CN106442539A - Method for measuring surface defect of workpiece by use of image information - Google Patents
Method for measuring surface defect of workpiece by use of image information Download PDFInfo
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- CN106442539A CN106442539A CN201610799974.XA CN201610799974A CN106442539A CN 106442539 A CN106442539 A CN 106442539A CN 201610799974 A CN201610799974 A CN 201610799974A CN 106442539 A CN106442539 A CN 106442539A
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- 230000007547 defect Effects 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000001514 detection method Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 4
- 241000276425 Xiphophorus maculatus Species 0.000 abstract 1
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8874—Taking dimensions of defect into account
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/888—Marking defects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention discloses a method for measuring a surface defect of a workpiece by use of image information. The method comprises steps as follows: step one, the workpiece is a platy workpiece, a first surface image of the workpiece is scanned with a laser scanner, a second surface image of the workpiece is shot with a camera, the focal length of the camera is located at the center of the workpiece and perpendicular to the vertical line of the workpiece surface when the second surface image is shot, and a light source is arranged in front of the workpiece and located on the vertical line; step two, the second surface image is converted into a grey image, the first surface image and the grey image are overlapped and aligned, and coordinates and grey values of all pixel points in the grey image are thus determined; step three, a background region and a defect region of the grey image are recognized, the size of the defect region is measured in a computer, and the actual size of the defect on the workpiece is calculated by means of the proportion relation between the grey image and the workpiece. The defect measurement accuracy is high, and follow-up data processing and analysis are facilitated.
Description
Technical field
The present invention relates to a kind of method that utilization image information measures Surface Flaw.
Background technology
The surface state of workpiece is an important index, can be used to weigh workpiece situation whether meet actually used
Needs, whether the material of workpiece qualified etc..At present when defect analysis are carried out to workpiece, can only be on actual workpiece
Measure the size of defect.On the one hand not, measured flaw size precision does not reach requirement, separately for this metering system degree of accuracy
On the one hand it has not been convenient to carry out follow-up data processing or analysis.
Content of the invention
The present invention has designed and developed a kind of high precision, and the utilization image information measurement facilitating follow-up data to process and analyzing
The method of Surface Flaw.
The present invention provide technical scheme be：
A kind of method that utilization image information measures Surface Flaw, including：
Step one, this workpiece are plate shaped workpiece, using the first surface image of laser scanner scans workpiece, recycle
Camera shoots the second surface image of workpiece, and when shooting second surface image, so that the focal length of camera is located across
Workpiece centre and on the vertical line of surface of the work, light source is arranged at the dead ahead of workpiece, makes light source be located on this vertical line,
During shooting, it is not turned on camera flashlamp, using light source lighting；
Step 2, second surface image is changed into gray level image, and by first surface image and gray level image overlapping alignment,
To determine the coordinate of all pixels point and gray value in gray level image；
Step 3, rim detection is carried out to gray level image, thus identifying the background area in gray level image and defect area
Domain, defect area is marked, and measures the size of defect area in a computer, using the ratio between gray level image and workpiece
Example relation, calculates the actual size of the defect on workpiece.
Preferably, described utilization image information measures in the method for Surface Flaw, in described step 2, utilizes
The actual length of side of the length of side of the outline of gray level image and workpiece calculates the proportionate relationship between gray level image and workpiece.
Preferably, described utilization image information measures in the method for Surface Flaw, in described step 3, also exists
Mark the center in sunken region of falling vacant in computer, and provide the coordinate of the center of defect area.
Preferably, described utilization image information measures in the method for Surface Flaw, in described step 3, also exists
Mark the maximum pixel of the gray scale in sunken region of falling vacant in computer, and provide the coordinate of the maximum pixel of gray scale.
Preferably, described utilization image information measures in the method for Surface Flaw, and described light source is white for sending
The light source of light.
The method that utilization image information of the present invention measures Surface Flaw is high to the certainty of measurement of defect, and just
Process in follow-up data and analyze.
Brief description
Fig. 1 is the schematic diagram of the gray level image of workpiece.
Specific embodiment
The present invention is described in further detail below in conjunction with the accompanying drawings, to make those skilled in the art with reference to specification literary composition
Word can be implemented according to this.
As shown in figure 1, the present invention provides a kind of method that utilization image information measures Surface Flaw, including：
Step one, this workpiece are plate shaped workpiece, using the first surface image of laser scanner scans workpiece, recycle
Camera shoots the second surface image of workpiece, and when shooting second surface image, so that the focal length of camera is located across
Workpiece centre and on the vertical line of surface of the work, light source is arranged at the dead ahead of workpiece, makes light source be located on this vertical line,
During shooting, it is not turned on camera flashlamp, using light source lighting；
Step 2, second surface image is changed into gray level image, and by first surface image and gray level image overlapping alignment,
To determine the coordinate of all pixels point and gray value in gray level image；
Step 3, rim detection is carried out to gray level image, thus identifying background area 1 and defect area in gray level image
Domain 2, defect area 2 is marked, and measures the size of defect area in a computer, using between gray level image and workpiece
Proportionate relationship, calculates the actual size of the defect on workpiece.
In the present invention, first with the first surface image of laser scanner scans workpiece, then obtain second surface image, when
By gray level image with first surface image overlapping alignment it is possible to be accurately judged to the coordinate of each pixel in gray level image.
The focal length of camera is located across on workpiece centre and the vertical line on vertical workpiece surface, and light source is also disposed at this vertical line
On, during shooting, it is not turned on camera flashlamp, and uses light source lighting, so can exclude other light to greatest extent
Interference, under the irradiation of single light source, it can very clearly display out in gray level image the defect of surface of the work, and then
Can be accurately identified out, finally obtain accurate measurement result.
Additionally, processing to gray level image in a computer, the gray scale according to pixel, to judge defect area, is surveyed
The size of amount defect area, and further according to the proportionate relationship between gray level image and workpiece, (this can be according to camera institute
The parameter determination setting) it is possible to calculate the actual size of the defect on workpiece.Because gray level image has been stored in computer
In, the actual size of gray level image, defect area and defect can be follow-up data processing and analysis provides important ginseng
Examine and foundation.
Preferably, described utilization image information measures in the method for Surface Flaw, in described step 2, utilizes
The actual length of side of the length of side of the outline of gray level image and workpiece calculates the proportionate relationship between gray level image and workpiece.
Preferably, data processing follow-up for convenience and analysis, described utilization image information measures surface of the work
In the method for defect, in described step 3, also mark the center of defect area in a computer, and provide defect area
Center coordinate.If irregularly shaped, then center can be a position substantially estimating to defect area
Put.
Preferably, data processing follow-up for convenience and analysis, described utilization image information measures surface of the work
In the method for defect, in described step 3, also mark the maximum pixel of the gray scale of defect area in a computer, and be given
The coordinate of the maximum pixel of gray scale.
Preferably, described utilization image information measures in the method for Surface Flaw, and described light source is white for sending
The light source of light.White light can present the difference between defect area and background area to greatest extent, and then improves to defect
The accuracy of identification in region.
Although embodiment of the present invention is disclosed as above, it is not restricted to listed in specification and embodiment
With, it can be applied to various suitable the field of the invention completely, for those skilled in the art, can be easily
Realize other modification, therefore under the universal being limited without departing substantially from claim and equivalency range, the present invention does not limit
In specific details with shown here as the legend with description.
Claims (5)
1. a kind of utilization image information measures the method for Surface Flaw it is characterised in that including：
Step one, this workpiece are plate shaped workpiece, using the first surface image of laser scanner scans workpiece, recycle photograph
Machine shoots the second surface image of workpiece, and when shooting second surface image, makes the focal length of camera be located across workpiece
Center and on the vertical line of surface of the work, light source is arranged at the dead ahead of workpiece, makes light source be located on this vertical line, shoots
When, it is not turned on camera flashlamp, using light source lighting；
Step 2, second surface image is changed into gray level image, and by first surface image and gray level image overlapping alignment, with true
Determine the coordinate of all pixels point and gray value in gray level image；
Step 3, rim detection is carried out to gray level image, thus identifying the background area in gray level image and defect area, will
Defect area is marked, and measures the size of defect area in a computer, is closed using the ratio between gray level image and workpiece
System, calculates the actual size of the defect on workpiece.
2. utilization image information as claimed in claim 1 measures the method for Surface Flaw it is characterised in that described step
In two, calculate the ratio between gray level image and workpiece using the length of side of the outline of gray level image and the actual length of side of workpiece
Relation.
3. utilization image information as claimed in claim 2 measures the method for Surface Flaw it is characterised in that described step
In three, also mark the center of defect area in a computer, and provide the coordinate of the center of defect area.
4. utilization image information as claimed in claim 3 measures the method for Surface Flaw it is characterised in that described step
In three, also mark the maximum pixel of the gray scale of defect area in a computer, and provide the seat of the maximum pixel of gray scale
Mark.
5. the method that the utilization image information as any one of Claims 1-4 measures Surface Flaw, its feature exists
In described light source is the light source sending white light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610799974.XA CN106442539B (en) | 2016-08-31 | 2016-08-31 | Utilize the method for image information measurement Surface Flaw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610799974.XA CN106442539B (en) | 2016-08-31 | 2016-08-31 | Utilize the method for image information measurement Surface Flaw |
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| Publication Number | Publication Date |
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| CN106442539A true CN106442539A (en) | 2017-02-22 |
| CN106442539B CN106442539B (en) | 2019-04-12 |
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| CN201610799974.XA Active CN106442539B (en) | 2016-08-31 | 2016-08-31 | Utilize the method for image information measurement Surface Flaw |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511359A (en) * | 2018-03-30 | 2018-09-07 | 武汉新芯集成电路制造有限公司 | The detection method of wafer defect |
| CN108872375A (en) * | 2018-05-08 | 2018-11-23 | 北京盈和瑞环境科技股份有限公司 | The detection method and device of board with enamel panel layer surface defect point |
| CN116698860A (en) * | 2023-08-08 | 2023-09-05 | 山东鲁地源天然药物有限公司 | Method for realizing mass solid root type traditional Chinese medicine slice quality analysis based on image processing |
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| JPH06347418A (en) * | 1993-06-04 | 1994-12-22 | Mitsui Mining & Smelting Co Ltd | Laser scanner and image forming method |
| US20070070335A1 (en) * | 2005-08-08 | 2007-03-29 | Tsvi Goren | Method and System for Detecting Defects |
| CN101354241A (en) * | 2008-07-11 | 2009-01-28 | 长安大学 | Method and system for evaluating aggregate digital image |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511359A (en) * | 2018-03-30 | 2018-09-07 | 武汉新芯集成电路制造有限公司 | The detection method of wafer defect |
| CN108872375A (en) * | 2018-05-08 | 2018-11-23 | 北京盈和瑞环境科技股份有限公司 | The detection method and device of board with enamel panel layer surface defect point |
| CN116698860A (en) * | 2023-08-08 | 2023-09-05 | 山东鲁地源天然药物有限公司 | Method for realizing mass solid root type traditional Chinese medicine slice quality analysis based on image processing |
| CN116698860B (en) * | 2023-08-08 | 2023-10-27 | 山东鲁地源天然药物有限公司 | Method for realizing mass solid root type traditional Chinese medicine slice quality analysis based on image processing |
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| CN106442539B (en) | 2019-04-12 |
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Effective date of registration: 20190115 Address after: Room A-B102-785, 198 Kaidi Road, Xiaoshan Economic and Technological Development Zone, Hangzhou, Zhejiang Province, 311200 Applicant after: Hangzhou Xiao Nan science and Technology Co Ltd Address before: No. 160 Jinji Road, Lianzhou Town, Hepu County, Guangxi Zhuang Autonomous Region Applicant before: Wang Qinyu |
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