CN106488654A - The manufacture method of coil support plate - Google Patents
The manufacture method of coil support plate Download PDFInfo
- Publication number
- CN106488654A CN106488654A CN201510533883.7A CN201510533883A CN106488654A CN 106488654 A CN106488654 A CN 106488654A CN 201510533883 A CN201510533883 A CN 201510533883A CN 106488654 A CN106488654 A CN 106488654A
- Authority
- CN
- China
- Prior art keywords
- plate body
- hole
- groove
- ring region
- coil support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Motors, Generators (AREA)
Abstract
A kind of manufacture method of coil support plate, comprises the steps：The first step, provides the first plate body and is sticked one side glue in the first plate body one side surface, is sticked double faced adhesive tape in another side surface；Second step, opens up first groove, first through hole, first connects hole and a slot segmentation in a be sticked side surface of double faced adhesive tape of the first plate body；3rd step, provides the second plate body and the side surface in the second plate body is sticked double faced adhesive tape；4th step, opens up in the second plate body and forms second groove, the second through hole and second connects hole；5th step, the first plate body is fitted with the second plate body and is fixed as one；6th step, removes the one side glue on the first plate body surface.
Description
Technical field
The present invention relates to a kind of support plate, particularly to a kind of manufacture method of coil support plate.
Background technology
The today developing rapidly in electronic product, a lot of electronic equipments such as mobile phone, flat board etc. are integrated with wireless charging function in a large number.
Have in the electronic equipment of wireless charging function and be equiped with wireless charging module.The support plate that described wireless charging module includes Wireless charging coil and carries described Wireless charging coil.Common, described support plate surface is formed with some grooves by the processing such as machining or ejection formation and is used for housing described Wireless charging coil.But; described most of support plate thickness is all generally grade and high to requirement on machining accuracy; when described groove is processed by machining or ejection formation; described support plate would generally because of extruding or stretching discontinuity and be easily caused described support plate and deform upon so that support plate surface smoothness is poor and affect the cooperation between Wireless charging coil and support plate.
Content of the invention
In view of this, the present invention provides a kind of manufacture method of good, the cheap coil support plate of flatness.
A kind of manufacture method of coil support plate, comprises the steps：
The first step, provides the first plate body and is sticked one side glue in the first plate body one side surface, is sticked double faced adhesive tape in another side surface；
Second step, forms first groove, first through hole, first connects hole and slot segmentation in a be sticked side surface of double faced adhesive tape of the first plate body；
3rd step, provides the second plate body and the side surface in the second plate body is sticked double faced adhesive tape；
4th step, connects hole in the second plate body formation second groove, the second through hole and second；
5th step, the first plate body is fitted with the second plate body and is fixed as one；And
6th step, removes the one side glue on the first plate body surface.
In coil support plate manufacture method of the present invention, on the first plate body and the second plate body, punching forms first groove and second groove respectively first, then by the first plate body and the positioning laminating of the second plate body.So, it is to avoid the deformation to the impact of plate body of a large amount of grooves is formed on single plate body, the surface smoothness of coil support plate formed after has been effectively ensured.And coil support plate of the present invention eliminates the higher Digit Control Machine Tool of use cost by conventional tool punching, has saved the manufacturing cost of coil support plate.
Brief description
Fig. 1 is the manufacturing flow chart of coil support plate of the present invention.
Fig. 2-10 is each step schematic diagram of manufacture method of coil support plate of the present invention.
Main element symbol description
| Coil support plate | 100 |
| First plate body | 10 |
| First groove | 11 |
| First through hole | 12 |
| First connects hole | 13 |
| Slot segmentation | 14 |
| First ring region | 111 |
| Second ring region | 112 |
| 3rd ring region | 113 |
| 4th ring region | 114 |
| 5th ring region | 115 |
| 6th ring region | 116 |
| 7th ring region | 117 |
| 8th ring region | 118 |
| 9th ring region | 119 |
| Second plate body | 20 |
| Second groove | 21 |
| Second through hole | 22 |
| Second connects hole | 23 |
| 3rd plate body | 30 |
| Third through-hole | 31 |
| 3rd connects hole | 32 |
| 4th plate body | 40 |
| Fourth hole | 41 |
| Line card | 43 |
Following specific embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Specific embodiment
As shown in figure 1, the present invention provides a kind of coil support plate 100 to be used for carrying Wireless charging coil（Not shown）.The manufacture method of described coil support plate 100, comprises the steps：
The first step, as shown in Fig. 2 providing the first plate body 10, is sticked double faced adhesive tape in a side surface of the first plate body 10, is sticked one side glue on other side surface.
Second step, as shown in figure 3, opening up first groove 11, first through hole 12, first connecing hole 13 and slot segmentation 14 in a be sticked side surface of double faced adhesive tape of the first plate body 10.
Described slot segmentation 14 is rectangular, and described slot segmentation 14 is located at the centre position of described first plate body 10.Specifically, described first plate body 10 has axis L, and described slot segmentation 14 is overlapped with the axis L of described first through hole 12.Described slot segmentation 14 runs through first groove 11 middle part and described first groove 11 is divided into first area A and second area B.
In the above-mentioned second step of the present embodiment, described first plate body 10 can be punched by board, and the thickness of described first plate body 10 can be made it equal to so that described first groove 11, first through hole 12 and first connect hole 13 and slot segmentation 14 just runs through the upper and lower surface of the first plate body 10 by adjusting the working depth of described board.Described first groove 11 is in a plurality of cincture shape breach, and it includes the first ring region 111, the second ring region 112, the 3rd ring region 113, the 4th ring region 114, the 5th ring region 115, the 6th ring region 116, the 7th ring region 117, the 8th ring region 118 and the 9th ring region 119 being intervally arranged successively from inside to outside.These ring region are annular.Further, often sequentially three ring region are a ring group, altogether for three ring groups.In every group, adjacent two ring region distances are equal and are less than the distance between two adjacent groups ring region.For example, in the first ring group being made up of the first ring region 111, the second ring region 112, the 3rd ring region 113, the distance between the first ring region 111 and the second ring region 112 are equal to the distance between the second ring region 112 and the 3rd ring region 113.The distance between this first ring group and the second ring group of being made up of the 4th ring region 114, the 5th ring region 115, the 6th ring region 116 are the distance between the 3rd ring region 113 and the 4th ring region 114, and this distance is more than the distance between the first ring region 111 and the second ring region 112.Each ring region all runs through described slot segmentation 14 symmetrical with the axis of the first plate body 10 with respect to described slot segmentation 14.
Described first through hole 12 is located at the one end in described first groove 11 outside.Described first connects hole 13 is located between described first groove 11 and described first through hole 12.9th ring region 119 of described first groove 11 extends further near one end of described first through hole 12, runs through described first and connects hole 13 and be communicated to described first through hole 12.Described first connects hole 13 for accessing the both positive and negative polarity of circuit.
3rd step, as shown in figure 4, providing one second plate body 20, is sticked double faced adhesive tape in a side surface of the second plate body 20.
Described second plate body 20 is equal sized with the length and width of the first plate body 10, and the thickness of described second plate body 20 is slightly less than the thickness of described first plate body 10.
4th step, as shown in figure 5, open up second groove 21, the second through hole 22 and second connects hole 23 on the second plate body 20.
In above-mentioned 4th step of the present embodiment, the working depth adjusting machine table during punching is equal to the thickness of described second plate body 20.Described second groove 21, the second through hole 22 and second connect the upper and lower surface that described second plate body 20 is all run through in hole 23.Described second groove 21 is a continuous multilamellar hollow groove.In the present embodiment, the number of plies of described first groove 21 is four and half, it is overlapped with each ring region arranged successively from inside to outside of described first plate body 10 from inside to outside successively, i.e., overlap with the first ring region 111 of described first groove 11, the second ring region 112, the 3rd ring region 113, the 4th ring region 114, the 5th ring region 115, the 6th ring region 116, the 7th ring region 117, the 8th ring region 118 and the 9th ring region 119, and tilt to connect two adjacent ring region near the axis of each ring region.Described second through hole 22 and second is connect hole 23 and is respectively connect with the first through hole 12 and first of described first plate body 10 that hole 13 is correspondingly arranged and size is identical.
5th step, as shown in fig. 6, the first plate body 10 is positioned by positioning machine table and fits with described second plate body 20 be fixed as one.
First plate body 10 is sticked the side of double faced adhesive tape and the second plate body 20 is fitted, described first through hole 12 and the second through hole 22 is corresponding overlaps, and described first connects hole 13 connects the corresponding coincidence in hole 23 with described second.Described second groove 21 is corresponding with part first groove 11 to be overlapped.Specifically, described second groove 21 overlap described first groove 11 first area A in the second ring region 112, the 4th ring region 114, the 6th ring region 116, the 8th ring region 118；First ring region 111 of second area B of described second groove 21 coincidence first groove 11, the 3rd ring region 113, the 5th ring region 115, the 7th ring region 117, the 9th ring region 119.
6th step, removes the one side glue on the first plate body 10 surface.
7th step, as shown in fig. 7, providing the 3rd plate body 30 that a side surface is sticked double faced adhesive tape, forming third through-hole 31 and the 3rd on the 3rd plate body 30 and connecing hole 32.
Described 3rd plate body 30 and the first plate body 10 and the second plate body 20 equivalently-sized.Described third through-hole 31 is rectangular, and described third through-hole 31 size is more than the size of first through hole 12 and the second through hole 22, and the described 3rd connects hole 32 connects hole 13 and second with described first and connect that hole 23 position is corresponding and size is identical.
8th step, as shown in figure 8, the fit together first plate body 10 and the second plate body 20 are fitted in the 3rd plate body 30 1 side surface.
After laminating, described second plate body 20 is located between described first plate body 10 and the 3rd plate body 30.
9th step, as shown in figure 9, providing a side surface to be sticked have the 4th plate body 40 of double faced adhesive tape, and formation fourth hole 41 and the 4th connects hole 42 and line card 43 on the 4th plate body 40.
Described 4th plate body 40 is identical with described first plate body 10, the second plate body 20, the 3rd plate body 30 size, and described fourth hole 41 is corresponding with described third through-hole 31 and size is identical.Described line card 43 connects hole 42 with the described 4th and connects.
Tenth step, as shown in Figure 10, the entirety of the fit together first plate body 10, the second plate body 20 and the 3rd plate body 30 is positioned by positioning machine table and fits with the 4th plate body 40, and described coil support plate 100 manufactures and completes.
In 6th step of the present invention, also can further include that the first groove 11 along the first plate body 10 is punched the second plate body 20, before punching, need the working depth adjusting machine table to be more than the thickness of the first plate body 10, be less than or equal to the thickness sum of the first plate body and the second plate body 20.During punching, only need to be punched the first ring region 111 do not overlap in the first area A of first groove 11, the 3rd ring region 113, the 5th ring region 115, the 7th ring region 117, the 9th ring region 119 with second groove 21, and first groove 11 second area B do not overlap with second groove 21 the second ring region 112, the 4th ring region 114, the 6th ring region 116, the 8th ring region 118.
In coil support plate 100 manufacture method described in embodiment of the present invention, form first groove 11 and second groove 21 on the first plate body 10 and the second plate body 20 respectively first, then the first plate body 10 and the second plate body 20 are positioned laminating.So, it is to avoid a large amount of grooves are formed on independent single plate body and plate body is produced with impact and deformation, the surface smoothness of coil support plate 100 molding after has been effectively ensured.And the punching positioning of coil support plate 100 described in embodiment of the present invention only need to eliminate the higher Digit Control Machine Tool of use cost using common process board, has saved the manufacturing cost of coil support plate 100.
It is understood that for the person of ordinary skill of the art, can with technology according to the present invention design make other various corresponding change and deformation, and all these change the protection domain that all should belong to the claims in the present invention with deformation.
Claims (10)
1. a kind of manufacture method of coil support plate, comprises the steps：
The first step, provides the first plate body and is sticked one side glue in the first plate body one side surface, is sticked double faced adhesive tape in another side surface；
Second step, forms first groove, first through hole, first connects hole and slot segmentation in a be sticked side surface of double faced adhesive tape of the first plate body；
3rd step, provides the second plate body and the side surface in the second plate body is sticked double faced adhesive tape；
4th step, connects hole in the second plate body formation second groove, the second through hole and second；
5th step, the first plate body is fitted with the second plate body and is fixed as one；And
6th step, removes the one side glue on the first plate body surface.
2. coil support plate as claimed in claim 1 manufacture method it is characterised in that：Described first groove, first through hole, first connect hole and slot segmentation all runs through the upper and lower surface of the first plate body.
3. coil support plate as claimed in claim 2 manufacture method it is characterised in that：Described first groove is in the breach of a plurality of interval ring-type, and it includes three ring groups being intervally arranged successively from inside to outside, includes the multiple ring region being intervally arranged successively from inside to outside in described each ring group.
4. coil support plate as claimed in claim 3 manufacture method it is characterised in that：Described first through hole is located at described first groove lateral ends, and the outermost ring region of described 3rd ring group is extended to described first through hole near one end of described first through hole and connected with described first through hole.
5. coil support plate as claimed in claim 3 manufacture method it is characterised in that：Described slot segmentation runs through in the middle part of described first groove and described first groove is divided into a first area A and a second area B.
6. coil support plate as claimed in claim 1 manufacture method it is characterised in that：Described second groove, the second through hole and second connect the upper and lower surface that Kong Jun runs through described second plate body, and described second through hole and second is connect hole and connect that hole is correspondingly arranged and size is identical respectively with the first through hole and first of described first plate body.
7. coil support plate as claimed in claim 5 manufacture method it is characterised in that：Described second groove is a continuous multilamellar hollow groove, and described second groove is overlapped with each ring region arranged successively from inside to outside of described first plate body from inside to outside successively, and tilts to connect two adjacent ring region.
8. coil support plate as claimed in claim 7 manufacture method it is characterised in that：Also include after the 6th step and the first groove along the first plate body is punched the second plate body.
9. coil support plate as claimed in claim 8 manufacture method it is characterised in that：The working depth adjusting machine table before punching is more than the thickness less than described second plate body for the thickness of described first plate body.
10. coil support plate as claimed in claim 9 manufacture method it is characterised in that：In the 6th step punching, only the ring region do not overlap with described second groove in the ring region that in first groove, first area A is not overlapped, and first groove second area B need to be punched with second groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510533883.7A CN106488654A (en) | 2015-08-27 | 2015-08-27 | The manufacture method of coil support plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510533883.7A CN106488654A (en) | 2015-08-27 | 2015-08-27 | The manufacture method of coil support plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106488654A true CN106488654A (en) | 2017-03-08 |
Family
ID=58233974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510533883.7A Withdrawn CN106488654A (en) | 2015-08-27 | 2015-08-27 | The manufacture method of coil support plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106488654A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722241A (en) * | 1993-07-05 | 1995-01-24 | Matsushita Electric Ind Co Ltd | Planar inductor and production thereof |
| JPH0917640A (en) * | 1995-06-26 | 1997-01-17 | Yaskawa Electric Corp | Element assembling member of transformer and pot core transformer |
| US5900797A (en) * | 1994-11-28 | 1999-05-04 | Murata Manufacturing Co., Ltd. | Coil assembly |
| US20040032313A1 (en) * | 2002-08-15 | 2004-02-19 | Andrew Ferencz | Simplified transformer design for a switching power supply |
| CN101677031A (en) * | 2008-09-19 | 2010-03-24 | 周有庆 | Straight wire PCB plane spiral coil primary current sensor |
| CN202977150U (en) * | 2012-11-19 | 2013-06-05 | 深圳顺络电子股份有限公司 | Charging coil component |
| CN103378211A (en) * | 2012-04-19 | 2013-10-30 | 聚日（苏州）科技有限公司 | Solar cell unit and manufacturing method thereof |
| US20150028984A1 (en) * | 2013-07-29 | 2015-01-29 | Samsung Electro-Mechanics Co., Ltd. | Thin film type inductor and method of manufacturing the same |
| CN104638778A (en) * | 2012-03-23 | 2015-05-20 | Lg伊诺特有限公司 | Wireless power receiver and method of manufacturing the same |
-
2015
- 2015-08-27 CN CN201510533883.7A patent/CN106488654A/en not_active Withdrawn
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722241A (en) * | 1993-07-05 | 1995-01-24 | Matsushita Electric Ind Co Ltd | Planar inductor and production thereof |
| US5900797A (en) * | 1994-11-28 | 1999-05-04 | Murata Manufacturing Co., Ltd. | Coil assembly |
| JPH0917640A (en) * | 1995-06-26 | 1997-01-17 | Yaskawa Electric Corp | Element assembling member of transformer and pot core transformer |
| US20040032313A1 (en) * | 2002-08-15 | 2004-02-19 | Andrew Ferencz | Simplified transformer design for a switching power supply |
| CN101677031A (en) * | 2008-09-19 | 2010-03-24 | 周有庆 | Straight wire PCB plane spiral coil primary current sensor |
| CN104638778A (en) * | 2012-03-23 | 2015-05-20 | Lg伊诺特有限公司 | Wireless power receiver and method of manufacturing the same |
| CN103378211A (en) * | 2012-04-19 | 2013-10-30 | 聚日（苏州）科技有限公司 | Solar cell unit and manufacturing method thereof |
| CN202977150U (en) * | 2012-11-19 | 2013-06-05 | 深圳顺络电子股份有限公司 | Charging coil component |
| US20150028984A1 (en) * | 2013-07-29 | 2015-01-29 | Samsung Electro-Mechanics Co., Ltd. | Thin film type inductor and method of manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170512 Address after: 528000 Guangdong, Chancheng West Industrial Zone, West Road, No. 35 Warburg Applicant after: Quanyida Technology (Foshan) Co., Ltd. Address before: 518109 Guangdong province Foshan City Warburg West Industrial Zone Chancheng District Road No. 35 Applicant before: Quanyida Technology (Foshan) Co., Ltd. Applicant before: Foxconn Precision Industry Co., Ltd. |
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| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170308 |