CN106433535A - Encapsulating compound for capacitor and preparation method thereof - Google Patents

Encapsulating compound for capacitor and preparation method thereof Download PDF

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Publication number
CN106433535A
CN106433535A CN201610817187.3A CN201610817187A CN106433535A CN 106433535 A CN106433535 A CN 106433535A CN 201610817187 A CN201610817187 A CN 201610817187A CN 106433535 A CN106433535 A CN 106433535A
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China
Prior art keywords
encapsulating compound
raw material
weight
capacitor
parts
Prior art date
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Granted
Application number
CN201610817187.3A
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Chinese (zh)
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CN106433535B (en
Inventor
张方明
林鹭伟
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Longchang Xiamen Composites Technology Co Ltd
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Longchang Xiamen Composites Technology Co Ltd
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Priority to CN201610817187.3A priority Critical patent/CN106433535B/en
Publication of CN106433535A publication Critical patent/CN106433535A/en
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Abstract

The invention provides an encapsulating compound for a capacitor and relates to the technical field of capacitors. The encapsulating compound is prepared from, by weight, 95-105 parts of main agent, 75-85parts of curing agent and 1-3parts of promoter, wherein the main agent includes90%-95%of epoxy resin, 4%-9.9% of active diluent and 0.1%-1% of epoxy defoaming agent, the curing agent includes 90%-95% of methyl hexahydrophthalic anhydride and 5%-10% of nonylphenol, and the promoter is 2-ethyl-4-methyl imidazole. The encapsulating compound is used for dipping small capacitor elements and is low in viscosity, good in fluidity and easy to defoam after mixing, and mixed liquid can be used for more than 36 hours. The encapsulating compound is cured at the medium temperature of 80-100 DEG C, the curing speed is high, and a primary curing effect can be reached within 1 hour. The shrinkage rate is low after curing, wetting resistance is good, the encapsulating compound has very good glossiness and high hardness, and a cured material is good in mechanical strength and has good electrical insulating performance and chemical resistance performance.

Description

A kind of encapsulating compound for capacitor and preparation method thereof
Technical field
The present invention relates to capacitor technology field, especially a kind of encapsulating compound for capacitor and preparation method thereof.
Background technology
Capacitor is in accordance with the difference of medium, and its species is a lot, for example：Electrolyte capacitance, papery electric capacity, thin-film capacitor, Ceramic condenser, mica capacitor, air electric capacity etc., but most frequent used in sound appliances, surely belong to electrolysis condenser and thin Membrane capacitance, electrochemical capacitor is used in where needing capacitance very big mostly, and the filter capacitor of such as main power source part is removed Outside filtering, and also serve as storage electric energy and be used, and thin-film capacitor is then extensively used in the commissure of analogue signal, power supply noise The place such as bypass.
Existing capacitor encapsulating compound needs that solidification temperature is higher, hardening time is longer, and reason is firming agent feature itself Determine, anhydride-cured epoxy adhesive is generally required and can be only achieved curing degree more than 90% more than 120 DEG C, the promotion of anhydride Effect also tends to need 2-3 hour to can be only achieved 90% degree cured above.
Content of the invention
The present invention provides a kind of encapsulating compound for capacitor and preparation method thereof, only needs 90～100 DEG C, within one hour The curing degree of solidfied material more than 90% can just be reached.
The present invention specifically adopts the following technical scheme that realization：
A kind of encapsulating compound for capacitor, including the raw material of following weight portion：95～105 parts of host, firming agent 75～ 85 parts, 1～3 part of accelerator, wherein,
The host includes each raw material of following percentage by weight：Epoxy resin 90%～95%, reactive diluent 4%～ 9.9%, epoxy defoamer 0.1%～1%；
The firming agent includes each raw material of following percentage by weight：Methyl hexahydrophthalic anhydride 90%～95%, nonyl phenol 5% ～10%；
The accelerator is：2-ethyl-4-methylimidazole.
Preferably, the epoxy resin is NPEL-128 epoxy resin.
A kind of preparation method of the encapsulating compound for capacitor, including：
1) prepare host, in terms of the percentage composition of raw material gross weight, weigh 90%～95% epoxy resin, 4%～ 9.9% reactive diluent, 0.1%～1% epoxy defoamer, put in blender, stirring mixing, mixed liquor stable homogeneous Afterwards, 80 mesh filter subpackage；
2) firming agent is prepared, in terms of the percentage composition of raw material gross weight, 5%～10% nonyl phenol is added to and is equipped with It is stirred at room temperature in the reactor of 90%～95% methyl hexahydrophthalic anhydride；
3) accelerator is prepared, under the conditions of being incubated 40 DEG C, 2-ethyl-4-methylimidazole is individually filtered subpackage；
4) in terms of parts by weight of raw materials, by step 3) 1～3 part of accelerator preparing is added to step 1) prepare 95～ In 105 parts of hosts, it is thoroughly mixed, is completely dissolved；
5) by step 2) 75～85 parts of firming agent preparing are added to step 4) in the mixed liquor for preparing, stir, i.e., Obtain product.
Preferably, step 1) in stirring mixing condition be 1000-1200 rev/min of rotating speed, stir 30-40 minute； Step 2) in stirring condition be 600-800 rev/min, stir 30-40 minute.
A kind of encapsulating compound for capacitor that the present invention is provided and preparation method thereof, its advantage is：For soaking Stain midget capacitor element, solidfied material heat distortion temperature HDT, glass transition temperature Tg all more than 135 DEG C, viscosity after mixing Low, good fluidity, easy froth breaking, mixed liquor up time were more than 36 hours；Middle temperature 80-100 DEG C solidification, curing rate is fast, and 1 is little When interior can reach just admittedly effect；After solidification, receipts place rate is little, moisture-proof is good, have good gloss, hardness height；Solidfied material mechanical strength Good, and with good electrical insulation capability and anti-chemical mediator.The hardening time of the solidification temperature of adhesive is substantially reduced, is carried High production effect and reducing energy consumption.Save processing cost.
Specific embodiment
Hereinafter the principle and feature of the present invention is described, example is served only for explaining the present invention, is not intended to limit Determine the scope of the present invention.
A kind of encapsulating compound for capacitor that the present embodiment is proposed, including the raw material of following weight portion：100 parts of host, 80 parts of firming agent, 1.5 parts of accelerator, wherein, host includes each raw material of following percentage by weight：NPEL-128 epoxy resin 95%, reactive diluent 4.5%, epoxy defoamer 0.5%；Firming agent includes each raw material of following percentage by weight：Methyl six Hydrogen phthalic anhydride 90%, nonyl phenol 10%；Accelerator is 2-ethyl-4-methylimidazole.
The preparation method of encapsulating compound, including：
1) prepare host, in terms of the percentage composition of raw material gross weight, weigh 95% NPEL-128 epoxy resin, 4.5% Reactive diluent, 0.5% epoxy defoamer, put into blender in, 1000 revs/min of rotating speed, stir 30 minutes, mixed liquor After stable homogeneous, 80 mesh filter subpackage；
2) firming agent is prepared, in terms of the percentage composition of raw material gross weight, 10% nonyl phenol is added to equipped with 90% It is stirred at room temperature in the reactor of methyl hexahydrophthalic anhydride, 600-800 rev/min of rotating speed, stirs 40 minutes；
3) accelerator is prepared, under the conditions of 40 DEG C of insulation, 2-ethyl-4-methylimidazole is individually filtered subpackage；
4) in terms of parts by weight of raw materials, by step 3) 1.5 parts of accelerator preparing are added to step 1) prepare 100 parts In host, it is thoroughly mixed, is completely dissolved；
5) by step 2) 80 parts of firming agent preparing are added to step 4) in the mixed liquor for preparing, stir, obtain final product product Product.
Wherein step 1)～3) physical property of host, firming agent and accelerator for preparing is as shown in table 1：
1 formula physical property of table
Material Color Density (25 DEG C) Viscosity (25 DEG C)
Host Colourless or pale yellow transparent viscous liquid 0.98g/cm3 3000-4500CPS
Firming agent Water white transparency liquid 1.13g/cm3 100-150CPS
Accelerator Clear yellow viscous liquid 0.97g/cm3 800-1000CPS
The product of preparation, when using, surface needs to keep drying, cleans, and by proportioning taken amount, and weighs accurately (especially It is accelerator), it is weight ratio rather than volume ratio that please make sure to keep in mind proportioning.Host can heat reduction viscosity with deaeration after profit mixing, but warm The up time will be shortened when spending high, it is proposed that 60 DEG C of preheating temperature；Firming agent is easy to the moisture absorption, the moisture shape in meeting absorption air Become precipitate or crystalloid.Therefore using finishing, cover tightly immediately, cannot be used with avoiding rotten.
Although specifically show and describe the present invention with reference to preferred embodiment, but those skilled in the art should be bright In vain, in the spirit and scope of the present invention for being limited without departing from appended claims, in the form and details can be right The present invention makes a variety of changes, and is protection scope of the present invention.

Claims (4)

1. a kind of encapsulating compound for capacitor, it is characterised in that including the raw material of following weight portion：95～105 parts of host, Gu 75～85 parts of agent, 1～3 part of accelerator, wherein,
The host includes each raw material of following percentage by weight：Epoxy resin 90%～95%, reactive diluent 4%～ 9.9%, epoxy defoamer 0.1%～1%；
The firming agent includes each raw material of following percentage by weight：Methyl hexahydrophthalic anhydride 90%～95%, nonyl phenol 5%～ 10%；
The accelerator is：2-ethyl-4-methylimidazole.
2. a kind of encapsulating compound for capacitor according to claim 1, it is characterised in that：The epoxy resin is NPEL-128 epoxy resin.
3. the preparation method of a kind of encapsulating compound for capacitor according to claim 1, it is characterised in that：Including：
1) prepare host, in terms of the percentage composition of raw material gross weight, weigh 90%～95% epoxy resin, 4%～9.9% Reactive diluent, 0.1%～1% epoxy defoamer, put in blender, stirring mixing, after mixed liquor stable homogeneous, 80 mesh Filter subpackage；
2) firming agent is prepared, in terms of the percentage composition of raw material gross weight, 5%～10% nonyl phenol is added to equipped with 90%～ It is stirred at room temperature in the reactor of 95% methyl hexahydrophthalic anhydride；
3) accelerator is prepared, under the conditions of being incubated 40 DEG C, 2-ethyl-4-methylimidazole is individually filtered subpackage；
4) in terms of parts by weight of raw materials, by step 3) 1～3 part of accelerator preparing is added to step 1) prepare 95～105 In part host, it is thoroughly mixed, is completely dissolved；
5) by step 2) 75～85 parts of firming agent preparing are added to step 4) in the mixed liquor for preparing, stir, obtain final product product Product.
4. the preparation method of a kind of encapsulating compound for capacitor according to claim 3, it is characterised in that：Step 1) in The condition of stirring mixing is 1000-1200 rev/min of rotating speed, stirs 30-40 minute；Step 2) in stirring condition be 600- 800 revs/min, stir 30-40 minute.
CN201610817187.3A 2016-09-12 2016-09-12 A kind of encapsulating compound and preparation method thereof for capacitor Active CN106433535B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108048008A (en) * 2017-12-08 2018-05-18 嘉兴市清河高力绝缘有限公司 Epoxy encapsulating compound
CN108251033A (en) * 2017-12-29 2018-07-06 广州聚合新材料科技股份有限公司 A kind of automobile thin film capacitor embedding special epoxy resin glue and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104804694A (en) * 2015-05-20 2015-07-29 叶芳 Novel epoxy resin LED packaging adhesive and preparation method thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104804694A (en) * 2015-05-20 2015-07-29 叶芳 Novel epoxy resin LED packaging adhesive and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
陈平等: "《环氧树脂及其应用》", 29 February 2004, 化学工业出版社 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108048008A (en) * 2017-12-08 2018-05-18 嘉兴市清河高力绝缘有限公司 Epoxy encapsulating compound
CN108251033A (en) * 2017-12-29 2018-07-06 广州聚合新材料科技股份有限公司 A kind of automobile thin film capacitor embedding special epoxy resin glue and preparation method thereof

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