CN106385763B - The production method of flexible printed circuit board, display and flexible printed circuit board - Google Patents
The production method of flexible printed circuit board, display and flexible printed circuit board Download PDFInfo
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- CN106385763B CN106385763B CN201610872236.3A CN201610872236A CN106385763B CN 106385763 B CN106385763 B CN 106385763B CN 201610872236 A CN201610872236 A CN 201610872236A CN 106385763 B CN106385763 B CN 106385763B
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- pin
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- arranged adjacent
- identical function
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Liquid Crystal (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
This application discloses a kind of flexible printed circuit board, to solve the problem of existing in the prior art how in the case where guaranteeing that the size of FPC is unlikely to excessive achieving the purpose that FPC impedance is made to be unlikely to excessively high.The flexible printed circuit board includes several pins, wherein is arranged on the flexible printed board in several pins, at least partly has between the pin of identical function and arranged adjacent without spacing.A kind of display, a kind of manufacturing method of flexible printed circuit board is also disclosed in the application.
Description
Technical field
This application involves flexible printed circuit board field more particularly to a kind of flexible printed circuit boards, display and flexibility
The production method of printed circuit.
Background technique
Flexible printed circuit board (Flexible Printed Circuit, FPC), also known as flexible circuit board are with poly-
Acid imide or polyester film etc. are substrate, and manufactured a kind of with height reliability, excellent flexible printed circuit.
Since FPC has the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good, it is widely used in intelligence at present
It can mobile phone, laptop, digital camera, display (such as liquid crystal display or OLED (Organic Light-Emitting
Diode, OLED) display) in.
For the application of FPC in the display, currently, display screen can be connected with the external circuit board by FPC.FPC
The mode of the connection type used between display screen, usually bonding (bonding).In actual scene, display screen and FPC
The schematic diagram being connected is as shown in Figure 1.
There are different types of pins such as signal pins (pin), power pins in bonding region, and different types of pin needs
Impedance it is different, industry common practice is to need low-impedance place, increases golden finger quantity.For example, increasing power supply (VDD)
The quantity of pin and ground connection (GND) pin, to achieve the purpose that reduce the impedance of FPC, but this meeting is so that the transverse width of FPC increases
Add.
As shown in Fig. 2, for the structural schematic diagram of a kind of FPC used in the prior art, in the figure, by by GND pin
Quantity increase to 8, the quantity of VDD pin is increased to 4, to reach the low-impedance purpose of drop, but this mode, is increased
The transverse width of FPC.
Currently, what kind of FPC it is unlikely that impedance can be reached in the case where guaranteeing that the size of FPC is unlikely to excessive using
In excessively high purpose, it is a problem to be solved.
Summary of the invention
The embodiment of the present application provides a kind of flexible printed circuit board, existing in the prior art how to guarantee solved
In the case that the size of FPC is unlikely to excessive, achieve the purpose that FPC impedance is made to be unlikely to the problem of excessively high.
The embodiment of the present application also provides a kind of display.
The embodiment of the present application also provides the production method and making apparatus of a kind of flexible printed circuit board, existing to solve
Present in technology how in the case where guaranteeing that the size of FPC is unlikely to excessive, reach the mesh for making FPC impedance be unlikely to excessively high
The problem of.
The embodiment of the present application adopts the following technical solutions:
A kind of flexible printed circuit board, including several pins are arranged on the flexible printed board in several pins,
At least partly have between the pin of identical function and arranged adjacent without spacing.
Optionally, the area of the pin at least partly having identical function and arranged adjacent, according to the expectation tool
The impedance that the pin of standby identical function and arranged adjacent has determines.
Optionally, the first longitudinal direction height of the pin at least partly having identical function and arranged adjacent meets:
So that according to the first longitudinal direction height, single pin transverse width and it is described at least partly have it is identical
The quantity of the pin of function and arranged adjacent, the calculated pin at least partly having identical function and arranged adjacent
Area, be equal to first setting area;
The first setting area, it is common according to the expectation pin at least partly having identical function and arranged adjacent
The impedance having determines.
Optionally, the quantity of the pin at least partly having identical function and arranged adjacent, according to single pin
For the pin at least partly having identical function and arranged adjacent to be arranged on transverse width and the flexible printed board
Region transverse width determine.
Optionally, on the flexible printed circuit board, except described at least partly have identical function and arranged adjacent
The second longitudinal direction height of other each pins outside pin meets:
So that being calculated according to the transverse width of single pin in the second longitudinal direction height and other described each pins
The single pin area, be equal to second setting area;
The second setting area is that the impedance being had according to the expectation single pin determines.
Optionally, the pin at least partly having identical function and arranged adjacent, including following at least one:
The power vd D pin of arranged adjacent;
It is grounded GND pin;
Operating voltage VC pin.
A kind of display, including display screen and flexible printed circuit board as described above;
The flexible printed circuit board is connected with the display screen using bonding mode.
A kind of manufacturing method of flexible printed circuit board, including:
According to making in several pins being arranged on the flexible printed board, at least partly has identical function and adjacent
Without the mode of spacing between the pin of arrangement, several pins are made.
Optionally, at least partly have the first area of the pin of identical function and arranged adjacent, it is described extremely according to expectation
The impedance that the pin that small part has identical function and arranged adjacent has determines.
Optionally, according to making at least partly have identical function in several pins being arranged on the flexible printed board
Mode without spacing between energy and the pin of arranged adjacent makes several pins, including:
In the manner described, and the first longitudinal direction height of setting, production is described at least partly to have identical function and phase
The pin of neighbour's arrangement, so that without spacing between the pin at least partly having identical function and arranged adjacent, and make
The longitudinal height at least partly having identical function and arranged adjacent described in obtaining is equal to the first longitudinal direction height;
The first longitudinal direction height is determined according to the transverse width of first area and single pin.
Optionally, its for removing the pin at least partly having identical function and arranged adjacent in several pins
The second area of his each pin is determined according to the impedance for it is expected that other described pins have.
Optionally, in the manner described, several pins are made, further include:
According to the second longitudinal direction height of setting, other described each pins are made, so that the longitudinal direction of other each pins
Height is equal to the second longitudinal direction height;
The second longitudinal direction height is determined according to the transverse width of single other pins and the second area.
It is optionally, described that at least partly to have identical function and the pin of arranged adjacent include following at least one:
The power vd D pin of arranged adjacent;The ground connection GND pin of arranged adjacent;The operating voltage VC pin of arranged adjacent;
Other described each pins, including signal pins.
At least one above-mentioned technical solution that the embodiment of the present application uses can reach following beneficial effect:
Due to having without spacing between the pin of identical function and arranged adjacent, not for identical function and arranged adjacent
It interspaces in advance between pin, that is, save space shared by the gap between the pin of identical function and arranged adjacent, therefore phase
For flexible printed circuit board as shown in Figure 2, even if keeping the quantity of GND pin and VDD pin constant, it can also subtract
Lack the size of FPC and does not increase impedance.As it can be seen that compared with the existing technology, scheme provided by the embodiments of the present application can guarantee
In the case that the size of FPC is unlikely to excessive, achieve the purpose that impedance is unlikely to excessively high.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is the schematic diagram that display screen is connected with FPC;
Fig. 2 is the structural schematic diagram of the FPC used in the prior art a kind of;
Fig. 3 is in the embodiment of the present application, and the spacing in each pin set between pin is 0 schematic diagram;
Fig. 4 is in the embodiment of the present application, without spacing between the pin in a part of pin set, and another part pin collection
There are the schematic diagrames of spacing between pin in conjunction;
Fig. 5 is in the embodiment of the present application, in same pin set, without spacing between some pin, and another part
There are the schematic diagrames of spacing between pin;
Fig. 6 is a kind of schematic diagram that can be used for the FPC of display screen bonding provided by the embodiments of the present application;
Fig. 7 is a kind of schematic diagram that can be used for the FPC of display screen bonding in the prior art;
Fig. 8 is a kind of schematic diagram for FPC that the embodiment of the present application 3 provides.
Specific embodiment
To keep the purposes, technical schemes and advantages of the application clearer, below in conjunction with the application specific embodiment and
Technical scheme is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the application one
Section Example, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall in the protection scope of this application.
Below in conjunction with attached drawing, the technical scheme provided by various embodiments of the present application will be described in detail.
Embodiment 1
Existing in the prior art how in the case where guaranteeing that the size of FPC is unlikely to excessive to solve, reaching makes FPC
Impedance is unlikely to the problem of excessively high purpose, and the embodiment of the present application provides a kind of FPC.
The FPC includes several pins, and several pins are arranged on FPC, the FPC's provided by the embodiments of the present application
It is mainly characterized by:Be arranged in several pins, have on flexible printed board identical function and arranged adjacent pin it
Between without spacing, i.e., spacing is 0.
In the embodiment of the present application, as long as function is identical and the pin of arranged adjacent, it can be considered as and constitute a pin collection
It closes.For example, each pin of each entitled " GND " in Fig. 2 is exactly function since their function is all ground connection
Identical pin;Each pin of entitled " VDD " is also that function is identical since their function is all connection power supply
Pin;And title be respectively " D0 ", " D1 " ..., the signal pins of " Dn-1 ", " Dn ", then since CLK can be separately connected
Line, control signal wire or DATA line, therefore they belong to the different pin of function.
For the dimension of pin set, in the embodiment of the present application, each pin collection that several pins can be constituted
In conjunction, spacing between pin all can be 0.As shown in figure 3, the spacing between pin is 0 in each pin set
Schematic diagram.
Alternatively, in each pin set that several pins can be constituted, can also only have one in the embodiment of the present application
Without spacing between pin in the pin set of part, and the spacing between the pin in another part pin set can not be 0
(there is spacing), but as the prior art as shown in Figure 2 distance away, as shown in Figure 4.FPC in Fig. 4
On, have between the pin in the pin set of part without spacing;And the spacing between the pin in some pin set is d1.
For the dimension of pin, in the embodiment of the present application, in same pin set, the spacing between all pins can
To be 0, as shown in Figure 3;Alternatively, in same pin set, without spacing between some pin, and another part pin it
Between spacing then not be 0, as shown in Figure 5.
Using FPC provided by the embodiments of the present application, due to having between the pin of identical function and arranged adjacent without spacing,
It does not interspace in advance between identical function and the pin of arranged adjacent, that is, save the pin of identical function and arranged adjacent
Between gap shared by space, therefore for FPC as shown in Figure 2, even if keeping GND pin and VDD pin
Quantity is constant, can also reduce the size of FPC and not increase impedance.As it can be seen that compared with the existing technology, the embodiment of the present application provides
Scheme can guarantee FPC size be unlikely to excessive in the case where, achieve the purpose that impedance is unlikely to excessively high.
Below in conjunction with reality, by the introduction to 2~embodiment of embodiment 4, illustrate that the embodiment of the present application provides scheme and exists
Application in the field FPC.
Embodiment 2
Embodiment 2 provides a kind of FPC that can be used for display screen bonding.As shown in fig. 6, the FPC provided for embodiment 2
Structural schematic diagram.
As shown in fig. 6, each pin that the FPC includes has respectively:GND pin, VDD pin, VCI pin, D1, D2 and D3
~Dn etc..
To keep attached drawing clarity, the pins such as D3~Dn are omitted in figure.In addition, the symbol "+" in figure, indicates contraposition note
Number (mark), the symbol "+" in other figures are also used to indicate that contraposition mark, repeat no more.
In the FPC shown in Fig. 6, between 4 GND pins of each arranged adjacent, gap, i.e. adjacent row is not present
It is apart 0 between 4 GND pins of column;Similar, between 4 VDD, gap is also not present, i.e. the 4 of arranged adjacent VDD draws
It is apart 0 between foot.And for arranged adjacent but have the pin of different function, for such as D1~Dn, then between them still
It so can be with d distance away.
The FPC shown in fig. 6 is based on a kind of FPC that can be used for display screen bonding as shown in Figure 7 in the prior art
The novel FPC of the one kind improved.Comparison diagram 6 and Fig. 7, it is available to draw a conclusion:
Assuming that the transverse width of the FPC shown in fig. 6 and each pin in the FPC shown in Fig. 7 is equal and is equal to w,
Gap if it exists between pin, then the distance in gap is equal to d.So, in the FPC shown in Fig. 7, if counting the 1st GND from left to right
Pin is to the transverse width A1 between D1 pin, transverse width A1=12w+11d.And in the FPC shown in fig. 6, if statistics
The 1st GND pin is to the transverse width A2 between D2 pin, transverse width A2=12w+4d from left to right.
As it can be seen that the transverse width of A2 reduces 7d for A1;Meanwhile the resistance relative to the FPC shown in Fig. 7
For anti-, the impedance of the FPC shown in fig. 6 becomes smaller there is no the reduction with transverse width.It can be seen that using the application
The scheme that embodiment provides can reach in terms of existing technologies in the case where guaranteeing that the size of FPC is unlikely to excessive
To the purpose for making FPC impedance be unlikely to excessively high.
Embodiment 3
Generally, may require that VDD pin, the impedance of GND pin are lower in practical applications --- for example, VDD pin and
The impedance of GND pin generally requires to be no more than 2 ohm;And for some signal pins, then do not require its impedance lower ---
For example, the impedance of individual signals pin within 100 ohm, can be seen as meeting the requirements.Therefore, if according to such as Fig. 2 or
The prior art as shown in Figure 7 highly sets identical as VDD pin, longitudinal height of GND pin for the longitudinal direction of signal pins
So that the impedance of signal pins reduces, be in fact less it is necessary to.
Based on above-mentioned analysis, embodiment 3 provides a kind of FPC.As shown in figure 8, the structure of the FPC provided for embodiment 3
Schematic diagram.
As shown in figure 8, each pin that the FPC includes has respectively:GND pin, VDD pin, VCI pin, D1, D2 and D3
~Dn etc..
Compared with FPC in the prior art as shown in Figure 2, in the FPC shown in Fig. 8, the longitudinal direction of each pin is highly
L2, and longitudinal height of each pin shown in Fig. 2 is L1.Relationship between L1 and L2, specially:L2=(4/7) L1.Cause
This, for the FPC shown in Fig. 2, the longitudinal direction of the FPC shown in Fig. 8 highly shortens.Due to the area and pin of pin
Generated impedance is negatively correlated, if the impedance of pin will increase it is therefore contemplated that longitudinal height of pin shortens, therefore,
In the embodiment of the present application, in order to guarantee that the impedance of VDD pin and GND pin not will increase, or excessive, Ke Yibian not will increase
Mutually increase the transverse width of VDD pin and GND pin, so that after the longitudinal direction of VDD pin and GND pin highly becomes larger, VDD
The area of pin and GND pin will not change, or will not vary widely.
Specifically, as shown in figure 8, being become by longitudinal height of FPC by L1 on the basis of FPC that can be shown in Fig. 2
While turning to L2, " golden finger " structure joined between 4 GND pins of arranged adjacent, being equivalent to draws 4 GND
Foot in a disguised form increases until there is no gaps between 4 GND pins.In other words, if each " golden finger " structure of addition is accordingly to be regarded as
GND pin is then the equal of having 7 GND pin arranged adjacents, and gap is not present between this 7 GND pins in Fig. 8.
Similarly, it compared with FPC as shown in Figure 2, between 4 VDD pins that the FPC shown in Fig. 8 includes, is also added
" golden finger " structure, being equivalent to increases 4 VDD pins in a disguised form until there is no gaps between 4 VDD pins, i.e., continuously
Away from.In other words, each " golden finger " structure of addition is accordingly to be regarded as VDD pin, is then the equal of there are 7 VDD pins adjacent in Fig. 8
Arrangement, and gap is not present between this 7 VDD pins, i.e., without spacing.
And for arranged adjacent but have the pin of different function, it, then still can be between them for such as D1~Dn
Distance away.
It should be noted that in the embodiment of the present application, L2=(4/7) L1 is properly termed as first longitudinal direction height.The application is real
It applies in example, the value of first longitudinal direction height, is the pin (GND as shown in Figure 8 for having identical function and arranged adjacent with expectation
Pin or VDD pin) impedance that has jointly is relevant.Specifically, expectation has the pin of identical function and arranged adjacent
The impedance having jointly is that the area common with the pin for having identical function and arranged adjacent is negatively correlated --- expectation
The impedance is smaller, then the area is bigger;Conversely, then the area is smaller.Therefore, can have according to expectation identical function and
The impedance that the pin of arranged adjacent has jointly, the determining area common with the pin for having identical function and arranged adjacent
(can be described as the first area), and then according to the single pin in the area, the pin for having identical function and arranged adjacent
Transverse width (such as d) and the pin for having identical function and arranged adjacent quantity, determine the first longitudinal direction height
Degree.Wherein, if assuming between the pin for having identical function and arranged adjacent described in requirement without spacing, the quantity=FPC
On it is laterally wide for the transverse width/single pin in the region of the pin for having identical function and arranged adjacent to be arranged
Degree.
Hereinafter, illustrating how to the area common according to the pin of standby identical function and arranged adjacent, and has phase
The transverse width of single pin in the pin of congenerous and arranged adjacent, determines first longitudinal direction height.
For example, the impedance that the VDD pin of 4 arranged adjacents of expectation has jointly is 2 ohm, then, if it is desired to single VDD
The corresponding area of pin is 0.08mm2Left and right, then according to the area, if VDD pin longitudinal direction height is 1mm, single VDD draws
The transverse width of foot can be 0.08mm.
Due to having different requirements for the impedance of pin in actual scene, this will lead to the area of pin in difference
There is different desired values under scene, so that the longitudinal height and transverse width of pin can answer scene and different, therefore, the application
Embodiment no longer carries out exhaustion.
The FPC shown in Fig. 8 and FPC shown in Fig. 2 are compared it is found that if 4 GND pins shown in assuming on the left of Fig. 2 are total
Be 2 ohm with the impedance generated, the transverse width of single pin is d, then, the impedance generated jointly due to GND pin with
The area of GND pin is negatively correlated, and on the left of Fig. 8 shown in the common area of GND pin be 7 × L2 × d=7 × (4/7) L1 × d
=4 × L1 × d.As it can be seen that GND pin shown on the left of the common area of 4 GND pins and Fig. 8 shown on the left of Fig. 2 is common
Area equation, therefore, the impedance that GND pin shown in the left side Fig. 8 generates jointly is also 2 ohm, does not increase impedance.
The area of the FPC shown in Fig. 8 and individual signals pin shown in Fig. 2 is compared it is found that in FPC shown in Fig. 8
The area of individual signals pin is M2=L2 × d=(4/7) L1 × d, that is to say, that the area change of individual signals pin in Fig. 8
Be the 4/7 of the area M1 of individual signals pin shown in Fig. 2, thus in Fig. 8 individual signals pin impedance, by 8 original Europe
Nurse (assumption value) changes as 8/ (4/7)=14 ohm.Due to the impedance of individual signals pin be within the scope of 100 ohm can
Receive, therefore, the structure of FPC shown in Fig. 8 still can satisfy the demand of practical application.
In the embodiment of the present application, longitudinal height of signal pins and VDD pin (or GND pin) in FPC shown in Fig. 8
It can be different.Specifically, longitudinal height of VDD pin (or GND pin) can be equal to previously described first longitudinal direction height,
And signal pins can then be equal to second longitudinal direction height.The second longitudinal direction height, for example first longitudinal direction height can be greater than, it can also
To be equal to first longitudinal direction height, or it is less than first longitudinal direction height.
Due to the impedance of signal pins, be it is negatively correlated with the area of signal pins, therefore, can be drawn according to desired signal
The impedance that foot has, determine signal pins area (can be described as second area) --- the impedance that desired signal pin has is small,
The area of signal pins is bigger;Conversely, then the area of signal pins is smaller.It in turn, can be according to the area and list determined
The transverse width (such as d) of a signal pins, determines the second longitudinal direction height.Specifically, second longitudinal direction height=individual signals
The area of pin/individual signals pin transverse width.
Embodiment 4
For inventive concept identical with Examples 1 to 3, the embodiment of the present application also provides a kind of display.The display
Specifically include any one novel FPC provided by the embodiments of the present application.In the display, which adopts with the display screen
It is connected with bonding mode.
Embodiment 5
Existing in the prior art how in the case where guaranteeing that the size of FPC is unlikely to excessive to solve, reaching makes FPC
Impedance is unlikely to the problem of excessively high purpose, and the embodiment of the present application also provides a kind of manufacturing method of flexible printed circuit board.It should
Method includes:According to making in several pins being arranged on the flexible printed board, have identical function and arranged adjacent
Mode (the rear referred to as described mode) between pin without spacing, makes several pins.
In one embodiment, can in the manner described, and the first longitudinal direction height of setting has described in production
The pin of identical function and arranged adjacent, so that having longitudinal height of the pin of identical function and arranged adjacent equal to described
First longitudinal direction height.
Wherein, the method for determination of first longitudinal direction height may refer in embodiment 3 for impedance, described have identical function
The related description of energy and the relationship of the area and first longitudinal direction height of the pin of arranged adjacent, details are not described herein again.
In one embodiment, in the manner described, several pins are made, can also include:
According to the second longitudinal direction height of setting, makes in several pins and have identical function and adjacent row except described
Other each pins of the pin of column, so that longitudinal height of other each pins is equal to the second longitudinal direction height.
Wherein, second longitudinal direction height mentioned here is the transverse width according to single pin in other described each pins
And it is expected the impedance determination that other described single pins have.Specifically how to determine that second longitudinal direction height may refer to implement
Associated description in example 3, details are not described herein again.
Using the manufacturing method of FPC provided by the embodiments of the present application, due to that can make have identical function and adjacent row
Without spacing between the pin of column, not to interspace in advance between the pin of identical function and arranged adjacent, that is, save identical function
Can and the pin of arranged adjacent between gap shared by space, therefore relative to flexible printed circuit board as shown in Figure 2 and
Speech can also reduce the size of FPC and not increase impedance even if keeping the quantity of GND pin and VDD pin constant.As it can be seen that phase
For the prior art, scheme provided by the embodiments of the present application can reach in the case where guaranteeing that the size of FPC is unlikely to excessive
Impedance is unlikely to excessively high purpose.
The above is only embodiments herein, are not intended to limit this application.To those skilled in the art,
Various changes and changes are possible in this application.It is all within the spirit and principles of the present application made by any modification, equivalent replacement,
Improve etc., it should be included within the scope of the claims of this application.
Claims (13)
1. a kind of flexible printed circuit board, including several pins, it is characterised in that:
It is arranged on the flexible printed circuit board in several pins, at least partly has identical function and arranged adjacent
Without spacing between pin.
2. flexible printed circuit board as described in claim 1, which is characterized in that described at least partly to have identical function and phase
The area of the pin of neighbour's arrangement, the impedance being had according to the pin at least partly having identical function and arranged adjacent described in expectation
It determines.
3. flexible printed circuit board as claimed in claim 2, which is characterized in that described at least partly to have identical function and phase
The first longitudinal direction height of the pin of neighbour's arrangement meets:
So that according to the first longitudinal direction height, single pin transverse width and described at least partly have identical function
And the quantity of the pin of arranged adjacent, the calculated pin at least partly having identical function and arranged adjacent face
Product is equal to the first setting area;
The first setting area has jointly according to the expectation pin at least partly having identical function and arranged adjacent
Impedance determine.
4. flexible printed circuit board as claimed in claim 3, which is characterized in that described at least partly to have identical function and phase
The quantity of the pin of neighbour's arrangement, according on the transverse width of single pin and the flexible printed circuit board for institute to be arranged
The transverse width at least partly having the region of pin of identical function and arranged adjacent is stated to determine.
5. flexible printed circuit board as claimed in claim 2, which is characterized in that it is on the flexible printed circuit board, remove institute
The second longitudinal direction height for stating other each pins outside the pin at least partly having identical function and arranged adjacent meets:
So that according to the transverse width of single pin in the second longitudinal direction height and other described each pins, calculated institute of institute
The area of single pin is stated, the second setting area is equal to;
The second setting area is that the impedance being had according to the expectation single pin determines.
6. flexible printed circuit board as described in claim 1, which is characterized in that described at least partly to have identical function and phase
The pin of neighbour's arrangement, including following at least one:
The power vd D pin of arranged adjacent;
It is grounded GND pin;
Operating voltage VC pin.
7. a kind of display, which is characterized in that the flexible printing electricity including display screen and as described in any claim of claim 1-6
Road plate;
The flexible printed circuit board is connected with the display screen using bonding mode.
8. a kind of manufacturing method of flexible printed circuit board, which is characterized in that including:
According to making in several pins being arranged on the flexible printed circuit board, at least partly has identical function and adjacent
Without the mode of spacing between the pin of arrangement, several pins are made.
9. method according to claim 8, which is characterized in that at least partly have the pin of identical function and arranged adjacent
First area is determined according to the impedance that the pin at least partly having identical function and arranged adjacent described in expectation has.
10. method as claimed in claim 9, which is characterized in that according to be arranged on the flexible printed circuit board
In several pins, at least partly have the mode between the pin of identical function and arranged adjacent without spacing, makes described several
Pin, including:
In the manner described, and the first longitudinal direction height of setting, production is described at least partly to have identical function and adjacent row
The pin of column, so that without spacing between the pin at least partly having identical function and arranged adjacent, and make institute
It states the longitudinal height at least partly having identical function and arranged adjacent and is equal to the first longitudinal direction height;
The first longitudinal direction height, according to first area, single pin transverse width and described at least partly have
The quantity of the pin of identical function and arranged adjacent determines.
11. method according to claim 8, which is characterized in that at least partly have phase except described in several pins
The second area of other each pins of the pin of congenerous and arranged adjacent, according to the impedance for it is expected that other described each pins have
It determines.
12. method as claimed in claim 11, which is characterized in that in the manner described, make several pins, also wrap
It includes:
According to the second longitudinal direction height of setting, other described each pins are made, so that longitudinal height of other each pins
Equal to the second longitudinal direction height;
The second longitudinal direction height is determined according to the transverse width of single other each pins and the second area.
13. method as claimed in claim 12, which is characterized in that described at least partly to have identical function and arranged adjacent
Pin includes following at least one:
The power vd D pin of arranged adjacent;The ground connection GND pin of arranged adjacent;The operating voltage VC pin of arranged adjacent;
Other described each pins, including signal pins.
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Citations (3)
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CN101030004A (en) * | 2007-04-24 | 2007-09-05 | 友达光电股份有限公司 | Wiring structure for coupling chip |
CN103077278A (en) * | 2013-01-06 | 2013-05-01 | 宁波大学 | Distribution method for power supply pins of voltage island in system on chip (SOC) |
CN104955269A (en) * | 2015-06-22 | 2015-09-30 | 安徽方兴科技股份有限公司 | FPC (Flexible Printed Circuit) golden finger |
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2016
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101030004A (en) * | 2007-04-24 | 2007-09-05 | 友达光电股份有限公司 | Wiring structure for coupling chip |
CN103077278A (en) * | 2013-01-06 | 2013-05-01 | 宁波大学 | Distribution method for power supply pins of voltage island in system on chip (SOC) |
CN104955269A (en) * | 2015-06-22 | 2015-09-30 | 安徽方兴科技股份有限公司 | FPC (Flexible Printed Circuit) golden finger |
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