CN106449522B - Display base plate, its production method and display device - Google Patents
Display base plate, its production method and display device Download PDFInfo
- Publication number
- CN106449522B CN106449522B CN201610975213.5A CN201610975213A CN106449522B CN 106449522 B CN106449522 B CN 106449522B CN 201610975213 A CN201610975213 A CN 201610975213A CN 106449522 B CN106449522 B CN 106449522B
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- Prior art keywords
- base plate
- display base
- metal layer
- spongy
- display
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
Abstract
The present invention relates to display field, the production method of display base plate of the invention, comprising: form metal layer image；Form the spongy thermoset resin layer of tool for covering at least partly region of the metal layer image.The resin that the present invention uses not only has absorbent function, it can absorb due to environment bring micro-moisture, and hardness with higher and ageing-resistant performance, it can effectively prevent moisture metal layer, it is especially provided with the metal layer of via hole, effectively raises reliability and safety of the display device under the adverse circumstances such as high temperature and humidity.
Description
Technical field
The present invention relates to display fields, in particular to display base plate, its production method and display device.
Background technique
Thin film transistor-liquid crystal display as a kind of panel display apparatus, have the function of it is small in size, low, radiationless with
And preparation cost it is relatively low the features such as, therefore be applied in high-performance display field more and more.
The display panel of thin film transistor-liquid crystal display includes array substrate and color membrane substrates.In the system of display panel
During work, wires design is a highly important content.Wherein, in differences such as data line, grid line and public electrode wires
It needs to realize by via hole between the film layer of layer and be electrically connected to each other.
Via hole is as metal wire overlapped general design is used in liquid crystal display device, since the metal of its lap position is different
Matter and design otherness, have become the weak link being easily corroded on entire liquid crystal display.Currently, it is most of by
The case where display device caused by corrosion fails, betides the position of via hole.
In the prior art, ultraviolet glue can be coated as protection, to reduce the probability that via hole is corroded by crossing hole site.But
Ultraviolet glue is easy to fall off at high temperature, can be become fragile to the cold and is hardened, therefore intensity decline, is not appropriate for being used for
The protection in hole.
Summary of the invention
It is described aobvious the technical problem to be solved in the present invention is to provide a kind of display base plate, its production method and display device
Show substrate during the preparation process, using having spongy thermosetting resin as protective layer, moisture is prevented to be provided with hole
The metal layer at place avoids the metal layer at via hole from corroding, and improves display panel and display is reliable under hot and humid environment
Property and safety.
The invention discloses a kind of production methods of display base plate, comprising:
Form metal layer image；
Form the spongy thermoset resin layer of tool for covering at least partly region of the metal layer image.
Preferably, it is formed before metal layer image, the method also includes: formation includes the layer pattern of via hole；
The figure for forming the metal layer includes:
Form the metal layer image on the layer pattern, the metal layer image by the via hole with it is described
The figure of other film layers of display base plate connects.
Preferably, the spongy thermoset resin layer of tool for covering at least partly region of the metal layer image is formed
Include:
To have spongy thermosetting resin coated in the display base plate surface for being formed with the metal layer image, solidification
Afterwards, thermoset resin layer is patterned, so that the thermoset resin layer covers the whole region of the metal layer image.
Preferably, the spongy thermoset resin layer of tool for covering at least partly region of the metal layer image is formed
Include:
To have spongy thermosetting resin coated in the display base plate surface for being formed with the metal layer image, solidification
Afterwards, it is etched to preset thickness, so that the display base plate surface all covers thermoset resin layer.
Preferably, the preset thickness is 600nm~1500nm.
Preferably, the spongy thermoset resin layer of tool is made of transparent resin.
Preferably, the spongy thermoset resin layer of tool is gathered by the thermosetting acrylic resin containing hydrophilic radical
It closes.
Preferably, the hydrophilic radical is hydroxyl or carboxyl.
The invention discloses a kind of display base plates, and the production method makes to obtain by adopting the above technical scheme, described
At least partly region overlay of the metal layer image of display base plate has the spongy thermoset resin layer of tool.
The invention discloses a kind of display devices, including display base plate as described in the above technical scheme.
Compared with prior art, the production method of display base plate of the invention, comprising: form metal layer image；Formation is covered
Cover the spongy thermoset resin layer of tool in at least partly region of the metal layer image.The resin that the present invention uses is not only
With absorbent function, can absorb due to environment bring micro-moisture, and hardness with higher and ageing-resistant performance, energy
It is enough effectively prevent moisture metal layer, is especially provided with the metal layer of via hole, effectively raises display device in high temperature
Reliability and safety under the adverse circumstances such as high humidity.
Detailed description of the invention
Fig. 1 shows in display base plate at via hole coated with resins schematic diagram；
Fig. 2 indicates the schematic diagram being patterned in display base plate to the resin layer formed at via hole；
Fig. 3 indicates the structural schematic diagram at display base plate via hole；
Fig. 4 indicates another structural schematic diagram at display base plate via hole.
Specific embodiment
For a further understanding of the present invention, the preferred embodiment of the invention is described below with reference to embodiment, still
It should be appreciated that these descriptions are only further explanation the features and advantages of the present invention, rather than to the claims in the present invention
Limitation.
The invention discloses a kind of production method of display base plate, production method relevant to via hole is stressed, other
The production method of film layer does not do particular determination, comprising the following steps:
Step S1: metal layer image is formed.
According to the present invention, the metal layer is not done specifically limited, the metal layer can be naked for exposed or part
Dew, and can functional layer structure made of the plain conductor or metal with ingress of air etc., such as: grid line, source electrode, drain electrode
Deng.The metal layer can be single layer structure, or multilayered structure, such as cover other metals on the electrode and collectively form
Metal layer.The figure of the metal layer includes via pattern.
Preferably, it is formed before metal layer image, the method also includes: formation includes the layer pattern of via hole.
Step S1 can specifically be divided into:
Step S11: formation includes the layer pattern of via hole；
Step S12: forming metal layer image on the layer pattern, the metal layer image by the via hole with
The figure of other film layers of display base plate connects.
Other described film layers can be other metal parts or metal layer, such as various electrodes, or various
Signal wire, such as grid line and data line.
Step S2: the spongy thermosetting resin of tool for covering at least partly region of the metal layer image is formed
Layer.
The resin layer is solidified by having spongy thermosetting resin.The spongy thermosetting resin of tool
The preferably transparent resin material of layer is made, to guarantee the display performance of display panel；More preferably containing hydrophilic radical
Thermosetting acrylic resin is polymerized, and the hydrophilic radical is preferably hydroxy or carboxy, other can also be selected with hydrophilic
The group of property.The present invention is the application new in one kind of display field of the thermosetting acrylic resin containing hydrophilic radical, Gu
Reticular structure is formed by polymerization when change, in this way made of resin layer with excellent water absorbing capacity, higher hardness and resistance to
Ageing properties are particularly suitable for application as the protective layer of covering metal layer image, can effectively prevent moisture metal layer, keep away
Exempt from metal layer corrosion, the metal layer for being provided with via hole is especially avoided to fail due to corrosiveness.Especially, in preparation process
When the middle situation for resin layer breakage occur, it also can be absorbed and lacked moisture, prevent moisture metal layer.
Specifically, the method for forming the resin layer is as shown in Figures 1 to 3, comprising the following steps:
As shown in Figure 1, will have spongy thermosetting resin coated in the display base for being formed with the metal layer image
Plate surface；In Fig. 1,11 it is substrate, 12 is insulating layer, 13 is other film layers, and 14 be metal layer, and 15 is have spongy thermosetting
Property resin layer, 16 be via hole；
After solidification, as shown in Fig. 2, be patterned to thermoset resin layer, the method for the composition can be with are as follows: is using 17
Exposure mask covering part region, then etches away uncovered area, forms the pattern of needs；
So that the thermoset resin layer covers the whole region of the metal layer image, as shown in Figure 3.
The present invention determines the cured mode by the performance of thermosetting resin, can be to be heating and curing or ultraviolet
Linear light is irradiated or is directly heated, and in view of the property of display base plate, more preferably ultraviolet light irradiates, the thermosetting irradiated through ultraviolet light
Property resin is changed into solid-state by liquid, and does not influence the performance of other film layers.
The spongy thermosetting resin of tool is preferably the thermosetting acrylic resin containing hydrophilic radical, described to contain
There is the thermosetting acrylic resin of hydrophilic radical to irradiate by ultraviolet light, be cross-linked to form reticular structure, substantially increases its machinery
Performance and the performance of chemicals-resistant corrosion.
In general, having spongy thermosetting resin can be dissolved in organic solvent, in order on display base plate surface
It is coated.The present invention type of organic solvent is not done it is specifically limited, according to well known to those skilled in the art organic molten
Agent.And for the concentration of the spongy thermosetting resin of the tool in organic solvent can according to the actual situation into
Row is appropriate to be adjusted.
Alternatively, the method for forming the resin layer are as follows:
To have spongy thermosetting resin coated in the display base plate surface for being formed with the metal layer image, solidification
Afterwards, it is etched to preset thickness, so that all covering has spongy thermoset resin layer on the display base plate surface.
The preset thickness does not influence the performance of other film layers of display base plate, preferably 600nm~1500nm.More preferably
700~1000 nanometers.
The spongy thermosetting resin of tool does not influence the other function structure of display base plate, all covering display
After substrate surface, it can not only protect at via hole and not be corroded, and display base plate surface others metal knot can be protected
Structure is not corroded.
The invention also discloses a kind of display base plates, and the production method makes to obtain by adopting the above technical scheme, institute
At least partly region overlay for stating the metal layer image of display base plate has the spongy thermoset resin layer of tool.The present invention is to aobvious
Show that other structures production method does not do particular determination in substrate.
Invention additionally discloses a kind of display devices, including display base plate described in above-mentioned technical proposal.
For a further understanding of the present invention, below with reference to embodiment to display base plate provided by the invention, preparation method
And display device row is described in detail, protection scope of the present invention is not limited by the following examples.
Embodiment 1
Drain electrode is formed on substrate,
Formation includes the layer pattern of via hole in the drain electrode；
On the layer pattern formed pixel electrode figure, the pixel electrode figure by the via hole with it is described
The drain electrode of display base plate connects.
Form the spongy thermoset resin layer of tool for covering at least partly region of the pixel electrode figure.
Specifically, the acrylic resin containing hydroxyl can be coated in the display base for being formed with the pixel electrode figure
Plate surface after solidification, is etched to 600nm, so that the display base plate surface all covers polyacrylic resin layer.
Treated that display base plate is used in display device by described, in the environment of 60 DEG C, 90% relative humidity, continues
Operation 240h is lighted, screen is shown without any exception in test process, and corresponding via hole carries out on to the product for completing test
Without any problem in evaluation procedure.
Embodiment 2
As shown in figure 4, the pattern of first electrode 21 is formed by patterning processes on the substrate 10.
Insulating layer 12 is formed in the substrate surface for being formed with metal layer 22.
Via hole 16 is formed by patterning processes on the surface of insulating layer 12.
The pattern of second electrode 23 is formed by patterning processes on the layer pattern for being formed with via hole 16.Wherein,
Two electrodes 23 are electrically connected by via hole 16 with metal layer 22.
Acrylic resin containing hydroxyl is coated in the display base plate surface for being formed with the second electrode figure, solidification
Afterwards, polyacrylic resin layer is patterned, so that the polyacrylic resin layer 15 covers the complete of the second electrode figure
Portion region.
It should be noted that the patterning processes in the embodiment of the present invention, can refer to including photoetching process, or, including photoetching
Technique and etch step, while can also include other techniques for being used to form predetermined pattern such as printing, ink-jet；Photoetching work
Skill refers to the work that figure is formed using photoresist, mask plate, exposure machine etc. including technical process such as film forming, exposure, developments
Skill.Can according to the present invention formed in the corresponding patterning processes of structure choice.
The above description of the embodiment is only used to help understand the method for the present invention and its core ideas.It should be pointed out that pair
For those skilled in the art, without departing from the principle of the present invention, the present invention can also be carried out
Some improvements and modifications, these improvements and modifications also fall within the scope of protection of the claims of the present invention.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (5)
1. a kind of production method of display base plate characterized by comprising
Formation includes the layer pattern of via hole；
Metal layer image is formed on the layer pattern, the metal layer image passes through the via hole and the display base plate
The figure of other film layers connects；
To have spongy thermosetting resin and be coated in and be formed with the display base plate surface of the metal layer image, after solidification,
It is etched to preset thickness, so that the display base plate surface all covers thermoset resin layer；The spongy thermosetting of tool
Property resin layer be made of transparent resin, the spongy thermoset resin layer of the tool is by the thermosetting property propylene containing hydrophilic radical
Acid resin is polymerized.
2. the production method of display base plate according to claim 1, which is characterized in that the preset thickness be 600nm~
1500nm。
3. the production method of display base plate according to claim 1, which is characterized in that the hydrophilic radical be hydroxyl or
Carboxyl.
4. a kind of display base plate, which is characterized in that be made to using production method as claimed in any one of claims 1-3
It arrives, all covering has spongy thermoset resin layer on the display base plate surface.
5. a kind of display device, including display base plate as claimed in claim 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610975213.5A CN106449522B (en) | 2016-11-07 | 2016-11-07 | Display base plate, its production method and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610975213.5A CN106449522B (en) | 2016-11-07 | 2016-11-07 | Display base plate, its production method and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106449522A CN106449522A (en) | 2017-02-22 |
| CN106449522B true CN106449522B (en) | 2019-10-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610975213.5A Expired - Fee Related CN106449522B (en) | 2016-11-07 | 2016-11-07 | Display base plate, its production method and display device |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107315294A (en) * | 2017-07-25 | 2017-11-03 | 深圳市华星光电技术有限公司 | A kind of preparation method of display base plate, display panel and display base plate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103543607A (en) * | 2012-07-12 | 2014-01-29 | Jsr株式会社 | Organic EL element, radiation-sensitive resin composition, and cured film |
| CN105097826A (en) * | 2015-06-04 | 2015-11-25 | 京东方科技集团股份有限公司 | Gate driver on array (GOA) unit, fabrication method thereof, display substrate and display device |
-
2016
- 2016-11-07 CN CN201610975213.5A patent/CN106449522B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103543607A (en) * | 2012-07-12 | 2014-01-29 | Jsr株式会社 | Organic EL element, radiation-sensitive resin composition, and cured film |
| CN105097826A (en) * | 2015-06-04 | 2015-11-25 | 京东方科技集团股份有限公司 | Gate driver on array (GOA) unit, fabrication method thereof, display substrate and display device |
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| CN106449522A (en) | 2017-02-22 |
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