CN106478902A - A kind of photocurable resin material for casting - Google Patents
A kind of photocurable resin material for casting Download PDFInfo
- Publication number
- CN106478902A CN106478902A CN201610850705.1A CN201610850705A CN106478902A CN 106478902 A CN106478902 A CN 106478902A CN 201610850705 A CN201610850705 A CN 201610850705A CN 106478902 A CN106478902 A CN 106478902A
- Authority
- CN
- China
- Prior art keywords
- resin material
- photocurable resin
- methyl
- material according
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000463 material Substances 0.000 title claims abstract description 31
- 229920005989 resin Polymers 0.000 title claims abstract description 26
- 239000011347 resin Substances 0.000 title claims abstract description 26
- 238000005266 casting Methods 0.000 title abstract description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 9
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims abstract description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 8
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000003999 initiator Substances 0.000 claims abstract description 5
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims abstract description 4
- -1 (3,4- epoxycyclohexyl) methyl Chemical group 0.000 claims description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- 239000012955 diaryliodonium Substances 0.000 claims description 7
- 125000005520 diaryliodonium group Chemical group 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 4
- 229940106691 bisphenol a Drugs 0.000 claims description 4
- CWXZAJNUTOBAOI-UHFFFAOYSA-N 1-(2,3-dimethoxyphenyl)-2-hydroxy-2-phenylethanone Chemical compound COC1=CC=CC(C(=O)C(O)C=2C=CC=CC=2)=C1OC CWXZAJNUTOBAOI-UHFFFAOYSA-N 0.000 claims description 3
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical group C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 claims description 3
- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 claims description 3
- DJHGAFSJWGLOIV-UHFFFAOYSA-K Arsenate3- Chemical compound [O-][As]([O-])([O-])=O DJHGAFSJWGLOIV-UHFFFAOYSA-K 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 3
- 229940000489 arsenate Drugs 0.000 claims description 3
- PQZJTHGEFIQMCO-UHFFFAOYSA-N oxetan-2-ylmethanol Chemical compound OCC1CCO1 PQZJTHGEFIQMCO-UHFFFAOYSA-N 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- NLQMSBJFLQPLIJ-UHFFFAOYSA-N (3-methyloxetan-3-yl)methanol Chemical compound OCC1(C)COC1 NLQMSBJFLQPLIJ-UHFFFAOYSA-N 0.000 claims description 2
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical class C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 claims description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical class OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 229920001038 ethylene copolymer Polymers 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- 150000002148 esters Chemical class 0.000 claims 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims 2
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 claims 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims 1
- BAFRZTCMPBYSMX-UHFFFAOYSA-N C1(CCCCC1)C1C(CCC2C1O2)(C(=O)O)C.[O] Chemical class C1(CCCCC1)C1C(CCC2C1O2)(C(=O)O)C.[O] BAFRZTCMPBYSMX-UHFFFAOYSA-N 0.000 claims 1
- 229910019142 PO4 Inorganic materials 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 150000002118 epoxides Chemical class 0.000 claims 1
- 235000019253 formic acid Nutrition 0.000 claims 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 239000000052 vinegar Substances 0.000 claims 1
- 238000005495 investment casting Methods 0.000 abstract description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052799 carbon Inorganic materials 0.000 abstract description 9
- 239000000178 monomer Substances 0.000 abstract description 3
- 238000007639 printing Methods 0.000 abstract description 2
- 238000007493 shaping process Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- OXQXGKNECHBVMO-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical class C1C(C(=O)O)CCC2OC21 OXQXGKNECHBVMO-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- KJCLYACXIWMFCC-UHFFFAOYSA-M sodium;5-benzoyl-4-hydroxy-2-methoxybenzenesulfonate Chemical compound [Na+].C1=C(S([O-])(=O)=O)C(OC)=CC(O)=C1C(=O)C1=CC=CC=C1 KJCLYACXIWMFCC-UHFFFAOYSA-M 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- ORTMHVMCRHIAHL-UHFFFAOYSA-N 4-methyl-5-(7-oxabicyclo[4.1.0]heptan-4-yl)-7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical class C1CC2OC2CC1C1C2OC2CCC1(C)C(O)=O ORTMHVMCRHIAHL-UHFFFAOYSA-N 0.000 description 1
- DJOWTWWHMWQATC-KYHIUUMWSA-N Karpoxanthin Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1(O)C(C)(C)CC(O)CC1(C)O)C=CC=C(/C)C=CC2=C(C)CC(O)CC2(C)C DJOWTWWHMWQATC-KYHIUUMWSA-N 0.000 description 1
- SSOONFBDIYMPEU-UHFFFAOYSA-N [3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propyl] prop-2-enoate Chemical compound OCC(CO)(CO)COCC(CO)(CO)COC(=O)C=C SSOONFBDIYMPEU-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229940111759 benzophenone-2 Drugs 0.000 description 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- BFMKFCLXZSUVPI-UHFFFAOYSA-N ethyl but-3-enoate Chemical compound CCOC(=O)CC=C BFMKFCLXZSUVPI-UHFFFAOYSA-N 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
- C08F255/02—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having two or three carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
- C08F283/065—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to unsaturated polyethers, polyoxymethylenes or polyacetals
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
Abstract
A kind of photocurable resin material for casting, including cycloaliphatic epoxy resin, fourth oxygen ring derivatives, bisphenol-A epoxy resin, the acrylate monomer nothing benzene ring structure, thermoplastic polymer and initiator.After the photocurable resin material roasting, carbon residual is less, it is adaptable to obtains the 3 D workpiece prototype of precision by way of 3 D-printing, carries out hot investment casting for substituting wax pattern.
Description
Technical field
The present invention relates to photocurable resin material, and in particular to a kind of photocurable resin material for hot investment casting.
Background technology
At present, hot investment casting industry generally first makes prototype using wax material on wax injector, then in the outer of prototype
Surface hangs ceramic slurry, then is placed in prototype fusing discharge under hot environment, and the slurry sintering ceramic of outer surface, after high-temperature roasting
Casting metal, you can obtain high-precision casting workpiece.But prototype is made with wax material, it is necessary first to mould is made, so
After could penetrate was moulding on wax injector, and Mold Making extremely takes, and cost is very high, once prototype parameter needs to repair
Change, then will remake mould.In addition, for the extremely complex part of shape, even more cannot be produced with wax material high-precision
The prototype of degree.
Rapid shaping technique is the Rapid Manufacturing Technology of a kind of direct utilization CAD data manufacture product of rising in recent years,
It is advantageous that speed is fast, the manufacture that mould and cutter can complete complicated shape product is not needed, be one kind " Non-mould shaping "
Technology can shorten the design of product and production cycle, reduce production cost, and wherein Stereolithography is that application at present is ripe a kind of
Rapid shaping technique.
Have some and replace the Research Literature of wax pattern in hot investment casting with photocureable rapid shaping fabrication techniques prototype, such as
Wang Wei's《Application of the photocureable rapid shaping in hot investment casting》With Yu Dongman's《Precision casting based on photocureable rapid shaping
Make industrial analysis》Deng.After photocureable rapid shaping fabrication techniques colophony prototype, in the periphery of colophony prototype equably hanging material
And stucco, multilayer shell is formed, then roasting removes colophony prototype and forms casting shell, casting metal, you can make foundry goods.This
Technique need not make pressure wax-pattern to be had, low cost, and foundry goods cycle is short, is a kind of precision casting process of fast and low-cost.
However, the prototype of photocureable rapid shaping making is replaced wax pattern to yet suffer from problems.Especially prominent
It is that the light-cured resin for being used at present is substantially as showing what the directions such as model, medical treatment, industrial design were developed, and if
Use it for replacing the wax pattern in hot investment casting, then require less, the excessive carbon of carbon residual quantity after photocurable resin material roasting
Residual quantity influences whether the dimensional accuracy of shell, and then causes the precision of casting workpiece undesirable, in addition also influences whether
The surface quality of workpiece.
Content of the invention
The present invention is exactly for above not enough, there is provided a kind of combination property is superior, the less light of carbon residual quantity after roasting
Curing resin material, it is adaptable to obtain the 3 D workpiece prototype of precision by way of 3 D-printing, carry out for substituting wax pattern
Hot investment casting.
The present invention can be achieved through the following technical solutions：
A kind of photocurable resin material for casting, including following weight proportion component：Cycloaliphatic epoxy resin 10-40%, fourth
Oxygen ring derivatives 10-30%, bisphenol-A epoxy resin 5-50%, nothing the acrylate monomer 10-40% of benzene ring structure, thermoplastic
Property polymer 1-5%, initiator 5-15%.
Further, the cycloaliphatic epoxy resin is 3,4- epoxycyclohexyl-methyl -3,4- epoxycyclohexyl formic acid esters,
Double ((3,4- epoxycyclohexyl) methyl) adipate esters, hexahydrophthalic acid bisglycidyl ester, 3,4- epoxycyclohexyl first
One or more in methyl acrylate.
Further, the fourth oxygen ring derivatives are 3- methylol -1- oxetanes, 2- hydroxymethyl-oxetane,
One or more in 3- methyl -3- hydroxymethyl-oxetane.
Further, the bisphenol-A epoxy resin is the liquid hydrogenated bisphenol-A of epoxide equivalent 190-350g/eq
Resin.
Further, the acrylate monomer nothing benzene ring structure is tripropylene glycol diacrylate, DPG two
Acrylate, 1,6- hexanediyl ester, polyethyleneglycol diacrylate, trimethylolpropane trimethacrylate, three hydroxyls
Trimethacrylate, one or more in pentaerythritol triacrylate.
Further, the inertia thermoplastic polymer is ethylene-vinyl acetate copolymer class.
Further, the initiator is Diaryl iodonium hexafluorophosphate, Diaryl iodonium hexafluoro arsenate, triaryl
Sulphur hexafluorophosphate, 2- hydroxy-2-methyl -1- phenyl -1- acetone, benzophenone, dimethoxybenzoin, chlorinated diphenyl ketone
In one or more.
The present invention has the advantages that：
All containing a large amount of bisphenol A type epoxy resins and containing benzene ring structure or high crosslink density in existing light-cured resin formula
After acrylate, a large amount of benzene ring structures or mistake high crosslink density can cause material calcination, carbon residual quantity is higher, has a strong impact on precision
The dimensional accuracy and surface quality of casting shell, has selected the epoxy resin poor nothing benzene ring structure and heat endurance in the present invention
This problem is solved well with acrylate；
The present invention has selected thermoplastic ethylene-vinyl acetate copolymer, in the environment of high-temperature roasting, the thermoplastic polymerization
Thing can be changed into flowable state, can cause serious destruction to the structure of 3 D workpiece prototype and overall mechanical properties, promote in prototype
Cured epoxy resin and acrylate more thoroughly decompose at high temperature, reduce further the residual of the carbon after material calcination
Amount.
Specific embodiment
With reference to embodiment, the present invention is done and is further described in detail.
Comparative example
Photocurable resin material in comparative example, is made up of the material of following mass fraction：Bisphenol A type epoxy resin 30%, 3- hydroxyl
Methyl isophthalic acid-oxetanes 10%, bisphenol-A epoxy resin 25%, dipentaerythritol acrylate 9%, ethoxylated bisphenol
A dimethylacrylate 12%, Diaryl iodonium hexafluorophosphate 9%, benzophenone 5%.
Embodiment 1
Photocurable resin material in embodiment 1, is made up of the material of following mass fraction：3,4- epoxycyclohexyl-methyl -3,
4- epoxycyclohexyl formic acid esters 20%, 3- methylol -1- oxetanes 15%, bisphenol-A epoxy resin 30%, 3 the third two
Alcohol diacrylate 18%, pentaerythritol triacrylate 7%, ethylene-vinyl acetate copolymer 1%, Diaryl iodonium hexafluorophosphoric acid
Salt 7%, benzophenone 2%.
Embodiment 2
Photocurable resin material in embodiment 2, is made up of the material of following mass fraction：3,4- epoxycyclohexyl-methyl -3,
4- epoxycyclohexyl formic acid esters 8%, hexahydrophthalic acid bisglycidyl ester 2%, 2- hydroxymethyl-oxetane 25%, hydrogenation
Bisphenol A type epoxy resin 35%, 1,6- hexanediyl ester 10%, trimethylolpropane trimethacrylate 5%, ethyl vinyl acetate
Ethylene copolymer 3%, Diaryl iodonium hexafluoro arsenate 8%, dimethoxybenzoin 4%.
Embodiment 3
Photocurable resin material in embodiment 3, is made up of the material of following mass fraction：3,4- epoxycyclohexyl-methyl -3,
4- epoxycyclohexyl formic acid esters 22%, 3,4- epoxycyclohexyl-methyl methacrylate 15%, 3- methyl -3- methylol oxa- rings
Butane 10%, bisphenol-A epoxy resin 28%, tripropylene glycol diacrylate 7%, polyethyleneglycol diacrylate 2%, season penta
Tetrol triacrylate 5%, ethylene-vinyl acetate copolymer 1%, triaryl sulphur hexafluorophosphate 5%, benzophenone 5%
Using above example light-cured resin at identical conditions, on rapidform machine make 3 D workpiece, Ran Houmo
Intend the condition of roasting prototype in precision casting process（1000 DEG C, 2 hours）, carbon residual quantity after test piece roasting, as a result such as
Table 1.
1 carbon residual quantity test comparison result of table
| Sequence number | Comparative example | Embodiment 1 | Embodiment 2 | Embodiment 3 |
| Carbon residual quantity | 1.2% | 0.5% | 0.3% | 0.6% |
From embodiment, the photocurable resin material of the present invention, after the 3 D workpiece roasting made by which, charcoal residual quantity is obvious
Reduce, be particularly suited for carrying out hot investment casting.
Above example is only the preferred embodiment of the present invention, and protection scope of the present invention is not limited merely to above-mentioned reality
Example is applied, all technical schemes belonged under thinking of the present invention all should belong to protection scope of the present invention.It should be pointed out that without departing from this
Some modifications and modification under the premise of inventive principle, should be regarded as protection scope of the present invention.
Claims (7)
1. a kind of for cast photocurable resin material, it is characterised in that including following weight proportion component：Alicyclic epoxy
Resin 10-40%, fourth oxygen ring derivatives 10-30%, bisphenol-A epoxy resin 5-50%, nothing the acrylate list of benzene ring structure
Body 10-40%, thermoplastic polymer 1-5%, initiator 5-15%.
2. photocurable resin material according to claim 1, it is characterised in that the cycloaliphatic epoxy resin is 3,4- ring
Oxygen cyclohexyl methyl -3,4- epoxycyclohexyl formic acid esters, double ((3,4- epoxycyclohexyl) methyl) adipate esters, hexahydro neighbour's benzene two
Formic acid bisglycidyl ester, one or more in 3,4- epoxycyclohexyl-methyl methacrylates.
3. photocurable resin material according to claim 1, it is characterised in that the fourth oxygen ring derivatives are 3- hydroxyl first
Base -1- oxetanes, 2- hydroxymethyl-oxetane, one or more in 3- methyl -3- hydroxymethyl-oxetane.
4. photocurable resin material according to claim 1, it is characterised in that the bisphenol-A epoxy resin is
The liquid hydrogenated bisphenol a resin of epoxide equivalent 190-350g/eq.
5. photocurable resin material according to claim 1, it is characterised in that the acrylate list nothing benzene ring structure
Body is tripropylene glycol diacrylate, propylene glycol diacrylate, 1,6- hexanediyl ester, two propylene of polyethylene glycol
Acid esters, trimethylolpropane trimethacrylate, trimethylol-propane trimethacrylate, in pentaerythritol triacrylate
One or more.
6. photocurable resin material according to claim 1, it is characterised in that the thermoplastic polymer is ethene-vinegar
Sour ethylene copolymer species.
7. photocurable resin material according to claim 1, it is characterised in that the initiator is Diaryl iodonium hexafluoro
Phosphate, Diaryl iodonium hexafluoro arsenate, triaryl sulphur hexafluorophosphate, 2- hydroxy-2-methyl -1- phenyl -1- acetone,
Benzophenone, dimethoxybenzoin, one or more in chlorinated diphenyl ketone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610850705.1A CN106478902B (en) | 2016-09-26 | 2016-09-26 | A kind of photocurable resin material for casting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610850705.1A CN106478902B (en) | 2016-09-26 | 2016-09-26 | A kind of photocurable resin material for casting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106478902A true CN106478902A (en) | 2017-03-08 |
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| CN107141424A (en) * | 2017-05-19 | 2017-09-08 | 湖南华曙高科技有限责任公司 | Photocurable resin material |
| CN108774376A (en) * | 2018-06-19 | 2018-11-09 | 深圳摩方新材科技有限公司 | A kind of resin mold prototype formula and its full form casting process for photocureable rapid shaping |
| CN110272521A (en) * | 2019-05-07 | 2019-09-24 | 络合高新材料(上海)有限公司 | 3D printing flexibility color inhibition photosensitive resin and preparation method thereof |
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| CN106478902B (en) | 2018-12-04 |
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