CN106455309A - Surface modification porous metal circuit board and preparation method thereof - Google Patents
Surface modification porous metal circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN106455309A CN106455309A CN201610986079.9A CN201610986079A CN106455309A CN 106455309 A CN106455309 A CN 106455309A CN 201610986079 A CN201610986079 A CN 201610986079A CN 106455309 A CN106455309 A CN 106455309A
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- CN
- China
- Prior art keywords
- parts
- wiring board
- basic unit
- conductive layer
- surface modification
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention provides a surface modification porous metal circuit board and a preparation method thereof. A surface modification porous metal mode is used, so that the sensitive ingredient load quantity of a circuit board can be increased; the sensitivity of a sensor can be improved; meanwhile, the advantages of high inductance and low resistance are realized; meanwhile, a base layer has high intensity and high softness performance and can meet the requirements of different kinds of sensors.
Description
Technical field
The invention belongs to PCB processing technique field, and in particular to a kind of wiring board of surface modification porous metals and its system
Preparation Method.
Background technology
As porous material has, density is little, voidage is high, specific surface area is big and has the characteristics such as selective penetrated property to gas,
Thus they become in present material science and develop a kind of more rapid material.Development of the porous material since half a century
All around the needs in its three great traditions field：Adsorbing material, catalysis material, ion exchange material.As material science is led
Cross slot interference on domain increasingly deep so that porous material is with huge latent in the advanced materials such as microelectronics, molecular device
Power.Increasing scientist has carried out system in-depth study to the characterizing method of porous material and preparation method, gold
Belong to oxide mesoporous thing Quality Research and booming scene is presented, also achieve certain achievement.
At present, the sensor that biochemical detection is constituted with wiring board, by the change of conductance between wiring board come real
The now detection to biochemical.Existing wiring board mainly forms metal, pectination by photoetching process on insulating body
Be staggered circuit（Monomer electrode）, typically using gold, silver, copper as the feed metal for forming wiring board.Silver, copper have relatively low
Resistivity, wiring board is made using both metals and can effectively improve the sensitivity of sensor, improve the reliability of testing result
Property.But the metal chemistry such as silver, copper with low-resistivity are more active, easily with air or detected sample in strong oxygen
Chemical conversion point reacts, and so that wiring board is corroded and disconnects or surface formation oxide-film, causes wiring board to be damaged.And gold utensil have higher
Stability, it is adaptable to detect the sample of any property.But the resistivity of golden metal is higher, and the signal of telecommunication is in the circuit being made up of gold
Decay, distortion is susceptible to when transmitting in plate and circuit, causes that testing result precision is low, sensor response time slow, detection limit
Not enough.
Content of the invention
In view of this, the present invention provides a kind of wiring board of surface modification porous metals and preparation method thereof, and the present invention is adopted
With the sensitive composition load capacity that wiring board by the way of surface modification porous metals, can be increased, sensor is effectively improved sensitive
Degree, is provided simultaneously with high admittance, low-resistance advantage, while basic unit has high intensity and high flexibility can be adapted to inhomogeneity
The requirement of type sensor.
The technical scheme is that：A kind of wiring board of surface modification porous metals, the wiring board includes basic unit, in
Interbed, conductive layer and via, the two sides of the basic unit has been covered each by intermediate layer, and the surface in the intermediate layer is provided with conduction
Layer, the via is provided with conductive layer through the intermediate layer and basic unit, the conducting hole surface, and the conductive layer is porous
Metal material, the surface porosity factor of the porous metal material is 46-52%.
The raw material of the basic unit is grouped into by following weight meter group, 57 parts of polyethylene, 16 parts of polyurethane, ethyl vinyl acetate
15 parts of ethylene copolymer, SnO25 parts, 1.6 parts of antiaging agent.Made by the Synergistic of each component in the basic unit in the present invention
With so as to high intensity and high flexibility energy.
The conductive layer for being arranged at interlayer surfaces is provided with conductive coating, and the conductive coating is by following weight meter component
Composition：Al2O312.7 parts, 7.6 parts of ZnO, 0.87 part of BeO, 9.2 parts of Zr, 2.5 parts of Hf, 0.6 part of Sn, 0.25 part of IN.Logical
The synergistic function of each component in the conductive coating that crosses in the present invention, it is ensured that wiring board has high conductance and with low
The advantage of sheet resistance.
Sheet resistance of the conductive coating at 30 DEG C is 1.7*10-9-2.3*10-9Ω•m.
The intermediate layer is Al/Pt alloy, and the mass ratio of Al and Pt is 2：1, conductive layer adopts porous zinc bloom metal material
Material.By conductive layer is set to porous metals zinc oxide, the porous metals zinc oxide is closed using chemical vapour deposition technique
Become, in nano bar-shape structure, due to its special pattern and structure, its gas sensing property is good, can increase sensitive composition load capacity, raising
The sensitivity of wiring board.
A kind of preparation method of the wiring board of above-mentioned surface modification porous metals, comprises the following steps：
S1. basic unit being taken, substrate surface is respectively washed using surfactant solution and water, removes spot, the dust of substrate surface,
And make basic unit smooth；
S2., by the way of magnetron sputtering, add intermediate layer in substrate surface；
S3., by way of laser boring, the via through intermediate layer and basic unit is got；
S4., by way of plating, add conductive layer in interlayer surfaces；
S5. add conductive layer by way of magnetron sputtering in the conducting hole surface.
The present invention adopts said structure design, by the way of surface modification porous metals, can increase the sensitivity of wiring board
Composition load capacity, effectively improves transducer sensitivity, is provided simultaneously with high admittance, low-resistance advantage, at the same basic unit have high-strength
Degree and high flexibility can be adapted to the requirement of dissimilar sensor.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical scheme is clearly and completely described, it is clear that retouched
The embodiment that states is only a part of embodiment of the present invention, rather than whole embodiments.
Embodiment
A kind of wiring board of surface modification porous metals, the wiring board includes basic unit, intermediate layer, conductive layer and conducting
Hole, the two sides of the basic unit has been covered each by intermediate layer, and the surface in the intermediate layer is provided with conductive layer, and the via runs through institute
Intermediate layer and basic unit is stated, the conducting hole surface is provided with conductive layer, the conductive layer is porous metal material, described porous gold
The surface porosity factor of category material is 46-52%.
The raw material of the basic unit is grouped into by following weight meter group, 57 parts of polyethylene, 16 parts of polyurethane, ethyl vinyl acetate
15 parts of ethylene copolymer, SnO25 parts, 1.6 parts of antiaging agent.Made by the Synergistic of each component in the basic unit in the present invention
With so as to high intensity and high flexibility energy.
The conductive layer for being arranged at interlayer surfaces is provided with conductive coating, and the conductive coating is by following weight meter component
Composition：Al2O312.7 parts, 7.6 parts of ZnO, 0.87 part of BeO, 9.2 parts of Zr, 2.5 parts of Hf, 0.6 part of Sn, 0.25 part of IN.Logical
The synergistic function of each component in the conductive coating that crosses in the present invention, it is ensured that wiring board has high conductance and with low
The advantage of sheet resistance.
Sheet resistance of the conductive coating at 30 DEG C is 1.7*10-9-2.3*10-9Ω•m.
The intermediate layer is Al/Pt alloy, and the mass ratio of Al and Pt is 2：1, conductive layer adopts porous zinc bloom metal material
Material.By conductive layer is set to porous metals zinc oxide, the porous metals zinc oxide is closed using chemical vapour deposition technique
Become, in nano bar-shape structure, due to its special pattern and structure, its gas sensing property is good, can increase sensitive composition load capacity, raising
The sensitivity of wiring board.
A kind of preparation method of the wiring board of above-mentioned surface modification porous metals, comprises the following steps：
S1. basic unit being taken, substrate surface is respectively washed using surfactant solution and water, removes spot, the dust of substrate surface,
And make basic unit smooth；
S2., by the way of magnetron sputtering, add intermediate layer in substrate surface；
S3., by way of laser boring, the via through intermediate layer and basic unit is got；
S4., by way of plating, add conductive layer in interlayer surfaces；
S5. add conductive layer by way of magnetron sputtering in the conducting hole surface.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of spirit or essential attributes without departing substantially from the present invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit is required rather than described above is limited, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.
Moreover, it will be appreciated that although this specification is been described by according to embodiment, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of description is only that those skilled in the art should for clarity
Using description as an entirety, the technical scheme in each embodiment can also form those skilled in the art through appropriately combined
Understandable other embodiment.The ins and outs not described in detail in the present invention, can all pass through arbitrary in this area
Prior art is realized.Particularly, in the present invention, all technical characterstics not described in detail all can be realized by any prior art.
Claims (6)
1. a kind of wiring board of surface modification porous metals, it is characterised in that the wiring board includes basic unit, intermediate layer is conductive
Layer and via, the two sides of the basic unit has been covered each by intermediate layer, and the surface in the intermediate layer is provided with conductive layer, described leads
Through hole is provided with conductive layer through the intermediate layer and basic unit, the conducting hole surface, and the conductive layer is porous metal material,
The surface porosity factor of the porous metal material is 46-52%.
2. the wiring board of surface modification porous metals according to claim 1, it is characterised in that the raw material of the basic unit by
Following weight meter group is grouped into, 57 parts of polyethylene, 16 parts of polyurethane, 15 parts of ethylene-vinyl acetate copolymer, SnO25 parts, anti-
Aging dose 1.6 parts.
3. the wiring board of the surface modification porous metals according to claim 1 or 2, it is characterised in that described be arranged at
The conductive layer of interlayer surfaces is provided with conductive coating, and the conductive coating is grouped into by following weight meter group：Al2O312.7 part,
0.25 part of 0.6 part of 2.5 parts of 9.2 parts of 0.87 part of 7.6 parts of ZnO, BeO, Zr, Hf, Sn, IN.
4. the wiring board of the surface modification porous metals according to claim 1, it is characterised in that the conductive coating exists
Sheet resistance at 30 DEG C is 1.7*10-9-2.3*10-9Ω•m.
5. the wiring board of the surface modification porous metals according to claim 1, it is characterised in that the intermediate layer be
Pt alloy, the mass ratio of Al and Pt is 2：1, conductive layer adopts porous zinc bloom metal material.
6. a kind of preparation method of the wiring board of the surface modification porous metals as described in claim 1-5, it is characterised in that bag
Include following steps：
S1. basic unit being taken, substrate surface is respectively washed using surfactant solution and water, removes spot, the dust of substrate surface,
And make basic unit smooth；
S2., by the way of magnetron sputtering, add intermediate layer in substrate surface；
S3., by way of laser boring, the via through intermediate layer and basic unit is got；
S4., by way of plating, add conductive layer in interlayer surfaces；
S5. add conductive layer by way of magnetron sputtering in the conducting hole surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610986079.9A CN106455309A (en) | 2016-11-09 | 2016-11-09 | Surface modification porous metal circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610986079.9A CN106455309A (en) | 2016-11-09 | 2016-11-09 | Surface modification porous metal circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106455309A true CN106455309A (en) | 2017-02-22 |
Family
ID=58208201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610986079.9A Withdrawn CN106455309A (en) | 2016-11-09 | 2016-11-09 | Surface modification porous metal circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106455309A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109287073A (en) * | 2017-07-20 | 2019-01-29 | 国家纳米科学中心 | The surface modification method of flexible extensible route and its application |
-
2016
- 2016-11-09 CN CN201610986079.9A patent/CN106455309A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109287073A (en) * | 2017-07-20 | 2019-01-29 | 国家纳米科学中心 | The surface modification method of flexible extensible route and its application |
| CN109287073B (en) * | 2017-07-20 | 2021-09-10 | 国家纳米科学中心 | Surface modification method of flexible stretchable circuit and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170222 |