CN106442539B - Utilize the method for image information measurement Surface Flaw - Google Patents
Utilize the method for image information measurement Surface Flaw Download PDFInfo
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- CN106442539B CN106442539B CN201610799974.XA CN201610799974A CN106442539B CN 106442539 B CN106442539 B CN 106442539B CN 201610799974 A CN201610799974 A CN 201610799974A CN 106442539 B CN106442539 B CN 106442539B
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- level image
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8874—Taking dimensions of defect into account
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/888—Marking defects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
Abstract
The invention discloses a kind of methods using image information measurement Surface Flaw, it include: Step 1: the workpiece is plate shaped workpiece, utilize the first surface image of laser scanner scans workpiece, recycle the second surface image of camera shooting workpiece, and when shooting second surface image, so that the focal length of camera is located across workpiece centre and perpendicular on the vertical line of workpiece surface, light source is set to the front of workpiece, is located at light source on the vertical line；Step 2: second surface image is changed into gray level image, and by first surface image and gray level image overlapping alignment, to determine the coordinate and gray value of all pixels point in gray level image；Step 3: identifying the background area in gray level image and defect area, the size for measuring defect area in a computer calculates the actual size of the defect on workpiece using the proportionate relationship between gray level image and workpiece.The present invention is high to the measurement accuracy of defect, and handles and analyze convenient for follow-up data.
Description
Technical field
The present invention relates to a kind of methods using image information measurement Surface Flaw.
Background technique
The surface state of workpiece is an important index, and whether the situation that can be used to measure workpiece meets actual use
Needs, the material of workpiece whether qualification etc..It can only be on actual workpiece at present when carrying out defect analysis to workpiece
Measure the size of defect.On the one hand this measurement method accuracy is inadequate, and measured flaw size precision does not reach requirement, separately
On the one hand, it has not been convenient to carry out subsequent data processing or analysis.
Summary of the invention
The present invention has designed and developed a kind of precision height, and the utilization image information measurement for facilitating follow-up data to handle and analyze
The method of Surface Flaw.
Technical solution provided by the invention are as follows:
A method of Surface Flaw is measured using image information, comprising:
Step 1: the workpiece is plate shaped workpiece, using the first surface image of laser scanner scans workpiece, recycle
Camera shoots the second surface image of workpiece, and when shooting second surface image, is located across the focal length of camera
Light source, is set to the front of workpiece, is located at light source on the vertical line by workpiece centre and perpendicular on the vertical line of workpiece surface,
When shooting, it is not turned on camera flashlamp, is illuminated using light source；
Step 2: second surface image is changed into gray level image, and by first surface image and gray level image overlapping alignment,
To determine the coordinate and gray value of all pixels point in gray level image；
Step 3: edge detection is carried out to gray level image, to identify the background area in gray level image and defect area
Defect area is marked by domain, is measured the size of defect area in a computer, is utilized the ratio between gray level image and workpiece
Example relationship, calculates the actual size of the defect on workpiece.
Preferably, it in the method using image information measurement Surface Flaw, in the step 2, utilizes
The side length of the outer profile of gray level image and the practical side length of workpiece calculate the proportionate relationship between gray level image and workpiece.
Preferably, in the method using image information measurement Surface Flaw, in the step 3, also exist
The center in sunken region of falling vacant is marked in computer, and provides the coordinate of the center of defect area.
Preferably, in the method using image information measurement Surface Flaw, in the step 3, also exist
The maximum pixel of gray scale in sunken region of falling vacant is marked in computer, and provides the coordinate of the maximum pixel of gray scale.
Preferably, in the method using image information measurement Surface Flaw, the light source is that sending is white
The light source of light.
Method of the present invention using image information measurement Surface Flaw is high to the measurement accuracy of defect, and just
In follow-up data processing and analyze.
Detailed description of the invention
Fig. 1 is the schematic diagram of the gray level image of workpiece.
Specific embodiment
Present invention will be described in further detail below with reference to the accompanying drawings, to enable those skilled in the art referring to specification text
Word can be implemented accordingly.
As shown in Figure 1, the present invention provides a kind of method using image information measurement Surface Flaw, comprising:
Step 1: the workpiece is plate shaped workpiece, using the first surface image of laser scanner scans workpiece, recycle
Camera shoots the second surface image of workpiece, and when shooting second surface image, is located across the focal length of camera
Light source, is set to the front of workpiece, is located at light source on the vertical line by workpiece centre and perpendicular on the vertical line of workpiece surface,
When shooting, it is not turned on camera flashlamp, is illuminated using light source；
Step 2: second surface image is changed into gray level image, and by first surface image and gray level image overlapping alignment,
To determine the coordinate and gray value of all pixels point in gray level image；
Step 3: edge detection is carried out to gray level image, to identify background area 1 and the defect area in gray level image
Defect area 2 is marked by domain 2, the size of defect area is measured in a computer, using between gray level image and workpiece
Proportionate relationship calculates the actual size of the defect on workpiece.
In the present invention, first with the first surface image of laser scanner scans workpiece, then second surface image is obtained, when
By gray level image and first surface image overlapping alignment, so that it may be accurately judged to the coordinate of each pixel in gray level image.
The focal length of camera is located across on the vertical line on workpiece centre and vertical workpiece surface, and light source is also disposed at the vertical line
On, when shooting, it is not turned on camera flashlamp, and illuminated using light source, other light can be excluded to greatest extent in this way
Interference, the defect of workpiece surface can be clearly displayed, in turn very much under the irradiation of single light source in gray level image
It can be accurately identified out, finally obtain accurate measurement result.
In addition, handling in a computer gray level image, defect area is judged according to the gray scale of pixel, is surveyed
The size of defect area is measured, and (this can be according to camera institute further according to the proportionate relationship between gray level image and workpiece
The parameter of setting determines), so that it may calculate the actual size of the defect on workpiece.Since gray level image has been stored in computer
In, the actual size of gray level image, defect area and defect can provide important ginseng for subsequent data processing and analysis
It examines and foundation.
Preferably, it in the method using image information measurement Surface Flaw, in the step 2, utilizes
The side length of the outer profile of gray level image and the practical side length of workpiece calculate the proportionate relationship between gray level image and workpiece.
Preferably, subsequent data processing and analysis for convenience, the utilization image information measure workpiece surface
In the method for defect, in the step 3, the center of defect area is also marked in a computer, and provide defect area
Center coordinate.Defect area is if it is irregular shape, then center can be the position substantially estimated
It sets.
Preferably, subsequent data processing and analysis for convenience, the utilization image information measure workpiece surface
In the method for defect, in the step 3, the maximum pixel of gray scale of defect area is also marked in a computer, and provide
The coordinate of the maximum pixel of gray scale.
Preferably, in the method using image information measurement Surface Flaw, the light source is that sending is white
The light source of light.White light can show the difference between defect area and background area to the maximum extent, and then improve to defect
The accuracy of identification in region.
Although the embodiments of the present invention have been disclosed as above, but its is not only in the description and the implementation listed
With it can be fully applied to various fields suitable for the present invention, for those skilled in the art, can be easily
Realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, the present invention is simultaneously unlimited
In specific details and legend shown and described herein.
Claims (5)
1. a kind of method using image information measurement Surface Flaw, which is plate shaped workpiece, is clapped using camera
Take the photograph the second surface image of workpiece characterized by comprising
Step 1: using the first surface image of laser scanner scans workpiece, and when shooting second surface image, make to shine
The focal length of camera is located across workpiece centre and perpendicular on the vertical line of workpiece surface, and light source is set to the front of workpiece,
It is located at light source on the vertical line, when shooting, is not turned on camera flashlamp, is illuminated using light source；
Step 2: second surface image is changed into gray level image, and by first surface image and gray level image overlapping alignment, with true
Determine the coordinate and gray value of all pixels point in gray level image；
Step 3: edge detection is carried out to gray level image, thus identify the background area in gray level image and defect area, it will
Defect area is marked, and measures the size of defect area in a computer, is closed using the ratio between gray level image and workpiece
System, calculates the actual size of the defect on workpiece.
2. utilizing the method for image information measurement Surface Flaw as described in claim 1, which is characterized in that the step
In two, the ratio between gray level image and workpiece is calculated using the side length of the outer profile of gray level image and the practical side length of workpiece
Relationship.
3. utilizing the method for image information measurement Surface Flaw as claimed in claim 2, which is characterized in that the step
In three, the center of defect area is also marked in a computer, and provides the coordinate of the center of defect area.
4. utilizing the method for image information measurement Surface Flaw as claimed in claim 3, which is characterized in that the step
In three, the maximum pixel of gray scale of defect area is also marked in a computer, and provides the seat of the maximum pixel of gray scale
Mark.
5. according to any one of claims 1 to 4 using the method for image information measurement Surface Flaw, feature exists
In the light source is the light source for issuing white light.
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| CN201610799974.XA CN106442539B (en) | 2016-08-31 | 2016-08-31 | Utilize the method for image information measurement Surface Flaw |
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| CN106442539B true CN106442539B (en) | 2019-04-12 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108511359A (en) * | 2018-03-30 | 2018-09-07 | 武汉新芯集成电路制造有限公司 | The detection method of wafer defect |
| CN108872375A (en) * | 2018-05-08 | 2018-11-23 | 北京盈和瑞环境科技股份有限公司 | The detection method and device of board with enamel panel layer surface defect point |
| CN116698860B (en) * | 2023-08-08 | 2023-10-27 | 山东鲁地源天然药物有限公司 | Method for realizing mass solid root type traditional Chinese medicine slice quality analysis based on image processing |
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| JPH06347418A (en) * | 1993-06-04 | 1994-12-22 | Mitsui Mining & Smelting Co Ltd | Laser scanner and image forming method |
| CN101354241A (en) * | 2008-07-11 | 2009-01-28 | 长安大学 | Method and system for evaluating aggregate digital image |
| CN101706458A (en) * | 2009-11-30 | 2010-05-12 | 中北大学 | Automatic detection system and detection method of high resolution printed circuit board |
| WO2012014358A1 (en) * | 2010-07-30 | 2012-02-02 | 株式会社日立ハイテクノロジーズ | Fault inspection device and fault inspection method |
| CN203069156U (en) * | 2013-03-07 | 2013-07-17 | 中国石油大学(华东) | Novel scraping processing surface automatic detection device |
| CN105549322A (en) * | 2014-10-24 | 2016-05-04 | 信越化学工业株式会社 | Evaluation method of defect size of photomask blank, selection method, and manufacturing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7586599B2 (en) * | 2005-08-08 | 2009-09-08 | Applied Materials, Isreal, Ltd. | Method and system for detecting defects |
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- 2016-08-31 CN CN201610799974.XA patent/CN106442539B/en active Active
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| JPH06347418A (en) * | 1993-06-04 | 1994-12-22 | Mitsui Mining & Smelting Co Ltd | Laser scanner and image forming method |
| CN101354241A (en) * | 2008-07-11 | 2009-01-28 | 长安大学 | Method and system for evaluating aggregate digital image |
| CN101706458A (en) * | 2009-11-30 | 2010-05-12 | 中北大学 | Automatic detection system and detection method of high resolution printed circuit board |
| WO2012014358A1 (en) * | 2010-07-30 | 2012-02-02 | 株式会社日立ハイテクノロジーズ | Fault inspection device and fault inspection method |
| CN203069156U (en) * | 2013-03-07 | 2013-07-17 | 中国石油大学(华东) | Novel scraping processing surface automatic detection device |
| CN105549322A (en) * | 2014-10-24 | 2016-05-04 | 信越化学工业株式会社 | Evaluation method of defect size of photomask blank, selection method, and manufacturing method |
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Effective date of registration: 20190115 Address after: Room A-B102-785, 198 Kaidi Road, Xiaoshan Economic and Technological Development Zone, Hangzhou, Zhejiang Province, 311200 Applicant after: Hangzhou Xiao Nan science and Technology Co Ltd Address before: No. 160 Jinji Road, Lianzhou Town, Hepu County, Guangxi Zhuang Autonomous Region Applicant before: Wang Qinyu |
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