CN106488647A - Printed circuit board and mobile terminal - Google Patents
Printed circuit board and mobile terminal Download PDFInfo
- Publication number
- CN106488647A CN106488647A CN201610844278.6A CN201610844278A CN106488647A CN 106488647 A CN106488647 A CN 106488647A CN 201610844278 A CN201610844278 A CN 201610844278A CN 106488647 A CN106488647 A CN 106488647A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- crystal oscillator
- board body
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10075—Non-printed oscillator
Abstract
The application provides a kind of printed circuit board and mobile terminal, and wherein, printed circuit board includes：Printed circuit board body, at least one crystal oscillator being arranged on the printed circuit board body；Wherein, on the printed circuit board body around the crystal oscillator, at least one section heat dam is provided with, the heat dam is used for the crystal oscillator, is thermally isolated with other electronic devices and components being arranged on the printed circuit board body.Thus, the thermal resistance between other electronic devices and components and crystal oscillators is increased, impact of the heat of other electronic devices and components generations to crystal oscillator is reduced, improves the reliability and stability of crystal oscillator.
Description
Technical field
The present invention relates to electronic technology field, more particularly to a kind of printed circuit board and mobile terminal.
Background technology
At present, crystal oscillator is due to have the advantages that small volume, lightweight, reliability be high, frequency stability is high, wide
General it is applied in household electrical appliance and communication equipment.
Generally, in order to reduce impact of the cabling to crystal oscillator operating frequency, crystal oscillator is in printed circuit board
Position, better the closer to oscillating circuit.But, crystal oscillator is placed near other electronic devices and components, other can be caused
The heat that electronic devices and components are produced easily is conducted to crystal oscillator, and crystal oscillator temperature influence is larger, some temperature
Skew will make the operating frequency of crystal oscillator change.Therefore, the placement location of crystal oscillator, becomes printing electricity
Subject matter in the plate layout of road.
Content of the invention
It is contemplated that at least solving one of technical problem in correlation technique to a certain extent.For this purpose, the present invention
One purpose is to propose a kind of printed circuit board, increased the thermal resistance between other electronic devices and components and crystal oscillators, reduces
Impact of the heat that other electronic devices and components are produced to crystal oscillator, improves the reliability of crystal oscillator and stable
Property.
Second object of the present invention is to propose a kind of mobile terminal.
Third object of the present invention is to propose a kind of mobile terminal.
For reaching above-mentioned purpose, a kind of printed circuit board that the embodiment of the present invention is proposed, including：Printed circuit board body,
At least one crystal oscillator being arranged on the printed circuit board body；
Wherein, on the printed circuit board body around the crystal oscillator, be provided with least one section heat-insulated
Groove, the heat dam are used for the crystal oscillator, with other the electronics unit devices being arranged on the printed circuit board body
Part is thermally isolated.
According to one embodiment of present invention, on the printed circuit board body around the crystal oscillator,
N section heat dam is arranged at intervals with, wherein, N is the connecting line quantity between crystal oscillator and external circuitry, and N is just whole more than 1
Number.
According to one embodiment of present invention, the distance between the N section heat dam is the crystal oscillator and external world's electricity
The minimum line width that transmission signal takes between road.
According to one embodiment of present invention, the printed circuit board body includes M wiring layer；
Near the crystal oscillator L wiring layer in, the crystal oscillator overlay area be forbid wiring region,
Wherein, M, L are positive integer, and L is less than or equal to M.
According to another embodiment of the invention, L is more than or equal to
According to another embodiment of the invention, the width of the heat dam is at least the minimum feature of printed circuit board.
According to another embodiment of the invention, thermal baffle is additionally provided with the heat dam.
According to another embodiment of the invention, the height of the thermal baffle is more than the height of the crystal oscillator.
The printed circuit board that the embodiment of the present application is provided, arranges heat dam around crystal oscillator on a printed circuit board,
By crystal oscillator, it is thermally isolated with other electronic devices and components being arranged on the printed circuit board body.Thus, which increased
Thermal resistance between his electronic devices and components and crystal oscillator, reduces the heat of other electronic devices and components generations to crystal oscillator
Impact, improves the reliability and stability of crystal oscillator.
For reaching above-mentioned purpose, the application second aspect embodiment proposes a kind of mobile terminal, and which includes above-mentioned printing
Circuit board.
For reaching above-mentioned purpose, the application third aspect embodiment proposes a kind of mobile terminal, including with next or many
Individual component：Printed circuit board, housing, processor, memory, power circuit, audio-frequency assembly, input/output (I/O) interface, with
And communication component；Wherein, the printed circuit board is placed in the interior volume that the housing is surrounded, and the processor and described deposits
Reservoir is arranged on the printed circuit board；The power circuit, supplies for each circuit for the mobile terminal or device
Electricity；The memory is used for storing executable program code；The processor is by holding for storing in the reading memory
Line program code is running program corresponding with the executable program code；
Wherein, printed circuit board includes：Printed circuit board body, at least be arranged on the printed circuit board body
Individual crystal oscillator；On the printed circuit board body around the crystal oscillator, be provided with least one section heat-insulated
Groove, the heat dam are used for the crystal oscillator, with other the electronics unit devices being arranged on the printed circuit board top layer
Part is thermally isolated.
The mobile terminal that the embodiment of the present application is provided, arranges heat dam around crystal oscillator on a printed circuit board, will
Crystal oscillator, is thermally isolated with other electronic devices and components being arranged on the printed circuit board body.Thus, other increased
Thermal resistance between electronic devices and components and crystal oscillator, reduces shadow of the heat of other electronic devices and components generations to crystal oscillator
Ring, improve the reliability and stability of crystal oscillator.
Description of the drawings
Fig. 1 is a kind of status architecture schematic diagram of the printed circuit board of the application one embodiment；
Fig. 2 be Fig. 1 shown in printed circuit board A-A to profile；
Fig. 3 is the top view of the printed circuit board of another embodiment of the application；
Fig. 4 is the profile of the printed circuit board of another embodiment of the application；
Fig. 5 is the structural representation of the mobile terminal of the application one embodiment；
Fig. 6 is the structural representation of the mobile terminal of another embodiment of the application.
Description of reference numerals：
Printed circuit board body -1；Crystal oscillator -2；Heat dam -3；
Other electronic devices and components -4；First wiring layer-L1 the second wiring layer-L2；
3rd wiring layer-L3；Thermal baffle -5；Mobile terminal -50；
Printed circuit board -51；Housing -61；Processor -62；
Memory -63；Power circuit -64；Audio-frequency assembly 65；
Input/output (I/O) interface -66；Communication component 67.
Specific embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from start to finish
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and be not considered as limiting the invention.
With reference to the accompanying drawings describing printed circuit board and the mobile terminal of proposition according to embodiments of the present invention.
Fig. 1 is the top view of the printed circuit board of the application one embodiment, and Fig. 2 is the printed circuit board A-A shown in Fig. 1
To profile.
As depicted in figs. 1 and 2, the printed circuit board, including：Printed circuit board body 1, it is arranged on the printed circuit board
1 at least one crystal oscillator 2 on body；
Wherein, on the printed circuit board body 1 around the crystal oscillator 2, be provided with least one section every
Heat channel 3, the heat dam 3 are used for the crystal oscillator 2 and other electronics being arranged on the printed circuit board top layer
Components and parts 4 are thermally isolated.
It should be noted that the shape of at least one of Fig. 1 crystal oscillator 2 and structure, are only schematically illustrate.
Specifically, when printed circuit board body 1 is manufactured, in order to reduce the body of layout area and printed circuit board body 1
Product, generally in the one side of 1 putting electronic device of printed circuit board body, in addition to electronic devices and components, there also is provided various letters
Number line and power line, and constitute the thermal conductivity of the copper of holding wire and power line preferably, when holding wire or power line are shaken apart from crystal
Swing device 2 nearer when, it is easy to by the heat of other electronic devices and components, pass to crystal oscillator 2, so as to affect crystal oscillator
2 performance, therefore, in the present embodiment, as illustrated in fig. 1 and 2, on printed circuit board body 1, around crystal oscillator 2
Heat dam is set, by crystal oscillator 2 and external heat source (other electronic devices and components and the wire unrelated with crystal oscillator 2) every
From so that external heat cannot pass to crystal oscillator 2.In this way, other electronics unit devices are reduced as far as possible
Impact of the heat that part is produced to crystal oscillator 2, it is ensured that the stability of crystal oscillator 2 and reliability.
Wherein, the width of heat dam according to the heat that external heat source is produced, the intensity requirement of printed circuit board and can add
Work technique is arranged, and minimum can be the minimum feature of printed circuit board, for example, if printed circuit board is processed, most I
The live width of processing is 0.075 millimeter (mm), then it can be 0.075mm that the width of heat dam is minimum.So as in processing printed circuit
During plate, the processing of heat dam can be completed in wiring process, and without the need for extra processing technology.
Further, could work after needing to be connected with other electronic devices and components due to crystal oscillator 2.If, crystal
Oscillator 2 is connected by N bar connecting line with external circuitry, then will be heat-insulated around crystal oscillator 2 by this N bar connecting line
Groove is divided into N section.
For example, if N is 4, as shown in figure 3, vertical view of the Fig. 3 for the printed circuit board of another embodiment of the application
Figure, as shown in figure 3, can be with 4 sections of heat dams of interval setting around crystal oscillator 2.
In addition, being delivered to crystal oscillator 2 in order to reduce as far as possible by the connecting line between crystal oscillator 2 and external circuitry
Calorie value, can also ensure 2 normal work of crystal oscillator in the case of, by between crystal oscillator 2 and external circuitry
It is more narrow better that connecting line is arranged.I.e. the distance between N section heat dam is transmission letter between the crystal oscillator and external circuitry
Number take minimum line width.
For example, if in the case of 2 normal work of crystal oscillator, the connecting line between external circuitry is 0.075mm,
So the distance between N section heat dam may be configured as 0.075mm.
The printed circuit board that the embodiment of the present application is provided, arranges heat dam around crystal oscillator on a printed circuit board,
By crystal oscillator, it is thermally isolated with other electronic devices and components being arranged on the printed circuit board body.Thus, which increased
Thermal resistance between his electronic devices and components and crystal oscillator, reduces the heat of other electronic devices and components generations to crystal oscillator
Impact, improves the reliability and stability of crystal oscillator.
Further, for baroque printed circuit board, generally include on printed circuit board body multiple
Wiring layer, now, except with crystal oscillator around arrange heat dam, to cut off impact of the external heat source to crystal oscillator
Outward, in addition it is also necessary to increase the thermal resistance that external heat source transmits heat by the overlay area of crystal oscillator to crystal oscillator as far as possible,
Even described printed circuit board body includes M wiring layer；Then near the crystal oscillator L wiring layer in, described
Crystal oscillator overlay area is non-wiring region, and wherein, M, L are positive integer, and L is less than or equal to M.
Above-mentioned situation is described in detail with reference to Fig. 4.
Fig. 4 is the profile of the printed circuit board of another embodiment of the application.For example, if M=6, L=3, then
As shown in Figure 4, then when printed circuit board is drawn, you can will be close to the first wiring layer L1, second wiring of crystal oscillator 2
In layer L2 and the 3rd wiring layer L3,2 overlay area of crystal oscillator (as shown in phantom in FIG.) is set to forbid wiring region.Due to
Printed circuit board is that and the thermal resistance of insulating materials is bigger than the thermal resistance of wire with insulation board as base material, so as to not in crystal oscillator 2
Overlay area layer wiring, further increase the thermal resistance between external heat source and crystal oscillator 2, reduce extraneous heat
Impact of the amount to crystal oscillator 2.
It will be appreciated by persons skilled in the art that in the case that the space of printed circuit board allows, can be by crystal
All wiring layers below 2 overlay area of oscillator are both configured to forbid wiring region, to reduce external heat source pair to greatest extent
The impact of crystal oscillator 2.
Under normal circumstances, in order to increase other cloth in crystal oscillator 2 and printed circuit board in each wiring layer as far as possible
Thermal resistance between line, L are at least greater than or are equal toEven printed circuit board is 4 laminates, then near crystal oscillator 2 extremely
On few two wiring layers, the region covered by crystal oscillator 2 will be arranged to forbid wiring region.
Further, the heat for producing to isolate other components and parts passes to crystal oscillator 2 by air, acceptable
As shown in figure 4, on heat dam arrange thermal baffle 5, and the height of thermal baffle 5 the higher the better, it is contemplated that print electricity
The restriction of time space installed by road plate, and the height of thermal baffle 5 is at least greater than the height of crystal oscillator 2, so as to greatest extent
Increase space thermal resistance between other electronic devices and components 4 and crystal oscillators 2, reduce external heat to crystal oscillator 2
Impact.
The printed circuit board that the embodiment of the present application is provided, connects up near L of the crystal oscillator in printed circuit board
In layer, the crystal oscillator overlay area is for forbidding wiring region.Thus, external heat source and crystal oscillator are further increased
Between thermal resistance, reduce impact of the external heat to crystal oscillator, improve the reliability and stability of crystal oscillator.
Fig. 5 is the structural representation of the mobile terminal of the application one embodiment.
As shown in figure 5, the mobile terminal 50 includes：Printed circuit board 51, wherein, printed circuit board 51 can adopt this
The arbitrary shown form in bright above-mentioned Fig. 1,2,3 or 4.
Wherein, the mobile terminal 50 includes：Mobile phone or panel computer.
The mobile terminal that the embodiment of the present application is provided, arranges heat dam around crystal oscillator on a printed circuit board, will
Crystal oscillator, is thermally isolated with other electronic devices and components being arranged on the printed circuit board body, and near the crystal
In L wiring layer of oscillator, the crystal oscillator overlay area is for forbidding wiring region.Thus, increased external heat source with
Thermal resistance between crystal oscillator, reduces impact of the external heat to crystal oscillator, improves the reliability of crystal oscillator
And stability.
Fig. 6 is the structural representation of the mobile terminal of another embodiment of the application.For example, mobile terminal can be mobile
Phone etc..
Referring to Fig. 6, mobile terminal can include following one or more assemblies：Printed circuit board 51, housing 61, processor
62, memory 63, power circuit 64, audio-frequency assembly 65, input/output (I/O) interface 66, and communication component 67；Wherein, institute
State printed circuit board 51 and the interior volume that the housing 61 is surrounded is placed in, the processor 62 and the memory 63 are arranged on
On the circuit board 51；The power circuit 64, for being that each circuit of the mobile terminal or device are powered；The storage
Device 63 is used for storing executable program code；The processor 403 is by reading the executable journey stored in the memory 63
Sequence code is running program corresponding with the executable program code；
Wherein, printed circuit board includes 51：Printed circuit board body 1, it is arranged on the printed circuit board body 1 extremely
A few crystal oscillator 2；
Wherein, on the printed circuit board body 1 around the crystal oscillator 2, be provided with least one section every
Heat channel 3, the heat dam 3 are used for the crystal oscillator 2 and other electronics being arranged on the printed circuit board top layer
Components and parts 4 are thermally isolated.
The mobile terminal that the embodiment of the present application is provided, arranges heat dam around crystal oscillator on a printed circuit board, will
Crystal oscillator, is thermally isolated with other electronic devices and components being arranged on the printed circuit board body, and near the crystal
In L wiring layer of oscillator, the crystal oscillator overlay area is for forbidding wiring region.Thus, increased external heat source with
Thermal resistance between crystal oscillator, reduces impact of the external heat to crystal oscillator, improves the reliability of crystal oscillator
And stability.
In describing the invention, it is to be understood that term " between ", the orientation of instruction or the position relationship such as " connection "
Be based on orientation shown in the drawings or position relationship, be for only for ease of description the present invention and simplify description, rather than indicate or
The hint device of indication or element must with specific orientation, with specific azimuth configuration and operation, therefore it is not intended that
Limitation of the present invention.
In the present invention, unless otherwise clearly defined and limited, the term such as term " setting ", " connection " should do broad sense reason
Solution, for example, it may be being mechanically connected, or electrically connecting；Can be joined directly together, it is also possible to by the indirect phase of intermediary
Even, can be the connection of two element internals or the interaction relationship of two elements, unless otherwise clearly restriction.For this
For the those of ordinary skill in field, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or the spy described with reference to the embodiment or example
Point is contained in M embodiment or the example of the present invention.In this manual, to the schematic representation of above-mentioned term necessarily pin
To be identical embodiment or example.And, the specific features of description, structure, material or feature can any one or
Combined in multiple embodiments or example in an appropriate manner.Additionally, in the case of not conflicting, those skilled in the art
The feature of the different embodiments described in this specification or example and different embodiments or example can be combined and group
Close.
Although embodiments of the invention have been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, one of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification.
Claims (10)
1. a kind of printed circuit board, it is characterised in that include：Printed circuit board body, it is arranged on the printed circuit board body
On at least one crystal oscillator；
Wherein, on the printed circuit board body around the crystal oscillator, at least one section heat dam, institute are provided with
Heat dam is stated for by the crystal oscillator, with other electronic devices and components heat being arranged on the printed circuit board body every
From.
2. printed circuit board as claimed in claim 1, it is characterised in that around the crystalline substance on the printed circuit board body
Around oscillation body device, N section heat dam is arranged at intervals with, wherein, N is the connecting line quantity between crystal oscillator and external circuitry, N
It is the positive integer more than 1.
3. printed circuit board as claimed in claim 2, it is characterised in that the distance between the N section heat dam is the crystal
The minimum line width that transmission signal takes between oscillator and external circuitry.
4. printed circuit board as claimed in claim 1, it is characterised in that the printed circuit board body includes M wiring layer；
Near the crystal oscillator L wiring layer in, the crystal oscillator cover region be forbid wiring region, its
In, M, L are positive integer, and L is less than or equal to M.
5. printed circuit board as claimed in claim 4, it is characterised in that L is more than or equal to
6. the printed circuit board as described in claim 1-5 is arbitrary, it is characterised in that the width of the heat dam is at least to be printed
The minimum feature of circuit board.
7. the printed circuit board as described in claim 1-5 is arbitrary, it is characterised in that be additionally provided with heat-insulated gear on the heat dam
Plate.
8. printed circuit board as claimed in claim 7, it is characterised in that the height of the thermal baffle is shaken more than the crystal
Swing the height of device.
9. a kind of mobile terminal, it is characterised in that include the printed circuit board according to any one of claim 1-8.
10. a kind of mobile terminal, it is characterised in that including following one or more assemblies：Printed circuit board, housing, processor,
Memory, power circuit, audio-frequency assembly, input/output (I/O) interface, and communication component；Wherein, the printed circuit board
The interior volume that the housing is surrounded is placed in, the processor and the memory are arranged on the printed circuit board；Institute
Power circuit is stated, for being that each circuit of the mobile terminal or device are powered；The memory is used for storing executable journey
Sequence code；The processor is run and the executable journey by reading the executable program code stored in the memory
The corresponding program of sequence code；
Wherein, printed circuit board includes：Printed circuit board body, at least one be arranged on the printed circuit board body are brilliant
Oscillation body device；On the printed circuit board body around the crystal oscillator, at least one section heat dam, institute is provided with
Heat dam is stated for by the crystal oscillator, with other electronic devices and components heat being arranged on the printed circuit board top layer every
From.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610844278.6A CN106488647A (en) | 2016-09-22 | 2016-09-22 | Printed circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610844278.6A CN106488647A (en) | 2016-09-22 | 2016-09-22 | Printed circuit board and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106488647A true CN106488647A (en) | 2017-03-08 |
Family
ID=58267409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610844278.6A Pending CN106488647A (en) | 2016-09-22 | 2016-09-22 | Printed circuit board and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106488647A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708291A (en) * | 2017-09-30 | 2018-02-16 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB) and mobile terminal |
| CN108132682A (en) * | 2017-12-12 | 2018-06-08 | 北京自动化控制设备研究所 | A kind of circuit for reducing crystal oscillator operating temperature |
| CN109743056A (en) * | 2019-02-26 | 2019-05-10 | 泰斗微电子科技有限公司 | Satellite time transfer device |
| WO2022095210A1 (en) * | 2020-11-05 | 2022-05-12 | 深圳市大疆创新科技有限公司 | Inertial measurement module and unmanned aerial vehicle |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104734637A (en) * | 2014-12-30 | 2015-06-24 | 广东大普通信技术有限公司 | Temperature control method of crystal oscillator, crystal oscillator and manufacturing method of crystal oscillator |
| CN105934076A (en) * | 2016-06-28 | 2016-09-07 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal |
-
2016
- 2016-09-22 CN CN201610844278.6A patent/CN106488647A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104734637A (en) * | 2014-12-30 | 2015-06-24 | 广东大普通信技术有限公司 | Temperature control method of crystal oscillator, crystal oscillator and manufacturing method of crystal oscillator |
| CN105934076A (en) * | 2016-06-28 | 2016-09-07 | 广东欧珀移动通信有限公司 | Printed circuit board and mobile terminal |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708291A (en) * | 2017-09-30 | 2018-02-16 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB) and mobile terminal |
| CN108132682A (en) * | 2017-12-12 | 2018-06-08 | 北京自动化控制设备研究所 | A kind of circuit for reducing crystal oscillator operating temperature |
| CN109743056A (en) * | 2019-02-26 | 2019-05-10 | 泰斗微电子科技有限公司 | Satellite time transfer device |
| WO2022095210A1 (en) * | 2020-11-05 | 2022-05-12 | 深圳市大疆创新科技有限公司 | Inertial measurement module and unmanned aerial vehicle |
| CN114729805A (en) * | 2020-11-05 | 2022-07-08 | 深圳市大疆创新科技有限公司 | Inertia measurement module and unmanned vehicles |
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Application publication date: 20170308 |
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| RJ01 | Rejection of invention patent application after publication |