CN106498197B - A kind of preparation method of Sn Cu Al series lead-free solders - Google Patents
A kind of preparation method of Sn Cu Al series lead-free solders Download PDFInfo
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- CN106498197B CN106498197B CN201610912324.1A CN201610912324A CN106498197B CN 106498197 B CN106498197 B CN 106498197B CN 201610912324 A CN201610912324 A CN 201610912324A CN 106498197 B CN106498197 B CN 106498197B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/02—Compacting only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The present invention provides a kind of preparation method of Sn Cu Al series lead-free solders, first glass putty, copper powder, aluminium powder raw material are weighed according to the percentage by weight of each component, powder is well mixed using planetary ball mill, then powder is pressed into metallic monolith, melting finally is carried out using non-consumable arc furnace, alloy cast ingot is obtained after cooling.The lead-free solder of the present invention have alternative conventional solder and it is cheap the advantages of, while solve the technical barrier that aluminium is not easy mutually to melt in tin alloy.The present invention makes aluminium, and as micro alloying element, being formed strengthens phase, and is evenly distributed in tin Copper substrate, effectively increases the microhardness of matrix.
Description
Technical field
The invention belongs to lead-free solder technical field, and in particular to the preparation method of Sn-Cu series lead-free solder alloys.
Background technology
Lead in conventional tin-lead solders in electronic product waste procedures, seriously pollutes environment as poisonous heavy metal,
Human health is threatened, and the disabling of solder containing pb has become the hard requirement of electronics industry development with limiting the use of.Lead-free solder
Research and development need to consider whether it meets the requirement of performance from the following aspect：1) low melting point；2) suitable electrical conductivity,
The physical properties such as thermal conductivity, thermal coefficient of expansion；3) it is good with the wetability of existing device substrate, lead and PCB material；4) enough
Mechanical mechanics property：Shear strength, creep resistance, isothermal fatigue drag, heat engine fatigue resistance, the stabilization of metallography tissue
Property.In addition to the requirement for meeting performance, the New Lead-free Solder of research and development also needs to consider economic serviceability.
In a series of lead-free solders for having been developed that and studying, Sn-Cu systems price is the cheapest, and is easily recycled profit
With, but because the content of Sn in its eutectic composition is more, substantial amounts of sn rich phase, and the IMC (Cu formed are formed in tissue6Sn5) point
Cloth is more concentrated, and causes to show poor mechanical property under the normal temperature of Sn-Cu solder.The addition of minor-alloying element Al is not only formed
New enhancing phase, and make IMC distribution more scattered, so as to improving the mechanical property of Sn-Cu eutectic solders.
But in terms of Sn-Cu-Al alloys are prepared, because the system thermodynamically shows sizable mutually molten reprimand
Power, if using conventional cast smelting technology, micro aluminium element is difficult to be evenly distributed among alloy, does not reach the reason of composition design
Think effect.
The content of the invention
It is an object of the invention to provide a kind of preparation method of Sn-Cu-Al series lead-free solders, using ball milling tabletting and vacuum
Electric arc melting technology is combined；Parameters in strict control mechanical milling process, make ball milling mixing good, ensure follow-up melting
The uniformity organized in journey, solve in conventional cast smelting technology and mutually melt the larger Sn-Cu-Al systems alloy structure of repulsion not
Enough uniform problems.
The preparation method of the Sn-Cu-Al series lead-free solders of the present invention, comprises the following steps：
(1) raw material weighs, and weighing glass putty, copper powder, aluminium powder respectively according to the percentage by weight of each raw material components is put into ball milling
In tank；
(2) ball mill mixing, according to 10~15:1 ratio of grinding media to material, abrading-ball is put into the ball grinder for installing raw material, and abrading-ball is adopted
With the stainless steel ball of diameter 4mm and 6mm two kinds of specifications, proportioning is 1 each other:1~2；Then ball grinder is vacuumized, vacuum
Degree control is 5~10Pa；Inert gas is re-filled with, progress 30~80min of ball mill mixing in ball mill is finally putting into, controls rotating speed
For 80~150r/min；
(3) pressed powder, take well mixed powder to be put into compression mold and carry out tabletting, be forced into 8~12MPa, protect
5~10min is held, obtains metal sheeting；
(4) vacuum melting, metal sheeting is put into the crucible in non-consumable arc furnace, to electric arc stove evacuation,
Vacuum degree control is 1 × 10-3~7 × 10-3Pa；It is re-filled with inert gas and carries out gas washing；Finally enter under the protection of inert gas
Row melting, melting voltage are 220V, and melting current control closes electric arc after 10~50A, 30~60s of holding, obtains liquid conjunction
Gold；
(5) cooling of liquid alloy, under inert gas shielding, to crucible bottom water flowing, using the water of flowing to alloy
Quickly cooled down, alloy is 5~30 seconds by the cool time of liquid to solid-state, is taken out after being cooled to room temperature, you can obtain Sn-
Cu-Al series lead-free solder alloys.
As the preferred of technical scheme, ball mill uses planetary ball mill, and the ball mill alternate-running time is 5~
10min, alternate pause time are 5~10min.
As the preferred of technical scheme, the inert gas is argon gas.
In mechanical milling process, ratio of grinding media to material determines whether the mechanical impact that abrading-ball is applied to powder in mechanical milling process is sufficient
Enough trigger the broken and refinement of crystal grain, so as to reach nanometer particle.In general, ratio of grinding media to material is bigger, the probability of abrading-ball collision
Also it is bigger so that the absorbable mechanical energy of powder is more within unit interval and unit volume, correspondingly reaches equal ball milling effect
The Ball-milling Time of fruit is also shorter.But if ratio of grinding media to material is too high, then the collision in spherical tank reforms into touching between abrading-ball and tank skin
The process for main body is hit, reduces grinding efficiency on the contrary, also ball-milling medium can be lost, generates some pollutants.Make
For the preferred of technical scheme, the ratio of grinding media to material of the step (2) is 10:1；The proportioning of diameter 4mm and 6mm stainless steel abrading-ball is 1:
1.3, the size of abrading-ball and with compare raw material ball levigateization have facilitation, using such proportioning, have for properties of product
Raising act on, can promotion organization uniformly refine.
As the preferred of technical scheme, raw material weight percentage of the invention is copper 0.62~0.85%, aluminium 0.055%~
0.084%, surplus is tin.Wherein copper 0.70%, aluminium 0.075%, surplus is the raw material proportioning of tin, the Sn-Cu-Al prepared
Series lead-free solder alloy structure is more uniformly distributed refinement.
The Sn-Cu-Al series lead-free solder alloys micro-vickers hardness that the present invention prepares is 17~23HV.
Rotation during ball milling mainly by spherical tank causes abrading-ball therein to move, collision, and then powder is carried out
It is broken.As a rule, rotating speed is faster, and caused energy is bigger, and its operating efficiency is also higher, but when rotating speed is more than a certain critical
After value, the centrifugal force suffered by abrading-ball is excessive, and most times are all attached on tank skin, reduces operating efficiency on the contrary.Therefore
The difference according to material is needed, the appropriate value of a comparison is taken to the rotating speed of ball mill, therefore the rotating speed that the present invention uses is 90
Best results when~150r/min, wherein rotating speed are 90r/min.
Micro aluminium element is evenly mixed in matrix powder by the present invention by mechanical milling process, then carries out tabletting guarantor to powder
After pressure processing, vacuum melting is finally carried out, this series of steps causes aluminium to be easy to form the equally distributed increasing of disperse in the base
Qiang Xiang, effectively increase the microhardness of matrix.And because aluminium and tin are deposited during conventional cast melting or vacuum melting technique
Repulsion is mutually melted in sizable thermodynamics, when liquid aluminium and liquid tin are in process of setting, is easily independently solidified, Trace Aluminum is not
The enhancing phase of Dispersed precipitate is easily formed, does not have the effect of microalloying.
Beneficial effects of the present invention：
1st, combining powder metallurgy of the present invention prepares Sn-Cu-Al series lead-free solders with vacuum melting technology so for preparing
The Sn-Cu-Al alloy structures solid solution effect come is preferable with uniformization effect, function admirable, and hardness is strong.
2nd, the present invention strict ratio of grinding media to material, rotating speed and the particle diameter for controlling ball milling, is advantageous to material powder in mechanical milling process
Refine, the refinement of promotion organization, improve the uniformity of alloy powder.
3rd, the present invention adds micro aluminium element, is evenly mixed in by the optimization of ball milling parameter in powder, makes it rear
The enhancing formed during continuous vacuum arc melting, which is mutually evenly distributed in tin Copper substrate, to be possibly realized, and is overcome in traditional handicraft
Aluminium independently condenses in tin alloy, is not easy mutually to melt, is not easy to form the technical problem of the enhancing phase of Dispersed precipitate, obtained Sn-Cu-
Also more refined containing aluminium enhancing phase, crystal grain in Al alloy finished product tissues, alloy vickers microhardness value is 22.16HV, with making
The vickers microhardness value 13HV obtained with traditional melt casting process is compared, and improves 170%.
Brief description of the drawings
Fig. 1 is the microstructure picture of the embodiment of the present invention 2.
Fig. 2 is the XRD spectral lines of the embodiment of the present invention 2.
Specific embodiment
With reference to instantiation, the present invention is described further, but protection scope of the present invention does not limit to reality
Apply the scope of example expression.
Embodiment 1
1. composition of raw materials
Raw material components and percentage by weight are：Copper 0.70%, aluminium 0.075%, surplus are tin.Tin, copper, aluminum feedstock are
The metal dust of 200 mesh, purity are higher than 99.9%.
2. preparation method
(1) raw material weighs, and weighing glass putty, copper powder, aluminium powder respectively according to the percentage by weight of each raw material components is put into ball milling
In tank, every kind of powder weight precision controlling is in ± 0.00005g.
(2) ball mill mixing, the ratio of grinding media to material as listed by table 1-1, the stainless steel ball of diameter two kinds of specifications of 4mm and 6mm is pressed into quality
Than 1:1.3 are put into the ball grinder for installing raw material；Then ball grinder is vacuumized, vacuum degree control is 5~10Pa；It is re-filled with argon
Gas, ball grinder is put into planetary ball mill, ball mill operating parameters are alternate-running time 5min, the alternate pause time
5min, orthogonal test finally is carried out to ball milling major parameter by table 1-1.
Table 1-1 ball milling major parameter orthogonal arrays
(3) pressed powder, take well mixed 10 ± 1g of powder to be put into a diameter of 8mm compression mold and carry out tabletting,
10MPa is forced into, keeps 5min.
(4) vacuum melting, metal sheeting is put into the crucible in non-consumable arc furnace, to electric arc stove evacuation,
Vacuum degree control is 2 × 10-3~6 × 10-3Pa；It is re-filled with argon gas and carries out gas washing, fills gas washing and repeat 2~3 times；Finally in argon gas
Protection under carry out melting, melting voltage is 220V, and melting current control closes electric arc in 10~50A after keeping 30~60s,
Obtain liquid alloy.
(5) cooling of liquid alloy, under argon gas protection, to crucible bottom water flowing, alloy is carried out using the water of flowing
Quick cooling, alloy are 5~30 seconds by the cool time of liquid to solid-state.
(6) the last melting of repeat step (4) and step (5) 2~3 times, then etc. electric arc furnaces be cooled to room temperature after take out, point
Sn-Cu-Al series lead-free solders sample 1 corresponding with tested number 1~4, sample 2, sample 3, sample 4 are not obtained.
3. material property analysis detection
Sn-Cu-Al series lead-free solders sample made from above-mentioned preparation method is carried out using HVT-1000 microhardness testers
Hardness test, load 0.2N, load time 10s, and range analysis of orthogonal experiment is carried out to test result, analysis result is shown in Table 1-
2。
Table 1-2 ball milling major parameter range analysis of orthogonal experiment
In range analysis of orthogonal experiment, the numerical value that factor corresponds to extreme difference is bigger, illustrates the shadow of the factors on test result
Sound is bigger, and average represents hardness corresponding to level, and hardness is the higher the better, illustrates that this time experiment average is bigger, corresponding level
To be optimal.Descending influence of the ball milling parameter to Sn-Cu-Al series lead-free solder hardness knowable to table 1-2 is rotating speed, ball successively
Time consuming, ratio of grinding media to material, the horizontal quadrature of three factor two experiment optimal parameter is rotating speed 90r/min, Ball-milling Time 35min, ratio of grinding media to material
10:1。
Embodiment 2
1. composition of raw materials：Raw material components and percentage by weight are：Copper 0.70%, aluminium 0.075%, surplus are tin.Tin, copper,
Aluminum feedstock is the metal dust of 200 mesh, and purity is higher than 99.9%.
2. preparation method
(1) raw material weighs, and weighing glass putty, copper powder, aluminium powder respectively according to the percentage by weight of each raw material components is put into ball milling
In tank, every kind of powder weight precision controlling is in ± 0.00005g.
(2) ball mill mixing, by ratio of grinding media to material 10:1, by the stainless steel ball in mass ratio 1 of diameter two kinds of specifications of 4mm and 6mm:
1.3 are put into the ball grinder for installing raw material；Then ball grinder is vacuumized, vacuum degree control is 5~10Pa；It is re-filled with argon gas,
It is put into planetary ball mill, ball mill operating parameters are alternate-running time 5min, alternate pause time 5min, Ball-milling Time
35min, finally optimizes experiment to rotating speed, rotating speed is arranged to 80,90,100r/min.
(3) pressed powder, take well mixed 10 ± 1g of powder to be put into a diameter of 8mm compression mold and carry out tabletting,
10MPa is forced into, keeps 5min.
(4) vacuum melting, metal sheeting is put into the crucible in non-consumable arc furnace, to electric arc stove evacuation,
Vacuum degree control is 2 × 10-3~6 × 10-3Pa；It is re-filled with argon gas and carries out gas washing, fills gas washing and repeat 2~3 times；Finally in argon gas
Protection under carry out melting, melting voltage is 220V, and melting current control closes electric arc in 10~50A after keeping 30~60s,
Obtain liquid alloy.
(5) cooling of liquid alloy, under argon gas protection, to crucible bottom water flowing, alloy is carried out using the water of flowing
Quick cooling, alloy are 5~30 seconds by the cool time of liquid to solid-state.
(6) the last melting of repeat step (4) and step (5) 2~3 times, then etc. electric arc furnaces be cooled to room temperature after take out, point
Do not obtain and rotating speed 80,90, the corresponding Sn-Cu-Al series lead-free solders samples 5 of 100r/min, sample 6, sample 7.
3. material property analysis detection
Sn-Cu-Al series lead-free solders sample made from above-mentioned preparation method is carried out using HVT-1000 microhardness testers
Hardness test, load 0.2N, load time 10s, sample 5, sample 6, the micro-vickers hardness of sample 7 be respectively 19.58,
22.16、19.08HV.Fig. 1 is the microstructure picture of sample 6, and matrix is typical Sn-0.7Cu alloy structures in figure, is petal
Shape β-Sn phase+Cu6Sn5/ β-Sn eutectic phases, then Dispersed precipitate is in the base for the tiny strip enhancing phase containing aluminium.Fig. 2 is sample 6
X ray diffracting spectrum, show phase content more β-Sn and Cu6Sn5 presence.
Embodiment 3
1. composition of raw materials：Raw material components and percentage by weight are：Copper 0.62%, aluminium 0.055%, surplus are tin.Tin, copper,
Aluminum feedstock is the metal dust of 200 mesh, and purity is higher than 99.9%.
2. preparation method
(1) raw material weighs, and weighing glass putty, copper powder, aluminium powder respectively according to the percentage by weight of each raw material components is put into ball milling
In tank, every kind of powder weight precision controlling is in ± 0.00005g.
(2) ball mill mixing, by ratio of grinding media to material 12:1, by the stainless steel ball in mass ratio 1 of diameter two kinds of specifications of 4mm and 6mm:1
It is put into the ball grinder for installing raw material；Then ball grinder is vacuumized, vacuum degree control is 5~10Pa；Argon gas is re-filled with, is put into
In planetary ball mill, ball mill operating parameters are alternate-running time 8min, alternate pause time 8min, Ball-milling Time
50min, rotating speed is arranged to 80,90,150r/min.
(3) pressed powder, take well mixed 10 ± 1g of powder to be put into a diameter of 8mm compression mold and carry out tabletting,
8MPa is forced into, keeps 10min.
(4) vacuum melting, metal sheeting is put into the crucible in non-consumable arc furnace, to electric arc stove evacuation,
Vacuum degree control is 1 × 10-3~4 × 10-3Pa；It is re-filled with argon gas and carries out gas washing, fills gas washing and repeat 2~3 times；Finally in argon gas
Protection under carry out melting, melting voltage is 220V, and melting current control closes electric arc in 10~20A after keeping 30~40s,
Obtain liquid alloy.
(5) cooling of liquid alloy, under argon gas protection, to crucible bottom water flowing, alloy is carried out using the water of flowing
Quick cooling, alloy are 5~10 seconds by the cool time of liquid to solid-state.
(6) the last melting of repeat step (4) and step (5) 2~3 times, then etc. electric arc furnaces be cooled to room temperature after take out, point
Do not obtain and rotating speed 80,90, the corresponding Sn-Cu-Al series lead-free solders samples 8 of 150r/min, sample 9, sample 10.
3. material property analysis detection
Sn-Cu-Al series lead-free solders sample made from above-mentioned preparation method is carried out using HVT-1000 microhardness testers
Hardness test, load 0.2N, load time 10s, sample 8, sample 9, the micro-vickers hardness of sample 10 be respectively 19.96,
21.85、19.23HV。
Embodiment 4
1. composition of raw materials：Raw material components and percentage by weight are：Copper 0.85%, aluminium 0.084%, surplus are tin.Tin, copper,
Aluminum feedstock is the metal dust of 200 mesh, and purity is higher than 99.9%.
2. preparation method
(1) raw material weighs, and weighing glass putty, copper powder, aluminium powder respectively according to the percentage by weight of each raw material components is put into ball milling
In tank, every kind of powder weight precision controlling is in ± 0.00005g.
(2) ball mill mixing, by ratio of grinding media to material 15:1, by the stainless steel ball in mass ratio 1 of diameter two kinds of specifications of 4mm and 6mm:2
It is put into the ball grinder for installing raw material；Then ball grinder is vacuumized, vacuum degree control is 5~10Pa；Argon gas is re-filled with, is put into
In planetary ball mill, ball mill operating parameters are alternate-running time 10min, alternate pause time 10min, Ball-milling Time
60min, rotating speed is arranged to 80,90,150r/min.
(3) pressed powder, take well mixed 10 ± 1g of powder to be put into a diameter of 8mm compression mold and carry out tabletting,
12MPa is forced into, keeps 8min.
(4) vacuum melting, metal sheeting is put into the crucible in non-consumable arc furnace, to electric arc stove evacuation,
Vacuum degree control is 3 × 10-3~7 × 10-3Pa；It is re-filled with argon gas and carries out gas washing, fills gas washing and repeat 2~3 times；Finally in argon gas
Protection under carry out melting, melting voltage is 220V, and melting current control closes electric arc in 40~50A after keeping 40~60s,
Obtain liquid alloy.
(5) cooling of liquid alloy, under argon gas protection, to crucible bottom water flowing, alloy is carried out using the water of flowing
Quick cooling, alloy are 20~30 seconds by the cool time of liquid to solid-state.
(6) the last melting of repeat step (4) and step (5) 2~3 times, then etc. electric arc furnaces be cooled to room temperature after take out, point
Do not obtain and rotating speed 80,90, the corresponding Sn-Cu-Al series lead-free solders samples 11 of 150r/min, sample 12, sample 13.
3. material property analysis detection
Sn-Cu-Al series lead-free solders sample made from above-mentioned preparation method is carried out using HVT-1000 microhardness testers
Hardness test, load 0.2N, load time 10s, sample 11, sample 12, the micro-vickers hardness of sample 13 be respectively 19.85,
21.97、19.51HV。
Claims (6)
- A kind of 1. preparation method of Sn-Cu-Al series lead-free solders, it is characterised in that：Comprise the following steps：（1）Raw material weighs, and weighing glass putty, copper powder, aluminium powder respectively according to the percentage by weight of each raw material components is put into ball grinder； The raw material weight percentage is copper 0.62 ~ 0.85%, and aluminium 0.055% ~ 0.084%, surplus is tin；（2）Ball mill mixing, according to 10~15:1 ratio of grinding media to material, abrading-ball is put into the ball grinder for installing raw material, and abrading-ball uses The stainless steel ball of diameter 4mm and 6mm two kinds of specifications, proportioning is 1 each other: 1~2；Then ball grinder is vacuumized, vacuum Degree control is 5~10Pa；Inert gas is re-filled with, is finally putting into the progress min of ball mill mixing 30 ~ 80 in planetary ball mill, control Rotating speed processed is 80 ~ 150r/min；（3）Pressed powder, take well mixed powder to be put into compression mold and carry out tabletting, be forced into 8 ~ 12 MPa, keep 5 ~ 10min, obtain metal sheeting；（4）Vacuum melting, metal sheeting is put into the crucible in non-consumable arc furnace, to electric arc stove evacuation, vacuum Degree control is 1 × 10-3~7 × 10-3Pa；It is re-filled with inert gas and carries out gas washing；Finally melted under the protection of inert gas Refining, melting voltage are 220V, and melting current control closes electric arc after 10 ~ 50A, 30 ~ 60s of holding, obtains liquid alloy；（5）The cooling of liquid alloy, under inert gas shielding, to crucible bottom water flowing, alloy is carried out using the water of flowing Quick cooling, alloy are 5 ~ 30 seconds by the cool time of liquid to solid-state, are taken out after being cooled to room temperature, you can obtain Sn-Cu-Al Series lead-free solder alloy.
- 2. the preparation method of Sn-Cu-Al series lead-free solders according to claim 1, it is characterised in that：The planetary ball The alternate-running time of grinding machine is 5 ~ 10min, and the alternate pause time is 5 ~ 10min.
- 3. the preparation method of Sn-Cu-Al series lead-free solders according to claim 1, it is characterised in that：The inert gas For argon gas.
- 4. the preparation method of Sn-Cu-Al series lead-free solders according to claim 1, it is characterised in that：The step（2） Ratio of grinding media to material be 10: 1；The proportioning of diameter 4mm and 6mm stainless steel abrading-ball is 1: 1.3.
- 5. the preparation method of Sn-Cu-Al series lead-free solders according to claim 1, it is characterised in that：The raw material weight Percentage is copper 0.70%, and aluminium 0.075%, surplus is tin.
- 6. the preparation method of Sn-Cu-Al series lead-free solders according to claim 1, it is characterised in that：The Sn-Cu-Al Series lead-free solder alloy micro-vickers hardness is 17 ~ 23HV.
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| CN107177751B (en) * | 2017-04-25 | 2019-08-30 | 广西大学 | The good lead-free solder and preparation method thereof of a kind of corrosion-resistant and wetability |
| CN108374104A (en) * | 2018-03-09 | 2018-08-07 | 广西大学 | A kind of low melting point Sn-Bi-Al series lead-free solder alloy materials and preparation method thereof |
| CN108356441A (en) * | 2018-05-16 | 2018-08-03 | 深圳市亿铖达工业有限公司 | A kind of Sn base solders and preparation method thereof can be used for automotive electronics encapsulation |
| CN113088748B (en) * | 2021-04-02 | 2022-03-04 | 深圳市荟艺珠宝实业有限公司 | Preparation method of gold solder |
| CN115341111A (en) * | 2022-08-22 | 2022-11-15 | 桂林电子科技大学 | Ni-Sn series intermetallic compound and preparation method and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1895837A (en) * | 2005-07-12 | 2007-01-17 | 北京有色金属研究总院 | Sn-Cu-Cr lead-free soldering material and its preparation |
| CN102371438A (en) * | 2011-10-17 | 2012-03-14 | 上海交通大学 | Sn-Cu-Bi-Al lead-free solder |
| CN105921915A (en) * | 2016-07-01 | 2016-09-07 | 江苏大学 | Copper-based brazing material and brazing technique for hard alloy |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3074649B1 (en) * | 1999-02-23 | 2000-08-07 | インターナショナル・ビジネス・マシーンズ・コーポレ−ション | Lead-free solder powder, lead-free solder paste, and methods for producing them |
| WO2013099849A1 (en) * | 2011-12-27 | 2013-07-04 | 千住金属工業株式会社 | Sn-Cu-BASED LEAD-FREE SOLDER ALLOY |
-
2016
- 2016-10-18 CN CN201610912324.1A patent/CN106498197B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1895837A (en) * | 2005-07-12 | 2007-01-17 | 北京有色金属研究总院 | Sn-Cu-Cr lead-free soldering material and its preparation |
| CN102371438A (en) * | 2011-10-17 | 2012-03-14 | 上海交通大学 | Sn-Cu-Bi-Al lead-free solder |
| CN105921915A (en) * | 2016-07-01 | 2016-09-07 | 江苏大学 | Copper-based brazing material and brazing technique for hard alloy |
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