CN106442865A - Gas sensor and encapsulation method thereof - Google Patents
Gas sensor and encapsulation method thereof Download PDFInfo
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- CN106442865A CN106442865A CN201510493321.4A CN201510493321A CN106442865A CN 106442865 A CN106442865 A CN 106442865A CN 201510493321 A CN201510493321 A CN 201510493321A CN 106442865 A CN106442865 A CN 106442865A
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Abstract
An encapsulation gas sensor is composed of a sensing element (1), a shell, a circuit board (4) and a pin (6); the sensing element (1) is composed of a polymer component (11), a metalized surface layer upper surface (12) and a metalized surface layer lower surface (13), wherein the metalized surface layer upper surface (12) and the metalized surface layer lower surface (13) are fixedly arranged on the upper surface and the lower surface of the polymer component (11) respectively, and the polymer component (11), the metalized surface layer upper surface (12) and the metalized surface layer lower surface (13) are fixed into a whole; a top-layer cover plate of the shell and the metalized surface layer upper surface (12) of the sensing element (1) form electric contact, and the metalized surface layer lower surface (13) and the pin (6) on the circuit board (4) form electric connection. In the encapsulation process, operation is easy, batch encapsulation can be realized, and the efficiency is higher by the adoption of the encapsulation mode; it is avoided that temperature affects the performance of the sensing element in the process, and an advanced function can be achieved at a time through circuit change.
Description
Technical field
The present invention relates to the structure design of gas sensor and applied technical field, specifically provide
A kind of gas sensor and its method for packing.
Background technology
Gas sensor refers to certain tested gas and its concentration in environment are converted to and are become with it
The device of certain relation electric signal output or device, according to the signal of telecommunication of output can obtain with tested
The gas relevant information of existence in the environment, the signal of telecommunication passes through and processes, thus can be to tested
Gas is detected, monitored and is reported to the police；More can by interface and computer form automatic detection,
Control and warning system.Gas sensor packing forms generally have：TO base packing forms,
Plastic cylinder type packing forms etc..
Although TO base packing forms structure is simple, entirety adopts metal material, and electrode
It is connected with pin, the encapsulation of shell will be relatively costly by the way of welding；And plastics circle
Though cartridge type material cost is low, its inside configuration is complicated, and electrode is connected with pin and needs also exist for weldering
Connect.These packaged types determine that every sensor will individually encapsulate, even if in some processes mistake
Using automation equipment in journey, production efficiency is also very low.It is only element after more having sensor encapsulation
The product of rank, and subsequent use also needs to install circuit additional it is impossible to provide from gasmetry to mark
The total solution of quasi- electric signal output, technical problem therefore urgently to be resolved hurrily at present is：People
Expect to obtain a kind of technology gas sensor method for packing simpler, in hgher efficiency.
Content of the invention
It is an object of the invention to provide a kind of excellent gas sensor of technique effect and its encapsulation
Method.Itself mainly solving the technical problems that：Make that correlation technique is simpler, encapsulation process manufacture
In hgher efficiency.
The invention provides a kind of gas sensor it is characterised in that：Its composition is as follows：Sensing
Element 1, shell, circuit board 4, pin 6；Wherein：Shell is the cast knot of one end open
Structure；Sensing element 1 is encapsulated in its internal cavities shell；Circuit board 4 is as closure shell
Structure for one end open end is arranged at shell aperture and with shell wall jointly by shell inner cavity
Contain into a closed chamber；
In described gas sensor, the composition of sensing element 1 is as follows：Polymer elements 11,
Metalized surface layer upper surface 12, metalized surface layer lower surface 13；Wherein：The latter two points
It is not fixedly installed on the upper and lower surface of polymer elements 11 and three is fixed as one；
A part for pin 6 be arranged in shell inside and with metalized surface layer lower surface 13
Connect with circuit board 4, another part of pin 6 reaches the chamber that circuit board 4 is wrapped with shell
Outdoor；
The top layer cover plate of shell and sensing element near metalized surface layer upper surface 12 side
1 metalized surface layer upper surface 12 forms electrical contact.
Described gas sensor it is characterised in that：
Shell is specially metal-back 3 or metal pipe cap 5；Wherein：
The top blind flange of shell is to stretch out elasticity of flexure structure to inner chamber, and it is with the generation bullet that suffers oppression
Property deformation the metalized surface layer upper surface 12 of mode and sensing element 1 form electrical contact；
The top blind flange of metal-back 3 overall knot integrated with the elasticity of flexure structure stretched out to inner chamber
Structure.
In prior art：Other packaged types such as TO base, the packaged type of plastic cylinder type
Inside is connected with external terminal by wire electrode, and completing this electrical connection needs point of use
Welding machine is spot-welded together with external terminal by wire electrode.The present invention does not need point of use welding machine
Carry out spot welding, by using prefabricated component, carry out simply mechanical pretension extruding in assembling and connect
, this mode can once complete the encapsulation of many sensors, and is no longer the operation of monomer.
This packaged type, metal-back can adopt the material such as rustless steel, the size of top blind flange according to
The size of sensor determining, the big rootlet of top blind flange and sensing element upper surface part
Area according to sensing element upper surface to determine, arranges one in metal-back top blind flange bending part
The gap of individual overbending direction, convenient bending.Top blind flange is bent by bending process using mechanical arm
Cover on sensing element, make metal-back and sensing element upper surface complete electrical contact, after bending
Top blind flange keeps horizontality.
The present invention bends the last one procedure that top blind flange is encapsulation process, can be in this operation
Connecting detection device on circuit board, once complete electricity during bending metal-back top blind flange
Gas connects, you can real time detecting sensor performance, and encapsulation and detection once complete.And other envelopes
Dress mode has been assembled into completing to also need to after electrode is connected with external terminal to connect miscellaneous part
After whole sensor, could be detected for each sensor again, inefficiency, be wasted
A large amount of manpower and materials..
Described gas sensor it is characterised in that：
The top layer cover plate of shell near metalized surface layer upper surface 12 side and metallization table
Be additionally provided between surface layer upper surface 12 for filling therebetween gap and formed electrical connection
One of following several structures：Sponge like polymer, gasket construction, spring；It is specially and can use
In the structure guaranteeing that continuous extrusion upper and lower surface is electrically connected with sensitive material formation.
Can be on the basis of the top blind flange of shell has and stretches out elasticity of flexure structure to inner chamber
Reuse the electric connection structures such as sponge like polymer, gasket construction, spring；Can also directly exist
Electrically connected using sponge like polymer, gasket construction, spring etc. inside conventional ophthalmic top blind flange
Structural grouping becomes corresponding functional module.
Described packaged type gas sensor it is characterised in that：The metalized surface of gas sensor
Layer upper surface 12 and metalized surface layer lower surface 13 particular by plating, sputtering or steam
Send out platinum black, platinum carbon, Pt, Au, Ag, Ni, Pd, Cu, C be obtained.
Following Similar content can be by above-mentioned modification.
The assembly method of gas sensor as above it is characterised in that：Successively according to following
Step is operable to assembling and obtains described packaged type gas sensor method：
First, it pre-purchase or manufactures sensing element 1, shell, circuit board 4, pin 6；
Shell is specially tubular structure, its metal-back 3 or the gold that the one end open other end is closing blind hole
Belong to pipe cap 5；The top blind flange of described shell is to stretch out elasticity of flexure structure to inner chamber, and it is to be subject to
There is metalized surface layer upper surface 12 shape of elastically-deformable mode and sensing element 1 in compressing
Become electrical contact；The top blind flange of metal-back 3 and the elasticity of flexure structure stretched out to inner chamber are one
Change overall structure；
Secondly, pin 6 is arranged in the corresponding position of circuit board 4；Can between by pin
6 fixed and arranged on the circuit board 4 and become integral structure；
Sensing element 1 is loaded in metal-back 3 or the inner chamber of metal pipe cap 5 it is desirable to will sense
Metalized surface layer upper surface 12 side of element 1 is near metal-back 3 or metal pipe cap 5
Inner chamber blind hole end is arranged；
Then circuit board 4 is fixed on pin 6 and is arranged in opening of metal-back 3 or metal pipe cap 5
Mouthful end, and inwardly hold out against sensing element 1 by means of instrument or circuit board 4 itself and make metallization
Stretch out the elastic construction of bending to inner chamber inside the top blind flange of surface layer upper surface 12 and shell
It is in close contact and constitutes electrical connection, inside the top blind flange of shell, stretch out the bullet of bending simultaneously to inner chamber
Property structure occur elastic deformation ensure the contact reliability both it；Final circuit board 4 is towards outer
The side local of shell inner chamber side should be adjacent to the metalized surface layer lower surface 13 of sensing element 1
Arrange and constitute circuit board 4 or pin 6 fixed thereon and metalized surface layer lower surface
Electrical connection between 13；
Finally shell is assisted by outside subsidiary structure further with circuit board 4 and fix with shape
Become reliably overall assembling structure.
The technical solution used in the present invention：Will be by polymer elements, metalized surface layer upper surface
It is fixed on gold with the gas sensor sensing element of lower surface composition by way of being mechanically connected
Belong in the cavity that shell or metal pipe cap are formed with circuit board, sensing element measures and produces during tested gas
The raw signal of telecommunication by exporting on circuit board with the pin that it is electrically connected, the electricity on circuit board
Signal processing circuit completes Electric signal processing；
Wherein, by bending metals shell top blind flange or overall pressure metal pipe cap by sensing element
Be fixed in cavity, between using the structure of sustainable extruding joint face ensure sensing element with outer
Portion's circuit completes to be electrically connected.
Compared with the prior art, the invention has the advantages that：Encapsulation process is simple to operate,
Can encapsulate in batches, compare independent packaged type in hgher efficiency；Due in encapsulation process using circuit
Plate, can be according to target requirement, and first Reflow Soldering Electric signal processing element post package sensing element is kept away
During having exempted from, temperature causes performance impact to sensing element, more can be disposable by circuit variation
Realize Premium Features.The assembly method of described packaged type gas sensor will not using traditional
The welding operation technique that sensing element 1 and shell are welded as a whole, enormously simplify assembly technology
Process, has saved installation time, improves efficiency of assembling, is more suitable for electronics industry
The requirement producing and assembling.
Brief description
Below in conjunction with the accompanying drawings and embodiment the present invention is further detailed explanation：
Fig. 1 is the board structure of circuit figure using metal-back packing forms；
Fig. 2 is the gas sensor configuration figure using metal-back encapsulation；
Fig. 3 is the board structure of circuit figure using metal pipe cap packing forms；
Fig. 4 is the gas sensor configuration figure using metal pipe cap encapsulation.
Specific embodiment
Reference and accompanying drawing related description：Sensing element 1, spring structure 2, metal-back 3,
Circuit board 4, metal pipe cap 5, pin 6, Electric signal processing element 7；Polymer elements 11,
Metalized surface layer upper surface 12, metalized surface layer lower surface 13；Top blind flange 31.
Note：Spring structure 2 is with " shell near metalized surface layer upper surface 12 side
It is additionally provided between top layer cover plate and metalized surface layer upper surface 12 for filling therebetween
One of following several structures of gap and formation electrical connection：Sponge like polymer, gasket construction,
" spring " non-same structure in spring ".
Embodiment 1
A kind of gas sensor, its composition is as follows：Sensing element 1, shell, circuit board 4,
Pin 6；Wherein：Sensing element 1, circuit board 4 are all encapsulated in its internal cavities shell；
A part for pin 6 is arranged in the inside of shell and is connected with circuit board 4, pin 6 another
Part reaches the outside of shell, and sensing element 1 is connected with circuit board 4；
In described gas sensor, the composition of sensing element 1 is as follows：Polymer elements 11,
Metalized surface layer upper surface 12, metalized surface layer lower surface 13；Wherein：The latter two points
It is not fixedly installed on the upper and lower surface of polymer elements 11 and three is fixed as one；
The top layer cover plate of shell forms electricity with the metalized surface layer upper surface 12 of sensing element 1
Contact, metalized surface layer lower surface 13 is electrically connected with pin 6 composition on circuit board 4.
Shell is specially metal-back 3 or metal pipe cap 5；Wherein：The top blind flange of metal-back 3
Specifically flexural spring structure, there is elastically-deformable mode and sensing element 1 to suffer oppression in it
Metalized surface layer upper surface 12 formed electrical contact；
The specifically following several knots of top layer cover plate of the metal-back 3 as shell or metal pipe cap 5
One of structure：Sponge like polymer, gasket construction, filament structure；It specially can be used to ensure that
The structure that continuous extrusion upper and lower surface is electrically connected with sensitive material formation.
The metalized surface layer upper surface 12 of gas sensor and metalized surface layer lower surface 13
Particular by plating, sputtering or evaporation platinum black, platinum carbon, Pt, Au, Ag, Ni,
Pd, Cu, C and other metal or alloy are obtained.
The technical scheme that the present embodiment adopts：Will be by polymer elements, metalized surface layer upper table
The gas sensor sensing element of face and lower surface composition is fixed on by way of being mechanically connected
In the cavity of metal-back or metal pipe cap and circuit board composition, when sensing element measures tested gas
Produce the signal of telecommunication by exporting on circuit board with the pin that it is electrically connected, on circuit board
Electric signal processing circuit completes Electric signal processing；
Wherein, by bending metals shell top blind flange or overall pressure metal pipe cap by sensing element
Be fixed in cavity, between using the structure of sustainable extruding joint face ensure sensing element with outer
Portion's circuit completes to be electrically connected.
The assembly method of gas sensor as above：Operated as steps described below successively
So that assembling obtains described packaged type gas sensor method：
First, it pre-purchase or manufactures sensing element 1, shell, circuit board 4, pin 6；
Shell is specially tubular structure, its metal-back 3 or the gold that the one end open other end is closing blind hole
Belong to pipe cap 5；The top blind flange of described shell is to stretch out elasticity of flexure structure to inner chamber, and it is to be subject to
There is metalized surface layer upper surface 12 shape of elastically-deformable mode and sensing element 1 in compressing
Become electrical contact；The top blind flange of metal-back 3 and the elasticity of flexure structure stretched out to inner chamber are one
Change overall structure；
Secondly, pin 6 is arranged in the corresponding position of circuit board 4；Can between by pin
6 fixed and arranged on the circuit board 4 and become integral structure；
Sensing element 1 is loaded in metal-back 3 or the inner chamber of metal pipe cap 5 it is desirable to will sense
Metalized surface layer upper surface 12 side of element 1 is near metal-back 3 or metal pipe cap 5
Inner chamber blind hole end is arranged；
Then circuit board 4 is fixed on pin 6 and is arranged in opening of metal-back 3 or metal pipe cap 5
Mouthful end, and inwardly hold out against sensing element 1 by means of instrument or circuit board 4 itself and make metallization
Stretch out the elastic construction of bending to inner chamber inside the top blind flange of surface layer upper surface 12 and shell
It is in close contact and constitutes electrical connection, inside the top blind flange of shell, stretch out the bullet of bending simultaneously to inner chamber
Property structure occur elastic deformation ensure the contact reliability both it；Final circuit board 4 is towards outer
The side local of shell inner chamber side should be adjacent to the metalized surface layer lower surface 13 of sensing element 1
Arrange and constitute circuit board 4 or pin 6 fixed thereon and metalized surface layer lower surface
Electrical connection between 13；
Finally shell is assisted by outside subsidiary structure further with circuit board 4 and fix with shape
Become reliably overall assembling structure.
The present embodiment beneficial effect compared with prior art is：Encapsulation process is simple to operate, can
Batch encapsulates, and compares independent packaged type in hgher efficiency；Due in encapsulation process using circuit board,
Can be according to target requirement, first Reflow Soldering Electric signal processing element post package sensing element, it is to avoid
During temperature sensing element is caused with performance impact, more disposably can be realized by circuit variation
Premium Features.
The assembly method of described packaged type gas sensor not using traditional by sensing element 1
The welding operation technique being welded as a whole with shell, enormously simplify assembling technology procedure, saves
Installation time, improves efficiency of assembling, is more suitable for electronics industry metaplasia and produces and assemble
Requirement.
Embodiment 2
A kind of gas sensor, its composition is as follows：Sensing element 1, shell, circuit board 4,
Pin 6；Wherein：Shell is the cylinder structure of one end open；Sensing element 1 is encapsulated by shell
In its internal cavities；Circuit board 4 is arranged in as the structure that closure shell is one end open end
Jointly shell inner cavity is contained into a closed chamber at shell aperture and with shell wall；
In described gas sensor, the composition of sensing element 1 is as follows：Polymer elements 11,
Metalized surface layer upper surface 12, metalized surface layer lower surface 13；Wherein：The latter two points
It is not fixedly installed on the upper and lower surface of polymer elements 11 and three is fixed as one；
A part for pin 6 be arranged in shell inside and with metalized surface layer lower surface 13
Connect with circuit board 4, another part of pin 6 reaches the chamber that circuit board 4 is wrapped with shell
Outdoor；
The top layer cover plate of shell and sensing element near metalized surface layer upper surface 12 side
1 metalized surface layer upper surface 12 forms electrical contact.
Shell is specially metal-back 3 or metal pipe cap 5；Wherein：The top blind flange of shell be to
Inner chamber stretches out elasticity of flexure structure, and it occurs elastically-deformable mode and sensing element to suffer oppression
1 metalized surface layer upper surface 12 forms electrical contact；The top blind flange of metal-back 3 with to
The elasticity of flexure structure that inner chamber stretches out is integrated overall structure.
The top layer cover plate of shell near metalized surface layer upper surface 12 side and metallization table
Be additionally provided between surface layer upper surface 12 for filling therebetween gap and formed electrical connection
One of following several structures：Sponge like polymer, gasket construction, spring；It is specially and can use
In the structure guaranteeing that continuous extrusion upper and lower surface is electrically connected with sensitive material formation.
Shell top blind flange have stretch out elasticity of flexure structure to inner chamber on the basis of make again
It is combined into corresponding function mould with electric connection structures such as sponge like polymer, gasket construction, springs
Block.
The metalized surface layer upper surface 12 of gas sensor and metalized surface layer lower surface 13
Particular by plating, the platinum black of sputtering or evaporation, platinum carbon, Pt, Au, Ag, Ni,
Pd, Cu, C are obtained.
The assembly method of packaged type gas sensor as above：Enter as steps described below successively
Row operation is so that assembling obtains described packaged type gas sensor method：
First, it pre-purchase or manufactures sensing element 1, shell, circuit board 4, pin 6；
Shell is specially tubular structure, its metal-back 3 or the gold that the one end open other end is closing blind hole
Belong to pipe cap 5；The top blind flange of described shell is to stretch out elasticity of flexure structure to inner chamber, and it is to be subject to
There is metalized surface layer upper surface 12 shape of elastically-deformable mode and sensing element 1 in compressing
Become electrical contact；The top blind flange of metal-back 3 and the elasticity of flexure structure stretched out to inner chamber are one
Change overall structure；
Secondly, pin 6 is arranged in the corresponding position of circuit board 4；Can between by pin
6 fixed and arranged on the circuit board 4 and become integral structure；
Sensing element 1 is loaded in metal-back 3 or the inner chamber of metal pipe cap 5 it is desirable to will sense
Metalized surface layer upper surface 12 side of element 1 is near metal-back 3 or metal pipe cap 5
Inner chamber blind hole end is arranged；
Then circuit board 4 is fixed on pin 6 and is arranged in opening of metal-back 3 or metal pipe cap 5
Mouthful end, and inwardly hold out against sensing element 1 by means of instrument or circuit board 4 itself and make metallization
Inside surface layer upper surface 12 and the top blind flange of shell (or also contributed to by means of other
Indirectly constitute the intermediary element of electrical connection) constitute electrical connection, simultaneously inside the top blind flange of shell
Structure (or referring to above-mentioned intermediary element) occur elastic deformation ensure connecing both it
Tactile reliability；Final circuit board 4 should be adjacent to sensing element towards the side local of shell inner cavity side
The metalized surface layer lower surface 13 of part 1 is arranged and is constituted circuit board 4 or fixed thereon
Electrical connection between pin 6 and metalized surface layer lower surface 13；
Finally shell is assisted by outside subsidiary structure further with circuit board 4 and fix with shape
Become reliably overall assembling structure.
The technical scheme that the present embodiment adopts：Will be by polymer elements, metalized surface layer upper table
The gas sensor sensing element of face and lower surface composition is fixed on by way of being mechanically connected
In the cavity of metal-back or metal pipe cap and circuit board composition, when sensing element measures tested gas
Produce the signal of telecommunication by exporting on circuit board with the pin that it is electrically connected, on circuit board
Electric signal processing circuit completes Electric signal processing；
Wherein, by bending metals shell top blind flange or overall pressure metal pipe cap by sensing element
Be fixed in cavity, between using the structure of sustainable extruding joint face ensure sensing element with outer
Portion's circuit completes to be electrically connected.
The present embodiment beneficial effect compared with prior art is：Encapsulation process is simple to operate, can
Batch encapsulates, and compares independent packaged type in hgher efficiency；Due in encapsulation process using circuit board,
Can be according to target requirement, first Reflow Soldering Electric signal processing element post package sensing element, it is to avoid
During temperature sensing element is caused with performance impact, more disposably can be realized by circuit variation
Premium Features.
Embodiment 3
A kind of gas sensor, its composition is as follows：Sensing element 1, shell, circuit board 4,
Pin 6；Wherein：Shell is the cylinder structure of one end open；Sensing element 1 is encapsulated by shell
In its internal cavities；Circuit board 4 is arranged in as the structure that closure shell is one end open end
Jointly shell inner cavity is contained into a closed chamber at shell aperture and with shell wall；
In described gas sensor, the composition of sensing element 1 is as follows：Polymer elements 11,
Metalized surface layer upper surface 12, metalized surface layer lower surface 13；Wherein：The latter two points
It is not fixedly installed on the upper and lower surface of polymer elements 11 and three is fixed as one；
A part for pin 6 be arranged in shell inside and with metalized surface layer lower surface 13
Connect with circuit board 4, another part of pin 6 reaches the chamber that circuit board 4 is wrapped with shell
Outdoor；
The top layer cover plate of shell and sensing element near metalized surface layer upper surface 12 side
1 metalized surface layer upper surface 12 forms electrical contact.
In described gas sensor, the shell of close metalized surface layer upper surface 12 side
It is additionally provided between top layer cover plate and metalized surface layer upper surface 12 for filling therebetween
One of following several structures of gap and formation electrical connection：Sponge like polymer, gasket construction,
Spring；It specially can be used to ensure that continuous extrusion upper and lower surface and sensitive material form electricity even
The structure connecing.I.e.：Directly using sponge like polymer, pad inside conventional ophthalmic top blind flange
The electric connection structures such as coil structures, spring are combined into corresponding functional module.
The metalized surface layer upper surface 12 of gas sensor and metalized surface layer lower surface 13
Particular by plating, the platinum black of sputtering or evaporation, platinum carbon, Pt, Au, Ag, Ni,
Pd, Cu, C are obtained.
Embodiment 4
Gas sensor includes the cavity of metal-back 3 or metal pipe cap 5 and circuit board 4 composition,
Inside cavity is equipped with sensing element 1, the pin that circuit board 4 is electrically connected with sensing element 1
6 and to sensing element 1 output signal process Electric signal processing element 7.
Wherein sensing element 1 is by polymer elements 11, metalized surface layer upper surface 12 and gold
Genusization surface layer lower surface 13 forms.
Embodiment 1,4 packaging technologies are realized by following steps：
1st, such as Fig. 1 by metal-back 3, pin 6, Electric signal processing element 7 reflow soldering with electricity
On road plate 4 correspondence position；
2nd, sensing element 1 is respectively put in metal-back 3 cavity such as Fig. 1, makes to inductive sensing
Element 1 metalized surface layer lower surface 13 is electrically connected with pin 6；
3rd, such as Fig. 2 fold each metal-back 3 top blind flange 31 so as to corresponding sensing element
1 metalized surface layer upper surface 12 is electrically connected；
4th, mark calibration sensor.
Embodiment 5
Packaging technology difference from Example 4 is：First by pin 6, Electric signal processing unit
Part 7 is simultaneously placed on the correspondence position of circuit board 4, and reflow soldering is fixed, and then will
Sensing element 1 is encapsulated on circuit board 4 with metal pipe cap 5, and ensures corresponding sensing element 1
Metalized surface layer upper surface 12 and metal pipe cap 5 are electrically connected, metalized surface layer simultaneously
Lower surface 13 is electrically connected with pin 6.
In embodiment 4, the top blind flange 31 of metal-back 3 is flexural spring structure, and it is pressed in biography
Electrical connection is formed on sensing unit 1 metalized surface layer upper surface 12.
Metal-back 3 or metal pipe cap 5 and sensing element 1 metalized surface in embodiment 2,3
Layer upper surface 12 attachment structure is to can be used to ensure that continuous extrusion metal-back 3 or metal pipe cap 5
With sensing element 1 metalized surface layer upper surface 12 and keep be electrically connected structure, under being
State one of several：Sponge like polymer, gasket construction, filament structure, spring structure.
The metalized surface layer upper surface 12 of sensing element 1 and metallization table in embodiment 2,3
Surface layer lower surface 13 particular by plating, the platinum black of sputtering or evaporation, platinum carbon, Pt,
Au, Ag, Ni, Pd, Cu, C and other metal or alloy are obtained.
Above-described embodiment, simply presently preferred embodiments of the present invention, not it is used for limiting the present invention's
Practical range, therefore all equivalence changes with content described in the claims in the present invention, all should include
In scope of the presently claimed invention.
Claims (6)
1. a kind of gas sensor it is characterised in that：Its composition is as follows：Sensing element (1), shell, circuit board (4), pin (6)；Wherein：Shell is the cylinder structure of one end open；Sensing element (1) is encapsulated in its internal cavities shell；Circuit board (4) is arranged at shell aperture as the structure that closure shell is one end open end and jointly shell inner cavity is contained into a closed chamber with shell wall；
In described gas sensor, the composition of sensing element (1) is as follows：Polymer elements (11), metalized surface layer upper surface (12), metalized surface layer lower surface (13)；Wherein：The latter two upper and lower surfaces being respectively fixedly disposed at polymer elements (11) and three is fixed as one；
A part for pin (6) is arranged in the inside of shell and is connected with metalized surface layer lower surface (13) and circuit board (4), and another part of pin (6) reaches the exterior thereto that circuit board (4) is wrapped with shell；
The top layer cover plate of shell near metalized surface layer upper surface (12) side forms electrical contact with metalized surface layer upper surface (12) of sensing element (1).
2. according to gas sensor described in claim 1 it is characterised in that：
Shell is specially metal-back (3) or metal pipe cap (5)；Wherein：
The top blind flange of shell is to stretch out elasticity of flexure structure to inner chamber, and it occurs elastically-deformable mode and metalized surface layer upper surface (12) of sensing element (1) to form electrical contact to suffer oppression；The top blind flange of metal-back (3) and the integrated overall structure of elasticity of flexure structure stretched out to inner chamber.
3. according to gas sensor described in claim 1 or 2 it is characterised in that：
It is additionally provided between the top layer cover plate of shell of close metalized surface layer upper surface (12) side and metalized surface layer upper surface (12) for filling one of following several structures of gap and formation electrical connection therebetween：Sponge like polymer, gasket construction, spring；It specially can be used to ensure that the structure that continuous extrusion upper and lower surface is electrically connected with sensitive material formation.
4. according to gas sensor described in claim 1 or 2 it is characterised in that：Metalized surface layer upper surface (12) of gas sensor and metalized surface layer lower surface (13) are obtained particular by plating, sputtering or the platinum black evaporating, platinum carbon, Pt, Au, Ag, Ni, Pd, Cu, C.
5. according to gas sensor described in claim 3 it is characterised in that：Metalized surface layer upper surface (12) of gas sensor and metalized surface layer lower surface (13) are obtained particular by plating, sputtering or the platinum black evaporating, platinum carbon, Pt, Au, Ag, Ni, Pd, Cu, C.
6. gas sensor described in claim 1 assembly method it is characterised in that：It is operable to assembling successively as steps described below and obtain described gas sensor method：
First, it pre-purchase or manufactures sensing element (1), shell, circuit board (4), pin (6)；Shell is specially the tubular structure that the one end open other end is closing blind hole, consists of metal-back (3) or metal pipe cap (5)；The top blind flange of described shell is to stretch out elasticity of flexure structure to inner chamber, and it occurs elastically-deformable mode and metalized surface layer upper surface (12) of sensing element (1) to form electrical contact to suffer oppression；The top blind flange of metal-back (3) and the integrated overall structure of elasticity of flexure structure stretched out to inner chamber；
Secondly, pin (6) is arranged in the corresponding position of circuit board (4)；Can between pin (6) fixed and arranged is upper and become integral structure in circuit board (4)；
Sensing element (1) is loaded in metal-back (3) or the inner chamber of metal pipe cap (5) it is desirable to arrange metalized surface layer upper surface (12) side of sensing element (1) near the inner chamber blind hole end of metal-back (3) or metal pipe cap (5)；
Then circuit board (4) is fixed on pin (6) and is arranged in metal-back (3) or the opening of metal pipe cap (5), and by instrument or circuit board (4) itself inwardly compress sensing element (1) make metalized surface layer upper surface (12) with inside the top blind flange of shell to inner chamber stretch out bending elastic construction be in close contact constitute electrically connect, simultaneously inside the top blind flange of shell to inner chamber stretch out bending elastic construction occur elastic deformation ensure the two contact reliability；The electrical connection between circuit board (4) or pin (6) fixed thereon and metalized surface layer lower surface (13) is arranged and constituted to metalized surface layer lower surface (13) that the side local of final circuit board (4) shell inner cavity side should be adjacent to sensing element (1)；
Finally shell and circuit board (4) being passed through outside subsidiary structure assists fixation to form reliably overall assembling structure further.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510493321.4A CN106442865B (en) | 2015-08-12 | 2015-08-12 | A kind of gas sensor and its packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510493321.4A CN106442865B (en) | 2015-08-12 | 2015-08-12 | A kind of gas sensor and its packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106442865A true CN106442865A (en) | 2017-02-22 |
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| US20070144903A1 (en) * | 2005-12-27 | 2007-06-28 | Tzong-Sheng Lee | Packaging structure of gas detector and method for making the same |
| JP2010066174A (en) * | 2008-09-11 | 2010-03-25 | Citizen Finetech Miyota Co Ltd | Gas sensor |
| CN102636520A (en) * | 2012-01-09 | 2012-08-15 | 华中科技大学 | Packaging structure and method for metallic oxide gas sensitive element array |
| CN203117157U (en) * | 2013-03-08 | 2013-08-07 | 苏爱芳 | Gas sensor |
| CN103293206A (en) * | 2012-02-29 | 2013-09-11 | 日本特殊陶业株式会社 | Gas sensor |
| KR20140107863A (en) * | 2013-02-28 | 2014-09-05 | 세종공업 주식회사 | Packaging structure of gas sensor |
| US20150177171A1 (en) * | 2013-12-20 | 2015-06-25 | Samsung Electro-Mechanics Co., Ltd. | Gas sensor package |
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| US20070144903A1 (en) * | 2005-12-27 | 2007-06-28 | Tzong-Sheng Lee | Packaging structure of gas detector and method for making the same |
| JP2010066174A (en) * | 2008-09-11 | 2010-03-25 | Citizen Finetech Miyota Co Ltd | Gas sensor |
| CN102636520A (en) * | 2012-01-09 | 2012-08-15 | 华中科技大学 | Packaging structure and method for metallic oxide gas sensitive element array |
| CN103293206A (en) * | 2012-02-29 | 2013-09-11 | 日本特殊陶业株式会社 | Gas sensor |
| KR20140107863A (en) * | 2013-02-28 | 2014-09-05 | 세종공업 주식회사 | Packaging structure of gas sensor |
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