CN106461701A - Micromechanical structure for an acceleration sensor - Google Patents
Micromechanical structure for an acceleration sensor Download PDFInfo
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- CN106461701A CN106461701A CN201480075691.XA CN201480075691A CN106461701A CN 106461701 A CN106461701 A CN 106461701A CN 201480075691 A CN201480075691 A CN 201480075691A CN 106461701 A CN106461701 A CN 106461701A
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- micro mechanical
- mechanical structure
- oscillating mass
- spring element
- mass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0817—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for pivoting movement of the mass, e.g. in-plane pendulum
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Abstract
Disclosed is a micromechanical structure (100) for an acceleration sensor (200), comprising: - a seismic mass (10) which is asymmetrical in a defined manner in relation to the rotational z axis (A) of the structure (100) of the acceleration sensor (200); and - spring elements (20, 20', 21, 21') which are attached to the seismic mass (10) and to at least one fastening means (30); - the spring elements (20, 20', 21, 21') allow the seismic mass (10) to perform a rotational movement essentially only when an acceleration occurs in a defined sensing direction within a plane that extends substantially perpendicular to the rotational z axis (A).
Description
Technical field
The present invention relates to a kind of micro mechanical structure for acceleration transducer.The invention still further relates to a kind of use for making
Method in the micro mechanical structure of acceleration transducer.
Background technology
Known in the prior art for example it is directed to application in automotive field or consumer product area and produces system in batches
The capacitance type micro mechanical acceleration transducer made.It is to be set in the way of as resistance to as possible shaking especially in a major challenge in automotive field
Meter sensors with auxiliary electrode.For this reason, micro-machine acceleration transducer is wished to realize a kind of transmission function, this transmission function
So that the low frequency " smoothly " in effective band (typical bandwidth is about 10-400Hz) scope is transmitted, and make due to unintentional actuation
Caused upper frequency is effectively suppressed.
In order to suppress high skew amplitude, generally compared with high internal pressure power, acceleration transducer is hermetically sealed with many hundreds millibar
In sensor cavities, it is frequently used for this and there is high-viscosity gas, such as neon.The gas of closing leads to micro mechanical structure
High-damping.Described sensor great majority are overdamps, even if so that mechanical eigenfrequency f in typically several KHz0
In the range of be also not in resonant check.
Therefore damping can cause mechanical low-pass characteristic, but only form the amplitude of maximum every ten octaves 20dB relatively weakly
Suppression.Can get with the more precipitous decline of the transmission function of every ten octaves 40dB above eigenfrequency.Therefore in order to improve
Vibration resistance is it is expected that a kind of design alap sensor of eigenfrequency, such as 1kHz or lower.But in basis
In the lateral acceleration sensor (having the sensing sensitivity parallel to chip plane) of prior art, this hope is subject to strict
Restriction.
These sensors can be simplified and be described as spring mass system, its side-play amount can be passed through according to Hooke's law
Formula：
M*a=k*x (1)
Calculate,
Wherein, m... mass
A.... acceleration
K.... spring constant
X.... side-play amount
Side-play amount x be can get：
X=m*a/k (2)
Or with eigenfrequency f0Obtain after conversion：
X=a/ (4* π2*f0 2) (3)
That is, offset the increase in square when eigenfrequency reduces of amplitude x.
It is used for the allusion quotation of so-called low g application (being for example used for ESP or uphill starting auxiliary) for measurement range for several g
Type sensor has the eigenfrequency of 3kHz, and offsets about 28nm in the case of 1g acceleration.Intrinsic having 1kHz
In the sensor of frequency, this value has built up about 250nm.Even if because acceleration transducer also must have in low g applies
There are 20g or even dynamic range resistant to overload (that is, should not have mechanical impact or " impact ") in other words of 50g, so having
The such acceleration transducer having 50g impact acceleration must be allowed for the skew more than 12 μm.
In the capacity plate antenna device assembly being usually used between the motion of capacitance acceleration transducer and fixed electrode
Typical gap only about 2 μm of breach in other words.In the case that gap enlargement is to 12 μm, unipolar sensitivity about with
Coefficient 36 declines, because sensitivity dC/dx and gap are inverse square relation.
Additionally, significantly less electrode can only be realized in identical faces so that total sensitivity even also more declines, from
And make poor signal to noise to the stage that can not put up with.
A kind of replacement scheme of plate electrode is so-called comb electrode, for example public by DE 10 2,006 059928 A1
Know there is bigger side-play amount in this comb electrode.But the damping force of comb electrode is much smaller, so that may not
Realize supercritical damping sensor.Additionally, required high side-play amount is also the challenge being difficult to control for spring design, because bullet
Spring not only becomes soft in the driven direction, and unexpectedly substantially loses rigidity and overload resistance in a lateral direction.This
Levy the mandatory relationship of frequency and mechanical sensitivity so that the resonant frequency reduction probability of micromechanics lateral acceleration sensor is subject to
To quite strict restriction.
By EP 0 244 581 B1 and EP 0 773 443 B1 it is also known that according to seesaw principle work z acceleration sensing
Device.The advantage of z seesaw is, there is not eigenfrequency and the mandatory relationship of mechanical sensitivity.That is, eigenfrequency f of sensor0
, around the rotary inertia J of rotary shaft, relational expression is as follows for torsional rigidity kt depending on spring and seesaw：
f0 2=[1/ (2* π)2]*kt/J (4)
Mechanical sensitivity, although that is, unit acceleration a corner α again by spring torsional rigidity ktDraw, but
Also by quality degree of asymmetry δmThe moment of torsion producing therefrom draws：
δ α/da～δ m*rm/kt(5)
δ α/da... mechanical sensitivity
δ m... mass degree of asymmetry
rm... the barycenter of asymmetric quality and the distance turning round axle
kt... the torsional rigidity of spring
By reducing torsional rigidity ktOr it is used to J reduction eigenfrequency f by improving total rotation of seesaw0.If reduced simultaneously
The quality degree of asymmetry δ m of sensor, then the mechanical sensitivity of sensor still can keep arbitrarily small, therefore to a certain extent
Big freedom of motion need not be reserved in the design of sensor.Describe this making in DE 10 2,006 032 194 A1
With z seesaw as mechanical low pass principle.
In addition the known z seesaw working simultaneously as x and y lateral acceleration sensor, such as by DE 10 2008
Known in 001 442 A1, disclosed herein is so-called " simple substance amount oscillator ".The advantage of these sensors be they closely
Structure：Triple channel acceleration transducer just can be realized merely with unique oscillating mass and two springs, not only can accelerate in z
Implement the normal rotational movement around y-axis in the case of degree, and can in the case of x acceleration in the x-direction linearly inclined
Move, and to rotate reply around z-axis in the case of y acceleration.
When y senses using the quality degree of asymmetry with respect to rotary shaft, and the action principle similar to z seesaw, machine
Tool sensitivity and strictly not related around the eigenfrequency of z-axis.If certainly only wanting to realize single channel lateral pickup, example
As simple y sensor, then the design of common simple substance amount oscillator is not optimal, because structure can be towards all space sides
To skew, therefore, can provide unexpected in the case of there is disturbance acceleration towards two directions perpendicular to useful direction
Signal (crosstalk), especially construction machine impact or clash into and occur very by force transship in the case of.
Content of the invention
Therefore, the task of the present invention is, provides, for lateral acceleration sensor, the micro mechanical structure improving.
According in a first aspect, this task is solved by the micro mechanical structure for acceleration transducer, described micromechanics is tied
Structure has：
- oscillating mass, this oscillating mass limits ground asymmetrically for the z rotary shaft of acceleration sensor structure
Construction；
- spring element, this spring element is fixed on oscillating mass and at least one retaining element；
- wherein, accelerate along the sensing direction limiting substantially only in the plane being substantially normal to z shaft structure
When, the rotary motion of oscillating mass can be produced by spring element.
Consequence from this is that, when micro mechanical structure laterally accelerates towards setting direction, substantially only allow around restriction
One rotary freedom of rotary shaft.
According to second aspect, this task passes through the method solution for making the micro structure for acceleration transducer
Certainly, methods described has step：
- construction oscillating mass, this oscillating mass have for structure z rotary shaft limit asymmetric；
- it is constructed so as to spring element so that spring element is fixed on oscillating mass and at least one retaining element, its
In, during the sensing direction acceleration that edge limits substantially only in the plane being orthogonal to z shaft structure, can be by spring
Element produces the motion of oscillating mass.
The preferred extension of the structure according to the present invention and the method according to the invention is the theme of dependent claims.
The preferred extension of described structure is characterised by, at least one retaining element is arranged in z rotary shaft or
Person is arranged close to z rotary shaft for the lateral dimension of structure.Advantageously facilitate micro mechanical structure by this way
Design diversity.
Another advantageous extension scheme of micro mechanical structure is set to, by four spring elements mutually with about 90 degree of angle
Degree arrangement.Particularly advantageous sensor stiffness characteristics can be produced by this way on the acceleration direction not sensed.
Another advantageous extension scheme of described structure is characterised by, produces oscillating mass by the first additional mass
Degree of asymmetry.The mechanical sensitivity of structure can be changed by means of additional mass with limiting, wherein, additional mass advantageously only omits
Micromodification becomes rotary inertia.
Another advantageous extension scheme of described structure is characterised by, spring element structure higher compared with its width
Make.The trampoline mode of oscillating mass can especially advantageously be prevented by this way, because spring element is subject in such a mode
To bending, and spring thickness is cube relation with spring rate.
Another embodiment of described structure is set to, and spring element has the depth-width ratio more than five, therefore can be along rotation
Rotor shaft direction produces favourable spring element size for alignment sensitivity.
The advantageous extension scheme of micro mechanical structure is set to, the retaining element of at least one retaining element and electrode with respect to
Arrangement close to each other for the surface size of structure.
Another advantageous extension scheme of described structure is characterised by, the fixing unit of at least one retaining element and electrode
Part is spaced from each other with the spacing less than about the 20% of the maximum side size of structure.This facilitate common electrodes favourable can
Usability, wherein it is not necessary to reserve too big sensing gap, because the side-play amount near the rotary shaft in rotary motion is relatively
Little.Additionally, can advantageously make external action minimize in the mechanical encapsulation stress of structure by this way.
The advantageous extension scheme of micro mechanical structure is characterised by, arranges the second additional mass in addition to oscillating mass.
Can alternatively realize by this way, improve the rotary inertia of structure, wherein, sensitivity is kept essentially constant.
Another advantageous extension scheme of described structure is characterised by, by different from oscillating mass and additional mass
Material constructs the second additional mass.
Another preferred implementation of micro mechanical structure is set to, by additional mass and/or the second additional mass extremely
Small part is arranged in above oscillating mass.Also advantageously facilitate the design diversity of micro mechanical structure in the above described manner.
Brief description
Describe other features and advantages of the present invention referring next to multiple accompanying drawings in detail.All of feature constitutes this herein
Invention theme, these features independent of description of them in explanation or accompanying drawing or independent of in Patent right requirement to it
Quote.These accompanying drawings only qualitatively and with being not necessarily to scale to illustrate.Identical or function identical element in accompanying drawing
It is provided with identical reference marker.
Shown in accompanying drawing：
The basic configuration of Fig. 1 micro mechanical structure；
Fig. 2 has the micro mechanical structure of the Fig. 1 of regional current potential highlighting；
Fig. 3 is according to the first embodiment of the micro mechanical structure of the present invention；
Fig. 4 is according to another embodiment of the micro mechanical structure of the present invention；
The principle process of the embodiment of Fig. 5 the method according to the invention；And
Fig. 6 has the functional-block diagram of the acceleration transducer of micro mechanical structure.
Specific embodiment
Accompanying drawing 1 is shown in the first micro mechanical structure 100 that rectangular coordinate fastens orientation, can with reference to this first micro mechanical structure
Advantageously to explain the ultimate principle of the present invention.
Micro mechanical structure 100 is substantially in functional layer, preferably form in a layer of silicon, and includes oscillating mass 10, and this shakes
Kinoplaszm amount can be freely-movable by least one retaining element 30, the first spring element 20,20 ' and second spring element 21,21 '
Be suspended on above substrate (not shown).It is contemplated that be configured to the rotary shaft of this structure 100 in the z-direction by retaining element 30
A.Retaining element 30 integrally constructs in the simplest situations, and is fixed in substrate on the uniquely common face hanging
The center of structure 100.Alternatively could be arranged to, retaining element 30 is arranged for the lateral dimension of structure 100
Obtain near z rotary shaft A.
Alternatively it is contemplated that be alternative in single retaining element 30 also can using multiple, preferably two or completely preferred
Four separate retaining element (not shown), these retaining elements are each turned up the soil in lateral spacing with rotary shaft A and are fixed on substrate
On.Spring element 20,20 ', 21,21 ' preferably substantially with right angle mutually orthogonal arrange, and be fixed on retaining element 30 He
On oscillating mass 10.It is alternative in the beam springs that figure 1 illustrates, it is possible to use more complicated spring shape, for example, have
The back-shaped spring (not shown) of multiple spring levers being extending substantially parallel.
Oscillating mass 10 has multiple perforation according to surface micromachined technical construction, wherein, by etching silicon work(
Oxide sacrificial layer below ergosphere draws movable structure, and wherein, the perforation in oscillating mass 10 provides for etching gas
Passage in structure area below to be drawn.Such perforation can be abandoned in the case of using other micro mechanical technologies.
Movable electrode 22 is fixed on oscillating mass 10, for side-play amount is carried out with the fixing electronics of capacitive detection
Refer to 24 and this electrode contraposition.Fixing electronics refer to 24 be the first fixed electrode FE1 a part, this first fixed electrode additionally has
There are horn 26 and electrode suspension 32.Adjust the rotary inertia of micro mechanical structure 100 by the basic structure that figure 1 illustrates.
Printed conductor layer (not shown) is located at below structure 100, can give micro mechanical structure 100 by this printed conductor layer
Connect up and can apply with different current potentials.
Fig. 2 illustrates and Fig. 1 identical micro mechanical structure 100, but represents additionally by different hacures, and first is solid
Fixed electrode FE1 is on the first analysis current potential, and the second fixed electrode FE2 is on the second analysis current potential.Movable shake
Kinoplaszm amount 10 is on the 3rd current potential putting on retaining element 30.
In order to more preferable summary is arranged in structure 100 in a similar manner without fixed electrode FE3 and FE4 of mark
In left field.
Capacitance variations preferably by as have movable electronics refer to 22 the first fixed electrode FE1 and have movable
Electronics refers to the signal difference of the electric capacity between 42 the second fixed electrode FE2 to analyze and process.
The micro mechanical structure 100 of Fig. 1 and 2 does not represent lateral acceleration sensor, but right due to this micro mechanical structure
Title property construction can use around the rotary acceleration sensors of the rotary acceleration of z-axis as measurement.On the contrary, x and y
The linear acceleration in direction will not produce the side-play amount being worth mentioning, because the first spring element 20,20 ' is with respect to y direction
Acceleration has very big rigidity, and second spring element 21,21 ' has very big rigidity with respect to the acceleration in x direction.At least in knot
In the case of structure 100 perfect symmetry, based on difference analysis principle, small residual migration equally will not produce electro-detection letter
Number.In the linear acceleration in z direction, although oscillating mass can slightly offset (in so-called " trampoline " pattern), based on poor
Divide analysis principle still will not produce electrical output signal.
If additionally, selecting sufficiently large functional layer thickness h, the side-play amount in z direction also can be suppressed by strong machinery,
That is, with square being inversely proportional to of layer thickness h.Thickness h is about particularly preferably 20 μm and bigger.Here there is micro mechanical structure in a word
100, it is very little to the mechanical sensitivity of linear acceleration, and it is equal to zero to the current sensitivity of linear acceleration.Work as bullet
When spring element 20,20 ', 21,21 ' and oscillating mass 10 design suitable, the rotary motion around z-axis is to be minimum with spacing
Levy frequency f0Pattern.By means of sufficiently large oscillating mass 10 and with respect to the z fully pliable spring element of rotation 20,20 ',
21st, 21 ' eigenfrequency f of below 1kHz can be realized for structure 1000.
Fig. 3 illustrates the first embodiment of the micro mechanical structure 100 according to the present invention, this micro mechanical structure and Fig. 1 and Fig. 2
The differing only in of structure 100, add the first additional mass 50 on the right side of movable oscillating mass 10.Additional matter herein
Amount 50 can preferably integrally be constructed with oscillating mass 10, and can for example be realized by means of additional layer deposition.First is attached
Plus 5～50% in the order of magnitude that the preferred size of quality 50 is whole oscillating mass 10.
In order to illustrate, Fig. 3 highlightedly illustrates the first additional mass 50 by hacures, wherein, is not had by hacures
Show the current potential determining.By the first additional mass 50 and therefore generation with respect to the z rotary shaft through retaining element 30
Degree of asymmetry makes micro mechanical structure 100 for acceleration sensitive in the y-direction, and the rotary motion implemented around z-axis is made
It is the reaction to this transverse acceleration.Fixed electrode FE1, FE2 provide electric differential signal for this forms of motion.For example when
When oscillating mass 10 turns clockwise, movable electronics refers to 22 and first electric capacity between fixed electrode FE1 and increases, and can
The electronics of motion refers to 42 and second electric capacity between fixed electrode FE2 and reduces.
Due to second spring 21,21 ', rigidity is very big in the x direction, and therefore the linear acceleration in x direction does not produce worth one
The side-play amount carrying.It is additional to trampolining pattern, the linear acceleration in z direction makes structure 100 pass around the first elasticity unit
Part 20,20 ' the is launched, axis parallel to y direction produces the trend of rotary motion.But with above-mentioned, only there is the first elasticity
The simple substance amount oscillator of element 20,20 ' is different, and this rotary motion can be subject to second spring element 21,21 ' obstruction strongly.
The functional layer thickness h of spring element 20,20 ' is bigger, then the obstruction suffered by around the rotary motion of y-axis is stronger.
That can pass through the first additional mass 50 selects arbitrarily adjustment micro mechanical structure 100 along the machinery spirit of y useful direction
Sensitivity, applies anglec of rotation during acceleration every time.Especially can be by the first little additional mass 50 basis low at the same time
Levy frequency f0In the case of set little mechanical sensitivity, because eigenfrequency f0Mainly pass through spring rate and total rotary inertia J
Determine, only sub-fraction determines by the first little additional mass 50, and mechanical sensitivity passes through spring rate and passes through the
The moment of torsion that one additional mass 50 works determines.
Coarse evaluation has represented, and moves and around z-axis around the rotary motion of y-axis and trampoline-type in the z-direction
Rotary motion compare be subject to how strong hindering.As long as thickness h is significantly greater than width of the spring b, then mainly pass through to be bent
Two spring elements 21,21 ' of load effect determine the spring rate relevant with rotary motion.On the other hand, count for approximate
Calculate, the torsional rigidity of negligible first spring element 20,20 '.Two second spring elements 21,21 ' bending stiffness in the z-direction
kY, rot, that is, when rotating around y-axis, meet relationship below：
kY, rot～2*b*h3/L3(6)
B... the width of spring element
H... the height of spring element
L... the length of spring element
The bending stiffness relevant with translation in the z-direction of four spring elements 20,20 ', 21,21 ' meets following relation
Formula：
kZ, lin～4*b*h3/L3(7)
The bending stiffness relevant with the rotation around z-axis of four spring elements 20,20 ', 21,21 ' meets following mathematics
Relational expression：
dZ, rot～4*b3*h/L3(8)
In addition be suitable for, structure 100 around z-axis rotary inertia be around y-axis rotary inertia twice size：
Jz～2*Jy(9)
The ratio thus obtaining the eigenfrequency of two rotary motions around y-axis and z-axis is：
fY, rot/fZ, rot～b/h (10)
In e.g., about 2 μm of the width b of spring element and in the case of about 20 μm of thickness h, effective model is (around z
The rotation of axle) eigenfrequency f0Less than the eigenfrequency of perturbation mode (around the rotation of y-axis), both are about 10 times of passes
System.The frequency of trampoline-type motion in the z-direction is also proportional with b/h to effective model frequency ratio.Correspondingly it is also possible to
This trampolining is effectively suppressed by sufficiently narrow spring element 20,20 ', 21,21 ' and big thickness degree.
By being advantageously carried out eigenfrequency f of 1kHz or less according to the structure 100 of the present invention0.Can to this one kind
Can property be, specially the width b of design spring element 20,20 ', 21,21 ' and length l, wherein, the width b of spring element is downward
Limited by technical elements.Can realize about 1 μm of width of the spring, wherein, consider especially to be caused by groove width change
Manufacture deviation is discrete, and just will consider spring rate tolerance in the case that spring is very thin.Spring element 20,20 ',
21st, 21 ' length l is only limited by the size of total in principle, can also use back-shaped spring element if necessary, should
It is long that back-shaped spring element improves effective spring in the case of the size not significantly increasing spring element 20,20 ', 21,21 '
Degree.For realizing low eigenfrequency f0The second major parameter be to provide sufficiently large oscillating mass 10 sufficiently large in other words used
Property square J.The increase of total leads to bigger oscillating mass 10, but also implies that the consumption area of increase.
Therefore, it is alternative in the increase of total, arrange in another embodiment of the structure 100 according to the present invention
(as shown in Figure 4), at least part of oscillating mass 10 is applied with highdensity material 60 (such as tungsten), and/or passes through this
Plant material part or be filled up completely with perforation.Corresponding technology way of realization is by DE 10 2,009 026 738 A1 and DE 10
Known in 2011 011 160 A1.
For the micro mechanical structure 100 according to the present invention, the positioning of electrode is also critically important, because related to electrical output signal
Current sensitivity depend not only on mechanical sensitivity, and fatefully also depend on electrode assemblie, electrode surface, electrode spacing
With the distance particularly depending on electrode assemblie (electrode " center of gravity ") and the center anchor realized by retaining element 30.Especially
By suitable with rotary shaft apart from size design so that current sensitivity can scale in wide scope because with rotation
The distance of axle is less, then when rotating around z-axis, the change of electrode spacing is less.Therefore, it is possible to realize a kind of sensor, should
Sensor can have several millimeters of side-play amount with rotary shaft completely being separated by the exterior lateral area of very big distance, but near rotation
Only relatively small side-play amount in the electrode zone of rotating shaft A arrangement, therefore allows to use standard plate electrode.
As can be seen that the retaining element 32,34,36,38 of electrode suspension or electrode and the retaining element of oscillating mass 10
30 compare and are arranged to that comparison is close to each other, and this advantageously results in makes structure 100 have high fastness with respect to substrate bending
Effect.Thus can by the outer packing plastic of sensor element from external action to micro mechanical structure 100 suprabasil stress
Advantageously keep little degree.Advantageously improve the characteristic quality of sensor element by this way.
Here is it is noted that all above-mentioned embodiment of micro mechanical structure 100 is obviously only reference.Bullet can be considered
The other structures design of spring element 20,20 ', 21,21 ', these structure designs equally can illustrate set characteristic, you can light
Pine around z-axis rotation or rotates and is difficult to respect to other rotary shafts and the motion of all linear directions.The quantity of spring element
Especially it is not limited to four, but four can be considered as preferably.Equally certainly it is contemplated that to have slightly quality asymmetric with more round
The shape of degree substitutes the oscillating mass 10 of rectangle.
In addition it is also contemplated that the electrode assemblie substituting, especially radially point to the electrode of center retaining element 30 (not
Illustrate), wherein, capacitance variations are converted rotary motion into higher efficiency；Or the electrode (not shown) that dispersion is hung,
Wherein, each electronics refers to individually be fixed in substrate；And/or it is so-called full differential electrode (not shown), wherein, in phase
Be respectively arranged a movable finger with the first analysis current potential between adjacent movable finger and one there is the second analysis
Another finger of current potential.In the case of finally described, the electrode assemblie according to DE 10 2,009 045 391 A1 especially by
Regard as particularly advantageous, wherein, additional micromechanics layer is used in the electrode suspension of floating.
Accompanying drawing 5 illustrates the principle flow chart of the embodiment of the method according to the invention.
First step S1 constructs have for rotary shaft A of structure 100 and limit asymmetric vibration matter
Amount 10.
So implement the construction of spring element 20,20 ', 21,21 ' in second step S2 so that spring element 20,
20 ', 21,21 ' are fixed on oscillating mass 10 and at least one retaining element 30, wherein, are substantially only being orthogonal to z rotation
Along during the sensing direction acceleration limiting in the plane of axle A, just oscillating mass can be produced by spring element 20,20 ', 21,21 '
10 motion.
Accompanying drawing 6 illustrates the concept view with the transverse rotation acceleration transducer 200 of micro mechanical structure 100.Acceleration
Sensor 200 preferably can be used in the transverse acceleration that detection limits in automotive field.
For summary, provide a kind of lateral acceleration sensor by the present invention, this acceleration transducer is in lateral shift
When there is the rotatability along set sensing direction and the little cross sensitivity perpendicular to sensing direction.According to spring element
Part combination can advantageously construct very insensitive to vibrating with respect to the size of the oscillating mass of rotary shaft asymmetric structure
Acceleration transducer.Can realize especially advantageously very insensitive to ever-present vibration in automotive field by this way
The application of mechanical low pass.
Result can pass through the transverse acceleration in proposed one direction of Fundamentals of Sensors good detection, and other direction
The impact to sensed characteristic for the motion not worth mentioning.Signal thus can be avoided to mix, wherein, mainly sense parallel to chip list
The acceleration in face, rather than the acceleration of z direction and other horizontal direction.
Professional can also realize above undisclosed or micro mechanical structure disclosed in only part embodiment, and
Core without departing from the present invention.
Claims (13)
1. it is used for the micro mechanical structure (100) of acceleration transducer (200), described micro mechanical structure has：
- oscillating mass (10), this oscillating mass is with respect to the z rotary shaft of the structure (100) of described acceleration transducer (200)
(A) limit ground for asymmetrically to construct；
- spring element (20,20 ', 21,21 '), this spring element is fixed on described oscillating mass (10) and at least one fixing unit
On part (30)；
- wherein, substantially only in the sensing direction being substantially normal to edge restriction in the plane that described z rotary shaft (A) constructs
The rotary motion of described oscillating mass (10) during acceleration, can be produced by described spring element (20,20 ', 21,21 ').
2. micro mechanical structure (100) according to claim 1 is it is characterised in that at least one retaining element described (30)
It is arranged in z rotary shaft (A) or rotate with being arranged close to described z for the lateral dimension of described structure (100)
Axle.
3. micro mechanical structure (100) according to claim 1 and 2 it is characterised in that four spring elements (20,20 ',
21st, 21 ') mutually with about 90 degree of angle arrangement.
4. the micro mechanical structure according to any one of Claim 1-3 (100) is it is characterised in that pass through the first additional matter
Amount (50) produces the asymmetric of described oscillating mass (10).
5. the micro mechanical structure according to any one of claim 1 to 4 (100) is it is characterised in that described spring element
(20,20 ', 21,21 ') are constructed compared with their width (b) higher.
6. micro mechanical structure (100) according to claim 5 it is characterised in that described spring element (20,20 ', 21,
21 ') there is the depth-width ratio more than five.
7. the micro mechanical structure according to any one of the claims (100) is it is characterised in that described at least one is solid
The retaining element (32,34,36,38) determining element (30) and electrode (FE1, FE2, FE3, FE4) is with respect to described structure (100)
Closely arrange for surface size.
8. micro mechanical structure (100) according to claim 7 is it is characterised in that at least one retaining element described (30)
With the retaining element of electrode (FE1, FE2, FE3, FE4) (32,34,36,38) with the maximum side chi less than described structure (100)
The spacing of very little about 20% is spaced from each other.
9. the micro mechanical structure according to any one of the claims (100) is it is characterised in that except described vibration matter
Amount (10) additional setting the second additional mass (60) outward.
10. micro mechanical structure (100) according to claim 9 is it is characterised in that described second additional mass (60) passes through
Material construction different from described oscillating mass (10) and described additional mass (50).
11. micro mechanical structures (100) according to any one of the claims are it is characterised in that described additional mass
And/or described second additional mass (60) is at least partially arranged in above described oscillating mass (10) (50).
12. acceleration transducers (200), described acceleration transducer has according to any one of claim 1 to 11
Micro mechanical structure (100).
13. are used for the method manufacturing the micro mechanical structure (100) for acceleration transducer (200), and methods described has following
Step：
- construction oscillating mass (10), described oscillating mass has restriction for the z rotary shaft (A) of described structure (100)
Asymmetric；
- it is constructed so as to spring element (20,20 ', 21,21 ') so that described spring element (20,20 ', 21,21 ') is fixed on institute
State on oscillating mass (10) and at least one retaining element (30), wherein, be substantially only orthogonal to described z rotary shaft (A)
Along during the sensing direction acceleration limiting in the plane of construction, can produce by described spring element (20,20 ', 21,21 ')
The motion of described oscillating mass (10).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014202819.1A DE102014202819A1 (en) | 2014-02-17 | 2014-02-17 | Micromechanical structure for an acceleration sensor |
| DE102014202819.1 | 2014-02-17 | ||
| PCT/EP2014/079004 WO2015120940A1 (en) | 2014-02-17 | 2014-12-22 | Micromechanical structure for an acceleration sensor |
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| Publication Number | Publication Date |
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| CN106461701A true CN106461701A (en) | 2017-02-22 |
| CN106461701B CN106461701B (en) | 2020-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201480075691.XA Active CN106461701B (en) | 2014-02-17 | 2014-12-22 | Micromechanical structure for an acceleration sensor |
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| Country | Link |
|---|---|
| US (1) | US10215772B2 (en) |
| KR (1) | KR102221976B1 (en) |
| CN (1) | CN106461701B (en) |
| DE (1) | DE102014202819A1 (en) |
| WO (1) | WO2015120940A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109655631A (en) * | 2017-10-10 | 2019-04-19 | 罗伯特·博世有限公司 | Micromechanics spring structure |
| CN111735986A (en) * | 2019-01-24 | 2020-10-02 | 罗伯特·博世有限公司 | Micromechanical inertial sensor |
| CN112230018A (en) * | 2019-06-26 | 2021-01-15 | 株式会社村田制作所 | Capacitive micro-machined accelerometer |
| CN112834783A (en) * | 2020-12-31 | 2021-05-25 | 中国电子科技集团公司第十三研究所 | Micro-mechanical detection structure and MEMS inertia measurement device |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016119417A1 (en) * | 2015-01-30 | 2016-08-04 | 歌尔声学股份有限公司 | Z-axis structure of accelerometer and method for manufacturing same |
| DE102015222532A1 (en) * | 2015-11-16 | 2017-05-18 | Robert Bosch Gmbh | Micromechanical structure for an acceleration sensor |
| DE102016215829A1 (en) * | 2016-08-23 | 2018-03-01 | Robert Bosch Gmbh | Micromechanical component |
| DE102020211362A1 (en) * | 2020-09-10 | 2022-03-10 | Robert Bosch Gesellschaft mit beschränkter Haftung | Micromechanical structure and micromechanical sensor |
| CN115605765A (en) * | 2021-04-23 | 2023-01-13 | 深圳市韶音科技有限公司（Cn） | Acceleration sensing device |
| IT202100023795A1 (en) * | 2021-09-15 | 2023-03-15 | St Microelectronics Srl | Z-AXIS RESONANT ACCELEROMETER WITH DETECTION STRUCTURE HAVING IMPROVED PERFORMANCE |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4598585A (en) * | 1984-03-19 | 1986-07-08 | The Charles Stark Draper Laboratory, Inc. | Planar inertial sensor |
| US5025346A (en) * | 1989-02-17 | 1991-06-18 | Regents Of The University Of California | Laterally driven resonant microstructures |
| US5905203A (en) * | 1995-11-07 | 1999-05-18 | Temic Telefunken Microelectronic Gmbh | Micromechanical acceleration sensor |
| US20060191338A1 (en) * | 2004-12-22 | 2006-08-31 | Rainer Willig | Micromechanical rotation rate sensor having error suppression |
| US20070220973A1 (en) * | 2005-08-12 | 2007-09-27 | Cenk Acar | Multi-axis micromachined accelerometer and rate sensor |
| EP1626283B1 (en) * | 2004-08-13 | 2011-03-23 | STMicroelectronics Srl | Micro-electromechanical structure, in particular accelerometer, with improved insensitivity to thermomechanical stresses |
| CN102016603A (en) * | 2008-04-29 | 2011-04-13 | 罗伯特·博世有限公司 | Micromechanical component and method for operating a micromechanical component |
| CN102030302A (en) * | 2009-10-06 | 2011-04-27 | 罗伯特·博世有限公司 | Micromechanical structure and method for manufacturing micromechanical structure |
| CN102378733A (en) * | 2009-04-07 | 2012-03-14 | 西门子公司 | Micromechanical system and method for building a micromechanical system |
| US20130152686A1 (en) * | 2011-12-16 | 2013-06-20 | Analog Devices, Inc. | System and Method of Reducing Noise in a MEMS Device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3611360A1 (en) | 1986-04-04 | 1987-10-08 | Bosch Gmbh Robert | SENSOR FOR AUTOMATIC TRIGGERING OF PASSENGER PROTECTION DEVICES |
| DE19938206A1 (en) * | 1999-08-12 | 2001-02-15 | Bosch Gmbh Robert | Micro-mechanical rotational acceleration sensor has an oscillating mass fixed at its center with an array of differential measurement capacitors for determination of acceleration directly rather than using time differentiation |
| DE102006032194A1 (en) | 2006-07-12 | 2008-01-24 | Robert Bosch Gmbh | Acceleration sensor for use in vehicle, has sensor unit, whose frequency transfer function is modified such that sensor unit exhibits small mechanical bandwidth, which corresponds approximately to bandwidth of sensor |
| DE102006048381A1 (en) * | 2006-10-12 | 2008-04-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Sensor for detecting accelerations |
| DE102006059928A1 (en) | 2006-12-19 | 2008-08-21 | Robert Bosch Gmbh | Accelerometer with comb electrodes |
| DE102009026738A1 (en) | 2009-06-04 | 2010-12-09 | Robert Bosch Gmbh | Micromechanical acceleration sensor and method for producing an acceleration sensor |
| FR2954505B1 (en) * | 2009-12-22 | 2012-08-03 | Commissariat Energie Atomique | MICROMECHANICAL STRUCTURE COMPRISING A MOBILE PART HAVING STOPS FOR OFFLINE SHIFTS OF THE STRUCTURE AND METHOD FOR CARRYING OUT THE SAME |
| DE102011011160B4 (en) | 2011-01-05 | 2024-01-11 | Robert Bosch Gmbh | Micromechanical component and manufacturing process for a micromechanical component |
| DE102011083487B4 (en) | 2011-09-27 | 2023-12-21 | Robert Bosch Gmbh | Acceleration sensor and method for operating an acceleration sensor |
| DE102011057110A1 (en) * | 2011-12-28 | 2013-07-04 | Maxim Integrated Products, Inc. | MEMS Accelerometer |
| US9297825B2 (en) * | 2013-03-05 | 2016-03-29 | Analog Devices, Inc. | Tilt mode accelerometer with improved offset and noise performance |
-
2014
- 2014-02-17 DE DE102014202819.1A patent/DE102014202819A1/en active Pending
- 2014-12-22 CN CN201480075691.XA patent/CN106461701B/en active Active
- 2014-12-22 WO PCT/EP2014/079004 patent/WO2015120940A1/en active Application Filing
- 2014-12-22 KR KR1020167025557A patent/KR102221976B1/en active IP Right Grant
- 2014-12-22 US US15/119,010 patent/US10215772B2/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4598585A (en) * | 1984-03-19 | 1986-07-08 | The Charles Stark Draper Laboratory, Inc. | Planar inertial sensor |
| US5025346A (en) * | 1989-02-17 | 1991-06-18 | Regents Of The University Of California | Laterally driven resonant microstructures |
| US5905203A (en) * | 1995-11-07 | 1999-05-18 | Temic Telefunken Microelectronic Gmbh | Micromechanical acceleration sensor |
| EP1626283B1 (en) * | 2004-08-13 | 2011-03-23 | STMicroelectronics Srl | Micro-electromechanical structure, in particular accelerometer, with improved insensitivity to thermomechanical stresses |
| US20060191338A1 (en) * | 2004-12-22 | 2006-08-31 | Rainer Willig | Micromechanical rotation rate sensor having error suppression |
| US20070220973A1 (en) * | 2005-08-12 | 2007-09-27 | Cenk Acar | Multi-axis micromachined accelerometer and rate sensor |
| CN102016603A (en) * | 2008-04-29 | 2011-04-13 | 罗伯特·博世有限公司 | Micromechanical component and method for operating a micromechanical component |
| CN102378733A (en) * | 2009-04-07 | 2012-03-14 | 西门子公司 | Micromechanical system and method for building a micromechanical system |
| CN102030302A (en) * | 2009-10-06 | 2011-04-27 | 罗伯特·博世有限公司 | Micromechanical structure and method for manufacturing micromechanical structure |
| US20130152686A1 (en) * | 2011-12-16 | 2013-06-20 | Analog Devices, Inc. | System and Method of Reducing Noise in a MEMS Device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109655631A (en) * | 2017-10-10 | 2019-04-19 | 罗伯特·博世有限公司 | Micromechanics spring structure |
| CN111735986A (en) * | 2019-01-24 | 2020-10-02 | 罗伯特·博世有限公司 | Micromechanical inertial sensor |
| CN111735986B (en) * | 2019-01-24 | 2024-05-14 | 罗伯特·博世有限公司 | Micromechanical inertial sensor |
| CN112230018A (en) * | 2019-06-26 | 2021-01-15 | 株式会社村田制作所 | Capacitive micro-machined accelerometer |
| CN112834783A (en) * | 2020-12-31 | 2021-05-25 | 中国电子科技集团公司第十三研究所 | Micro-mechanical detection structure and MEMS inertia measurement device |
| CN112834783B (en) * | 2020-12-31 | 2022-09-13 | 中国电子科技集团公司第十三研究所 | Micro-mechanical detection structure and MEMS inertia measurement device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102221976B1 (en) | 2021-03-04 |
| DE102014202819A1 (en) | 2015-08-20 |
| US20170052207A1 (en) | 2017-02-23 |
| WO2015120940A1 (en) | 2015-08-20 |
| US10215772B2 (en) | 2019-02-26 |
| CN106461701B (en) | 2020-07-14 |
| KR20160120775A (en) | 2016-10-18 |
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