CN106413256B

CN106413256B - Chip packaging structure for realizing solderless interconnection with PCB

Info

Publication number: CN106413256B
Application number: CN201610999963.6A
Authority: CN
Inventors: 肖顺群; 刘江洪; 张继帆; 陈明川; 王辉
Original assignee: CETC 29 Research Institute; Shanghai Aerospace Science and Industry Appliance Co Ltd
Current assignee: CETC 29 Research Institute; Shanghai Aerospace Science and Industry Appliance Co Ltd
Priority date: 2016-11-14
Filing date: 2016-11-14
Publication date: 2023-10-20
Anticipated expiration: 2036-11-14
Also published as: CN106413256A

Abstract

The invention discloses a chip packaging structure for realizing welding-free interconnection with a PCB (printed circuit board), which comprises a plurality of chip bodies and the PCB, wherein the chip bodies are fixedly arranged on the PCB, a plurality of first screw sleeves and second screw sleeves are symmetrically arranged on the PCB, the chip bodies are fixedly arranged on the PCB through the first screw sleeves and the second screw sleeves, and the chip packaging structure also comprises a plurality of locking screws which are respectively matched with the first screw sleeves and the second screw sleeves to fixedly lock the chip bodies on the PCB. The chip packaging structure for realizing the welding-free interconnection with the PCB directly installs, fixes and locks the chip body on the PCB without welding, and realizes positioning, guiding, locking and misplug prevention structurally at the same time, thereby realizing repeated nondestructive installation and disassembly, ensuring reliable installation structure, being beneficial to realizing miniaturization and light weight and conforming to industry and technical development trend.

Description

Chip packaging structure for realizing solderless interconnection with PCB

Technical Field

The invention relates to a chip packaging structure, in particular to a chip packaging structure for realizing solderless interconnection with a PCB, and belongs to the technical field of electric connection.

Background

The signal transmission of a Printed Circuit Board (PCB) has various contact forms, and a plurality of plated through holes are usually formed on the PCB, and the signal transmission is performed by contacting an external circuit through the external through holes. Generally, the connecting structure is suitable for direct plug-in connection of the connector, namely, the contact pins of the connector are directly matched with the electroplating through holes, so that system interconnection and signal transmission are realized. This connection, which typically requires soldering of the pins to the PCB, has the following limitations: firstly, the assembly process is complex, each pin needs to be welded, the workload is large, and the welding quality cannot completely ensure the connection reliability; secondly, enough installation space needs to be reserved, otherwise, the operation cannot be performed; thirdly, can't realize harmless loading and unloading, install or dismantle many times, lead to its pin to appear quality problem, unable normal use.

Disclosure of Invention

The invention provides a chip packaging structure for realizing solderless interconnection with a PCB (printed circuit board) aiming at the defects of the prior art.

In order to solve the problems, the technical scheme adopted by the invention is as follows:

the utility model provides a chip packaging structure for realizing exempting from to weld interconnection with PCB board, includes a plurality of chip bodies and PCB board, and the chip body is installed and is fixed on the PCB board, the symmetry is provided with a plurality of first swivel nut and second swivel nut on the PCB board, the chip body passes through first swivel nut and second swivel nut fixed mounting on the PCB board, chip packaging structure still includes a plurality of locking screw, locking screw respectively with first swivel nut and second swivel nut cooperation, with the chip body installation locking on the PCB board.

As an improvement of the technical scheme, the first screw sleeve and the second screw sleeve are symmetrically arranged on the PCB.

As an improvement of the above technical solution, the first screw sleeve is a cylindrical structure, and the outside thereof includes: the arc-shaped surface and the vertical surface which play a role in positioning and guiding and play a role in positioning and preventing misplug are surrounded to form the outer surface.

As an improvement of the technical scheme, a threaded hole is formed in the first threaded sleeve, and the threaded hole is matched with the locking screw to realize locking.

As an improvement of the technical scheme, the end part of the locking screw is provided with two opening grooves which are vertically crossed.

As an improvement of the technical scheme, the first screw sleeve and the second screw sleeve are completely symmetrical in structure, and each chip body is at least fixed by one first screw sleeve and one second screw sleeve.

As an improvement of the technical scheme, the first screw sleeve and the second screw sleeve are distributed on the central axis of the chip body.

Compared with the prior art, the invention has the following implementation effects:

the chip packaging structure for realizing the welding-free interconnection with the PCB directly installs, fixes and locks the chip body on the PCB without welding, and realizes positioning, guiding, locking and misplug prevention structurally at the same time, thereby realizing repeated nondestructive installation and disassembly, ensuring reliable installation structure, being beneficial to realizing miniaturization and light weight and conforming to industry and technical development trend.

Drawings

FIG. 1 is a schematic diagram illustrating a chip package structure according to the present invention;

FIG. 2 is a schematic view of the first sleeve of FIG. 1;

fig. 3 is a schematic view of the locking screw of fig. 1 used in cooperation with the first sleeve.

Detailed Description

The present invention will be described below with reference to specific examples.

Fig. 1 is a schematic diagram illustrating the installation of a chip package structure according to the present invention. The chip packaging structure comprises a plurality of chip bodies 20 and a PCB 50, wherein the chip bodies 20 are installed and fixed on the PCB 50, the PCB 50 is provided with a plurality of first screw sleeves 30 and second screw sleeves 40, and the first screw sleeves 30 and the second screw sleeves 40 are fixed on the PCB 50 through threaded connection and can be connected or fixed in other modes; the chip body 20 is fixedly mounted on the PCB 50 through the first screw sleeve 30 and the second screw sleeve 40, the chip packaging structure further comprises a plurality of locking screws 10, and the locking screws 10 are respectively matched with the first screw sleeve 30 and the second screw sleeve 40 to mount and lock the chip body 20 on the PCB 50. The first screw sleeve 30 and the second screw sleeve 40 are symmetrically arranged on the PCB 50, so that when the chip body 20 is mounted, the chip body 20 contacts with the first screw sleeve 30 and the second screw sleeve 40 at the same time to bear force, and the acting forces counteract each other, so that the influence of internal stress of the chip body 20 during mounting is eliminated.

As shown in fig. 2, the first screw sleeve 30 in fig. 1 is a schematic structural view, the outer side of the first screw sleeve 30 is a cylindrical structure, and comprises an arc surface 31 and a vertical surface 32, the arc surface 31 and the vertical surface 32 surround to form an outer surface, the arc surface 31 is used for being matched with the PCB 50 in a plugging manner, and meanwhile, plays a role in positioning and guiding when the PCB 50 is plugged; the vertical surface 32 is used for preventing the misplug of the PCB 50, and plays roles of positioning and misplug prevention.

The first threaded sleeve 30 is also internally provided with a threaded hole 33, and the threaded hole 33 is matched with the locking screw 10 and realizes locking.

As shown in fig. 3, a schematic structure of the locking screw 10 used in cooperation with the first threaded sleeve 30 in fig. 1 is shown, and two vertically crossed open grooves 11 are formed at the end of the locking screw 10, so that the locking screw can be conveniently locked by various tools, such as a "one" or a "cross" type.

In the chip packaging structure of the present invention, the first screw sleeve 30 and the second screw sleeve 40 are completely symmetrical in structure and symmetrically mounted on the PCB 50, and each chip body 20 is fixed by at least one first screw sleeve 30 and one second screw sleeve 40, so that the mounting structure is very stable and reliable.

In the chip packaging structure of the present invention, the first screw sleeve 30 and the second screw sleeve 40 are distributed on the central axis of the chip body 20, so that the internal stress of the locking screw 10 when being matched with the first screw sleeve 30 and the second screw sleeve 40 is eliminated during the installation process, and the stability of the installation structure is further improved.

The foregoing is a detailed description of the invention with reference to specific embodiments, and is not intended to limit the practice of the invention to those descriptions. It will be apparent to those skilled in the art that several simple deductions or substitutions may be made without departing from the spirit of the invention, and these should be considered to be within the scope of the invention.

Claims

1. The chip packaging structure for realizing the solderless interconnection with the PCB comprises a PCB (50) and a plurality of chip bodies (20), wherein the chip bodies (20) are fixedly arranged on the PCB (50), and the chip packaging structure is characterized in that a plurality of first screw sleeves (30) and second screw sleeves (40) are arranged on the PCB (50), the chip bodies (20) are fixedly arranged on the PCB (50) through the first screw sleeves (30) and the second screw sleeves (40), the chip packaging structure further comprises a plurality of locking screws (10), and the locking screws (10) are respectively matched with the first screw sleeves (30) and the second screw sleeves (40) to fixedly lock the chip bodies (20) on the PCB (50);

the first screw sleeve (30) is of a barrel-mounted structure, and the outer side of the first screw sleeve comprises: an arc-shaped surface (31) which plays a role in positioning and guiding and a vertical surface (32) which plays a role in positioning and preventing misplug, and the arc-shaped surface (31) and the vertical surface (32) surround to form the outer surface.

2. A chip package structure for realizing a solderless interconnection with a PCB board according to claim 1, wherein the first screw sleeve (30) and the second screw sleeve (40) are symmetrically arranged on the PCB board (50).

3. A chip package structure for realizing a solderless interconnection with a PCB board according to claim 1 or 2, wherein the first screw sleeve (30) is internally provided with a threaded hole (33), and the threaded hole (33) is matched with the locking screw (10) and realizes locking.

4. A chip package structure for realizing a solderless interconnection with a PCB board according to claim 1 or 2, wherein the locking screw (10) is provided with two vertically intersecting open slots (11) at its ends.

5. A chip package structure for enabling solderless interconnection to a PCB of claim 1, wherein the first screw sleeve (30) and the second screw sleeve (40) are entirely symmetrical in structure, each chip body (20) being secured by at least one first screw sleeve (30) and one second screw sleeve (40).

6. A chip package structure for realizing a solderless interconnection with a PCB board as claimed in claim 1 or 5, wherein the first screw sleeve (30) and the second screw sleeve (40) are distributed on a central axis of the chip body (20).