CN106479449A - A kind of nanometer highly heat-conductive material - Google Patents

A kind of nanometer highly heat-conductive material Download PDF

Info

Publication number
CN106479449A
CN106479449A CN201610782609.8A CN201610782609A CN106479449A CN 106479449 A CN106479449 A CN 106479449A CN 201610782609 A CN201610782609 A CN 201610782609A CN 106479449 A CN106479449 A CN 106479449A
Authority
CN
China
Prior art keywords
nanometer
conductive material
highly heat
nano
adopts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610782609.8A
Other languages
Chinese (zh)
Inventor
姚望新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201610782609.8A priority Critical patent/CN106479449A/en
Publication of CN106479449A publication Critical patent/CN106479449A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/10—Liquid materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention discloses a kind of nanometer highly heat-conductive material, its formula is as follows：11 19 parts of part, nanometer high heat conduction powder of nano material 48,25 parts of catalyst, 18 29 parts of resin material, 13 parts of stabilizer, 40 50 parts of solvent.Raw material sources of the present invention extensively, production cost and cheap, product corrosion resistance and good, meanwhile, thermal conductivity is high, and good heat dissipation effect can partly or entirely substitute simple metal Heat Conduction Material.

Description

A kind of nanometer highly heat-conductive material
Technical field
The invention belongs to Heat Conduction Material field is and in particular to a kind of nanometer highly heat-conductive material.
Background technology
Complexity and function with microelectric technique increase with surprising rapidity, its power also continuing to increase, and Volume but constantly reduces.Because electronic component is also thermal source in itself, it is in the peak of whole electronic equipment temperature, it is too high Temperature rise often leads to electronic system malfunction and the lethal factor losing efficacy.For making electronic system (particularly sensitive circuit and first device Part) can sustainedly and stably work, it is reliably and effectively radiated obviously particularly significant.Therefore, research and develop high efficiency Electronic radiation material and correlation technique very urgent.
It is known that metal is conventional Heat Conduction Material.In metal heat-conducting material, the very high gold, silver of the coefficient of heat conduction because Quality is soft, density is big, price is high and cannot be widely used；Iron rule is because pyroconductivity is low, density big, and it is close to meet hyperpyrexia Degree occasion needs, and is not suitable for making computd air cooling fin etc.；Although the coefficient of heat conduction of copper is very high, due to close Spend the unfavorable factors such as big, relatively costly, difficulty of processing is big, using less in the fin of computer equipment；Aluminum is as the earth's crust Middle content highest metallic element, because its coefficient of heat conduction compared with high, density is little, price is low and is favored, but because fine aluminium is hard Degree is less, would generally fill other metal materials in various application fields and make aluminium alloy, obtains many fine aluminium institutes whereby not The characteristic possessing, thus become the first-selection of fin rapidoprint.Further, since metal material density is high, cost is big, perishable Erosion, in smelting and the course of processing, energy consumption and environmental pollution are big, and it is superior compared with metal therefore to seek a kind of performance, course of processing energy consumption Low, the little light composite material of effect on environment, as new heat sink material, with part or all of substituted metal, just becomes a kind of Objective demand.
On the other hand, people know that graphite is a kind of nonmetalloid, and it is the crystalline solid of carbon, has than copper and silver Bigger thermal conductivity.Graphite is along high heat conduction [theoretical value number kW/ (the mK)] characteristic on its lamella direction with perpendicular to its lamella Low heat conduction [theoretical value (6W/ (mK))] the characteristic layer structure special with it in direction is relevant.With above-mentioned Metal Substrate heat conduction material Material is compared, and the heat conductivity of material with carbon element is significantly higher, and itself light weight, corrosion-resistant, raw material are cheap and easy to get, and China's graphite mineral products Aboundresources, distribution area is wide, ground ore reserves big so that material with carbon element have in terms of heat sink material exploitation more superior before Way and market.
Content of the invention
It is an object of the invention to provide a kind of nanometer highly heat-conductive material, raw material sources of the present invention extensively, production cost and valency Lattice are cheap, product corrosion resistance and good, and meanwhile, thermal conductivity is high, and good heat dissipation effect can partly or entirely substitute simple metal heat conduction material Material.
A kind of nanometer highly heat-conductive material, its formula is as follows：
Nano material 4-8 part, nanometer high heat conduction powder 11-19 part, catalyst 2-5 part, resin material 18-29 part, stabilizer 1-3 part, solvent 40-50 part.
Described nano material adopts one of nano silicon oxide, nanometer silicon carbide, nano-silicon nitride.
Described nanometer high heat conduction powder adopts one of nano-graphite granule, nano aluminum nitride or both mixture.
The mixed proportion of described nano-graphite granule and nano aluminum nitride is 7-10.
Described catalyst adopts alkalescence catalyst, and described catalyst adopts sodium bicarbonate or potassium bicarbonate.
Described resin material is using the anime with hydroxyl or amino.
Described resin material is using with disubstituted anime.
Described stabilizer adopts acetic acid acetone.
Described solvent adopts one of ethanol, ethyl acetate, isopropanol, propanol.
The preparation method of described nanometer highly heat-conductive material, its step is as follows：
Step 1, nano material and nanometer high heat conduction powder is put in resin, stirs, and mixing speed is 500-800r/ Min, described mixing time is 20-50min；
Step 2, by the solvent of catalyst dissolution to 50%, then drops in resin, stirs, rate of addition is 5-15mL/min；
Step 3, puts into obtaining hybrid resin in step 2 in sealed reactor, stirs slight fever compressive reaction, obtains high heat conduction Material, described mixing speed is 1000-1500r/min, and heating-up temperature is 60-70 DEG C, and moulding pressure is 2-5MPa, the response time For 2-5h；
Step 4, stabilizer is added in residual solvent, then adds the highly heat-conductive material in step 3, after stirring Obtain a nanometer highly heat-conductive material, described highly heat-conductive material feed postition is Deca while hot, dropping temperature is 40-50 DEG C, Deca speed Spend for 15-30mL/min.
Compared with prior art, the invention has the advantages that：
1st, raw material sources of the present invention extensively, production cost and cheap, product corrosion resistance and good.Meanwhile, thermal conductivity Height, good heat dissipation effect, can partly or entirely substitute simple metal Heat Conduction Material.
2nd, the method that the present invention provides has convenient for production, has high yield, efficient advantage.
Specific embodiment
With reference to embodiment, the present invention is described further：
Embodiment 1
A kind of nanometer highly heat-conductive material, its formula is as follows：
11 parts of part, nanometer high heat conduction powder of nano material 4,2 parts of catalyst, 18 parts of resin material, 1 part of stabilizer, solvent 40 Part.
Described nano material adopts nano silicon oxide.
Described nanometer high heat conduction powder adopts nano-graphite granule.
Described catalyst adopts alkalescence catalyst, and described catalyst adopts sodium bicarbonate.
Described resin material is using the anime with hydroxyl.
Described stabilizer adopts acetic acid acetone.
Described solvent adopts ethanol.
The preparation method of described nanometer highly heat-conductive material, its step is as follows：
Step 1, nano material and nanometer high heat conduction powder is put in resin, stirs, and mixing speed is 500r/min, Described mixing time is 20min；
Step 2, by the solvent of catalyst dissolution to 50%, then drops in resin, stirs, rate of addition is 5mL/min；
Step 3, puts into obtaining hybrid resin in step 2 in sealed reactor, stirs slight fever compressive reaction, obtains high heat conduction Material, described mixing speed is 1000r/min, and heating-up temperature is 60 DEG C, and moulding pressure is 2MPa, and the response time is 2h；
Step 4, stabilizer is added in residual solvent, then adds the highly heat-conductive material in step 3, after stirring Obtain a nanometer highly heat-conductive material, described highly heat-conductive material feed postition is Deca while hot, dropping temperature is 40 DEG C, rate of addition is 15mL/min.
Embodiment 2
A kind of nanometer highly heat-conductive material, its formula is as follows：
19 parts of part, nanometer high heat conduction powder of nano material 8,5 parts of catalyst, 29 parts of resin material, 3 parts of stabilizer, solvent 50 Part.
Described nano material adopts nanometer silicon carbide.
Described nanometer high heat conduction powder adopts nano aluminum nitride.
Described catalyst adopts alkalescence catalyst, and described catalyst adopts potassium bicarbonate.
Described resin material is using the anime with amino.
Described stabilizer adopts acetic acid acetone.
Described solvent adopts ethyl acetate.
The preparation method of described nanometer highly heat-conductive material, its step is as follows：
Step 1, nano material and nanometer high heat conduction powder is put in resin, stirs, and mixing speed is 800r/min, Described mixing time is 50min；
Step 2, by the solvent of catalyst dissolution to 50%, then drops in resin, stirs, rate of addition is 15mL/min；
Step 3, puts into obtaining hybrid resin in step 2 in sealed reactor, stirs slight fever compressive reaction, obtains high heat conduction Material, described mixing speed is 1500r/min, and heating-up temperature is 70 DEG C, and moulding pressure is 5MPa, and the response time is 5h；
Step 4, stabilizer is added in residual solvent, then adds the highly heat-conductive material in step 3, after stirring Obtain a nanometer highly heat-conductive material, described highly heat-conductive material feed postition is Deca while hot, dropping temperature is 50 DEG C, rate of addition is 30mL/min.
Embodiment 3
A kind of nanometer highly heat-conductive material, its formula is as follows：
15 parts of part, nanometer high heat conduction powder of nano material 7,4 parts of catalyst, 24 parts of resin material, 3 parts of stabilizer, solvent 48 Part.
Described nano material adopts nano-silicon nitride.
Described nanometer high heat conduction powder adopts nano-graphite granule, the mixture of nano aluminum nitride.
The mixed proportion of described nano-graphite granule and nano aluminum nitride is 7.
Described catalyst adopts alkalescence catalyst, and described catalyst adopts sodium bicarbonate.
Described resin material is using with the disubstituted anime of hydroxyl.
Described stabilizer adopts acetic acid acetone.
Described solvent adopts isopropanol.
The preparation method of described nanometer highly heat-conductive material, its step is as follows：
Step 1, nano material and nanometer high heat conduction powder is put in resin, stirs, and mixing speed is 700r/min, Described mixing time is 30min；
Step 2, by the solvent of catalyst dissolution to 50%, then drops in resin, stirs, rate of addition is 13mL/min；
Step 3, puts into obtaining hybrid resin in step 2 in sealed reactor, stirs slight fever compressive reaction, obtains high heat conduction Material, described mixing speed is 1200r/min, and heating-up temperature is 67 DEG C, and moulding pressure is 5MPa, and the response time is 4h；
Step 4, stabilizer is added in residual solvent, then adds the highly heat-conductive material in step 3, after stirring Obtain a nanometer highly heat-conductive material, described highly heat-conductive material feed postition is Deca while hot, dropping temperature is 45 DEG C, rate of addition is 27mL/min.
Embodiment 4
A kind of nanometer highly heat-conductive material, its formula is as follows：
13 parts of part, nanometer high heat conduction powder of nano material 7,2 parts of catalyst, 23 parts of resin material, 1 part of stabilizer, solvent 42 Part.
Described nano material adopts nano silicon oxide.
Described nanometer high heat conduction powder adopts nano-graphite granule, the mixture of nano aluminum nitride.
The mixed proportion of described nano-graphite granule and nano aluminum nitride is 10.
Described catalyst adopts alkalescence catalyst, and described catalyst adopts sodium bicarbonate potassium.
Described resin material is using with the disubstituted anime of amino.
Described stabilizer adopts acetic acid acetone.
Described solvent adopts propanol.
The preparation method of described nanometer highly heat-conductive material, its step is as follows：
Step 1, nano material and nanometer high heat conduction powder is put in resin, stirs, and mixing speed is 600r/min, Described mixing time is 40min；
Step 2, by the solvent of catalyst dissolution to 50%, then drops in resin, stirs, rate of addition is 10mL/min；
Step 3, puts into obtaining hybrid resin in step 2 in sealed reactor, stirs slight fever compressive reaction, obtains high heat conduction Material, described mixing speed is 1200r/min, and heating-up temperature is 67 DEG C, and moulding pressure is 3MPa, and the response time is 4h；
Step 4, stabilizer is added in residual solvent, then adds the highly heat-conductive material in step 3, after stirring Obtain a nanometer highly heat-conductive material, described highly heat-conductive material feed postition is Deca while hot, dropping temperature is 42 DEG C, rate of addition is 22mL/min.
Embodiment 5
A kind of nanometer highly heat-conductive material, its formula is as follows：
15 parts of part, nanometer high heat conduction powder of nano material 5,5 parts of catalyst, 27 parts of resin material, 2 parts of stabilizer, solvent 48 Part.
Described nano material adopts nano silicon oxide.
Described nanometer high heat conduction powder adopts nano-graphite granule, the mixture of nano aluminum nitride.
The mixed proportion of described nano-graphite granule and nano aluminum nitride is 9.
Described catalyst adopts alkalescence catalyst, and described catalyst adopts potassium bicarbonate.
Described resin material is using the anime carrying.
Described resin material is using with hydroxyl and amino disubstituted fragrant resin.
Described stabilizer adopts acetic acid acetone.
Described solvent adopts ethanol.
The preparation method of described nanometer highly heat-conductive material, its step is as follows：
Step 1, nano material and nanometer high heat conduction powder is put in resin, stirs, and mixing speed is 700r/min, Described mixing time is 40min；
Step 2, by the solvent of catalyst dissolution to 50%, then drops in resin, stirs, rate of addition is 10mL/min；
Step 3, puts into obtaining hybrid resin in step 2 in sealed reactor, stirs slight fever compressive reaction, obtains high heat conduction Material, described mixing speed is 1400r/min, and heating-up temperature is 64 DEG C, and moulding pressure is 4MPa, and the response time is 3h；
Step 4, stabilizer is added in residual solvent, then adds the highly heat-conductive material in step 3, after stirring Obtain a nanometer highly heat-conductive material, described highly heat-conductive material feed postition is Deca while hot, dropping temperature is 46 DEG C, rate of addition is 21mL/min.
The heat conductivility test of embodiment 1-5：
Project Thermal conductivity along hot pressing direction The thermal conductivity in vertical hot pressing direction
Embodiment 1 5.8W/m·K 190W/m·K
Embodiment 2 6.3W/m·K 280W/m·K
Embodiment 3 6.0W/m·K 265W/m·K
Embodiment 4 6.1W/m·K 235W/m·K
Embodiment 5 6.5W/m·K 219W/m·K
The foregoing is only one embodiment of the invention, be not intended to limit the present invention, all employing equivalents or equivalent transformation The technical scheme that obtained of mode, all fall within protection scope of the present invention.

Claims (10)

1. a kind of nanometer highly heat-conductive material, its formula is as follows：
Nano material 4-8 part, nanometer high heat conduction powder 11-19 part, catalyst 2-5 part, resin material 18-29 part, stabilizer 1-3 Part, solvent 40-50 part.
2. a kind of nanometer highly heat-conductive material according to claims 1 is it is characterised in that described nano material adopts nanometer One of silicon oxide, nanometer silicon carbide, nano-silicon nitride.
3. a kind of nanometer highly heat-conductive material according to claims 1 is it is characterised in that described nanometer high heat conduction powder adopts One of nano-graphite granule, nano aluminum nitride or both mixture.
4. a kind of nanometer highly heat-conductive material according to claims 3 is it is characterised in that described nano-graphite granule and receiving The mixed proportion of rice aluminium nitride is 7-10.
5. a kind of nanometer highly heat-conductive material according to claims 1 is it is characterised in that described catalyst adopts alkalescence Catalyst, described catalyst adopts sodium bicarbonate or potassium bicarbonate.
6. a kind of nanometer highly heat-conductive material according to claims 1 is it is characterised in that described resin material is using carrying Hydroxyl or the anime of amino.
7. a kind of nanometer highly heat-conductive material according to claims 1 is it is characterised in that described resin material is using carrying Disubstituted anime.
8. a kind of nanometer highly heat-conductive material according to claims 1 is it is characterised in that described stabilizer adopts acetic acid third Ketone.
9. a kind of nanometer highly heat-conductive material according to claims 1 is it is characterised in that described solvent adopts ethanol, second One of acetoacetic ester, isopropanol, propanol.
10. a kind of nanometer highly heat-conductive material according to claims 1 is it is characterised in that described nanometer highly heat-conductive material Preparation method, its step is as follows：
Step 1, nano material and nanometer high heat conduction powder is put in resin, stirs, and mixing speed is 500-800r/min, Described mixing time is 20-50min；
Step 2, by the solvent of catalyst dissolution to 50%, then drops in resin, stirs, and rate of addition is 5- 15mL/min；
Step 3, puts into obtaining hybrid resin in step 2 in sealed reactor, stirs slight fever compressive reaction, obtains high heat conduction material Material, described mixing speed is 1000-1500r/min, and heating-up temperature is 60-70 DEG C, and moulding pressure is 2-5MPa, and the response time is 2-5h；
Step 4, stabilizer is added in residual solvent, then adds the highly heat-conductive material in step 3, obtain after stirring Nanometer highly heat-conductive material, described highly heat-conductive material feed postition is Deca while hot, and dropping temperature is 40-50 DEG C, and rate of addition is 15-30mL/min.
CN201610782609.8A 2016-08-31 2016-08-31 A kind of nanometer highly heat-conductive material Pending CN106479449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610782609.8A CN106479449A (en) 2016-08-31 2016-08-31 A kind of nanometer highly heat-conductive material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610782609.8A CN106479449A (en) 2016-08-31 2016-08-31 A kind of nanometer highly heat-conductive material

Publications (1)

Publication Number Publication Date
CN106479449A true CN106479449A (en) 2017-03-08

Family

ID=58273358

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610782609.8A Pending CN106479449A (en) 2016-08-31 2016-08-31 A kind of nanometer highly heat-conductive material

Country Status (1)

Country Link
CN (1) CN106479449A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1172462A (en) * 1995-09-01 1998-02-04 水泽化学工业株式会社 Composite alkali aluminum hydroxide carbonate, and process for production and use thereof
CN101035876A (en) * 2004-08-23 2007-09-12 莫门蒂夫性能材料股份有限公司 Thermally conductive composition and method for preparing the same
CN101248525A (en) * 2005-06-07 2008-08-20 莫门蒂夫功能性材料公司 B-stageable film, electronic device, and associated process
CN101550330A (en) * 2009-05-18 2009-10-07 浙江大学 Lightweight high heat conductive composite material and preparation method thereof
CN101993602A (en) * 2009-08-17 2011-03-30 莱尔德电子材料(深圳)有限公司 Highly thermally-conductive moldable thermoplastic composites and compositions
CN105111838A (en) * 2015-08-13 2015-12-02 蚌埠南自仪表有限公司 Blended graphene and silicon dioxide dispersing and heat-dispersion paint and preparation method therefor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1172462A (en) * 1995-09-01 1998-02-04 水泽化学工业株式会社 Composite alkali aluminum hydroxide carbonate, and process for production and use thereof
CN101035876A (en) * 2004-08-23 2007-09-12 莫门蒂夫性能材料股份有限公司 Thermally conductive composition and method for preparing the same
CN101248525A (en) * 2005-06-07 2008-08-20 莫门蒂夫功能性材料公司 B-stageable film, electronic device, and associated process
CN101550330A (en) * 2009-05-18 2009-10-07 浙江大学 Lightweight high heat conductive composite material and preparation method thereof
CN101993602A (en) * 2009-08-17 2011-03-30 莱尔德电子材料(深圳)有限公司 Highly thermally-conductive moldable thermoplastic composites and compositions
CN105111838A (en) * 2015-08-13 2015-12-02 蚌埠南自仪表有限公司 Blended graphene and silicon dioxide dispersing and heat-dispersion paint and preparation method therefor

Similar Documents

Publication Publication Date Title
CN101486575B (en) Light high heat conducting nano composite material and preparation thereof
CN105296786B (en) A kind of preparation method of aluminium base Graphene heat-conductive composite material sample
CN107686109B (en) Preparation method of high-performance graphite-graphene double-layer carbon-based heat-conducting film
CN107418206A (en) A kind of high dispersive graphene heat conduction masterbatch and preparation method
CN101550330A (en) Lightweight high heat conductive composite material and preparation method thereof
AU2020103465A4 (en) Method for preparing high-purity spherical ruthenium powder by microwave one-step method
CN105732043A (en) Method for preparing hafnium carbide ceramic powder body by using fused salt under assistance of carbon thermal reduction
CN104261360A (en) Silicon nitride powder based on catalytic nitridation and preparation method thereof
CN105482741A (en) High strength heat dissipation binding material for electronic products and preparation method thereof
CN108130456A (en) A kind of high heat conduction die-cast aluminum alloy material and preparation method thereof
CN105152652A (en) Plate-shaped Cr with ferrochrome slag as main material7C3And method for preparing the same
CN104148645B (en) A kind of composite ceramic heat-dissipating material and its preparation method
CN103566830B (en) Synthesis method of octahedron diamond
CN109181492A (en) A kind of graphene heat radiation coating for electronic component
CN106479449A (en) A kind of nanometer highly heat-conductive material
CN108149127B (en) A kind of aluminum-base nano titanium carbonitride crystal seed alloy and preparation method thereof
CN109111756A (en) A kind of nanometer of highly heat-conductive material
CN109942953B (en) Thermal degradation polypropylene gradient phase change heat storage material and preparation method thereof
CN106882807A (en) A kind of preparation method of boron carbide powder
CN103253668B (en) Low-temperature solid-phase synthesis method for titanium carbide ceramic powder
CN103880425A (en) Al3BC3 powder and preparation method thereof
CN101269979B (en) Method for synthesizing superfine aluminium nitride powder by combustion
CN108359414B (en) GO and spherical silver nanoparticle composite alcohol-based nanofluid and preparation method thereof
CN104393163B (en) A kind of preparation method of tellurium bismuthino thermoelectric material
CN104843657A (en) Alkali metal based aluminum nitride nano-material and preparation method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20170308

WD01 Invention patent application deemed withdrawn after publication