CN106514057A - Washable flux paste and soldering paste and production method thereof - Google Patents

Washable flux paste and soldering paste and production method thereof Download PDF

Info

Publication number
CN106514057A
CN106514057A CN201611186140.8A CN201611186140A CN106514057A CN 106514057 A CN106514057 A CN 106514057A CN 201611186140 A CN201611186140 A CN 201611186140A CN 106514057 A CN106514057 A CN 106514057A
Authority
CN
China
Prior art keywords
weld
paste
aiding cream
solder
cream
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201611186140.8A
Other languages
Chinese (zh)
Other versions
CN106514057B (en
Inventor
罗礼伟
郑序漳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XIAMEN JISSYU SOLDER CO Ltd
Original Assignee
XIAMEN JISSYU SOLDER CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XIAMEN JISSYU SOLDER CO Ltd filed Critical XIAMEN JISSYU SOLDER CO Ltd
Priority to CN201611186140.8A priority Critical patent/CN106514057B/en
Publication of CN106514057A publication Critical patent/CN106514057A/en
Application granted granted Critical
Publication of CN106514057B publication Critical patent/CN106514057B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362Selection of compositions of fluxes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40Making wire or rods for soldering or welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to washable flux paste and soldering paste and a production method thereof. The washable flux paste comprises, by weight, 40-50% of 1-(3- amino propyl) imidazole rosin salt, 15-30% of EO-PO-EO segmented copolymers, 13-25% of polyethylene glycol oleate, 5-8% of halogen activating agents, 0.2-2% of fumed silica, 0.2-2% of hydrogenated castor oil and 0.05-2% of corrosion inhibitors. The produced soldering paste has the advantages that the thermal collapse resistance is good, the tin melting effect of micro welding spots is good, residues can be washed through distilled water after welding and the soldering-aiding activity is high. The soldering paste can be used for welding electronic products such as computers and mobile phones, high reliability can be realized by completely washing the residues after welding, and the distilled water can serve as a washing agent, so that the environment friendliness is high.

Description

A kind of washing weld-aiding cream, solder(ing) paste and preparation method thereof
Technical field
The invention belongs to industrial solder technical field, and in particular to a kind of washing weld-aiding cream and preparation method thereof, and The solder(ing) paste prepared using the washing weld-aiding cream.
Background technology
SMT is surface installation technique (surface mounting technology) (Surface Mount Technology), is current electronics A kind of most popular technology and technique in assembling industry.It is that one kind will be without pin or short leg surface-assembled components and parts (abbreviation SMC/SMD, Chinese claim sheet component) installed in the surface of printed circuit board (Printed Circuit Board, PCB) or On the surface of other substrates, by the circuit load technology of the methods such as Reflow Soldering or immersed solder welding assembly in addition.
Solder(ing) paste is accompanied by a kind of novel welding material that SMT arises at the historic moment.Solder(ing) paste is a complicated system, is By the mastic of solder powder, paste paste-shaped welding combination (weld-aiding cream) and other additives mixeds.Solder(ing) paste is at normal temperatures There is certain viscosity, commitment positions can will be bonded at the beginning of electronic devices and components, under welding temperature, with solvent and portions additive Volatilization, will be formed permanently connected by weldering components and parts together with printed circuit pad solder.This is because one is mixed with solder(ing) paste Quantitative thixotropic agent, with pseudoplastic fluid volume property.Solder(ing) paste printing when, by the thrust of scraper, its viscosity degradation, When template window is reached, viscosity reaches minimum, therefore can pass through window and be deposited on the pad of PCB, with stopping for external force Only, the rapid rise again of solder(ing) paste viscosity, is not in thus the slump and cross flow of printed pattern, obtains good printing effect Really.
Conventional No clean tin cream weld-aiding cream generally comprise resin (Colophonium), thixotropic agent, solvent, activator, corrosion inhibiter and Other auxiliary agents.In welding process, Colophonium serves removal glass putty oxide on surface and protection glass putty during high temperature reflux The effect not being reoxidized;After the completion of welding, Colophonium uniform fold is on pad surface.With the development of electronics industry, respectively Plant electronic product to emerge in an endless stream, requirements at the higher level are proposed to the packaging technology of product, be to ensure the product later stage in the presence of a harsh environment It is continual and steady to work, it is ensured that preferable electric property, or the post processing to pcb board is remained in order to avoid the Colophonium of pad surface Impact is produced, for these Colophonium residual needs for having the pcb board pad surface of particular/special requirement are cleaned.
To ensure the residual of the thorough tin cream pad surface of cleaning, conventional abluent is organic solvent at present, and which is main Composition is chlorinated organic solvent, hydrocarbon solvent etc..Wherein, organic solvent is big to operator's physical impairment, and flash-point is low and inflammable easy Quick-fried, environmental pollution is serious, and the organic solvent of chlorine fluorine hydrogen is serious to air breakup, is used by limiting.
Chinese invention patent application CN 103909358A discloses " a kind of washing tin cream and preparation method thereof ", by making Washing is reached with surfactant-based solvent dissolving rosin component to require, formula Halogen, be suitable for high-reliability electronic encapsulation and produce Product washing process, and the product of particular/special requirement is remained to postwelding;Chinese invention patent application CN 102161135A is disclosed " a kind of lead-free soldering wire and its water-soluble flux used ", substitutes Colophonium as carrier using high molecular weight water soluble polymer, Cleaned with water beneficial to postwelding, reduce is used for production and the Rework Technics of PCB using the environmental pollution that chloride abluent brings.This two Part document both provides not halogen formula, it is to avoid problem of environmental pollution, but while also have impact on weld-aiding cream helps weldering activity.
The content of the invention
The present invention remains the active component of Colophonium in existing weld-aiding cream based on different Research ideas, and to Colophonium Activity is strengthened, innovatively using not chloride halogen activator, there is provided a kind of heat resistanceheat resistant is caved in, and performance is good, and fine solder joint melts stannum Effect is good, and postwelding residual is easy to washing, meets Halogen standard, and more general Halogen formula has that preferably helps weldering active to help Soldering paste, and the washing solder(ing) paste for meeting SMT technological requirements prepared using the weld-aiding cream.
For achieving the above object, concrete scheme of the invention is as follows:
A kind of washing weld-aiding cream, including following components in percentage by weight:
The structural formula of the EO-PO-EO block copolymers is
Preferably, the EO-PO-EO block copolymers are BASF AGOne kind during PE is serial.
Further, the washing weld-aiding cream includes following components in percentage by weight:
The structural formula of the EO-PO-EO block copolymers is
Preferably, the EO-PO-EO block copolymers are BASF AGOne kind during PE is serial.
Further, 1- (3- aminopropyls) the imidazoles abietate is to rub by 1- (3- aminopropyls) imidazoles and Colophonium You compare 1:1 ratio is dissolved in isopropanol, is dried after neutralization reaction;
Preferably, the Colophonium be hydrogenated rosin, maleic acid modified Colophonium, the one kind in acrylic acid modified rosin.
Further, the polyethylene glycol (PEG) oleate be polyethylene glycol 200 monoleate, polyethylene glycol 200 dioleic acid ester, The double Oleic acid of PEG400 monoleate, PEG400 dioleic acid ester, Macrogol 600 monoleate, Macrogol 600 One or more in ester.
Further, organic amine salt of the halogen active agent for hydroiodic acid;
Further, the halogen active agent is two hydriodate of 1,2-diaminoethane, 1,2- dimethyl -2- isothiourea hydrogen iodine One kind in hydrochlorate, N- amino-N- amyl group guanidine hydriodates.
Further, the aerosil is hydrophobicity aerosil;
Preferably, the aerosil is watt gram model N20, Degussa model AEROSIL 380, Degussa model One kind in A200, moral mountain model REOLOSIL QS40, Cabot M-5.
Further, the corrosion inhibiter be 1,2,3- benzotriazoles, benzimidazole, in TTA one Kind.
The present invention also provides a kind of preparation method of above-mentioned washing weld-aiding cream, comprises the following steps:
Raw material is weighed by weight percentage;
By 1- (3- aminopropyls) imidazoles abietate, EO-PO-EO block copolymers, polyethylene glycol (PEG) oleate, halogen activation Agent, castor oil hydrogenated, corrosion inhibiter mix in adding beaker, and after being heated into settled solution, low rate mixing cooling obtains paste mixing Thing;
The paste mixture is mixed with halogen activator, aerosil, is ground with three-roll grinder, obtain cream Body;
The mastic is detected with Hegman grind gage, when the mastic fineness is less than 10 μm, obtains washing and help weldering Cream.
The present invention also provides a kind of washing solder(ing) paste, containing following component:Above-mentioned washing weld-aiding cream, tinbase spherical solder Powder.
Wherein:
The use of 1- (3- aminopropyls) the imidazoles abietate improves the water solublity of product of the present invention, and the present invention 1- (3- aminopropyls) imidazoles abietate be with mol ratio 1 by 1- (3- aminopropyls) imidazoles and Colophonium:1 ratio is dissolved in In isopropanol, it is dried after neutralized reaction, Colophonium active component can be remained, and the activity to Colophonium carries out adding By force.Preferably, the addition of 1- (3- aminopropyls) imidazoles abietate of the present invention is the 40-50% of weld-aiding cream quality of the present invention.
The EO-PO-EO block copolymers have following characteristic:(1) possesses appropriate viscosity and viscosity, and viscosity with temperature Degree rate of change is low, can be used for allotment washing solder(ing) paste;(2) possess surfactant properties, postwelding contributes to residual cleaning;(3) Possesses heat-resisting quantity, stable during welding, flue gas is few, volatilization is few, retention amount is big in postwelding residue, distillation is remained in beneficial to postwelding Thoroughly cleaning in water.BASF AGPE series can be used, for example:PE 3100、 4300、6100、6200、6400、6800、8100、9200、9400、10100、10150.Preferably, EO-PO-EO blocks of the present invention The addition of copolymer is the 15-30% of weld-aiding cream quality of the present invention.
The polyethylene glycol (PEG) oleate has following characteristic:(1) with appropriate viscosity, can be used for allotment washing scolding tin Cream;(2) in dispersed in water, postwelding contributes to residual cleaning;(3) possesses heat-resisting quantity, stable during welding, flue gas is few, waves Send out few, retention amount is big in postwelding residue, thoroughly cleaning in distilled water is remained in beneficial to postwelding.Preferably, poly- second of the invention two The addition of alcohol oleate is the 13-25% of weld-aiding cream quality of the present invention.
Organic amine salt of the halogen active agent for hydroiodic acid, preferred embodiments of the present invention are:1,2- ethylenediamine dihydro iodine One kind in hydrochlorate, 1,2- dimethyl -2- isothiourea hydriodates, N- amino-N- amyl group guanidine hydriodates.The halogen reactive Agent has following characteristic:(1) containing I, without chlorine element, bromo element, a large amount of additions still conform to standard GB/T/T 31475 2015《Circuit assembly high-quality intraconnection solder(ing) paste》With regard to the requirement of Halogen standard, i.e.,:Chlorine≤900PPM, bromine≤ 900PPM, chlorine+bromine≤900PPM;(2) more general Halogen activating agent have preferably help weldering activity, it is preferred that halogen of the present invention The addition of plain activating agent is the 5-8% of weld-aiding cream quality of the present invention.
The present invention adopts the two kinds of combinations of aerosil and castor oil hydrogenated with the use of as thixotropic agent.It is described Aerosil has following characteristic:(1) good thixotroping structure can be formed through suitable activating process;(2) solid powder Last shape, easily disperses in water, beneficial to cleaning, is different from the conventional amide of solder(ing) paste, Semen Ricini oils postwelding in solid, shaped and is difficult It is dissolved in water.Preferably, the addition of aerosil of the present invention is the 0.2-2% of weld-aiding cream quality of the present invention.Because using The weld-aiding cream compliance that single aerosil does thixotropic agent modulation is poor, can affect the printing effect of solder(ing) paste.The present invention Find that a small amount of addition castor oil hydrogenated can improve solder(ing) paste printing performance through test, while postwelding residue still possesses washable Property.Preferably, the addition of castor oil hydrogenated of the present invention is the 0.2-2% of weld-aiding cream quality of the present invention.
When the washing weld-aiding cream of the present invention is mixed with tinbase spherical solder powder, it is possible to obtain solder(ing) paste.Here tinbase Spherical solder powder can be atomized by centrifugation or ultrasonic atomization process and sieved and obtained.The granular size of tinbase spherical solder powder With it is identical used by routine, usually 25-45 μm, 20-38 μm or thinner.The present invention requires fusing point to selected solder alloy Less than 250 DEG C, it is possible to use traditional Sn63Pb37、Sn62Pb36Ag2Alloy, it is also possible to using new lead-free alloy, for example: SnAgCu, SnAg, SnBi, SnBiCu, SnBiAg, SnBiCuSb etc..These solder alloys can also including one or more Bi, In, Ag, Ni, Co, Mo, Fe, P, Ge or the like.
The present invention will wash weld-aiding cream for preparing during washing solder(ing) paste, and the content to washing weld-aiding cream is not especially limited System;When the content for washing weld-aiding cream reaches the 8-14% of washing solder(ing) paste total amount, the washing solder(ing) paste of optimum performance can be obtained, This is the optimum proportioning that the industry is assured that according to the concrete composition of tinbase spherical solder powder.The washing weld-aiding cream of the present invention Can be mainly used in and solder(ing) paste is mixed to form by vacuum stirring with tinbase spherical alloy powder (fusing point is less than 250 DEG C), be applied to The surface mount process of electronic product.
The beneficial effects of the present invention is:
The present invention uses EO-PO-EO block copolymers as surfactant to strengthen solvent polyethylene glycol (PEG) oleate pair The dissolubility of resin 1- (3- aminopropyls) imidazoles abietate, and strengthen that aqueous solvent during washing process remained to postwelding it is molten Xie Xing.And, the present invention is creatively improved to the weld-aiding cream of prior art using aerosil, to ensure this The heat resistanceheat resistant of bright weld-aiding cream is caved in ability, is conducive to present invention adaptability in use to SMT techniques.Using free from chloride The organic amine salt of hydroiodic acid still conforms to the requirement of national Halogen standard as halogen active agent, a large amount of additions, and more general Halogen activating agent have preferably help weldering activity.
Solder(ing) paste prepared by of the invention has the property that:(1) heat resistanceheat resistant performance of caving in is good;(2) the molten stannum effect of fine solder joint It is good;(3) postwelding residue can be cleaned using distilled water;(4) help weldering activity high.The solder(ing) paste of the present invention can be applicable to computer, handss The welding of the electronic products such as machine, reaches the effect of high reliability by postwelding residue thoroughly cleaning, can use distilled water conduct Abluent, it is more environmentally-friendly.
Specific embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is intended to for explaining the present invention, and can not It is interpreted as limitation of the present invention.Unreceipted particular technique or condition person in embodiment, according to described by document in the art Technology or condition or carry out according to product description.Agents useful for same or the unreceipted production firm person of instrument, are and can lead to Cross city available from conventional products.
Embodiment 1:A kind of preparation of washing weld-aiding cream
1 embodiment 1-5 of table washing weld-aiding cream formula table (w/w%)
Prepare 1- (3- aminopropyls) imidazoles abietate:1- (3- aminopropyls) imidazoles and hydrogenated rosin are with mol ratio 1:1 Ratio be dissolved in isopropanol, after neutralization reaction drying form.
Composition of raw materials:It is shown in Table 1.
Preparation method:
By 1- (3- aminopropyls) imidazoles abietate,PE 3100, PEG400 monoleate, 1, Two hydriodate of 2- ethylenediamines, castor oil hydrogenated, 1,2,3- benzotriazoles mix in adding beaker, after being heated to settled solution Low rate mixing is cooled down, and obtains paste mixture;
Above-mentioned paste mixture is mixed with the aerosil of two hydriodate of 1,2-diaminoethane, watt gram model N20, Ground with three-roll grinder, obtain mastic;
The mastic that obtain is ground to Jing three-roll grinders with Hegman grind gage to detect, when mastic fineness is less than 10 μm When, that is, the washing weld-aiding cream of this enforcement 1 is obtained.
Embodiment 2:A kind of preparation of washing weld-aiding cream
Prepare 1- (3- aminopropyls) imidazoles abietate:1- (3- aminopropyls) imidazoles and maleic acid modified Colophonium with mole Than 1:1 ratio is dissolved in isopropanol, and drying after neutralization reaction is formed.
Composition of raw materials:It is shown in Table 1.Preparation method is with embodiment 1.
Embodiment 3:A kind of preparation of washing weld-aiding cream
Prepare 1- (3- aminopropyls) imidazoles abietate:1- (3- aminopropyls) imidazoles and acrylic acid modified rosin with mole Than 1:1 ratio is dissolved in isopropanol, and drying after neutralization reaction is formed.
Composition of raw materials:It is shown in Table 1.Preparation method is with embodiment 1.
Embodiment 4:A kind of preparation of washing weld-aiding cream
Prepare 1- (3- aminopropyls) imidazoles abietate:1- (3- aminopropyls) imidazoles and maleic acid modified Colophonium with mole Than 1:1 ratio is dissolved in isopropanol, and drying after neutralization reaction is formed.
Composition of raw materials:It is shown in Table 1.Preparation method is with embodiment 1.
Embodiment 5:A kind of preparation of washing weld-aiding cream
Prepare 1- (3- aminopropyls) imidazoles abietate:1- (3- aminopropyls) imidazoles and hydrogenated rosin are with mol ratio 1:1 Ratio be dissolved in isopropanol, after neutralization reaction drying form.
Composition of raw materials:It is shown in Table 1.Preparation method is with embodiment 1.
Prepare embodiment washing solder(ing) paste:
Washing weld-aiding cream obtained by embodiment 1-5 is fully stirred under vacuumized conditions with tinbase spherical solder powder respectively Mixing is mixed, washing solder(ing) paste I, II, III, IV, V is obtained.The mixed proportion of two kinds of components is shown in Table 2:
Table 2 washes I, II, III, IV, V formula table (w/w%) of solder(ing) paste
Comparative example 1:A kind of preparation of weld-aiding cream
3 comparative example 1-4 weld-aiding cream formula table (w/w%) of table
Composition of raw materials is shown in Table 3.
Preparation method:
By 1- (3- aminopropyls) imidazoles hydrogenated rosin salt,PE 3100, PEG400 list Oleic acid During ester, castor oil hydrogenated, 1,2,3- benzotriazoles add beaker, after being heated to clarification, low rate mixing cooling;
The mixing of two hydriodate of 1,2-diaminoethane is added, and is ground with three-roll grinder;
Detected with Hegman grind gage, mastic fineness can obtain the weld-aiding cream of comparative example 1 less than 10 μm.
Comparative example 2:A kind of preparation of weld-aiding cream
Composition of raw materials:It is shown in Table 3.
Preparation method:
By hydrogenated rosin, newtrex,PE 3100, PEG400 monoleate, hydrogenated castor During oil, 1,2,3- benzotriazoles add beaker, after being heated to clarification, low rate mixing cooling;
Aerosil, the mixing of two hydriodate of 1,2-diaminoethane are added, and is ground with three-roll grinder;
Detected with Hegman grind gage, mastic fineness can obtain the weld-aiding cream of comparative example 2 less than 10 μm.
Comparative example 3:A kind of preparation of weld-aiding cream
Composition of raw materials:It is shown in Table 3.
Preparation method:
Hydrogenated rosin, newtrex, diethylene glycol monohexyl ether, castor oil hydrogenated are added in beaker, after being heated to clarification, Low rate mixing is cooled down;
Succinic acid, 2- ethyl imidazol(e)s, diphenylguanidine hydrobromate, 1,2,3- benzotriazoles are added, and uses three-roll grinder Grinding;
Detected with Hegman grind gage, mastic fineness can obtain the weld-aiding cream of comparative example 3 less than 10 μm.
Comparative example 4:A kind of preparation of weld-aiding cream
Composition of raw materials:It is shown in Table 3.
Preparation method:
By polyethylene glycol 6000, polyethylene glycol-800,PE 3100, PEG400 monoleate, hydrogen Change in Oleum Ricini, 1,2,3- benzotriazoles addition beaker, after being heated to clarification, low rate mixing cooling;
Aerosil, two hydriodate of 1,2-diaminoethane are added, and is ground with three-roll grinder;
Detected with Hegman grind gage, mastic fineness can obtain the weld-aiding cream of comparative example 4 less than 10 μm.
Prepare comparative example solder(ing) paste:
Weld-aiding cream obtained by comparative example 1-4 is sufficiently stirred for mixing under vacuumized conditions with tinbase spherical solder powder respectively Close, obtain solder(ing) paste I ', II ', III ', IV '.The mixed proportion of two kinds of components is shown in Table 4:
4 solder(ing) paste of table, I ', II ', III ', IV ' formula table (w/w%)
Above-mentioned washing solder(ing) paste I, II, III, IV, V and solder(ing) paste I ', II ', III ', IV ' are tried in following manner Test:
1. heat resistanceheat resistant slump test
Place after weld-aiding cream production solder(ing) paste is allocated after stablizing within 24 hours.Specification JIS of tin cream is defined with reference to Japanese industry The method of testing that 3284 hot slumps of Z specify is tested, and the 10-15 minutes under conditions of temperature is (180 ± 10) DEG C, is chosen 3.0mm 0.7mm figures therein are used to evaluate.
If bridging is not outstanding to the minimum 0.2mm of spacing, " A " is labeled as;If 0.2mm bridgings and 0.3mm not bridging be it is good, It is labeled as " B ";If bridging is not good for 0.3mm bridgings and 0.4mm, " C " is labeled as;Think if the larger 0.4mm bridgings of spacing It is unqualified, it is labeled as " X ".
2. the molten tin test of fine solder joint
Solder(ing) paste is printed in copper-clad plate using the steel mesh of 0.1mm thickness, printing be shaped as 0.15mm, 0.2mm, The circular pattern of 0.25mm, 0.3mm diameter, is positioned over backflow fusing the observation under 20 power microscopes in hot air reflux brazier.
If the minimum 0.15mm of diameter is completely melt for outstanding, to be labeled as " A ";If diameter 0.15mm fusings not exclusively and 0.2mm is completely melt for good, to be labeled as " B ";If diameter 0.2mm fusings not exclusively and 0.25mm is completely melt for good, to be labeled as “C”;Think unqualified if >=0.25mm fusing not exclusively, be labeled as " X ".
3. water cleaning test
Copper-clad plate after welding according to test method 2 is placed in ultrasonic washing unit and cleans, and abluent is 50 ± 5 DEG C of steaming Distilled water, scavenging period are 120 seconds, change the rinsing of distilled water similarity condition secondary after cleaning.It is placed in hot air drier after cleaning Drying, sees whether to clean up under 20 power microscopes.
It was found that postwelding residue is considered as cleaning up, " A " is labeled as;It was found that having postwelding residue to be considered as does not clean dry Only, it is labeled as " X ".
Result of the test in detail is shown in Table 5.
Performance comparison test's table of 5 each weld-aiding cream of table
Test result analysis:
Can be seen that from performance comparison test's table of 5 each weld-aiding cream of table:
Comparative example 1 uses single thixotropic agent castor oil hydrogenated, shows as the molten stannum effect of reasonable fine solder joint and water is clear Washing property, but heat resistanceheat resistant slump performance is very poor.
Comparative example 2 using disposable tin cream conventional hydrogenated rosin, newtrex, show the molten stannum effect of fine solder joint preferably and Heat resistanceheat resistant slump, but cleaning is very poor.
Comparative example 3 is the common disposable formula of printed circuit board solder(ing) paste, shows the molten stannum effect of fine solder joint preferably and resists Hot slump, but cleaning is very poor.
Comparative example 4 substitutes Colophonium using Polyethylene Glycol, and helpless weldering effect shows cleaning preferably and heat resistanceheat resistant slump, but The molten stannum poor effect of fine solder joint.
Embodiment of the present invention 1-5 uses 1- (3- aminopropyls) imidazoles abietate, EO-PO-EO block copolymers, poly- second two The materials such as alcohol oleate, aerosil, the combination property that prepared weld-aiding cream has had are prepared using the weld-aiding cream Solder(ing) paste shows fine solder joint preferably and melts stannum effect, heat resistanceheat resistant slump performance, and cleaning is good.
Although specifically showing and describing the present invention with reference to preferred embodiment, those skilled in the art should be bright In vain, in the spirit and scope of the present invention limited without departing from appended claims, in the form and details can be right The present invention makes a variety of changes, and is protection scope of the present invention.

Claims (10)

1. it is a kind of to wash weld-aiding cream, it is characterised in that including following components in percentage by weight:
The structural formula of the EO-PO-EO block copolymers is
Preferably, the EO-PO-EO block copolymers are BASF AGOne kind during PE is serial.
2. one kind according to claim 1 washes weld-aiding cream, it is characterised in that including following components in percentage by weight:
The structural formula of the EO-PO-EO block copolymers is
Preferably, the EO-PO-EO block copolymers are BASF AGOne kind during PE is serial.
3. one kind according to claim 1 washes weld-aiding cream, it is characterised in that 1- (3- aminopropyls) the imidazoles Colophonium Salt is with mol ratio 1 by 1- (3- aminopropyls) imidazoles and Colophonium:1 ratio is dissolved in isopropanol, is dried after neutralization reaction ;
Preferably, the Colophonium be hydrogenated rosin, maleic acid modified Colophonium, the one kind in acrylic acid modified rosin.
4. one kind according to claim 1 washes weld-aiding cream, it is characterised in that the polyethylene glycol (PEG) oleate is poly- second two It is 200 monoleate of alcohol, polyethylene glycol 200 dioleic acid ester, PEG400 monoleate, PEG400 dioleic acid ester, poly- One or more in 600 monoleate of ethylene glycol, Macrogol 600 dioleic acid ester.
5. one kind according to claim 1 washes weld-aiding cream, it is characterised in that the halogen active agent has for hydroiodic acid Machine amine salt.
6. one kind according to claim 5 washes weld-aiding cream, it is characterised in that the halogen active agent is 1,2-diaminoethane One kind in two hydriodates, 1,2- dimethyl -2- isothiourea hydriodates, N- amino-N- amyl group guanidine hydriodates.
7. one kind according to claim 1 washes weld-aiding cream, it is characterised in that the aerosil is hydrophobicity gas Aerosil;
Preferably, the aerosil is watt gram model N20, Degussa model AEROSIL 380, Degussa model One kind in A200, moral mountain model REOLOSIL QS40, Cabot M-5.
8. one kind according to claim 1 washes weld-aiding cream, it is characterised in that the corrosion inhibiter is 1,2,3- benzene, three nitrogen of a pair of horses going side by side One kind in azoles, benzimidazole, TTA.
9. the preparation method of the arbitrary described washing weld-aiding cream of a kind of claim 1-8, it is characterised in that comprise the following steps:
Raw material is weighed by weight percentage;
By 1- (3- aminopropyls) imidazoles abietate, EO-PO-EO block copolymers, polyethylene glycol (PEG) oleate, halogen activator, Castor oil hydrogenated, corrosion inhibiter mix in adding beaker, and after being heated into settled solution, low rate mixing cooling obtains paste mixture;
The paste mixture is mixed with halogen activator, aerosil, is ground with three-roll grinder, obtain mastic;
The mastic is detected with Hegman grind gage, when the mastic fineness is less than 10 μm, obtain washing weld-aiding cream.
10. it is a kind of to wash solder(ing) paste, it is characterised in that containing following component:The arbitrary described washing of claim 1-8 helps weldering Cream, tinbase spherical solder powder.
CN201611186140.8A 2016-12-20 2016-12-20 A kind of washing weld-aiding cream, solder(ing) paste and preparation method thereof Active CN106514057B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611186140.8A CN106514057B (en) 2016-12-20 2016-12-20 A kind of washing weld-aiding cream, solder(ing) paste and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611186140.8A CN106514057B (en) 2016-12-20 2016-12-20 A kind of washing weld-aiding cream, solder(ing) paste and preparation method thereof

Publications (2)

Publication Number Publication Date
CN106514057A true CN106514057A (en) 2017-03-22
CN106514057B CN106514057B (en) 2018-08-14

Family

ID=58340518

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611186140.8A Active CN106514057B (en) 2016-12-20 2016-12-20 A kind of washing weld-aiding cream, solder(ing) paste and preparation method thereof

Country Status (1)

Country Link
CN (1) CN106514057B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113441875A (en) * 2020-03-27 2021-09-28 千住金属工业株式会社 Cleaning flux and cleaning paste
US11167380B2 (en) * 2018-06-01 2021-11-09 Senju Metal Industry Co., Ltd. Flux for solder paste and solder paste
CN114289932A (en) * 2022-01-24 2022-04-08 云南锡业锡材有限公司 Halogen-free cleaning-free lead-free soldering tin wire soldering flux and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070199976A1 (en) * 2006-02-27 2007-08-30 Mao-Yao Huang Process of forming a polyol
US20090035467A1 (en) * 2003-08-12 2009-02-05 Hideki Sekiguchi Recording Liquid, Liquid Cartridge, Liquid Emitting Device and Liquid Emitting Method
CN101818378A (en) * 2010-04-26 2010-09-01 江苏林洋新能源有限公司 Velvet manufacturing solution of monocrystalline silicon additive
CN102161135A (en) * 2011-03-30 2011-08-24 浙江强力焊锡材料有限公司 Lead-free welding tin wire and water-soluble welding flux used by same
CN103422175A (en) * 2013-08-30 2013-12-04 昊诚光电(太仓)有限公司 Polishing method for solar cell silicon wafer
CN103909358A (en) * 2014-03-13 2014-07-09 江苏科技大学 Water-washing type solder paste and preparation method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090035467A1 (en) * 2003-08-12 2009-02-05 Hideki Sekiguchi Recording Liquid, Liquid Cartridge, Liquid Emitting Device and Liquid Emitting Method
US20070199976A1 (en) * 2006-02-27 2007-08-30 Mao-Yao Huang Process of forming a polyol
CN101818378A (en) * 2010-04-26 2010-09-01 江苏林洋新能源有限公司 Velvet manufacturing solution of monocrystalline silicon additive
CN102161135A (en) * 2011-03-30 2011-08-24 浙江强力焊锡材料有限公司 Lead-free welding tin wire and water-soluble welding flux used by same
CN103422175A (en) * 2013-08-30 2013-12-04 昊诚光电(太仓)有限公司 Polishing method for solar cell silicon wafer
CN103909358A (en) * 2014-03-13 2014-07-09 江苏科技大学 Water-washing type solder paste and preparation method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11167380B2 (en) * 2018-06-01 2021-11-09 Senju Metal Industry Co., Ltd. Flux for solder paste and solder paste
EP3804902A4 (en) * 2018-06-01 2022-03-16 Senju Metal Industry Co., Ltd. Flux for solder paste and solder paste
CN113441875A (en) * 2020-03-27 2021-09-28 千住金属工业株式会社 Cleaning flux and cleaning paste
US11298780B2 (en) 2020-03-27 2022-04-12 Senju Metal Industry Co., Ltd. Flux and solder paste using the same
CN114289932A (en) * 2022-01-24 2022-04-08 云南锡业锡材有限公司 Halogen-free cleaning-free lead-free soldering tin wire soldering flux and preparation method thereof
CN114289932B (en) * 2022-01-24 2023-02-24 云南锡业锡材有限公司 Halogen-free cleaning-free lead-free soldering tin wire soldering flux and preparation method thereof

Also Published As

Publication number Publication date
CN106514057B (en) 2018-08-14

Similar Documents

Publication Publication Date Title
TW317519B (en)
CN102513734B (en) Method for preparing paste soldering flux
CN102398124B (en) Water-based cleaning-free flux for lead-free welding flux and preparation method thereof
CN106514057B (en) A kind of washing weld-aiding cream, solder(ing) paste and preparation method thereof
CN104476007B (en) A kind of high-melting point lead-free halogen-free soldering tin paste and preparation method thereof
TW200812741A (en) No-clean low-residue solder paste for semiconductor device applications
JPWO2009020199A1 (en) Cleaning composition for removing lead-free solder flux and method for removing lead-free solder flux
CN108555474B (en) Halogen-free environment-friendly lead-free tin paste and preparation method thereof
CN101780606A (en) Washing-free lead-free halogen-free tin soldering paste
CN102513735A (en) Flux paste for high-bismuth content solder paste and preparation method thereof
CN102166689B (en) Halogen-free lead-free soldering paste and soldering flux used by same
CN101352788B (en) Scaling powder for leadless soldering tin
JP6136851B2 (en) Solder flux and solder paste
JPWO2010041668A1 (en) Flux, conductive paste, bonded component and method for manufacturing bonded component
CN106392380A (en) No-clean flux high in welding passing rate
JPH05501082A (en) Use of organic acids in low residue solder pastes
CN102528329A (en) Halogen-free and lead-free solder paste and preparation method
CN110328467A (en) A kind of scaling powder and preparation method thereof
JP5945914B2 (en) Cleaning agent for removing flux residue
JP2004158728A (en) Flux for soldering circuit board, and solder paste
JP2011104638A (en) Water-soluble flux, conductive paste, and bonded component
WO2023179805A1 (en) Flux for no-clean gold-tin soldering paste, preparation method therefor, and application thereof
GB2080341A (en) Solder Flux Compositions
CN106514056A (en) Preparation method for electronic substrate welding assistant
CN105598602A (en) Halogen-free soldering flux for high-activity tin wire and preparation method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: The invention relates to a water washing solder aid paste, a solder paste and a preparation method thereof

Effective date of registration: 20210622

Granted publication date: 20180814

Pledgee: Xiamen finance Company limited by guarantee

Pledgor: XIAMEN JISSYU SOLDER Co.,Ltd.

Registration number: Y2021980005049

PE01 Entry into force of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20230529

Granted publication date: 20180814

Pledgee: Xiamen finance Company limited by guarantee

Pledgor: XIAMEN JISSYU SOLDER Co.,Ltd.

Registration number: Y2021980005049

PC01 Cancellation of the registration of the contract for pledge of patent right