CN106402684A - Heat transfer mixed gas filled in LED lamp - Google Patents
Heat transfer mixed gas filled in LED lamp Download PDFInfo
- Publication number
- CN106402684A CN106402684A CN201610940798.7A CN201610940798A CN106402684A CN 106402684 A CN106402684 A CN 106402684A CN 201610940798 A CN201610940798 A CN 201610940798A CN 106402684 A CN106402684 A CN 106402684A
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- CN
- China
- Prior art keywords
- mixed gas
- heat transfer
- helium
- led
- lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
Abstract
The invention discloses a heat transfer mixed gas filled in an LED lamp. The heat transfer mixed gas consists of helium and xenon, and a volume ratio of the helium to xenon under a normal temperature is 70:30 to 80:20. The disclosed optimal mixed gas efficiently transfers heat produced by a chip by using convection and heat transfer of the gases through optimal match of heat transfer mechanisms of the gases, and accumulation of heat on the chip is avoided. A common LED lamp bulb is filled with the mixed gas disclosed in the technical solution instead of existing filling gas such as air, single inert gas or helium-hydrogen or helium-oxygen mixed gas, and a chip temperature of the LED is obviously reduced under the same power, such that a light emitting efficiency and service life of the LED lamp are greatly improved. The heat transfer mixed gas is particularly suitable for filling a closed LED lamp, such as a bulb lamp, a mercury lamp, a spotlight, a down lamp, a BR lamp, an MR lamp and the like.
Description
Technical field
The invention belongs to the technical field of LED electricity-saving lamp, particularly to the optimum biography being filled with a kind of closing chamber of LED
Hot mixing gas.
Background technology
The energy consumption of LED is the 1/4 of conventional fluorescent lamps, and the life-span is up to 10 times of the latter.However, with conventional fluorescent phase
Than, the chip non-refractory of LED bulb, its life-span, with the rising rapid decrease of semiconductor PN temperature, occurs notable simultaneously
Light decay.Therefore, the cooling encapsulation technology of LED is just particularly important.At present, the heat sink conception of LED substantially can be divided
For forcing cooling and natural cooling.Scheme due to forcing cooling needs complicated, the bulky cooling device of Circumscribed structure, leads
Cause its less stable, life-span shorter.On the contrary, natural cooling scheme, because of its compact conformation, noiselessness, becomes the main of LED
Radiating mode.The gas being filled with the closing chamber of LED in prior art is air, due to the convection current of air and heat conductivility relatively
Difference, heat is mainly conducted to outer surface by metallic object, and few portion heat is transferred to bulb outer surface by filling air, therefore not
The outer surface that bulb can be made full use of distributes heat in environment.
Content of the invention
A kind of optimum heat transfer gas of filling in LED, it is an object of the invention to overcoming above-mentioned prior art not enough, is provided
Body, to reduce LED chip temperature, extends LED service life.
It is contemplated that finding a kind of optimum mixed gas being filled with LED closing chamber, using the free convection of gas
With heat conduction, chip heat is efficiently delivered to tube face, realizes high efficiency and heat radiation.Using numerical simulation, theoretical optimization and experiment
Verify the method combining, compare the heat transfer property blending different proportion inert gas, find out the optimum heat transfer gas of filling LED
Body forms, and reduces chip temperature, improves the purpose of LED service life.
In order to achieve the above object, the technical scheme is that：
In a kind of LED, the heat transfer mixed gas of filling, are mixed by helium and xenon, in LED chip operating temperature
In the range of count by volume, helium is 70% 80%, and xenon is 20% 30%.
In described LED, the heat transfer mixed gas of filling, are mixed by helium and xenon, when LED chip temperature is high
When 120 degrees Celsius, at 25 DEG C of environment temperature, helium takes 80 with the volume ratio of xenon：20.
In a kind of described LED, the heat transfer mixed gas of filling, are mixed by helium and xenon, when LED chip temperature
When degree is higher than 70 degrees Celsius, at 25 DEG C of environment temperature, helium takes 70 with the volume ratio of xenon：30.
The present invention adopts helium and xenon mixed gas, replace air of the prior art, single inert gas or helium hydrogen,
The mixed gas of helium oxygen etc., can significantly reduce LED chip temperature under equal-wattage, thus greatly improving the use longevity of LED
Life.
Brief description
Fig. 1 is constant power (7W), under conditions of different filling gas, chip and circumstance of temperature difference value figure.
Specific embodiment
The mixed gas being made up of helium, neon, argon, krypton, xenon, 6 kinds of inert gases of nitrogen are filled in LED bulb closing chamber,
First pass through the Nu-Ra curve that CFD is calculated LED bulb, derived the heat convection of this kind of mixed gas by the definition of Nu number
Coefficient h, calculates thermal conductivity λ of this kind of proportioning gas simultaneously, carries out exhaustion by programming further, and using certain optimization
Method, searches and obtains a kind of optimum heat-conducting gas component of filling in LED, and this optimum heat transfer mixed gas are mixed with xenon by helium
Conjunction forms, and concrete volume ratio is：Helium：Xenon is 70：30～80：20.In above 6 kinds of inert gases, the heat conduction system of helium
Number highest, therefore has best heat conductivility；The density of xenon is maximum, and free convection Rayleigh number is maximum, therefore free convection
The strongest.The mixing of helium and xenon can make the heat conduction of gas and free convection realize Optimum Matching, therefore optimum heat transfer
Mixed gas are made up of with xenon helium.
The volume ratio of optimum heat-conducting gas component under the different chip temperature of table 1
Table 1 lists the optimum heat-conducting gas composition under the conditions of different chip temperatures (i.e. different capacity).Different chips
The difference very little that under temperature operating conditions, optimum heat transfer mixed gas are constituted, commonly uses in operating temperature range in LED chip, optimum
Heat transfer mixed gas volume range be：Helium：Xenon is 70：30～80：20.When power is larger, LED chip work temperature
Degree higher (as higher than 120 DEG C), the volume accounting of helium takes large values in the above range；When power is less, LED chip works
Temperature relatively low (as less than 70 DEG C), the volume accounting of helium gets the small value in the above range.
For verifying optimum heat-conducting gas formula disclosed by the invention, LED bulb is filled optimum mixed gas, sky respectively
Gas and single inert gas, the chip in the case that power, environment temperature are certain, under the conditions of the different filling gas of contrast
Temperature (Fig. 1).Result shows, the temperature rise value of its chip of bulb of the optimum mixed gas of filling is less by 30.7% than filling air,
The single gas helium more best than heat transfer property is little by 9.7%.It can be seen that, the optimum mixed gas formula that the present invention announces can show
Write the heat dispersion of lifting LED bulb.
Optimum heat-conducting gas formula disclosed by the invention, makes full use of the high heat conductance of helium and the strong nature of xenon
Heat convection ability, can effectively improve the heat exchange efficiency of LED bulb, significantly reduce chip temperature, thus improving its service life,
Can be filled in any closed LEDbulb lamp and all conditional electricity-saving lamps to chip operating temperature.
The product form of above-described embodiment and diagram the non-limiting present invention and style, any art common
Suitable change or modification that technical staff is done to it, all should be regarded as the patent category without departing from the present invention.
Claims (3)
1. a kind of heat transfer mixed gas being filled in LED it is characterised in that：Mixed by helium and xenon, in LED core
Count by volume in piece operating temperature range, helium is 70% 80%, xenon is 20% 30%.
2. a kind of heat transfer mixed gas being filled in LED according to claim 1 it is characterised in that：By helium and
Xenon mixes, and when LED chip temperature is higher than 120 degrees Celsius, helium takes 80 with the volume ratio of xenon：20.
3. a kind of heat transfer mixed gas being filled in LED according to claim 1 it is characterised in that：By helium and
Xenon mixes, and when LED chip temperature is less than 70 degrees Celsius, helium takes 70 with the volume ratio of xenon：30.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610940798.7A CN106402684A (en) | 2016-10-25 | 2016-10-25 | Heat transfer mixed gas filled in LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610940798.7A CN106402684A (en) | 2016-10-25 | 2016-10-25 | Heat transfer mixed gas filled in LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106402684A true CN106402684A (en) | 2017-02-15 |
Family
ID=58012779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610940798.7A Pending CN106402684A (en) | 2016-10-25 | 2016-10-25 | Heat transfer mixed gas filled in LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106402684A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB522692A (en) * | 1937-12-24 | 1940-06-25 | Bernhard Berghaus | Improvements in and relating to electronic discharge tubes |
| JPH04349384A (en) * | 1991-05-24 | 1992-12-03 | Okaya Electric Ind Co Ltd | Electric discharge type surge-absorbing element |
| CN101169235A (en) * | 2007-09-05 | 2008-04-30 | 昌鑫光电（东莞）有限公司 | White light LED with modified structure |
| CN203431571U (en) * | 2013-09-13 | 2014-02-12 | 朱君梅 | Small-power LED gas-filled lamp bulb |
| CN203656666U (en) * | 2014-01-13 | 2014-06-18 | 江苏厚睦莱照明科技有限公司 | LED lamp with incandescent lamp tungsten filament structure |
| CN104913217A (en) * | 2015-05-29 | 2015-09-16 | 杭州杭科光电股份有限公司 | LED (Light Emitting Diode) bulb lamp with driving power supply integrated in bulb shell |
-
2016
- 2016-10-25 CN CN201610940798.7A patent/CN106402684A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB522692A (en) * | 1937-12-24 | 1940-06-25 | Bernhard Berghaus | Improvements in and relating to electronic discharge tubes |
| JPH04349384A (en) * | 1991-05-24 | 1992-12-03 | Okaya Electric Ind Co Ltd | Electric discharge type surge-absorbing element |
| CN101169235A (en) * | 2007-09-05 | 2008-04-30 | 昌鑫光电（东莞）有限公司 | White light LED with modified structure |
| CN203431571U (en) * | 2013-09-13 | 2014-02-12 | 朱君梅 | Small-power LED gas-filled lamp bulb |
| CN203656666U (en) * | 2014-01-13 | 2014-06-18 | 江苏厚睦莱照明科技有限公司 | LED lamp with incandescent lamp tungsten filament structure |
| CN104913217A (en) * | 2015-05-29 | 2015-09-16 | 杭州杭科光电股份有限公司 | LED (Light Emitting Diode) bulb lamp with driving power supply integrated in bulb shell |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170215 |
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| WD01 | Invention patent application deemed withdrawn after publication |