CN106478902B - A kind of photocurable resin material for casting - Google Patents
A kind of photocurable resin material for casting Download PDFInfo
- Publication number
- CN106478902B CN106478902B CN201610850705.1A CN201610850705A CN106478902B CN 106478902 B CN106478902 B CN 106478902B CN 201610850705 A CN201610850705 A CN 201610850705A CN 106478902 B CN106478902 B CN 106478902B
- Authority
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- China
- Prior art keywords
- resin material
- methyl
- photocurable resin
- epoxy resin
- casting
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- 239000000463 material Substances 0.000 title claims abstract description 28
- 229920005989 resin Polymers 0.000 title claims abstract description 24
- 239000011347 resin Substances 0.000 title claims abstract description 24
- 238000005266 casting Methods 0.000 title claims abstract description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 9
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims abstract description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 8
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000003999 initiator Substances 0.000 claims abstract description 5
- 239000000178 monomer Substances 0.000 claims abstract description 5
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims abstract description 4
- -1 1,6- hexanediyl ester Chemical class 0.000 claims description 11
- 239000012955 diaryliodonium Substances 0.000 claims description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 125000005520 diaryliodonium group Chemical group 0.000 claims description 5
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 5
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- NLQMSBJFLQPLIJ-UHFFFAOYSA-N (3-methyloxetan-3-yl)methanol Chemical compound OCC1(C)COC1 NLQMSBJFLQPLIJ-UHFFFAOYSA-N 0.000 claims description 3
- CWXZAJNUTOBAOI-UHFFFAOYSA-N 1-(2,3-dimethoxyphenyl)-2-hydroxy-2-phenylethanone Chemical compound COC1=CC=CC(C(=O)C(O)C=2C=CC=CC=2)=C1OC CWXZAJNUTOBAOI-UHFFFAOYSA-N 0.000 claims description 3
- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 claims description 3
- DJHGAFSJWGLOIV-UHFFFAOYSA-K Arsenate3- Chemical compound [O-][As]([O-])([O-])=O DJHGAFSJWGLOIV-UHFFFAOYSA-K 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 229940000489 arsenate Drugs 0.000 claims description 3
- 229940106691 bisphenol a Drugs 0.000 claims description 3
- 125000004386 diacrylate group Chemical group 0.000 claims description 3
- PQZJTHGEFIQMCO-UHFFFAOYSA-N oxetan-2-ylmethanol Chemical compound OCC1CCO1 PQZJTHGEFIQMCO-UHFFFAOYSA-N 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical class C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910019142 PO4 Inorganic materials 0.000 claims description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical class C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 claims description 2
- 229920001038 ethylene copolymer Polymers 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 2
- 239000010452 phosphate Substances 0.000 claims description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- 150000002148 esters Chemical class 0.000 claims 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 claims 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims 1
- BAFRZTCMPBYSMX-UHFFFAOYSA-N C1(CCCCC1)C1C(CCC2C1O2)(C(=O)O)C.[O] Chemical class C1(CCCCC1)C1C(CCC2C1O2)(C(=O)O)C.[O] BAFRZTCMPBYSMX-UHFFFAOYSA-N 0.000 claims 1
- GTTSNKDQDACYLV-UHFFFAOYSA-N Trihydroxybutane Chemical compound CCCC(O)(O)O GTTSNKDQDACYLV-UHFFFAOYSA-N 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 235000019253 formic acid Nutrition 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 claims 1
- 239000000052 vinegar Substances 0.000 claims 1
- 238000005495 investment casting Methods 0.000 abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052799 carbon Inorganic materials 0.000 abstract description 9
- 238000007639 printing Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000007493 shaping process Methods 0.000 description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical group C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 2
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- KJCLYACXIWMFCC-UHFFFAOYSA-M sodium;5-benzoyl-4-hydroxy-2-methoxybenzenesulfonate Chemical compound [Na+].C1=C(S([O-])(=O)=O)C(OC)=CC(O)=C1C(=O)C1=CC=CC=C1 KJCLYACXIWMFCC-UHFFFAOYSA-M 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 description 1
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 description 1
- ORTMHVMCRHIAHL-UHFFFAOYSA-N 4-methyl-5-(7-oxabicyclo[4.1.0]heptan-4-yl)-7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical class C1CC2OC2CC1C1C2OC2CCC1(C)C(O)=O ORTMHVMCRHIAHL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004258 Ethoxyquin Substances 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229940111759 benzophenone-2 Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 description 1
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- DECIPOUIJURFOJ-UHFFFAOYSA-N ethoxyquin Chemical compound N1C(C)(C)C=C(C)C2=CC(OCC)=CC=C21 DECIPOUIJURFOJ-UHFFFAOYSA-N 0.000 description 1
- 229940093500 ethoxyquin Drugs 0.000 description 1
- 235000019285 ethoxyquin Nutrition 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
- C08F255/02—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having two or three carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
- C08F283/065—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to unsaturated polyethers, polyoxymethylenes or polyacetals
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
Abstract
A kind of photocurable resin material for casting, including cycloaliphatic epoxy resin, fourth oxygen ring derivatives, bisphenol-A epoxy resin, the acrylate monomer without benzene ring structure, thermoplastic polymer and initiator.Carbon residual is less after photocurable resin material roasting, suitable for obtaining accurate 3 D workpiece prototype by way of 3 D-printing, carries out hot investment casting for substituting wax pattern.
Description
Technical field
The present invention relates to photocurable resin materials, and in particular to a kind of photocurable resin material for hot investment casting.
Background technique
Currently, hot investment casting industry usually first makes prototype using wax material on wax injector, then in the outer of prototype
Surface hangs ceramic slurry, then is placed under hot environment to melt prototype and be discharged, and the slurry of outer surface is sintered ceramic, after high-temperature roasting
Casting metal can be obtained high-precision casting workpiece.However prototype is made with wax material, it is necessary first to make mold, so
After was moulding could be penetrated on wax injector, and Mold Making is extremely time-consuming, and cost is very high, once prototype parameter needs are repaired
Change, then to remake mold.In addition, the part extremely complex for shape, can not even more be produced high-precision with wax material
The prototype of degree.
Rapid shaping technique is that one kind of rising in recent years directly manufactures the Rapid Manufacturing Technology of product using CAD data,
It is advantageous that speed is fast, do not need mold and the manufacture of complicated shape product can be completed in cutter, it is a kind of " Non-mould shaping "
Technology can shorten the design and producing period of product, reduce production cost, and wherein Stereolithography is that current application is mature a kind of
Rapid shaping technique.
Have some Research Literatures that wax pattern in hot investment casting is replaced with Introduction To Stereolithography production prototype, such as
" application of the photocureable rapid shaping in hot investment casting " of Wang Wei and " the accurate casting based on photocureable rapid shaping of Yu Dongman
Make industrial analysis " etc..After making colophony prototype with Introduction To Stereolithography, in the periphery of colophony prototype equably hanging material
And stucco, multilayer shell is formed, then roast and remove colophony prototype formation casting shell, casting metal can produce casting.It is this
Technique does not need production pressure wax-pattern tool, and at low cost, the casting period is short, is a kind of precision casting process of fast and low-cost.
However, replacing wax pattern to still have problems the prototype of photocureable rapid shaping production.Especially prominent
Be, at present used in light-cured resin be substantially to show model, medical treatment, the exploitation of the directions such as industrial design, and if
It is used for replacing the wax pattern in hot investment casting, then less, the excessive carbon of carbon residual quantity after requiring photocurable resin material to roast
Residual quantity influences whether the dimensional accuracy of shell, and then causes the precision of casting workpiece undesirable, in addition also influences whether
The surface quality of workpiece.
Summary of the invention
The present invention exactly against the above deficiency, provides that a kind of comprehensive performance is superior, the less light of carbon residual quantity after roasting
Curing resin material is carried out suitable for obtaining accurate 3 D workpiece prototype by way of 3 D-printing for substituting wax pattern
Hot investment casting.
The present invention can be achieved through the following technical solutions:
A kind of photocurable resin material for casting, including following weight proportion component: cycloaliphatic epoxy resin 10-
40%, fourth oxygen ring derivatives 10-30%, bisphenol-A epoxy resin 5-50%, the acrylate monomer 10- of no benzene ring structure
40%, thermoplastic polymer 1-5%, initiator 5-15%.
Further, the cycloaliphatic epoxy resin is 3,4- epoxycyclohexyl-methyl -3,4- epoxycyclohexyl formic acid esters,
Bis- ((3,4- epoxycyclohexyl) methyl) adipate esters, hexahydrophthalic acid bisglycidyl ester, 3,4- epoxycyclohexyl first
One of methyl acrylate is a variety of.
Further, the fourth oxygen ring derivatives be 3- methylol -1- oxetanes, 2- hydroxymethyl-oxetane,
One of 3- methyl -3- hydroxymethyl-oxetane is a variety of.
Further, the bisphenol-A epoxy resin is the liquid hydrogenated bisphenol-A of epoxide equivalent 190-350g/eq
Resin.
Further, the acrylate monomer of the no benzene ring structure is tripropylene glycol diacrylate, dipropylene glycol two
Acrylate, 1,6- hexanediyl ester, polyethyleneglycol diacrylate, trimethylolpropane trimethacrylate, three hydroxyls
Trimethacrylate, one of pentaerythritol triacrylate or a variety of.
Further, the inertia thermoplastic polymer is ethylene-vinyl acetate copolymer class.
Further, the initiator is Diaryl iodonium hexafluorophosphate, Diaryl iodonium hexafluoro arsenate, triaryl
Sulphur hexafluorophosphate, 2- hydroxy-2-methyl -1- phenyl -1- acetone, benzophenone, dimethoxybenzoin, chlorinated diphenyl ketone
One of or it is a variety of.
The invention has the following beneficial effects:
It is crosslinked containing a large amount of bisphenol A type epoxy resins and containing benzene ring structure or height in existing light-cured resin formula close
Carbon residual quantity is higher after the acrylate of degree, a large amount of benzene ring structures or mistake high crosslink density will lead to material calcination, seriously affects
The dimensional accuracy and surface quality of precision casting shell, the present invention in selected the epoxy poor without benzene ring structure and thermal stability
This problem of resin and acrylate very good solution；
The present invention has selected thermoplastic ethylene-vinyl acetate copolymer, and in the environment of high-temperature roasting, this is thermoplastic
Polymer can become flowable state, can structure to 3 D workpiece prototype and overall mechanical properties cause serious destruction, promote former
Cured epoxy resin and acrylate more thoroughly decompose at high temperature in type, the carbon after further reduced material calcination
Residual quantity.
Specific embodiment
Below with reference to embodiment, the present invention is done and is further described in detail.
Comparative example
Photocurable resin material in comparative example is made of the material of following mass fraction: bisphenol A type epoxy resin 30%,
3- methylol -1- oxetanes 10%, bisphenol-A epoxy resin 25%, dipentaerythritol hexaacrylate 9%, ethoxyquin
Bisphenol a dimethacrylate 12%, Diaryl iodonium hexafluorophosphate 9%, benzophenone 5%.
Embodiment 1
Photocurable resin material in embodiment 1 is made of the material of following mass fraction: 3,4- epoxycyclohexyl first
Base -3,4- epoxycyclohexyl formic acid esters 20%, 3- methylol -1- oxetanes 15%, bisphenol-A epoxy resin 30%, three
Propylene glycol diacrylate 18%, pentaerythritol triacrylate 7%, ethylene-vinyl acetate copolymer 1%, Diaryl iodonium hexafluoro
Phosphate 7%, benzophenone 2%.
Embodiment 2
Photocurable resin material in embodiment 2 is made of the material of following mass fraction: 3,4- epoxycyclohexyl first
Base -3,4- epoxycyclohexyl formic acid esters 8%, hexahydrophthalic acid bisglycidyl ester 2%, 2- hydroxymethyl-oxetane 25%,
Bisphenol-A epoxy resin 35%, 1,6- hexanediyl ester 10%, trimethylolpropane trimethacrylate 5%, ethylene-
Acetate ethylene copolymer 3%, Diaryl iodonium hexafluoro arsenate 8%, dimethoxybenzoin 4%.
Embodiment 3
Photocurable resin material in embodiment 3 is made of the material of following mass fraction: 3,4- epoxycyclohexyl first
Base -3,4- epoxycyclohexyl formic acid esters 22%, 3,4- epoxycyclohexyl-methyl methacrylates 15%, 3- methyl -3- methylol
Oxetanes 10%, bisphenol-A epoxy resin 28%, tripropylene glycol diacrylate 7%, polyethyleneglycol diacrylate
2%, pentaerythritol triacrylate 5%, ethylene-vinyl acetate copolymer 1%, triaryl sulphur hexafluorophosphate 5%, benzophenone
5%
Using above example light-cured resin under the same conditions, 3 D workpiece is made on rapidform machine, so
The condition (1000 DEG C, 2 hours) that prototype is roasted in precision casting process, the carbon residual quantity after test piece roasting, knot are simulated afterwards
Fruit such as table 1.
1 carbon residual quantity test comparison result of table
| Serial number | Comparative example | Embodiment 1 | Embodiment 2 | Embodiment 3 |
| Carbon residual quantity | 1.2% | 0.5% | 0.3% | 0.6% |
By embodiment as it can be seen that photocurable resin material of the invention, charcoal residual quantity after being roasted by the 3 D workpiece of its production
It is substantially reduced, is particularly suitable for carrying out hot investment casting.
Above embodiments are only the preferred embodiment of the present invention, and protection scope of the present invention is not limited merely to above-mentioned reality
Example is applied, all technical solutions belonged under thinking of the present invention are within the scope of protection of the invention.It should be pointed out that not departing from this
Several modifications and modification under the premise of inventive principle, should be regarded as protection scope of the present invention.
Claims (4)
1. a kind of photocurable resin material for casting, which is characterized in that including following weight proportion component: alicyclic epoxy
Resin 10-40%, fourth oxygen ring derivatives 10-30%, bisphenol-A epoxy resin 5-50%, the acrylic acid of no benzene ring structure
Ester monomer 10-25%, thermoplastic polymer 1-5%, initiator 5-15%, wherein the bisphenol-A epoxy resin is ring
The liquid hydrogenated bisphenol a resin of oxygen equivalent 190-350g/eq, the acrylate monomer of the no benzene ring structure are tripropylene glycol two
Acrylate, dipropylene glycol diacrylate, 1,6- hexanediyl ester, polyethyleneglycol diacrylate, trihydroxy methyl
Propane trimethyl acrylic ester, one of pentaerythritol triacrylate or a variety of, the thermoplastic polymer are ethylene-vinegar
Sour ethylene copolymer species.
2. photocurable resin material according to claim 1, which is characterized in that the cycloaliphatic epoxy resin is 3,4- ring
Oxygen cyclohexyl methyl -3,4- epoxycyclohexyl formic acid esters, bis- ((3,4- epoxycyclohexyl) methyl) adipate esters, hexahydro neighbour benzene two
Formic acid bisglycidyl ester, one of 3,4- epoxycyclohexyl-methyl methacrylates or a variety of.
3. photocurable resin material according to claim 1, which is characterized in that the fourth oxygen ring derivatives are 3- hydroxyl first
Base -1- oxetanes, 2- hydroxymethyl-oxetane, one of 3- methyl -3- hydroxymethyl-oxetane or a variety of.
4. photocurable resin material according to claim 1, which is characterized in that the initiator is Diaryl iodonium hexafluoro
Phosphate, Diaryl iodonium hexafluoro arsenate, triaryl sulphur hexafluorophosphate, 2- hydroxy-2-methyl -1- phenyl -1- acetone,
Benzophenone, dimethoxybenzoin, one of chlorinated diphenyl ketone or a variety of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610850705.1A CN106478902B (en) | 2016-09-26 | 2016-09-26 | A kind of photocurable resin material for casting |
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| CN107141424B (en) * | 2017-05-19 | 2019-08-06 | 湖南华曙高科技有限责任公司 | Photocurable resin material |
| CN108774376B (en) * | 2018-06-19 | 2021-07-20 | 深圳摩方新材科技有限公司 | Resin mold prototype formula for photocuring rapid prototyping and investment casting process thereof |
| CN110272521A (en) * | 2019-05-07 | 2019-09-24 | 络合高新材料(上海)有限公司 | 3D printing flexibility color inhibition photosensitive resin and preparation method thereof |
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