CN106485387A - Semiconductor process flow control method and device - Google Patents
Semiconductor process flow control method and device Download PDFInfo
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- CN106485387A CN106485387A CN201510551757.4A CN201510551757A CN106485387A CN 106485387 A CN106485387 A CN 106485387A CN 201510551757 A CN201510551757 A CN 201510551757A CN 106485387 A CN106485387 A CN 106485387A
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- examination criteria
- quality control
- standard
- control standard
- technological standardss
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The embodiment of the present invention provides a kind of semiconductor process flow control method and device.The method includes:Obtain the corresponding technological standardss of each processing step of quasiconductor, examination criteria and quality control standard;If technological standardss, examination criteria and quality control standard are unequal, notify technologist's modification technological standardss, notify tester's modification examination criteria and/or notify quality management and control personnel modification quality control standard.The embodiment of the present invention obtains the corresponding technological standardss of each processing step of quasiconductor, examination criteria and quality control standard by computer, and judge whether technological standardss, examination criteria and quality control standard are equal, when technological standardss, examination criteria and quality control standard not etc. when, notify technologist's modification technological standardss, notify tester's modification examination criteria and/or notify quality management and control personnel modification quality control standard, replenishment of process designs, in order to avoid erroneous judgement occurs to product in production process, and cause excessive abnormality processing.
Description
Technical field
The present embodiments relate to semiconductor production manufactures field, more particularly, to a kind of semiconductor process flow
Control method and device.
Background technology
Semiconductor process flow is related to manufacturing process, data collection and analysis process and quality management process,
During manufacturing, technologist arranges technological standardss in manufacturing execution system, and according to this
Technological standardss manufacture quasiconductor;After semiconductor production manufacture terminates, tester partly leads from all of
Whether sample drawn in body, carries out data acquisition detection to sample, and close according to examination criteria judgment sample
Lattice are up to standard, and wherein, examination criteria is arranged in data acquisition and analysis system by board standard by board module;
In addition, the quality standard that quality management and control personnel press company arranges quality control standard in quality control system,
And judge whether the quasiconductor manufactured meets the quality control standard of company.
In actual production manufacture process, due to technological standardss, examination criteria and quality control standard respectively
Formulated by different personnel, therefore, three may differ, once occur three not situations such as, then
The manufacturing process of quasiconductor will come to a halt, or even have a strong impact on the manufacturing progress of quasiconductor.
Content of the invention
The embodiment of the present invention provides a kind of semiconductor process flow control method and device, and replenishment of process designs,
In order to avoid erroneous judgement occurs to product in production process, and cause excessive abnormality processing.
The embodiment of the present invention is to provide a kind of semiconductor process flow control method on one side, including:
Obtain the corresponding technological standardss of each processing step of quasiconductor, examination criteria and quality control standard;
Judge whether described technological standardss, described examination criteria and described quality control standard are equal;
If described technological standardss, described examination criteria and described quality control standard are unequal, notify work
Artist person changes described technological standardss, notifies tester to change described examination criteria and/or notice quality pipe
Control personnel change described quality control standard.
The embodiment of the present invention is to provide a kind of semiconductor process flow control device on the other hand, including:
Acquisition module, for obtain the corresponding technological standardss of each processing step of quasiconductor, examination criteria and
Quality control standard;
Judge module, for judging described technological standardss, described examination criteria and described quality control standard
Whether equal;
Notification module, if for described technological standardss, described examination criteria and described quality control standard not
Equal, then notify technologist to change described technological standardss, notify tester to change described examination criteria
And/or notify quality management and control personnel to change described quality control standard.
Semiconductor process flow control method provided in an embodiment of the present invention and device, are obtained by computer
The corresponding technological standardss of each processing step of quasiconductor, examination criteria and quality control standard, and judge work
Whether skill standard, examination criteria and quality control standard are equal, when technological standardss, examination criteria and quality
When administrative standard does not wait, notify technologist's modification technological standardss, notify tester's modification examination criteria
And/or notifying quality management and control personnel modification quality control standard, replenishment of process designs, in order to avoid in production process
To product, erroneous judgement occurs, and cause excessive abnormality processing.
Brief description
Fig. 1 is semiconductor process flow control method flow chart provided in an embodiment of the present invention;
Fig. 2 is the structure chart of semiconductor process flow control device provided in an embodiment of the present invention;
The structure chart of the semiconductor process flow control device that Fig. 3 provides for another embodiment of the present invention.
Specific embodiment
Fig. 1 is semiconductor process flow control method flow chart provided in an embodiment of the present invention.The present invention is real
Apply example for technological standardss, examination criteria and quality control standard in semiconductor process flow respectively by difference
Personnel formulate, therefore, three may differ, once occur three not situations such as, then can be to product
Product quality is judged by accident, so certainly will cause mistake or excessive abnormality processing (such as:Should not HOLD
Product is suspended production, non-product up to standard is placed to subsequent processing on the contrary), in order to solve this problem this
Bright embodiment provides semiconductor process flow control method, and the executive agent of the method is specially computer,
The comprising the following steps that of the method:
Step S101, the acquisition corresponding technological standardss of each processing step of quasiconductor, examination criteria and quality
Administrative standard;
In embodiments of the present invention, each processing step of quasiconductor corresponds to technological standardss, examination criteria respectively
And quality control standard, technological standardss are arranged in manufacturing execution system by technologist, detect mark
Standard is arranged in data acquisition and analysis system by board standard by board module, and quality control standard is by quality
The quality standard that management and control personnel press company is arranged in quality control system.Computer is specifically from the manufacturing
Obtain technological standardss in execution system, obtain examination criteria from data acquisition and analysis system, from quality pipe
Quality control standard is obtained in reason system.
Step S102, whether judge described technological standardss, described examination criteria and described quality control standard
Equal;
Described technological standardss, described examination criteria and described quality control standard that computer judgement gets
Whether equal.
If the described technological standardss of step S103, described examination criteria and described quality control standard are unequal,
Technologist is then notified to change described technological standardss, notify tester to change described examination criteria and/or lead to
Know that quality management and control personnel change described quality control standard.
If computer judges described technological standardss, described examination criteria and described quality control standard not phase
Deng, then notify technologist change described technological standardss, notify tester change described examination criteria and/
Or notify quality management and control personnel to change described quality control standard, specifically, if described technological standardss and institute
State examination criteria equal, and unequal with described quality control standard, then notify quality management and control personnel modification
Described quality control standard;If described technological standardss, described examination criteria and described quality control standard are mutual
Unequal, then notify technologist to change described technological standardss, notify tester to change described inspection respectively
Mark is accurate and notifies quality management and control personnel to change described quality control standard, stops this technological design simultaneously
Subsequent processes, in order to avoid erroneous judgement to product in production process, and cause excessive abnormality processing, until described
After technological standardss, described examination criteria are further continued for this technological design when consistent with described quality control standard
Continuous process it is ensured that in production process product normal manufacture.
The embodiment of the present invention obtains the corresponding technological standardss of each processing step of quasiconductor, inspection by computer
Mark is accurate and quality control standard, and judges technological standardss, examination criteria and quality control standard whether phase
Deng, when technological standardss, examination criteria and quality control standard not etc. when, notify technologist's modification technique
Standard, notify tester modification examination criteria and/or notify quality management and control personnel modification quality management mark
Standard, replenishment of process designs, in order to avoid erroneous judgement to product in production process, and causes excessive abnormality processing.
On the basis of above-described embodiment, the described acquisition corresponding technological standardss of each processing step of quasiconductor,
After examination criteria and quality control standard, also include:
Calculate higher limit and the lower limit of described technological standardss according to described technological standardss;
Calculate higher limit and the lower limit of described examination criteria according to described examination criteria;
Calculate higher limit and the lower limit of described quality control standard according to described quality control standard.
In embodiments of the present invention, technological standardss, examination criteria and quality control standard correspond to one respectively
Numerical range, for example, the technological standardss of semiconductor thickness are 0.72 ± 0.06 μm, then the work of semiconductor thickness
The higher limit of skill standard is 0.78 μm, and the lower limit of the technological standardss of semiconductor thickness is 0.66 μm.In the same manner,
Examination criteria and quality control standard correspond to a numerical range, technological standardss, examination criteria and matter respectively
Amount administrative standard may identical it is also possible to different.
Described judge whether described technological standardss, described examination criteria and described quality control standard equal,
Including:Judge higher limit, the higher limit of described examination criteria and the described quality management of described technological standardss
Whether the higher limit of standard is equal, and judges the lower limit of described technological standardss, described examination criteria
Whether the lower limit of lower limit and described quality control standard is equal.
For example, the technological standardss of semiconductor thickness are 0.72 ± 0.06 μm, then the technological standardss of semiconductor thickness
Higher limit be 0.78 μm, the lower limit of the technological standardss of semiconductor thickness is 0.66 μm;Semiconductor thickness
Examination criteria be 0.71 ± 0.06 μm, then the higher limit of the examination criteria of semiconductor thickness is 0.77 μm, half
The lower limit of the examination criteria of conductor thickness is 0.65 μm;The quality control standard of semiconductor thickness is
0.70 ± 0.06 μm, then the higher limit of the quality control standard of semiconductor thickness be 0.76 μm, semiconductor thickness
The lower limit of quality control standard be 0.64 μm, then computer judges to know the upper limit of described technological standardss
The higher limit of value, the higher limit of described examination criteria and described quality control standard is unequal, and described work
The lower limit of the lower limit of skill standard, the lower limit of described examination criteria and described quality control standard not phase
Deng.
Described judge described technological standardss, described examination criteria and described quality control standard whether equal it
Afterwards, also include:Generate semiconductor process flow control table, described semiconductor process flow control table includes
Described technological standardss, described examination criteria and described quality control standard, and described technological standardss, institute
State examination criteria and the comparative result of described quality control standard.
Computer judges whether described technological standardss, described examination criteria and described quality control standard are equal
Afterwards, generate semiconductor process flow control table, described semiconductor process flow control table includes described work
Skill standard, described examination criteria and described quality control standard, and described technological standardss, described detection
Standard and the comparative result of described quality control standard, the structure of this semiconductor process flow control table is as follows
Shown in table 1:
Table 1
Technological standardss | Examination criteria | Quality control standard | Comparative result |
0.72±0.06μm | 0.71±0.06μm | 0.70±0.06μm | Different |
If described technological standardss, described examination criteria and described quality control standard are unequal, lead to
Know that technologist changes described technological standardss, notifies tester to change described examination criteria and/or notice product
Matter management and control personnel change described quality control standard, including:If described technological standardss, described examination criteria
Unequal with described quality control standard, then generate warning information, and according to described alarm information noticing work
Artist person changes described technological standardss, notifies tester to change described examination criteria and/or notice quality pipe
Control personnel change described quality control standard.
If described technological standardss, described examination criteria and described quality control standard are unequal, generate and accuse
Alarming information, warning information specifically indicates described technological standardss, described examination criteria and described quality management mark
In standard, which two standard differs, or three all differs, and points out three according to above-mentioned this warning information of table 1
Person all differs, then notify technologist to change described technological standardss, notify tester to change described inspection
Mark is accurate and notifies quality management and control personnel to change described quality control standard;If described technological standardss and described
Examination criteria is equal, and unequal with described quality control standard, then notify quality management and control personnel modification institute
State quality control standard;If described technological standardss and described quality control standard are equal, and with described detection
Standard is unequal, then notify tester to change described examination criteria;If described examination criteria and described matter
Amount administrative standard is equal, and unequal with described technological standardss, then notify technologist to change described technique
Standard, concrete Notification Method is the computer or terminal transmission announcement information to corresponding personnel, informs corresponding
The interdependent canonical parameter of personnel's modification.
The embodiment of the present invention obtains the corresponding technological standardss of each processing step of quasiconductor, inspection by computer
Mark is accurate and quality control standard, and judges technological standardss, examination criteria and quality control standard whether phase
Deng, when technological standardss, examination criteria and quality control standard not etc. when, notify technologist's modification technique
Standard, notify tester modification examination criteria and/or notify quality management and control personnel modification quality management mark
Standard, replenishment of process designs, in order to avoid erroneous judgement to product in production process, and causes excessive abnormality processing.
Fig. 2 is the structure chart of semiconductor process flow control device provided in an embodiment of the present invention.The present invention
It is real that the semiconductor process flow control device that embodiment provides can execute semiconductor process flow control method
Apply the handling process of example offer, as shown in Fig. 2 semiconductor process flow control device 20 includes obtaining mould
Block 21 is used for obtaining the corresponding technological standardss of each processing step of quasiconductor, examination criteria and quality management mark
Accurate;Judge module 22 is used for judging described technological standardss, described examination criteria and described quality control standard
Whether equal;If notification module 23 is used for described technological standardss, described examination criteria and described quality management
Standard is unequal, then notify technologist to change described technological standardss, notify tester to change described inspection
Mark is accurate and/or notifies quality management and control personnel to change described quality control standard.
The embodiment of the present invention obtains the corresponding technological standardss of each processing step of quasiconductor, inspection by computer
Mark is accurate and quality control standard, and judges technological standardss, examination criteria and quality control standard whether phase
Deng, when technological standardss, examination criteria and quality control standard not etc. when, notify technologist's modification technique
Standard, notify tester modification examination criteria and/or notify quality management and control personnel modification quality management mark
Standard, replenishment of process designs, in order to avoid erroneous judgement to product in production process, and causes excessive abnormality processing.
The structure chart of the semiconductor process flow control device that Fig. 3 provides for another embodiment of the present invention.?
On the basis of above-described embodiment, acquisition module 21 is specifically for calculating described technique according to described technological standardss
The higher limit of standard and lower limit;According to described examination criteria calculate described examination criteria higher limit and under
Limit value;Calculate higher limit and the lower limit of described quality control standard according to described quality control standard.
Judge module 22 is specifically for judging the higher limit of described technological standardss, the upper limit of described examination criteria
Value and described quality control standard higher limit whether equal, and judge described technological standardss lower limit,
Whether the lower limit of the lower limit of described examination criteria and described quality control standard is equal.
Semiconductor process flow control device 20 also includes semiconductor process flow control table generation module 24,
For generating semiconductor process flow control table, described semiconductor process flow control table includes described technique
Standard, described examination criteria and described quality control standard, and described technological standardss, described detection mark
The comparative result of accurate and described quality control standard.
If notification module 23 is specifically for described technological standardss, described examination criteria and described quality management mark
Accurate unequal, then generate warning information, and change described work according to described alarm information noticing technologist
Skill standard, notify tester change described examination criteria and/or notify quality management and control personnel change described matter
Amount administrative standard.
Transmission equipment provided in an embodiment of the present invention can be specifically for executing the method that above-mentioned Fig. 1 is provided
Embodiment, here is omitted for concrete function.
The embodiment of the present invention obtains the corresponding technological standardss of each processing step of quasiconductor, inspection by computer
Mark is accurate and quality control standard, and judges technological standardss, examination criteria and quality control standard whether phase
Deng, when technological standardss, examination criteria and quality control standard not etc. when, notify technologist's modification technique
Standard, notify tester modification examination criteria and/or notify quality management and control personnel modification quality management mark
Standard, replenishment of process designs, in order to avoid erroneous judgement to product in production process, and causes excessive abnormality processing.
In sum, the embodiment of the present invention obtains the corresponding work of each processing step of quasiconductor by computer
Skill standard, examination criteria and quality control standard, and judge technological standardss, examination criteria and quality management
Whether standard equal, when technological standardss, examination criteria and quality control standard not etc. when, notify technique people
Member changes technological standardss, notifies tester's modification examination criteria and/or notify quality management and control personnel modification matter
Amount administrative standard, replenishment of process designs, in order to avoid erroneous judgement to product in production process, and causes polyisocyanate
Often process.
It should be understood that disclosed apparatus and method in several embodiments provided by the present invention,
Can realize by another way.For example, device embodiment described above is only schematically,
For example, the division of described unit, only a kind of division of logic function, in addition actual can have when realizing
Dividing mode, for example multiple units or assembly can in conjunction with or be desirably integrated into another system, or
Some features can be ignored, or does not execute.Another, shown or discussed coupling each other or
Direct-coupling or communication connection can be by some interfaces, the INDIRECT COUPLING of device or unit or communication link
Connect, can be electrical, mechanical or other forms.
The described unit illustrating as separating component can be or may not be physically separate, make
For the part that unit shows can be or may not be physical location, you can with positioned at a place,
Or can also be distributed on multiple NEs.Can select according to the actual needs part therein or
The whole unit of person is realizing the purpose of this embodiment scheme.
In addition, can be integrated in a processing unit in each functional unit in each embodiment of the present invention,
Can also be that unit is individually physically present it is also possible to two or more units are integrated in a list
In unit.Above-mentioned integrated unit both can be to be realized in the form of hardware, it would however also be possible to employ hardware adds software
The form of functional unit is realized.
The above-mentioned integrated unit realized in the form of SFU software functional unit, can be stored in a computer
In read/write memory medium.Above-mentioned SFU software functional unit is stored in a storage medium, including some fingers
Order is with so that a computer equipment (can be personal computer, server, or network equipment etc.)
Or processor (processor) executes the part steps of each embodiment methods described of the present invention.And it is aforementioned
Storage medium include:USB flash disk, portable hard drive, read only memory (Read-Only Memory, ROM),
Random access memory (Random Access Memory, RAM), magnetic disc or CD etc. are various permissible
The medium of store program codes.
Those skilled in the art can be understood that, for convenience and simplicity of description, only with above-mentioned each
The division of functional module is illustrated, and in practical application, can divide above-mentioned functions as desired
Join and completed by different functional modules, the internal structure of device will be divided into different functional modules, with
Complete all or part of function described above.The specific work process of the device of foregoing description is permissible
With reference to the corresponding process in preceding method embodiment, will not be described here.
Finally it should be noted that:Various embodiments above is only in order to illustrating technical scheme rather than right
It limits;Although being described in detail to the present invention with reference to foregoing embodiments, this area common
Technical staff should be understood:It still can be modified to the technical scheme described in foregoing embodiments,
Or equivalent is carried out to wherein some or all of technical characteristic;And these modifications or replacement, and
Do not make the scope of the essence disengaging various embodiments of the present invention technical scheme of appropriate technical solution.
Claims (10)
1. a kind of semiconductor process flow control method is it is characterised in that include:
Obtain the corresponding technological standardss of each processing step of quasiconductor, examination criteria and quality control standard;
Judge whether described technological standardss, described examination criteria and described quality control standard are equal;
If described technological standardss, described examination criteria and described quality control standard are unequal, notify work
Artist person changes described technological standardss, notifies tester to change described examination criteria and/or notice quality pipe
Control personnel change described quality control standard.
2. method according to claim 1 is it is characterised in that described each technique of acquisition quasiconductor
After the corresponding technological standardss of step, examination criteria and quality control standard, also include:
Calculate higher limit and the lower limit of described technological standardss according to described technological standardss;
Calculate higher limit and the lower limit of described examination criteria according to described examination criteria;
Calculate higher limit and the lower limit of described quality control standard according to described quality control standard.
3. method according to claim 2 it is characterised in that the described technological standardss of described judgement,
Whether described examination criteria and described quality control standard are equal, including:
Judge higher limit, the higher limit of described examination criteria and the described quality management mark of described technological standardss
Whether accurate higher limit is equal, and judges under the lower limit of described technological standardss, described examination criteria
Whether the lower limit of limit value and described quality control standard is equal.
4. method according to claim 3 it is characterised in that the described technological standardss of described judgement,
Described examination criteria and described quality control standard whether equal after, also include:
Generate semiconductor process flow control table, described semiconductor process flow control table includes described technique
Standard, described examination criteria and described quality control standard, and described technological standardss, described detection mark
The comparative result of accurate and described quality control standard.
If 5. the method according to any one of claim 1-4 is it is characterised in that described technique
Standard, described examination criteria and described quality control standard are unequal, then notify technologist's modification described
Technological standardss, tester is notified to change described examination criteria and/or notify quality management and control personnel modification described
Quality control standard, including:
If described technological standardss, described examination criteria and described quality control standard are unequal, generate and accuse
Alarming information, and change described technological standardss, notify tester according to described alarm information noticing technologist
Member changes described examination criteria and/or notifies quality management and control personnel to change described quality control standard.
6. a kind of semiconductor process flow control device is it is characterised in that include:
Acquisition module, for obtain the corresponding technological standardss of each processing step of quasiconductor, examination criteria and
Quality control standard;
Judge module, for judging described technological standardss, described examination criteria and described quality control standard
Whether equal;
Notification module, if for described technological standardss, described examination criteria and described quality control standard not
Equal, then notify technologist to change described technological standardss, notify tester to change described examination criteria
And/or notify quality management and control personnel to change described quality control standard.
7. semiconductor process flow control device according to claim 6 is it is characterised in that described
Acquisition module specifically for calculating higher limit and the lower limit of described technological standardss according to described technological standardss;
Calculate higher limit and the lower limit of described examination criteria according to described examination criteria;According to described quality management
The higher limit of quality control standard described in criterion calculation and lower limit.
8. semiconductor process flow control device according to claim 7 is it is characterised in that described
Judge module is specifically for judging higher limit, the higher limit of described examination criteria and the institute of described technological standardss
Whether the higher limit stating quality control standard is equal, and judges the lower limit of described technological standardss, described
Whether the lower limit of the lower limit of examination criteria and described quality control standard is equal.
9. semiconductor process flow control device according to claim 8 is it is characterised in that also wrap
Include:
Semiconductor process flow control table generation module, for generating semiconductor process flow control table, institute
State semiconductor process flow control table and include described technological standardss, described examination criteria and described quality management
Standard, and the comparative result of described technological standardss, described examination criteria and described quality control standard.
10. the semiconductor process flow control device according to any one of claim 6-9, its feature
It is, if described notification module is specifically for described technological standardss, described examination criteria and described quality pipe
Reason standard is unequal, then generate warning information, and changes institute according to described alarm information noticing technologist
State technological standardss, notify tester to change described examination criteria and/or notify quality management and control personnel modification institute
State quality control standard.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110543155A (en) * | 2019-09-02 | 2019-12-06 | 暖流信息科技(上海)有限公司 | advanced manufacturing process management system and execution method thereof |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103107117A (en) * | 2011-11-11 | 2013-05-15 | 无锡华润上华科技有限公司 | Semi-conductor processing management system and method |
CN103698489A (en) * | 2013-12-30 | 2014-04-02 | 力合科技(湖南)股份有限公司 | Verification method and device of test data |
CN103823408A (en) * | 2012-11-16 | 2014-05-28 | 无锡华润上华科技有限公司 | Semiconductor equipment machine quality monitoring method and system |
CN103885423A (en) * | 2014-03-27 | 2014-06-25 | 上海华力微电子有限公司 | Statistical process control system and method for wafer acceptance test |
CN103972122A (en) * | 2013-02-05 | 2014-08-06 | 北大方正集团有限公司 | Wafer probing method and wafer probing device |
CN104714532A (en) * | 2015-03-10 | 2015-06-17 | 杭州掌企科技有限公司 | Quality control method and device |
-
2015
- 2015-09-01 CN CN201510551757.4A patent/CN106485387A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103107117A (en) * | 2011-11-11 | 2013-05-15 | 无锡华润上华科技有限公司 | Semi-conductor processing management system and method |
CN103823408A (en) * | 2012-11-16 | 2014-05-28 | 无锡华润上华科技有限公司 | Semiconductor equipment machine quality monitoring method and system |
CN103972122A (en) * | 2013-02-05 | 2014-08-06 | 北大方正集团有限公司 | Wafer probing method and wafer probing device |
CN103698489A (en) * | 2013-12-30 | 2014-04-02 | 力合科技(湖南)股份有限公司 | Verification method and device of test data |
CN103885423A (en) * | 2014-03-27 | 2014-06-25 | 上海华力微电子有限公司 | Statistical process control system and method for wafer acceptance test |
CN104714532A (en) * | 2015-03-10 | 2015-06-17 | 杭州掌企科技有限公司 | Quality control method and device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110543155A (en) * | 2019-09-02 | 2019-12-06 | 暖流信息科技(上海)有限公司 | advanced manufacturing process management system and execution method thereof |
CN110543155B (en) * | 2019-09-02 | 2021-08-10 | 暖流信息科技(上海)有限公司 | Manufacturing process management system |
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