CN108597832A - A kind of Polymer-filled - Google Patents

A kind of Polymer-filled Download PDF

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Publication number
CN108597832A
CN108597832A CN201810299732.3A CN201810299732A CN108597832A CN 108597832 A CN108597832 A CN 108597832A CN 201810299732 A CN201810299732 A CN 201810299732A CN 108597832 A CN108597832 A CN 108597832A
Authority
CN
China
Prior art keywords
coil
polymer
glue
groove
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810299732.3A
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Chinese (zh)
Inventor
沈凯泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WUJIANG HUAAN ELECTRIC APPLIANCE CO Ltd
Original Assignee
WUJIANG HUAAN ELECTRIC APPLIANCE CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUJIANG HUAAN ELECTRIC APPLIANCE CO Ltd filed Critical WUJIANG HUAAN ELECTRIC APPLIANCE CO Ltd
Priority to CN201810299732.3A priority Critical patent/CN108597832A/en
Publication of CN108597832A publication Critical patent/CN108597832A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/005Impregnating or encapsulating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/022Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/30Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H01F27/306Fastening or mounting coils or windings on core, casing or other support

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Medical Uses (AREA)

Abstract

The invention discloses a kind of Polymer-filleds,Including skeleton and encapsulating die,Skeleton is made using three-ply board,Coil is wound on the outside of skeleton,The both sides of coil are provided with suture introducing needle,Casting glue is provided on the outside of coil,Casting glue is made using epoxide resin material,Air-gap is provided in the middle part of coil,The both sides of coil are provided with several wiring holes,Wiring hole matches connection with suture introducing needle,Encapsulating die is made of sidewall paneling and transverse baffle two parts,The both sides of sidewall paneling are provided with several grooves,The depth of groove is 5mm,The thickness of groove is 2.5mm,Transverse baffle is provided with several hole for injecting glue,And hole for injecting glue equidistantly arranges,Negative-pressure air fan is provided at the top of encapsulating die,When unlatching,Mould inside can be made to form subnormal ambient,Casting glue can be absorbed by the suction Jiao Kou at top,Enhance the mobility of casting glue,Reduce the generation of bubble,The prepared coil precision made is higher.

Description

A kind of Polymer-filled
Technical field
The present invention relates to potting fixture technical field, specially a kind of Polymer-filled.
Background technology
Coil is often referred to wire winding in a ring, and most common coil application has:Motor, inductance, transformer and annular Antenna etc..Coil in circuit refers to inductor.It is that guide line one one is wound up, conducting wire insulate each other, and insulate Pipe can be hollow, can also include iron core or powder core, abbreviation inductance.Inductance can be divided into fixed inductance and can power transformation again Sense, fixed inductance coil abbreviation inductance or coil.It is indicated with L, unit has Henry (H), millihenry (mH), microhenry (uH), 1H =10^3mH=10^6uH.And electron pouring sealant belongs to liquid before uncured, has mobility, glue viscosity is according to product Material, performance, the difference of production technology and different from.After existing coil uses casting glue embedding, until casting glue is complete Its use value could be realized after all solidstate, and waterproof and dampproof, dust-proof, insulation, heat conduction, secrecy, anti-corrosion can be played after solidification Erosion, heatproof, shockproof effect.But certain air-gap can be reserved between inductance coil in order to control the size of inductance value, Bubble is easy tod produce near air-gap after using casting glue embedding, influences whole precision, the inductance value of the coil made exists Error.
So how to design a kind of Polymer-filled, becoming us will currently solve the problems, such as.
Invention content
The purpose of the present invention is to provide a kind of Polymer-filleds, to solve mentioned above in the background art but inductor wire Certain air-gap can be reserved between circle in order to control the size of inductance value, held near air-gap after using casting glue embedding It is also easy to produce bubble, influences whole precision, the inductance value of the coil made has error.
To achieve the above object, the present invention provides the following technical solutions:A kind of Polymer-filled, including skeleton and embedding mould Tool, the skeleton are made using three-ply board, and coil is wound on the outside of the skeleton, and the both sides setting of the coil is leaded Needle is provided with casting glue on the outside of the coil, and the casting glue is made using epoxide resin material, in the coil Portion is provided with air-gap, and the both sides of the coil are provided with several wiring holes, and the wiring hole matches connection with suture introducing needle, described Encapsulating die is made of sidewall paneling and transverse baffle two parts, and the both sides of the sidewall paneling are provided with several grooves, described recessed The depth of slot is 5mm, and the thickness of the groove is 2.5mm, and the transverse baffle is provided with several hole for injecting glue, and the hole for injecting glue Equidistantly arrangement.
Further, the spacing between two be disposed adjacent the groove is 5cm.
Further, it is provided at the top of the encapsulating die and inhales Jiao Kou, negative pressure wind is provided at the top of the suction Jiao Kou Connection is connected with the suction Jiao Kou in machine, the negative-pressure air fan.
Further, return duct, the other end and glue injection equipment of the return duct are provided at the top of the negative-pressure air fan It is connected.
Further, the top and bottom of the transverse baffle are both provided with card slot, and the card slot is semicircle blocks Slot, the card slot are consistent with the size of the groove.
Further, the suture introducing needle is made using corronil material, a diameter of 0.5mm of the suture introducing needle.
Compared with prior art, the beneficial effects of the invention are as follows:This kind of Polymer-filled is provided with dedicated encapsulating die, And encapsulating die is made of sidewall paneling and transverse baffle two parts, the both sides of sidewall paneling are provided with several grooves, the groove Depth be 5mm, the thickness of the groove is 2.5mm, and the transverse baffle is provided with several hole for injecting glue, and described hole for injecting glue etc. Spacing arranges, and can carry out injecting glue to it using corresponding glue injection equipment, and the top of transverse baffle and bottom are both provided with Card slot, and the card slot is semicircle card slot, the card slot is consistent with the size of the groove, can be according to the big ditty of coil The position of whole transverse baffle reduces economic cost, in addition in order to prepare different size of Polymer-filled to save casting glue It is provided with negative-pressure air fan at the top of encapsulating die, when unlatching, mould inside can be made to form subnormal ambient, casting glue can lead to The suction Jiao Kou for crossing top absorbs, and enhances the mobility of casting glue, reduces the generation of bubble, the prepared coil precision made compared with Height, and the casting glue absorbed can be again introduced into glue injection equipment by return duct and be connected, more economical environmental protection.
Description of the drawings
Fig. 1 is the overall structure diagram of the present invention;
Fig. 2 is the structural schematic diagram of coil top of the present invention;
Fig. 3 is the structural schematic diagram of encapsulating die of the present invention;
Fig. 4 is the structural schematic diagram of transverse baffle of the present invention;
In figure:1- suture introducing needles;2- casting glues;3- coils;4- skeletons;5- air-gaps;6- wiring holes;7- transverse baffles;8- Negative-pressure air fan;9- return ducts;10- inhales Jiao Kou;11- grooves;12- encapsulating dies;13- hole for injecting glue;14- card slots.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
- 4 are please referred to Fig.1, the present invention provides a kind of technical solution:A kind of Polymer-filled, including skeleton 4 and encapsulating die 12, the skeleton 4 is made using three-ply board, has certain intensity, and will not be conductive, economic cost is relatively low, the bone The outside of frame 4 is wound with coil 3, and the both sides of the coil 3 are provided with suture introducing needle 1, and the outside of the coil 3 is provided with casting glue 2, The casting glue 2 is made using epoxide resin material, and the middle part of the coil 3 is provided with air-gap 5, the coil 3 Both sides are provided with several wiring holes 6, and the wiring hole 6 matches connection with suture introducing needle 1, the encapsulating die 12 by sidewall paneling and 7 two parts of transverse baffle are constituted, and the both sides of the sidewall paneling are provided with several grooves 11, and the depth of the groove 11 is 5mm, institute The thickness for stating groove 11 is 2.5mm, and the transverse baffle 7 is provided with several hole for injecting glue 13, and the hole for injecting glue 13 is equidistantly arranged Row.
Further, the spacing between two be disposed adjacent the groove 11 is 5cm, be may be selected when preparing Polymer-filled Size it is more.
Further, the top of the encapsulating die 12, which is provided with, inhales glue mouth 10, and the top for inhaling glue mouth 10 is provided with Negative-pressure air fan 8, the conducting of the negative-pressure air fan 8 and the suctions glue mouth 10 connect, and when unlatching, can make mould inside formation negative pressure ring Border, casting glue 2 can be absorbed by the suction glue mouth 10 at top, enhanced the mobility of casting glue 2, reduced the generation of bubble, make Prepared coil precision it is higher.
Further, the top of the negative-pressure air fan 8 is provided with return duct 9, and the other end and the injecting glue of the return duct 9 are set Standby to be connected, the casting glue 2 absorbed can be again introduced into glue injection equipment by return duct 9 and be connected, more economical environmental protection.
Further, the top and bottom of the transverse baffle 7 are both provided with card slot 14, and the card slot 14 is semicircle Shape card slot, the card slot 14 is consistent with the size of the groove 11, the transverse baffle 7 allow very easily carry out installation with Dismounting.
Further, the suture introducing needle 1 is made using corronil material, the suture introducing needle 1 it is a diameter of 0.5mm, corronil electric conductivity are preferable, during actual use impedance is smaller.
Operation principle:First, this kind of Polymer-filled is provided with dedicated encapsulating die 12, and encapsulating die 12 is by side wall Plate and 7 two parts of transverse baffle are constituted, and the both sides of sidewall paneling are provided with several grooves 11, and the depth of the groove 11 is 5mm, The thickness of the groove 11 is 2.5mm, and the transverse baffle 7 is provided with several hole for injecting glue 13, and the hole for injecting glue 13 is equidistant Arrangement, can carry out injecting glue using corresponding glue injection equipment to it, and the top and bottom of transverse baffle 7 are both provided with card slot 14, and the card slot 14 is semicircle card slot 14, the card slot 14 is consistent with the size of the groove 11, can be according to coil Size adjusts the position of transverse baffle 7, in order to prepare different size of Polymer-filled, to save casting glue reduce it is economical at This, is provided with negative-pressure air fan 8 at the top of encapsulating die in addition, when unlatching, mould inside can be made to form subnormal ambient, embedding Glue 2 can be absorbed by the suction glue mouth 10 at top, enhanced the mobility of casting glue 2, reduced the generation of bubble, what is made is prepared Coil precision it is higher, and the casting glue 2 absorbed can be again introduced into glue injection equipment by return duct 9 and be connected, more economically Environmental protection.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace And modification, the scope of the present invention is defined by the appended.

Claims (6)

1. a kind of Polymer-filled, including skeleton (4) and encapsulating die (12), it is characterised in that:The skeleton (4) is closed using three Plate is made, and coil (3) is wound on the outside of the skeleton (4), the both sides of the coil (3) are provided with suture introducing needle (1), described Casting glue (2) is provided on the outside of coil (3), the casting glue (2) is made using epoxide resin material, the coil (3) be provided with air-gap (5) in the middle part of, the both sides of the coil (3) are provided with several wiring holes (6), the wiring hole (6) with Suture introducing needle (1) matching connection, the encapsulating die (12) are made of sidewall paneling and transverse baffle (7) two parts, the side wall The both sides of plate are provided with several grooves (11), and the depth of the groove (11) is 5mm, and the thickness of the groove (11) is 2.5mm, The transverse baffle (7) is provided with several hole for injecting glue (13), and the hole for injecting glue (13) equidistantly arranges.
2. a kind of Polymer-filled according to claim 1, it is characterised in that:Two be disposed adjacent the groove (11) it Between spacing be 5cm.
3. a kind of Polymer-filled according to claim 1, it is characterised in that:It is provided at the top of the encapsulating die (12) Jiao Kou (10) is inhaled, negative-pressure air fan (8), the negative-pressure air fan (8) and the suction Jiao Kou are provided at the top of the suction Jiao Kou (10) (10) conducting connection.
4. a kind of Polymer-filled according to claim 3, it is characterised in that:It is provided at the top of the negative-pressure air fan (8) The other end of return duct (9), the return duct (9) is connected with glue injection equipment.
5. a kind of Polymer-filled according to claim 1, it is characterised in that:The top and bottom of the transverse baffle (7) Portion is both provided with card slot (14), and the card slot (14) is semicircle card slot, the ruler of the card slot (14) and the groove (11) It is very little consistent.
6. a kind of Polymer-filled according to claim 1, it is characterised in that:The suture introducing needle (1) uses corronil material Material is made, a diameter of 0.5mm of the suture introducing needle (1).
CN201810299732.3A 2018-04-04 2018-04-04 A kind of Polymer-filled Pending CN108597832A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810299732.3A CN108597832A (en) 2018-04-04 2018-04-04 A kind of Polymer-filled

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810299732.3A CN108597832A (en) 2018-04-04 2018-04-04 A kind of Polymer-filled

Publications (1)

Publication Number Publication Date
CN108597832A true CN108597832A (en) 2018-09-28

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CN201810299732.3A Pending CN108597832A (en) 2018-04-04 2018-04-04 A kind of Polymer-filled

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113314297A (en) * 2021-05-18 2021-08-27 浙江华消科技有限公司 Coil encapsulation structure and encapsulation process
CN115023061A (en) * 2022-06-30 2022-09-06 天津津航计算技术研究所 Printed board assembly reinforcing method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002170731A (en) * 2000-11-30 2002-06-14 Yaskawa Electric Corp Resin impregnation molding device for cylindrical hollow coil
CN1469401A (en) * 2003-06-04 2004-01-21 中国科学院等离子体物理研究所 Vacuum infusion process of large winding in soft mold
CN201702365U (en) * 2010-04-27 2011-01-12 宁波市展发磁业科技有限公司 Rare-earth permanent-magnetic material tile-shaped mould
CN202258780U (en) * 2011-09-05 2012-05-30 上海一电变压器有限公司 Upper end closing plate device of vertical pouring mould for epoxy resin coil of dry-type transformer
CN106935394A (en) * 2017-05-04 2017-07-07 山东泰开干变有限公司 A kind of dry transformer high-tension coil horizontal type casting mold and pouring procedure
CN207966729U (en) * 2018-04-04 2018-10-12 吴江市华安电器有限公司 A kind of Polymer-filled

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002170731A (en) * 2000-11-30 2002-06-14 Yaskawa Electric Corp Resin impregnation molding device for cylindrical hollow coil
CN1469401A (en) * 2003-06-04 2004-01-21 中国科学院等离子体物理研究所 Vacuum infusion process of large winding in soft mold
CN201702365U (en) * 2010-04-27 2011-01-12 宁波市展发磁业科技有限公司 Rare-earth permanent-magnetic material tile-shaped mould
CN202258780U (en) * 2011-09-05 2012-05-30 上海一电变压器有限公司 Upper end closing plate device of vertical pouring mould for epoxy resin coil of dry-type transformer
CN106935394A (en) * 2017-05-04 2017-07-07 山东泰开干变有限公司 A kind of dry transformer high-tension coil horizontal type casting mold and pouring procedure
CN207966729U (en) * 2018-04-04 2018-10-12 吴江市华安电器有限公司 A kind of Polymer-filled

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113314297A (en) * 2021-05-18 2021-08-27 浙江华消科技有限公司 Coil encapsulation structure and encapsulation process
CN115023061A (en) * 2022-06-30 2022-09-06 天津津航计算技术研究所 Printed board assembly reinforcing method
CN115023061B (en) * 2022-06-30 2024-04-30 天津津航计算技术研究所 Printed board assembly reinforcing method

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Application publication date: 20180928