CN106413256B - Chip packaging structure for realizing solderless interconnection with PCB - Google Patents

Abstract

The invention discloses a chip packaging structure for realizing solderless interconnection with a PCB board. It includes a plurality of chip bodies and a PCB board. The chip body is installed and fixed on the PCB board. A plurality of third chips are symmetrically arranged on the PCB board. A screw sleeve and a second screw sleeve. The chip body is fixedly mounted on the PCB board through the first screw sleeve and the second screw sleeve. The chip packaging structure also includes a plurality of locking screws, and the locking screws are respectively connected to the first screw sleeve. The screw sleeve cooperates with the second screw sleeve to install and lock the chip body on the PCB board. The present invention describes a chip packaging structure for realizing solderless interconnection with a PCB board. This structure directly installs, fixes and locks the chip body on the PCB board. Welding is no longer required, and the structure simultaneously realizes positioning, guidance, and Locking and mis-insertion prevention enable multiple non-destructive installations and disassemblies. The installation structure is reliable, conducive to miniaturization and lightweight, and is in line with industry and technology development trends.

Description

A chip packaging structure used to achieve solderless interconnection with PCB boards

Technical field

The invention relates to a chip packaging structure, in particular to a chip packaging structure for realizing solderless interconnection with a PCB board, and belongs to the technical field of electrical connection.

Background technique

There are many contact forms for signal transmission on printed circuit boards (PCB boards). Usually, there are several plated through holes on the PCB board, and signal transmission is carried out through external through holes and external circuit contact. Generally, this connection structure is suitable for direct plugging and unplugging of connectors, that is, the contact pins of the connector directly match the electroplated through holes to achieve system interconnection and signal transmission. This connection method generally requires welding the pins on the PCB board, which leads to the following limitations of this connection method: First, the assembly process is complex, each pin needs to be welded, the workload is large, and the welding quality cannot be achieved. The reliability of its connection is completely guaranteed; secondly, sufficient installation space needs to be reserved, otherwise the operation cannot be carried out; thirdly, non-destructive loading and unloading cannot be achieved, and repeated installation or disassembly will cause quality problems in its pins and cannot be used normally.

Contents of the invention

The present invention aims at the shortcomings of the existing technology and provides a chip packaging structure for realizing solderless interconnection with a PCB board.

In order to solve the above problems, the technical solutions adopted by the present invention are as follows:

A chip packaging structure for realizing solderless interconnection with a PCB board, including a plurality of chip bodies and a PCB board. The chip body is installed and fixed on the PCB board. A plurality of first screw sleeves and a plurality of first screw sleeves are symmetrically arranged on the PCB board. and a second screw sleeve. The chip body is fixedly mounted on the PCB board through the first screw sleeve and the second screw sleeve. The chip packaging structure also includes a plurality of locking screws. The locking screws are respectively connected to the first screw sleeve and the second screw sleeve. The two screw sleeves cooperate to install and lock the chip body on the PCB board.

As an improvement of the above technical solution, the first screw sleeve and the second screw sleeve are symmetrically arranged on the PCB board.

As an improvement of the above technical solution, the first screw sleeve has a cylindrical structure, and its outer side includes: an arc-shaped surface that plays a positioning and guiding role and a vertical surface that plays a positioning and mis-insertion prevention role. The arc-shaped surface and the vertical surface Surrounded by faces forming its outer surface.

As an improvement to the above technical solution, a threaded hole is provided inside the first thread sleeve, and the threaded hole cooperates with the locking screw to achieve locking.

As an improvement to the above technical solution, the end of the locking screw is provided with two perpendicularly intersecting opening slots.

As an improvement to the above technical solution, the structures of the first screw sleeve and the second screw sleeve are completely symmetrical, and each chip body is fixed by at least one first screw sleeve and one second screw sleeve.

As an improvement of the above technical solution, the first screw sleeve and the second screw sleeve are distributed on the central axis of the chip body.

Compared with the prior art, the implementation effects of the present invention are as follows:

The present invention describes a chip packaging structure for realizing solderless interconnection with a PCB board. This structure directly installs, fixes and locks the chip body on the PCB board. Welding is no longer required, and the structure simultaneously realizes positioning, guidance, and Locking and mis-insertion prevention enable multiple non-destructive installations and disassemblies. The installation structure is reliable, conducive to miniaturization and lightweight, and is in line with industry and technology development trends.

Description of the drawings

Figure 1 is a schematic diagram of the installation of the chip packaging structure of the present invention;

Figure 2 is a schematic structural diagram of the first screw sleeve in Figure 1;

FIG. 3 is a schematic structural diagram of the locking screw used in conjunction with the first screw sleeve in FIG. 1 .

Detailed ways

The content of the present invention will be described below with reference to specific embodiments.

As shown in Figure 1, it is a schematic diagram of the installation of the chip packaging structure of the present invention. The chip packaging structure of the present invention includes a plurality of chip bodies 20 and a PCB board 50. The chip body 20 is installed and fixed on the PCB board 50. The PCB board 50 is provided with a plurality of first screw sleeves 30 and second screw sleeves. 40. The first screw sleeve 30 and the second screw sleeve 40 are fixed on the PCB board 50 through threaded connection, and can also be connected or fixed in other ways; the chip body 20 is connected through the first screw sleeve 30 and the second screw sleeve 40 Fixedly installed on the PCB board 50, the chip packaging structure also includes a plurality of locking screws 10. The locking screws 10 cooperate with the first screw sleeve 30 and the second screw sleeve 40 to install and lock the chip body 20 on the PCB. On board 50. The first screw sleeve 30 and the second screw sleeve 40 are symmetrically arranged on the PCB board 50, so that when the chip body 20 is installed, the chip body 20 is in contact with the first screw sleeve 30 and the second screw sleeve 40 to receive force at the same time, and The acting forces cancel each other out, eliminating the influence of internal stress when the chip body 20 is installed.

As shown in Figure 2, it is a schematic structural diagram of the first screw sleeve 30 in Figure 1. The first screw sleeve 30 has a cylindrical structure, and its outer side includes an arc surface 31 and a vertical surface 32. The arc surface 31 and the vertical surface 32 Surrounding and forming its outer surface, the arcuate surface 31 is used to insert and match the PCB board 50, and at the same time plays a positioning and guiding role when the PCB board 50 is inserted; the vertical surface 32 is used to prevent the PCB board from 50% mis-insertion, which plays the role of positioning and preventing mis-insertion.

The first screw sleeve 30 is also provided with a threaded hole 33 inside, and the threaded hole 33 cooperates with the locking screw 10 to achieve locking.

As shown in Figure 3, it is a schematic structural diagram of the locking screw 10 used in conjunction with the first thread sleeve 30 in Figure 1. The end of the locking screw 10 is provided with two vertically intersecting opening slots 11, which facilitates the use of a variety of Tool locking, such as using the "one" word or "ten" word can work.

In the chip packaging structure of the present invention, the first screw sleeve 30 and the second screw sleeve 40 are completely symmetrical in structure and symmetrically installed on the PCB board 50. Each chip body 20 is composed of at least one first screw sleeve 30 and a third screw sleeve 30. The two screw sleeves are fixed by 40, so the installation structure is very stable and reliable.

In the chip packaging structure of the present invention, the first screw sleeve 30 and the second screw sleeve 40 are distributed on the central axis of the chip body 20, so that during the installation process, the locking screw 10 and the first screw sleeve 30 and the second screw sleeve are eliminated. The internal stress when the two screw sleeves 40 are matched further improves the stability of the installation structure.

The above content is a detailed description of the present invention in combination with specific embodiments, and it cannot be concluded that the specific implementation of the present invention is limited to these descriptions. For those skilled in the technical field to which the present invention belongs, a number of simple deductions or substitutions can be made without departing from the concept of the present invention, which should be deemed to fall within the scope of protection of the present invention.

Claims (6)

1. A chip packaging structure for realizing solderless interconnection with a PCB board, including a PCB board (50) and a plurality of chip bodies (20). The chip body (20) is installed and fixed on the PCB board (50). The characteristic is that the PCB board (50) is provided with a plurality of first screw sleeves (30) and second screw sleeves (40), and the chip body (20) passes through the first screw sleeve (30) and the second screw sleeve (40). The sleeve (40) is fixedly installed on the PCB board (50). The chip packaging structure also includes a plurality of locking screws (10). The locking screws (10) are respectively connected with the first screw sleeve (30) and the second screw sleeve. (40) Cooperate and install and lock the chip body (20) on the PCB board (50); The first screw sleeve (30) has a cylindrical structure, and its outer side includes: an arc-shaped surface (31) that plays a positioning and guiding role, and a vertical surface (32) that plays a positioning and mis-insertion prevention role. The arc-shaped surface (31) and vertical surfaces (32) surround it to form its outer surface. 2. A chip packaging structure for realizing solderless interconnection with a PCB board according to claim 1, characterized in that the first screw sleeve (30) and the second screw sleeve (40) are symmetrically arranged on on the PCB board (50). 3. A chip packaging structure for realizing solderless interconnection with a PCB board according to claim 1 or 2, characterized in that a threaded hole (33) is provided inside the first screw sleeve (30), The threaded hole (33) cooperates with the locking screw (10) to achieve locking. 4. A chip packaging structure for realizing solderless interconnection with a PCB board according to claim 1 or 2, characterized in that the end of the locking screw (10) is provided with two vertically intersecting openings. slot(11). 5. A chip packaging structure for solderless interconnection with a PCB board as claimed in claim 1, characterized in that the first screw sleeve (30) and the second screw sleeve (40) are completely symmetrical in structure , each chip body (20) is fixed by at least a first screw sleeve (30) and a second screw sleeve (40). 6. A chip packaging structure for realizing solderless interconnection with a PCB board according to claim 1 or 5, characterized in that the first screw sleeve (30) and the second screw sleeve (40) are distributed On the central axis of the chip body (20).