CN106483219A - Photoresistance atomizing treatment equipment and photoresistance atomization process system - Google Patents
Photoresistance atomizing treatment equipment and photoresistance atomization process system Download PDFInfo
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- CN106483219A CN106483219A CN201610889971.5A CN201610889971A CN106483219A CN 106483219 A CN106483219 A CN 106483219A CN 201610889971 A CN201610889971 A CN 201610889971A CN 106483219 A CN106483219 A CN 106483219A
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- China
- Prior art keywords
- photoresistance
- accommodating cavity
- sample
- sample box
- air inlet
- Prior art date
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- 238000000889 atomisation Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000001179 sorption measurement Methods 0.000 claims abstract description 39
- 239000011261 inert gas Substances 0.000 claims abstract description 21
- 238000001259 photo etching Methods 0.000 claims abstract description 7
- 239000007789 gas Substances 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 7
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 14
- 238000010586 diagram Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 6
- 239000003999 initiator Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N30/00—Investigating or analysing materials by separation into components using adsorption, absorption or similar phenomena or using ion-exchange, e.g. chromatography or field flow fractionation
- G01N30/02—Column chromatography
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Sampling And Sample Adjustment (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The present invention discloses a kind of photoresistance atomizing treatment equipment, and which includes:Manipulation seat stand, accommodating cavity, sample box, air inlet pipe, ultraviolet lamp tube and adsorption tube;Accommodating cavity is arranged on operation seat stand;Sample box is arranged in accommodating cavity, and sample box is used for placing photoresistance sample;Air inlet pipe is by operating seat stand to penetrate in accommodating cavity, and air inlet pipe is connected with sample box, and air inlet pipe is used for inert gas to be passed through in sample box;Ultraviolet lamp tube is arranged on the inner surface of accommodating cavity, and ultraviolet lamp tube is used for the photoresistance sample to being positioned in sample box carries out ultraviolet photoetching;Adsorption tube is connected with sample box, and adsorption tube passes accommodating cavity, and adsorption tube is used for collecting the sliver of the photoresistance sample after ultraviolet photoetching blown out by inert gas.The photoresistance atomizing treatment equipment of the present invention can carry out atomization process to photoresist, consequently facilitating the assessment of the atomization performance of photoresist, to filter out high-quality photoresist, reduces the loss caused because of photoresist.
Description
Technical field
The invention belongs to photoresistance atomization technique field, specifically, is related to a kind of photoresistance atomizing treatment equipment and photoresistance mist
Change processing system.
Background technology
(Thin Film Transistor-Liquid Crystal Display, TFT-LCD show TFT-LCD
Show device) it is all to show good display in combination properties such as brightness, contrast, power consumption, life-span, volume and weights at present, it
Function admirable, characteristic is good for large-scale production, high degree of automation and development space is wide, has gradually occupied display neck
The leading position in domain.
In TFT-LCD, liquid crystal panel is generally (i.e. color by Array substrate (i.e. thin-film transistor array base-plate), CF substrate
Color filter array substrate) and be clipped in liquid crystal therebetween and constitute.
In the processing procedure of each substrate, generally designed by coating, exposure, development, baking etc. on the glass substrate
R, G, B, BM (BlackMatrix), PS (Photo Spacer) photoresistance pattern.But in processing procedure, once had exposure light shield to occur
The phenomenon of atomization, so as to cause the photoresistance pattern after exposing to produce variation, shape and live width (CD) occur extremely.And cause exposure
The reason for light shield is atomized is that in photoresistance, light initiator sliver is taken out of by residual solvent, is attached to exposure light when being exposed
On cover, so as to cause exposure light shield to be atomized.
Therefore, need a kind of photoresistance atomizing treatment equipment badly to be atomized photoresist when photoresist is assessed, to comment
Estimate impact of the photoresist to exposure light shield.
Content of the invention
To achieve these goals, the invention provides a kind of photoresistance atomizing treatment equipment, which includes:Manipulation seat stand, appearance
Put cavity, sample box, air inlet pipe, ultraviolet lamp tube and adsorption tube;The accommodating cavity is arranged on the operation seat stand;Described
Sample box is arranged in the accommodating cavity, and the sample box is used for placing photoresistance sample;The air inlet pipe is by the operation seat
Platform is penetrated in the accommodating cavity, and the air inlet pipe is connected with the sample box, and the air inlet pipe is used for leading to inert gas
Enter in the sample box;The ultraviolet lamp tube is arranged on the inner surface of the accommodating cavity, and the ultraviolet lamp tube is used for putting
The photoresistance sample being placed in the sample box carries out ultraviolet photoetching;The adsorption tube is connected with the sample box, and the suction
Attached pipe passes the accommodating cavity, and the adsorption tube is used for collecting the light after ultraviolet photoetching blown out by the inert gas
The sliver of resistance sample.
Further, the accommodating cavity includes four side walls and a roof, and four side walls are relative two-by-two to be set
Put, the roof is enclosed in the side of four side walls, the operation seat stand is enclosed in the opposite side of four side walls, with
The top surface of the operation seat stand is made towards the roof.
Further, at least one of described four side walls are configured to open or close.
Further, the ultraviolet lamp tube is arranged on the inner surface of the side wall that can be opened or closed.
Further, the air inlet pipe is penetrated in the operation seat stand by outside, and the top surface by the operation seat stand
Pass, so as to penetrate in the accommodating cavity;The adsorption tube is passed by the roof of the accommodating cavity;The air inlet pipe by
After the top surface of the operation seat stand is passed, the air inlet pipe is carried out on the top surface of the operation seat stand using nut
Fastening;After the adsorption tube is passed by the roof of the accommodating cavity, right on the outer surface of the roof using nut
The adsorption tube is fastened.
Further, the sample box is in cuboid, and the sample box includes:Upper wall, lower wall, left side wall, right side wall,
Front side wall and rear wall, the air inlet pipe are connected to the lower wall, and the adsorption tube is connected to the upper wall;In the air inlet
After pipe is connected to the lower wall, the air inlet pipe is fastened on the outer surface of the lower wall using nut;In the adsorption tube
After being connected to the upper wall, the adsorption tube is fastened on the outer surface of the upper wall using nut.
Further, described left side wall or part thereof and/or the right side wall or part thereof be configured to open or
Close.
Further, the photoresistance atomizing treatment equipment also includes hygrosensor, and the hygrosensor is arranged at institute
State in accommodating cavity, to detect the temperature in the accommodating cavity.
Further, the manipulation seat stand includes:Total gas pressure dial gauge, for indicating the pressure of inert gas source;Power supply
Switch, for controlling opening or closing for power supply;Control keyboard, for set operating temperature, photoresistance sample processing time and
Gas flow in the sample box;Temperature control system, for remaining to the work by the temperature in the accommodating cavity
Temperature;Display screen, for showing the setup parameter in the course of work;Activate switch, for control to the light in the sample box
Beginning or stopping that resistance sample is processed.
Present invention also offers a kind of photoresistance atomization process system, which includes inert gas source and above-mentioned photoresistance atomization
Processing equipment, the air inlet pipe of the photoresistance atomizing treatment equipment are connected with the inert gas source.
Beneficial effects of the present invention:A kind of photoresistance atomizing treatment equipment and photoresistance atomization process system that the present invention is provided
Atomization process can be carried out to photoresist, consequently facilitating the assessment of the atomization performance of photoresist, to filter out high-quality photoresistance
Material, reduces the loss caused because of photoresist.
Description of the drawings
By combining the following description that accompanying drawing is carried out, above and other aspect of embodiments of the invention, feature and advantage
Will become clearer from, in accompanying drawing:
Fig. 1 is that photoresistance atomization process of the side wall of accommodating according to an embodiment of the invention cavity in open mode sets
Standby schematic diagram;
Fig. 2 is that the photoresistance atomization process that the side wall of accommodating according to an embodiment of the invention cavity is closed sets
Standby schematic diagram;
Fig. 3 is schematic diagram of the right half of right side wall according to an embodiment of the invention in the sample box of open mode;
Fig. 4 is that the right half of right side wall according to an embodiment of the invention is closed and is placed with photoresistance sample
Sample box schematic diagram;
Fig. 5 is the schematic diagram of photoresistance atomization process system according to an embodiment of the invention.
Specific embodiment
Hereinafter, with reference to the accompanying drawings to describing embodiments of the invention in detail.However, it is possible to come in many different forms real
Apply the present invention, and the present invention should not be construed as limited to the specific embodiment that illustrates here.Conversely, providing these enforcements
Example be in order to explain the principle of the present invention and its practical application, so that others skilled in the art are it will be appreciated that the present invention
Various embodiments and be suitable for the various modifications of specific intended application.
Hereinafter, " on ", D score, "left", "right", "front", "rear", " top ", the word such as " bottom " be intended merely to facilitate
Description embodiment, is not meant to limit the present invention.
Fig. 1 is that photoresistance atomization process of the side wall of accommodating according to an embodiment of the invention cavity in open mode sets
Standby schematic diagram.Fig. 2 is at the photoresistance atomization that the side wall of accommodating according to an embodiment of the invention cavity is closed
The schematic diagram of reason equipment.
See figures.1.and.2, photoresistance atomizing treatment equipment 100 includes according to an embodiment of the invention:Manipulation seat stand 110,
Accommodating cavity 120, sample box 130, air inlet pipe 140, ultraviolet lamp tube 150 and adsorption tube 160;Accommodating cavity 120 is arranged at behaviour
Make on seat stand 110;Sample box 130 is arranged in accommodating cavity 120, and sample box 130 is used for placing photoresistance sample 300;Air inlet pipe
140 are penetrated in accommodating cavity 120 by operation seat stand 110, and air inlet pipe 140 is connected with sample box 130, and air inlet pipe 140 is used for will
Inert gas is passed through in sample box 130;Ultraviolet lamp tube 150 is arranged on the inner surface of accommodating cavity 120, and ultraviolet lamp tube 150 is used
Ultraviolet photoetching is carried out in the photoresistance sample 300 to being positioned in sample box 130;Adsorption tube 160 is connected with sample box 130, and
Adsorption tube 160 passes accommodating cavity 120, and adsorption tube 160 is used for collecting the light after ultraviolet photoetching blown out by inert gas
The sliver 300A of resistance sample 300.
Specifically, housing cavity 120 includes four side walls, 121,122,123,124 and roof 125.Side wall
121 are oppositely arranged with side wall 123, and side wall 122 is oppositely arranged with side wall 124, and 122 connecting side wall 121 of side wall and side wall 123
One end, the other end of 124 connecting side wall 121 of side wall and side wall 123, so, four side walls 121,122,123,124 surround after be
Both ends open and hollow cuboid.Roof 125 is enclosed in one end of four side walls 121,122,123,124, and manipulates seat stand
110 other ends for being enclosed in four side walls 121,122,123,124, so that the top surface 110A of operation seat stand 110 is towards roof
125.The another of four side walls 121,122,123,124 is closed that is, housing cavity 120 and borrowing operation seat stand 110 as which
" diapire " of one end.Additionally, four side walls 121,122,123,124 can be formed by transparent material, but the present invention is not restricted to
This.
Certainly, it should be noted that housing cavity 120 can also include a diapire, the diapire is with roof 125 in the face of setting
Put, the other end of four side walls 121,122,123,124 is enclosed in so as to the diapire.When accommodating cavity 120 and operation seat stand 110
During installation, the diapire for housing cavity 120 is made to fit assembling with the top surface 110A for operating seat stand 110.
Further, for the ease of installing or dismounting sample box 130, it is preferable that can by four side walls 121,122,
123rd, at least one of 124 it is configured to open or closes.In the present embodiment, side wall 121 is configured to beat
On or off is closed.In FIG, side wall 121 is in open mode;In fig. 2, side wall 121 is closed.Additionally, side wall
Handle 126 can be provided with 121 outer surface.
Three ultraviolet lamp tubes 150 are arranged on the inner surface of side wall 121, but the present invention is not restricted to this.For example ultraviolet
Fluorescent tube 150 is may be disposed on side wall 122,123,124, roof 125 and the inner surface of any one in top surface 110A, or
Person can arrange uviol lamp on side wall 122 and/or side wall 123 and/or side wall 124 and/or roof 125 and/or top surface 110A
Pipe 150.Additionally, the quantity of ultraviolet lamp tube 150 is not also limited with three, its quantity can be set according to the actual requirements.
Three sample boxs 130 are arranged in accommodating cavity 120, but quantity of the present invention not to sample box 130 is limited
System.Fig. 3 is schematic diagram of the right half of right side wall according to an embodiment of the invention in the sample box of open mode.Fig. 4 is
The be closed and sample box that be placed with photoresistance sample 300 of the right half of right side wall according to an embodiment of the invention
Schematic diagram.In figs. 3 and 4, air inlet pipe 140 and the adsorption tube 160 of part are shown.
With reference to Fig. 3 and Fig. 4, sample box 130 is a cuboid box, and which includes:Upper wall 131, lower wall 132, left side wall
133rd, right side wall 134, front side wall 135 and rear wall 136.
For the ease of taking photoresistance sample 300, can be by left side wall 133, right side wall 134, front side wall 135 and rear wall
At least one of 136 are configured to open or close.Further, the side wall that opens or close is configured to,
Which integrally can be configured to open or close, it is also possible to be partly configured to open or close.In this enforcement
In example, the right half 134A of right side wall 134 is configured to open or is closed, wherein the right half 134A of right side wall 134
Width need the thickness of slightly larger than photoresistance sample 300, be easy to photoresistance sample 300 free in and out sample box 130.
Additionally, when photoresistance sample 300 is positioned over sample box 130, making the photoresistance of photoresistance sample 300 towards front side wall
130.
With continued reference to Fig. 1, air inlet pipe 140 is penetrated in operation seat stand 110 (which is can refer to shown in Fig. 5) by outside, and by grasping
The top surface 110A for making seat stand 110 is passed, so as to penetrate in accommodating cavity 120.Penetrate in accommodating cavity 120 in air inlet pipe 140
Afterwards, air inlet pipe 140 is fastened on the top surface 110A of operation seat stand 110 using nut 181.It should be noted that entering
The position that tracheae 140 wears, is provided with corresponding interface, and connection in order to air inlet pipe 140 runs through.
With reference to Fig. 3, penetrate the lower wall 132 that air inlet pipe 140 in accommodating cavity 120 is connected to sample box 130, so as to sample
Connection in box 130.After in accommodating cavity 120 is penetrated, air inlet pipe 140 is connected to the lower wall 132 of sample box 130, using spiral shell
Female 182 fasten air inlet pipe 140 on the outer surface of lower wall 132.
With reference to Fig. 4, adsorption tube 160 is connected on the upper wall 131 of sample box 130, so as to connect with sample box 130.?
After adsorption tube 160 is connected on the upper wall 131 of sample box 130, fasten on the outer surface of upper wall 131 using nut 184
Air inlet pipe 140.It should be noted that the position worn in adsorption tube 160, is provided with corresponding interface, in order to adsorption tube
160 connection runs through.
With continued reference to Fig. 1 and Fig. 2, the adsorption tube 160 on the upper wall 131 of sample box 130 is connected to by accommodating cavity 120
Roof 125 is passed, and wherein, the adsorption tube 160 passed by the roof 125 of accommodating cavity 120 collects sliver 300A.In adsorption tube
After 160 are passed by the roof 125 of accommodating cavity 120, adsorption tube 160 is entered on the outer surface of roof 125 using nut 183
Row fastening.
Additionally, after the sample box 130 for being placed with photoresistance sample 300 is installed in accommodating cavity 120, sample box 130
Front side wall 135 towards side wall 121 inner surface so that ultraviolet lamp tube 150 is towards photoresistance sample 300.
Further, in order to sense the temperature in accommodating cavity 120, photoresistance atomization process according to an embodiment of the invention
Equipment 100 also includes hygrosensor 170, and the hygrosensor 170 is arranged in accommodating cavity 120, to detect accommodating cavity
Temperature in 120, so that temperature control system can be adjusted in time to housing the temperature in cavity 120, to ensure to hold
Put the operating temperature that the temperature in cavity 120 is maintained at setting.It should be appreciated that hygrosensor 170 can be removed.
Manipulation seat stand 110 includes:Total gas pressure dial gauge 111, for indicating the pressure of inert gas source (in Fig. 5 200);
Power switch 112, for controlling opening or closing for power supply;Control keyboard 113, for setting operating temperature, photoresistance sample 300
Process time and sample box 130 in gas flow;Temperature control system (not shown), for by accommodating cavity 120
Temperature remain to the operating temperature of setting;LCD display 114, for showing the setup parameter in the course of work;Activate switch
115, for controlling the beginning processed by the photoresistance sample 300 in sample box 130 or stopping.
Fig. 5 is the schematic diagram of photoresistance atomization process system according to an embodiment of the invention.
With reference to Fig. 5, photoresistance atomization process system includes according to an embodiment of the invention:Above-mentioned photoresistance atomization process sets
For 100 and inert gas source 200;Wherein, the air inlet pipe 140 of photoresistance atomizing treatment equipment 100 is connected to inert gas source
200, so as to the inert gas (such as nitrogen) in inert gas source 200 is transported in sample box 130.
Below will be to utilizing photoresistance atomization process system according to an embodiment of the invention to carry out at atomization photoresistance sample
The process of reason is illustrated.
First, photoresistance sample 300 is positioned in sample box 130.Here, photoresistance sample 300 is warp on the glass substrate
Coating-drying-prebake conditions obtain the full membrane sample of photoresistance.
Then, opening side wall 121, the sample box 130 for being placed with photoresistance sample 300 is installed in accommodating cavity 120, is made
Sample box 130 is connected with air inlet pipe 140 and adsorption tube 160 respectively, and makes photoresistance sample 300 towards ultraviolet lamp tube 150.
Then, close side wall 121.
Then, inert gas source 200 is opened, and turns on the power switch 112.
Then, the gas flow of operating temperature, sample processing time and 130 stream of sample box is set according to actual needs.
Method to set up:F key is function key, often by once switching between temperature, time and each sample box flow flow;C is for removing
Key, can delete parameter current;For preserving key, the method parameter that can preserve setting is continuing with S so that next time tests.
Then, after parameter setting is finished, activate switch 115 is pressed, now ultraviolet lamp tube 150, air-flow and temperature start
Work, proceeds by sample treatment, and the material that light initiator sliver 300A etc. in photoresistance sample 300 can be taken out of by air-flow is received
Collection is in adsorption tube 160.
Finally, after being finished according to set time, photoresistance atomization process system is automatically stopped, ultraviolet lamp tube 150, air-flow
Quit work with temperature, and buzzing prompting, close inert gas source 200 and power switch 112.
Afterwards, the sliver 300A in adsorption tube 160 is taken out, with thermal desorption-gas chromatograph or thermal desorption-makings connection
The analysis of light initiator sliver 300A is carried out with instrument, characterizes the atomization performance of photoresistance sample 300 with the size of its content, less
Illustrate to be less susceptible to cause exposure light shield to be atomized.
In sum, embodiments in accordance with the present invention, there is provided at a kind of photoresistance atomizing treatment equipment and photoresistance atomization
Reason system, can carry out atomization process to photoresist, consequently facilitating the assessment of the atomization performance of photoresist, excellent to filter out
Matter photoresist, reduces the loss caused because of photoresist.
Although the present invention is illustrate and described with reference to specific embodiment, it should be appreciated by those skilled in the art that:
In the case of without departing from the spirit and scope of the present invention limited by claim and its equivalent, can here carry out form and
Various change in details.
Claims (10)
1. a kind of photoresistance atomizing treatment equipment, it is characterised in that include:Manipulation seat stand, accommodating cavity, sample box, air inlet pipe, purple
Outer fluorescent tube and adsorption tube;
The accommodating cavity is arranged on the operation seat stand;The sample box is arranged in the accommodating cavity, the sample
Box is used for placing photoresistance sample;The air inlet pipe by described operation seat stand penetrate in the accommodating cavity, and the air inlet pipe with
The sample box connection, the air inlet pipe are used for inert gas to be passed through in the sample box;The ultraviolet lamp tube is arranged at institute
State on the inner surface of accommodating cavity, the ultraviolet lamp tube is used for the photoresistance sample to being positioned in the sample box carries out ultraviolet light
Exposure;The adsorption tube is connected with the sample box, and the adsorption tube passes the accommodating cavity, and the adsorption tube is used for receiving
The sliver of the photoresistance sample after ultraviolet photoetching that collection is blown out by the inert gas.
2. photoresistance atomizing treatment equipment according to claim 1, it is characterised in that the accommodating cavity includes four side walls
And a roof, four side walls are oppositely arranged two-by-two, and the roof is enclosed in the side of four side walls, the behaviour
The opposite side of four side walls is enclosed in as seat stand, so that the top surface of the operation seat stand is towards the roof.
3. photoresistance atomizing treatment equipment according to claim 2, it is characterised in that at least one of described four side walls
It is configured to open or close.
4. photoresistance atomizing treatment equipment according to claim 3, it is characterised in that the ultraviolet lamp tube is arranged at the energy
On the inner surface of the side wall for enough opening or closing.
5. photoresistance atomizing treatment equipment according to claim 2, it is characterised in that the air inlet pipe is penetrated described by outside
In operation seat stand, and passed by the top surface of the operation seat stand, so as to penetrate in the accommodating cavity;The adsorption tube is by institute
The roof for stating accommodating cavity is passed;
After the air inlet pipe is passed by the top surface of the operation seat stand, using nut in the top surface for operating seat stand
On the air inlet pipe is fastened;After the adsorption tube is passed by the roof of the accommodating cavity, using nut in institute
State on the outer surface of roof and the adsorption tube is fastened.
6. photoresistance atomizing treatment equipment according to claim 1, it is characterised in that the sample box is in cuboid, institute
Stating sample box includes:Upper wall, lower wall, left side wall, right side wall, front side wall and rear wall, the air inlet pipe be connected to described under
Wall, the adsorption tube are connected to the upper wall;
After the air inlet pipe is connected to the lower wall, the air inlet is fastened on the outer surface of the lower wall using nut
Pipe;After the adsorption tube is connected to the upper wall, the adsorption tube is fastened on the outer surface of the upper wall using nut.
7. photoresistance atomizing treatment equipment according to claim 6, it is characterised in that described left side wall or part thereof and/or
Described right side wall or part thereof is configured to open or close.
8. photoresistance atomizing treatment equipment according to claim 1, it is characterised in that the photoresistance atomizing treatment equipment is also wrapped
Hygrosensor is included, the hygrosensor is arranged in the accommodating cavity, to detect the temperature in the accommodating cavity.
9. photoresistance atomizing treatment equipment according to claim 8, it is characterised in that the manipulation seat stand includes:
Total gas pressure dial gauge, for indicating the pressure of inert gas source;
Power switch, for controlling opening or closing for power supply;
Control keyboard, for setting the gas flow in operating temperature, photoresistance sample processing time and the sample box;
Temperature control system, for remaining to the operating temperature by the temperature in the accommodating cavity;
Display screen, for showing the setup parameter in the course of work;
Activate switch, for controlling the beginning processed by the photoresistance sample in the sample box or stopping.
10. a kind of photoresistance atomization process system, it is characterised in that including inert gas source and 1 to 9 any one institute of claim
The photoresistance atomizing treatment equipment that states, the air inlet pipe of the photoresistance atomizing treatment equipment are connected with the inert gas source.
Priority Applications (1)
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CN201610889971.5A CN106483219B (en) | 2016-10-11 | 2016-10-11 | Photoresist atomizing treatment equipment and photoresist atomization process system |
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CN201610889971.5A CN106483219B (en) | 2016-10-11 | 2016-10-11 | Photoresist atomizing treatment equipment and photoresist atomization process system |
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CN106483219B CN106483219B (en) | 2019-09-17 |
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CN102189617A (en) * | 2010-03-03 | 2011-09-21 | 鸿富锦精密工业(深圳)有限公司 | Surface activation treatment device |
CN105116570A (en) * | 2015-09-15 | 2015-12-02 | 武汉华星光电技术有限公司 | Glass substrate baking device |
US20160209436A1 (en) * | 2015-01-16 | 2016-07-21 | Htc Corporation | Gas detection device and gas inlet module thereof |
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2016
- 2016-10-11 CN CN201610889971.5A patent/CN106483219B/en active Active
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US20070298331A1 (en) * | 2006-06-09 | 2007-12-27 | Gudeng Precision Industrial Co., Ltd. | Gas filling apparatus for photomask box |
CN101173953A (en) * | 2006-09-30 | 2008-05-07 | 亚申科技研发中心(上海)有限公司 | System and method for sampling tests |
CN101540272A (en) * | 2009-04-24 | 2009-09-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Plasma cleaning method for removing byproduct in chamber and plasma processing system |
CN102189617A (en) * | 2010-03-03 | 2011-09-21 | 鸿富锦精密工业(深圳)有限公司 | Surface activation treatment device |
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CN105116570A (en) * | 2015-09-15 | 2015-12-02 | 武汉华星光电技术有限公司 | Glass substrate baking device |
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