside armature winding
The outer via of via and secondary windings, some interior vias include in armature winding via in via and secondary windings.
7. ic substrate according to claim 6, it is characterised in that armature winding and secondary windings are using printing
The mode of line connection via is formed.
8. ic substrate according to claim 1, it is characterised in that pressing in the upper copper clad layers has semi-solid preparation
Piece.
9. ic substrate according to claim 8, it is characterised in that the stitching surface of the prepreg is towards described
The corresponding position of cannelure is provided with windowing.
10. ic substrate according to claim 7, it is characterised in that the magnet ring of via coiling is connected by track
Transformer built-in is internal in the insulation of the substrate body, does not have the path of air creepage distance, can reach the resistance to of 5.7 kilovolts
Pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611182408.0A CN106531716B (en) | 2016-12-20 | 2016-12-20 | Integrated circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611182408.0A CN106531716B (en) | 2016-12-20 | 2016-12-20 | Integrated circuit substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106531716A true CN106531716A (en) | 2017-03-22 |
| CN106531716B CN106531716B (en) | 2019-12-06 |
Family
ID=58341125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611182408.0A Active CN106531716B (en) | 2016-12-20 | 2016-12-20 | Integrated circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106531716B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019210541A1 (en) * | 2018-04-29 | 2019-11-07 | 深南电路股份有限公司 | Transformer and manufacturing method therefor, and electromagnetic device |
| CN113012902A (en) * | 2021-02-25 | 2021-06-22 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Planar inductor and manufacturing method thereof |
| CN114630504A (en) * | 2020-12-10 | 2022-06-14 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202503818U (en) * | 2012-01-12 | 2012-10-24 | 东莞森玛仕格里菲电路有限公司 | Magnetic core embedded PCB |
| CN103915235A (en) * | 2014-03-21 | 2014-07-09 | 华为技术有限公司 | Planar magnetic element and manufacturing method thereof |
| CN205194482U (en) * | 2014-08-14 | 2016-04-27 | 株式会社村田制作所 | Embedded magnetic element device |
| CN206282849U (en) * | 2016-12-20 | 2017-06-27 | 圣邦微电子（北京）股份有限公司 | A kind of ic substrate |
-
2016
- 2016-12-20 CN CN201611182408.0A patent/CN106531716B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202503818U (en) * | 2012-01-12 | 2012-10-24 | 东莞森玛仕格里菲电路有限公司 | Magnetic core embedded PCB |
| CN103915235A (en) * | 2014-03-21 | 2014-07-09 | 华为技术有限公司 | Planar magnetic element and manufacturing method thereof |
| CN205194482U (en) * | 2014-08-14 | 2016-04-27 | 株式会社村田制作所 | Embedded magnetic element device |
| CN206282849U (en) * | 2016-12-20 | 2017-06-27 | 圣邦微电子（北京）股份有限公司 | A kind of ic substrate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019210541A1 (en) * | 2018-04-29 | 2019-11-07 | 深南电路股份有限公司 | Transformer and manufacturing method therefor, and electromagnetic device |
| CN114630504A (en) * | 2020-12-10 | 2022-06-14 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN113012902A (en) * | 2021-02-25 | 2021-06-22 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | Planar inductor and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106531716B (en) | 2019-12-06 |
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