CN106442539A - Method for measuring surface defect of workpiece by use of image information - Google Patents

Method for measuring surface defect of workpiece by use of image information Download PDF

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Publication number
CN106442539A
CN106442539A CN201610799974.XA CN201610799974A CN106442539A CN 106442539 A CN106442539 A CN 106442539A CN 201610799974 A CN201610799974 A CN 201610799974A CN 106442539 A CN106442539 A CN 106442539A
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workpiece
image
gray level
defect
level image
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CN201610799974.XA
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CN106442539B (en
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王钦裕
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Hangzhou Xiao Nan science and Technology Co Ltd
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王钦裕
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • G01N2021/8874Taking dimensions of defect into account
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • G01N2021/888Marking defects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

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  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The invention discloses a method for measuring a surface defect of a workpiece by use of image information. The method comprises steps as follows: step one, the workpiece is a platy workpiece, a first surface image of the workpiece is scanned with a laser scanner, a second surface image of the workpiece is shot with a camera, the focal length of the camera is located at the center of the workpiece and perpendicular to the vertical line of the workpiece surface when the second surface image is shot, and a light source is arranged in front of the workpiece and located on the vertical line; step two, the second surface image is converted into a grey image, the first surface image and the grey image are overlapped and aligned, and coordinates and grey values of all pixel points in the grey image are thus determined; step three, a background region and a defect region of the grey image are recognized, the size of the defect region is measured in a computer, and the actual size of the defect on the workpiece is calculated by means of the proportion relation between the grey image and the workpiece. The defect measurement accuracy is high, and follow-up data processing and analysis are facilitated.

Description

The method measuring Surface Flaw using image information
Technical field
The present invention relates to a kind of method that utilization image information measures Surface Flaw.
Background technology
The surface state of workpiece is an important index, can be used to weigh workpiece situation whether meet actually used Needs, whether the material of workpiece qualified etc..At present when defect analysis are carried out to workpiece, can only be on actual workpiece Measure the size of defect.On the one hand not, measured flaw size precision does not reach requirement, separately for this metering system degree of accuracy On the one hand it has not been convenient to carry out follow-up data processing or analysis.
Content of the invention
The present invention has designed and developed a kind of high precision, and the utilization image information measurement facilitating follow-up data to process and analyzing The method of Surface Flaw.
The present invention provide technical scheme be:
A kind of method that utilization image information measures Surface Flaw, including:
Step one, this workpiece are plate shaped workpiece, using the first surface image of laser scanner scans workpiece, recycle Camera shoots the second surface image of workpiece, and when shooting second surface image, so that the focal length of camera is located across Workpiece centre and on the vertical line of surface of the work, light source is arranged at the dead ahead of workpiece, makes light source be located on this vertical line, During shooting, it is not turned on camera flashlamp, using light source lighting;
Step 2, second surface image is changed into gray level image, and by first surface image and gray level image overlapping alignment, To determine the coordinate of all pixels point and gray value in gray level image;
Step 3, rim detection is carried out to gray level image, thus identifying the background area in gray level image and defect area Domain, defect area is marked, and measures the size of defect area in a computer, using the ratio between gray level image and workpiece Example relation, calculates the actual size of the defect on workpiece.
Preferably, described utilization image information measures in the method for Surface Flaw, in described step 2, utilizes The actual length of side of the length of side of the outline of gray level image and workpiece calculates the proportionate relationship between gray level image and workpiece.
Preferably, described utilization image information measures in the method for Surface Flaw, in described step 3, also exists Mark the center in sunken region of falling vacant in computer, and provide the coordinate of the center of defect area.
Preferably, described utilization image information measures in the method for Surface Flaw, in described step 3, also exists Mark the maximum pixel of the gray scale in sunken region of falling vacant in computer, and provide the coordinate of the maximum pixel of gray scale.
Preferably, described utilization image information measures in the method for Surface Flaw, and described light source is white for sending The light source of light.
The method that utilization image information of the present invention measures Surface Flaw is high to the certainty of measurement of defect, and just Process in follow-up data and analyze.
Brief description
Fig. 1 is the schematic diagram of the gray level image of workpiece.
Specific embodiment
The present invention is described in further detail below in conjunction with the accompanying drawings, to make those skilled in the art with reference to specification literary composition Word can be implemented according to this.
As shown in figure 1, the present invention provides a kind of method that utilization image information measures Surface Flaw, including:
Step one, this workpiece are plate shaped workpiece, using the first surface image of laser scanner scans workpiece, recycle Camera shoots the second surface image of workpiece, and when shooting second surface image, so that the focal length of camera is located across Workpiece centre and on the vertical line of surface of the work, light source is arranged at the dead ahead of workpiece, makes light source be located on this vertical line, During shooting, it is not turned on camera flashlamp, using light source lighting;
Step 2, second surface image is changed into gray level image, and by first surface image and gray level image overlapping alignment, To determine the coordinate of all pixels point and gray value in gray level image;
Step 3, rim detection is carried out to gray level image, thus identifying background area 1 and defect area in gray level image Domain 2, defect area 2 is marked, and measures the size of defect area in a computer, using between gray level image and workpiece Proportionate relationship, calculates the actual size of the defect on workpiece.
In the present invention, first with the first surface image of laser scanner scans workpiece, then obtain second surface image, when By gray level image with first surface image overlapping alignment it is possible to be accurately judged to the coordinate of each pixel in gray level image.
The focal length of camera is located across on workpiece centre and the vertical line on vertical workpiece surface, and light source is also disposed at this vertical line On, during shooting, it is not turned on camera flashlamp, and uses light source lighting, so can exclude other light to greatest extent Interference, under the irradiation of single light source, it can very clearly display out in gray level image the defect of surface of the work, and then Can be accurately identified out, finally obtain accurate measurement result.
Additionally, processing to gray level image in a computer, the gray scale according to pixel, to judge defect area, is surveyed The size of amount defect area, and further according to the proportionate relationship between gray level image and workpiece, (this can be according to camera institute The parameter determination setting) it is possible to calculate the actual size of the defect on workpiece.Because gray level image has been stored in computer In, the actual size of gray level image, defect area and defect can be follow-up data processing and analysis provides important ginseng Examine and foundation.
Preferably, described utilization image information measures in the method for Surface Flaw, in described step 2, utilizes The actual length of side of the length of side of the outline of gray level image and workpiece calculates the proportionate relationship between gray level image and workpiece.
Preferably, data processing follow-up for convenience and analysis, described utilization image information measures surface of the work In the method for defect, in described step 3, also mark the center of defect area in a computer, and provide defect area Center coordinate.If irregularly shaped, then center can be a position substantially estimating to defect area Put.
Preferably, data processing follow-up for convenience and analysis, described utilization image information measures surface of the work In the method for defect, in described step 3, also mark the maximum pixel of the gray scale of defect area in a computer, and be given The coordinate of the maximum pixel of gray scale.
Preferably, described utilization image information measures in the method for Surface Flaw, and described light source is white for sending The light source of light.White light can present the difference between defect area and background area to greatest extent, and then improves to defect The accuracy of identification in region.
Although embodiment of the present invention is disclosed as above, it is not restricted to listed in specification and embodiment With, it can be applied to various suitable the field of the invention completely, for those skilled in the art, can be easily Realize other modification, therefore under the universal being limited without departing substantially from claim and equivalency range, the present invention does not limit In specific details with shown here as the legend with description.

Claims (5)

1. a kind of utilization image information measures the method for Surface Flaw it is characterised in that including:
Step one, this workpiece are plate shaped workpiece, using the first surface image of laser scanner scans workpiece, recycle photograph Machine shoots the second surface image of workpiece, and when shooting second surface image, makes the focal length of camera be located across workpiece Center and on the vertical line of surface of the work, light source is arranged at the dead ahead of workpiece, makes light source be located on this vertical line, shoots When, it is not turned on camera flashlamp, using light source lighting;
Step 2, second surface image is changed into gray level image, and by first surface image and gray level image overlapping alignment, with true Determine the coordinate of all pixels point and gray value in gray level image;
Step 3, rim detection is carried out to gray level image, thus identifying the background area in gray level image and defect area, will Defect area is marked, and measures the size of defect area in a computer, is closed using the ratio between gray level image and workpiece System, calculates the actual size of the defect on workpiece.
2. utilization image information as claimed in claim 1 measures the method for Surface Flaw it is characterised in that described step In two, calculate the ratio between gray level image and workpiece using the length of side of the outline of gray level image and the actual length of side of workpiece Relation.
3. utilization image information as claimed in claim 2 measures the method for Surface Flaw it is characterised in that described step In three, also mark the center of defect area in a computer, and provide the coordinate of the center of defect area.
4. utilization image information as claimed in claim 3 measures the method for Surface Flaw it is characterised in that described step In three, also mark the maximum pixel of the gray scale of defect area in a computer, and provide the seat of the maximum pixel of gray scale Mark.
5. the method that the utilization image information as any one of Claims 1-4 measures Surface Flaw, its feature exists In described light source is the light source sending white light.
CN201610799974.XA 2016-08-31 2016-08-31 Utilize the method for image information measurement Surface Flaw Active CN106442539B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108511359A (en) * 2018-03-30 2018-09-07 武汉新芯集成电路制造有限公司 The detection method of wafer defect
CN108872375A (en) * 2018-05-08 2018-11-23 北京盈和瑞环境科技股份有限公司 The detection method and device of board with enamel panel layer surface defect point
CN116698860A (en) * 2023-08-08 2023-09-05 山东鲁地源天然药物有限公司 Method for realizing mass solid root type traditional Chinese medicine slice quality analysis based on image processing

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CN105549322A (en) * 2014-10-24 2016-05-04 信越化学工业株式会社 Evaluation method of defect size of photomask blank, selection method, and manufacturing method

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US20070070335A1 (en) * 2005-08-08 2007-03-29 Tsvi Goren Method and System for Detecting Defects
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108511359A (en) * 2018-03-30 2018-09-07 武汉新芯集成电路制造有限公司 The detection method of wafer defect
CN108872375A (en) * 2018-05-08 2018-11-23 北京盈和瑞环境科技股份有限公司 The detection method and device of board with enamel panel layer surface defect point
CN116698860A (en) * 2023-08-08 2023-09-05 山东鲁地源天然药物有限公司 Method for realizing mass solid root type traditional Chinese medicine slice quality analysis based on image processing
CN116698860B (en) * 2023-08-08 2023-10-27 山东鲁地源天然药物有限公司 Method for realizing mass solid root type traditional Chinese medicine slice quality analysis based on image processing

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