FR2954505B1 - MICROMECHANICAL STRUCTURE COMPRISING A MOBILE PART HAVING STOPS FOR OFFLINE SHIFTS OF THE STRUCTURE AND METHOD FOR CARRYING OUT THE SAME - Google Patents
MICROMECHANICAL STRUCTURE COMPRISING A MOBILE PART HAVING STOPS FOR OFFLINE SHIFTS OF THE STRUCTURE AND METHOD FOR CARRYING OUT THE SAMEInfo
- Publication number
- FR2954505B1 FR2954505B1 FR0959412A FR0959412A FR2954505B1 FR 2954505 B1 FR2954505 B1 FR 2954505B1 FR 0959412 A FR0959412 A FR 0959412A FR 0959412 A FR0959412 A FR 0959412A FR 2954505 B1 FR2954505 B1 FR 2954505B1
- Authority
- FR
- France
- Prior art keywords
- offline
- shifts
- stops
- carrying
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- VJYFKVYYMZPMAB-UHFFFAOYSA-N ethoprophos Chemical group CCCSP(=O)(OCC)SCCC VJYFKVYYMZPMAB-UHFFFAOYSA-N 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
- B81C1/00468—Releasing structures
- B81C1/00476—Releasing structures removing a sacrificial layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
- B81C1/0096—For avoiding stiction when the device is in use, i.e. after manufacture has been completed
- B81C1/00984—Methods for avoiding stiction when the device is in use not provided for in groups B81C1/00968 - B81C1/00976
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0817—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for pivoting movement of the mass, e.g. in-plane pendulum
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
- G01P2015/0871—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system using stopper structures for limiting the travel of the seismic mass
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0959412A FR2954505B1 (en) | 2009-12-22 | 2009-12-22 | MICROMECHANICAL STRUCTURE COMPRISING A MOBILE PART HAVING STOPS FOR OFFLINE SHIFTS OF THE STRUCTURE AND METHOD FOR CARRYING OUT THE SAME |
EP10195946.8A EP2343556B1 (en) | 2009-12-22 | 2010-12-20 | Micromechanical structure including a mobile part equipped with stops for out-of-plane movements of the structure, and the method for making said structure |
US12/974,540 US9061895B2 (en) | 2009-12-22 | 2010-12-21 | Micromechanical structure comprising a mobile part having stops for out-of plane displacements of the structure and its production process |
JP2010286052A JP5985147B2 (en) | 2009-12-22 | 2010-12-22 | MICROMACHINE STRUCTURE WITH MOBILE UNIT WITH STOP PART FOR OUT-PLANE DISPLACEMENT OF STRUCTURE AND MANUFACTURING PROCESS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0959412A FR2954505B1 (en) | 2009-12-22 | 2009-12-22 | MICROMECHANICAL STRUCTURE COMPRISING A MOBILE PART HAVING STOPS FOR OFFLINE SHIFTS OF THE STRUCTURE AND METHOD FOR CARRYING OUT THE SAME |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2954505A1 FR2954505A1 (en) | 2011-06-24 |
FR2954505B1 true FR2954505B1 (en) | 2012-08-03 |
Family
ID=42670352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0959412A Expired - Fee Related FR2954505B1 (en) | 2009-12-22 | 2009-12-22 | MICROMECHANICAL STRUCTURE COMPRISING A MOBILE PART HAVING STOPS FOR OFFLINE SHIFTS OF THE STRUCTURE AND METHOD FOR CARRYING OUT THE SAME |
Country Status (4)
Country | Link |
---|---|
US (1) | US9061895B2 (en) |
EP (1) | EP2343556B1 (en) |
JP (1) | JP5985147B2 (en) |
FR (1) | FR2954505B1 (en) |
Families Citing this family (30)
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US8945970B2 (en) * | 2006-09-22 | 2015-02-03 | Carnegie Mellon University | Assembling and applying nano-electro-mechanical systems |
FR2962209B1 (en) * | 2010-07-02 | 2012-07-13 | Nexter Munitions | RELIEF ANTI ADHERENCE FOR SAFETY AND ARMING DEVICE |
FR2965349B1 (en) * | 2010-09-23 | 2017-01-20 | Commissariat Energie Atomique | BOLOMETER WITH FREQUENCY DETECTION |
CN104145185B (en) * | 2011-11-09 | 2017-07-11 | 罗伯特·博世有限公司 | Mass location structure with bending contact surface |
FR2983844B1 (en) | 2011-12-12 | 2014-08-08 | Commissariat Energie Atomique | PIVOT MECHANICAL BONDING FOR MEMS AND NEMS MECHANICAL STRUCTURES |
FR3000050B1 (en) | 2012-12-20 | 2016-03-04 | Tronic S Microsystems | MICROELECTROMECHANICAL DEVICE HAVING AT LEAST TWO DEFORMABLE ELEMENTS OF DIFFERENT DIMENSIONS |
FR3000194B1 (en) | 2012-12-24 | 2015-03-13 | Commissariat Energie Atomique | SIMPLIFIED CALIBRATION GYROSCOPE AND METHOD FOR SIMPLIFIED CALIBRATION OF A GYROSCOPE |
FR3000484B1 (en) | 2012-12-27 | 2017-11-10 | Tronic's Microsystems | MICROELECTROMECHANICAL DEVICE COMPRISING A MOBILE MASS THAT IS ABLE TO MOVE OUT OF THE PLAN |
JP6085757B2 (en) * | 2013-03-13 | 2017-03-01 | 国立研究開発法人産業技術総合研究所 | Fabrication method of microstructure |
FI126199B (en) * | 2013-06-28 | 2016-08-15 | Murata Manufacturing Co | CAPACITIVE MICROMECHANICAL SENSOR STRUCTURE AND MICROMECHANICAL ACCELERATOR SENSOR |
JP6205921B2 (en) * | 2013-07-11 | 2017-10-04 | セイコーエプソン株式会社 | Physical quantity sensors, electronic devices, and moving objects |
US10371715B2 (en) | 2013-12-23 | 2019-08-06 | Invensense, Inc. | MEMS accelerometer with proof masses moving in an anti-phase direction |
US8973439B1 (en) * | 2013-12-23 | 2015-03-10 | Invensense, Inc. | MEMS accelerometer with proof masses moving in anti-phase direction normal to the plane of the substrate |
JP2015123526A (en) * | 2013-12-26 | 2015-07-06 | ソニー株式会社 | Function element, acceleration sensor, and switch |
DE102014202819A1 (en) | 2014-02-17 | 2015-08-20 | Robert Bosch Gmbh | Micromechanical structure for an acceleration sensor |
JP2015161878A (en) * | 2014-02-28 | 2015-09-07 | セイコーエプソン株式会社 | Actuator, optical scanner, image display device, and head mount display |
FR3018916B1 (en) | 2014-03-19 | 2017-08-25 | Commissariat Energie Atomique | MICROELECTROMECHANICAL AND / OR NANOELECTROMECHANICAL DIFFERENTIAL PRESSURE MEASURING SENSOR |
FR3021309A1 (en) | 2014-05-26 | 2015-11-27 | Commissariat Energie Atomique | CAPACITIVE CAPACITIVE MICROELECTRONIC AND / OR NANOELECTRONIC DEVICE WITH INCREASED COMPACITY |
EP3038126A1 (en) * | 2014-12-22 | 2016-06-29 | DelfMEMS SAS | MEMS structure with thick movable membrane |
KR20160091143A (en) * | 2015-01-23 | 2016-08-02 | 삼성전기주식회사 | MEMS Sensor |
ITUB20153580A1 (en) | 2015-09-11 | 2017-03-11 | St Microelectronics Srl | MICROELETTROMECHANICAL SENSOR DEVICE WITH REDUCED SENSITIVITY TO STRESS AND ITS MANUFACTURING PROCEDURE |
WO2017204858A1 (en) * | 2016-05-26 | 2017-11-30 | Mems Drive Inc. | Shock caging features for mems actuator structures |
FR3058409A1 (en) * | 2016-11-10 | 2018-05-11 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | ARTICULATED MICROELECTROMECHANICAL AND / OR NANOELECTROMECHANICAL DEVICE WITH OFF-PLAN SHIFT |
FR3065956B1 (en) * | 2017-02-23 | 2021-05-21 | Safran | MEMS OR NEMS DEVICE WITH STOP STACKING |
JP6691882B2 (en) * | 2017-03-03 | 2020-05-13 | 株式会社日立製作所 | Acceleration sensor |
CN106876265B (en) * | 2017-03-29 | 2019-05-03 | 武汉华星光电技术有限公司 | A kind of method of differentiation control etch depth |
FR3082998B1 (en) * | 2018-06-25 | 2021-01-08 | Commissariat Energie Atomique | DEVICE AND METHODS FOR TRANSFERRING CHIPS FROM A SOURCE SUBSTRATE TO A DESTINATION SUBSTRATE |
EP3653567B1 (en) | 2018-11-19 | 2024-01-10 | Sciosense B.V. | Method for manufacturing an integrated mems transducer device and integrated mems transducer device |
FR3094708B1 (en) * | 2019-04-08 | 2022-12-02 | Commissariat Energie Atomique | OFF-PLANE HINGE FOR MICROMECHANICAL AND/OR NANOMECHANICAL STRUCTURE WITH REDUCED SENSITIVITY TO INTERNAL STRESS |
JP7365996B2 (en) * | 2020-12-17 | 2023-10-20 | 株式会社鷺宮製作所 | Vibration power generation element and its manufacturing method |
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US4882933A (en) * | 1988-06-03 | 1989-11-28 | Novasensor | Accelerometer with integral bidirectional shock protection and controllable viscous damping |
JPH02260333A (en) | 1989-03-31 | 1990-10-23 | Fujikura Ltd | Manufacture of micro mechanical switch |
US5181156A (en) * | 1992-05-14 | 1993-01-19 | Motorola Inc. | Micromachined capacitor structure and method for making |
FR2736934B1 (en) | 1995-07-21 | 1997-08-22 | Commissariat Energie Atomique | METHOD FOR MANUFACTURING A STRUCTURE WITH A USEFUL LAYER MAINTAINED A DISTANCE FROM A SUBSTRATE BY STOPS, AND FOR DISCONNECTING SUCH A LAYER |
US6871544B1 (en) * | 1999-03-17 | 2005-03-29 | Input/Output, Inc. | Sensor design and process |
US7122395B2 (en) * | 2002-12-23 | 2006-10-17 | Motorola, Inc. | Method of forming semiconductor devices through epitaxy |
US6936491B2 (en) * | 2003-06-04 | 2005-08-30 | Robert Bosch Gmbh | Method of fabricating microelectromechanical systems and devices having trench isolated contacts |
US7585744B2 (en) * | 2003-12-08 | 2009-09-08 | Freescale Semiconductor, Inc. | Method of forming a seal for a semiconductor device |
US7232701B2 (en) * | 2005-01-04 | 2007-06-19 | Freescale Semiconductor, Inc. | Microelectromechanical (MEM) device with a protective cap that functions as a motion stop |
DE102006011545B4 (en) * | 2006-03-14 | 2016-03-17 | Robert Bosch Gmbh | Micromechanical combination component and corresponding manufacturing method |
FR2898884B1 (en) | 2006-03-27 | 2008-05-02 | Commissariat Energie Atomique | INERTIAL MICRO-SENSOR RESONANT TO VARIABLE THICKNESS PRODUCED IN SURFACE TECHNOLOGIES |
US20080074725A1 (en) * | 2006-08-25 | 2008-03-27 | Spatial Photonics, Inc. | Micro devices having anti-stiction materials |
KR100868759B1 (en) * | 2007-01-25 | 2008-11-17 | 삼성전기주식회사 | MEMS device and fabrication method of the same |
US20080290430A1 (en) * | 2007-05-25 | 2008-11-27 | Freescale Semiconductor, Inc. | Stress-Isolated MEMS Device and Method Therefor |
DE102007060878B4 (en) * | 2007-12-18 | 2015-10-01 | Robert Bosch Gmbh | Micromechanical system |
ITTO20090489A1 (en) * | 2008-11-26 | 2010-12-27 | St Microelectronics Srl | READING CIRCUIT FOR A MULTI-AXIS MEMS GYROSCOPE WITH DETECTED DETECTION DIRECTIONS COMPARED TO THE REFERENCE AXES, AND CORRESPONDING MEMS MULTI-AXIS GIROSCOPE |
FR2941525B1 (en) * | 2009-01-23 | 2011-03-25 | Commissariat Energie Atomique | GYROMETER IN SURFACE TECHNOLOGY, DETECTION OFFLINE BY MEASURING GAUGE. |
TWI391663B (en) * | 2009-02-25 | 2013-04-01 | Nat Univ Tsing Hua | Accelerometer |
FR2983844B1 (en) | 2011-12-12 | 2014-08-08 | Commissariat Energie Atomique | PIVOT MECHANICAL BONDING FOR MEMS AND NEMS MECHANICAL STRUCTURES |
-
2009
- 2009-12-22 FR FR0959412A patent/FR2954505B1/en not_active Expired - Fee Related
-
2010
- 2010-12-20 EP EP10195946.8A patent/EP2343556B1/en active Active
- 2010-12-21 US US12/974,540 patent/US9061895B2/en active Active
- 2010-12-22 JP JP2010286052A patent/JP5985147B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
FR2954505A1 (en) | 2011-06-24 |
US9061895B2 (en) | 2015-06-23 |
US20110147860A1 (en) | 2011-06-23 |
EP2343556B1 (en) | 2018-10-24 |
EP2343556A1 (en) | 2011-07-13 |
JP2011148084A (en) | 2011-08-04 |
JP5985147B2 (en) | 2016-09-06 |
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Legal Events
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Year of fee payment: 7 |
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Year of fee payment: 8 |
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Year of fee payment: 10 |
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ST | Notification of lapse |
Effective date: 20200910 |