CN106385653A - Bone conduction module and hearing device - Google Patents

Bone conduction module and hearing device Download PDF

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Publication number
CN106385653A
CN106385653A CN201611102348.7A CN201611102348A CN106385653A CN 106385653 A CN106385653 A CN 106385653A CN 201611102348 A CN201611102348 A CN 201611102348A CN 106385653 A CN106385653 A CN 106385653A
Authority
CN
China
Prior art keywords
bone conduction
substrate
conduction module
gasket
support frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611102348.7A
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Chinese (zh)
Inventor
丁耀民
赵程
王晓峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU PANT PIEZOELECTRIC TECH Co Ltd
Original Assignee
SUZHOU PANT PIEZOELECTRIC TECH Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU PANT PIEZOELECTRIC TECH Co Ltd filed Critical SUZHOU PANT PIEZOELECTRIC TECH Co Ltd
Priority to CN201611102348.7A priority Critical patent/CN106385653A/en
Publication of CN106385653A publication Critical patent/CN106385653A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091Details not provided for in groups H04R1/1008 - H04R1/1083
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)

Abstract

The invention provides a bone conduction module and a hearing device, relating to the bone conduction technology field. The bone conduction module comprises an upper pad, a lower pad a support; the support is provided with the upper pad; and the lower pad is arranged on the lower end of the support. The bone conduction module and the hearing device can transmit sound to a user through the bone conduction mode and utilize a bone vibration principle to transmit vibration to a skull and directly transmit the vibration to internal ear nerves through the skull without vibrating an eardrum, so that the ears are free without restriction. As a result, the bone conduction module and hearing device can avoid accidents caused by not hearing external voice, Meanwhile, through holes are formed on a substrate to reduce quality of the substrate so as to reduce air conduction sound pressure generated during vibration of a piezoelectric plate and improve amplitude. Because the bone conduction is adopted and the hearing device does not need the sound hole, the hearing device has a waterproof function.

Description

Bone conduction module and hearing device
Technical field
The present invention relates to bone conduction technology field, especially relate to a kind of bone conduction module and hearing device.
Background technology
Bone conduction is the conduction pattern that a kind of communication media using human skull as sound source body to realize sound.
Sound transmission has two ways, and one kind is aerial conduction, and abbreviation conductance is it is simply that utilize the principle of air vibration, sound Sound passes to tympanum, then passes to internal auricularis by tympanum.
Normal communication between people, major part is the principle using conductance, and people's one's voice in speech is passed to other In the ear of people.Most earphone and sonifer are all the products made using the principle of air vibration in the market.
Aerial conduction, it is necessary to the air vibration that causes sound using the tympanum in people's ear, sends ear to by tympanum The auricularis of piece inside.When because the age becomes big or pathological changes, during the tympanum hydraulic performance decline of people, people will be produced with audition barrier Hinder.
Another mode of sound transmission is exactly bone conduction, abbreviation bone conduction.
It utilizes the principle of bone vibration, vibration is passed on skull, by skull, is transferred directly to internal auricularis, Do not need the vibration of tympanum.
Conductance sound delivering path be " sound wave-auricle-external auditory meatus-tympanum-malleus-incus-stapes-vestibuli- Outward, endolymph-spiral organ of Corti-acoustic nerve-auditory center ".
Osteophony pathway is:" sound wave-skull-bony labyrinth-internal ear lymph fluid-spiral organ of Corti-acoustic nerve-is big Cortex auditory center ".
For the normal people for audition, when speaking, the sound oneself heard, is conductance and bone conduction in fact The result of the superposition of two kinds of sound transmission modes.Because the speed of bone conduction is faster than the speed of conductance, according to the volume spoken, The bone conduction finally heard is also different from the SOV of conductance.
Ossiphone does not have so-called " earphone " or earplug, the substitute is a shake that can produce vibration signal Swing device.By in the raised mastoid after being pressed on ear of oscillator, the vibrations of oscillator can cause the concussion of skull and by signal The advantage crossing external ear with middle ear ossiphone is just being that this is directly delivered to internal ear.
Content of the invention
It is an object of the invention to provide bone conduction module and hearing device, to solve the hearing device anti-noise of aerial conduction Sound ability, long-time big using affecting on audition, easy breed bacteria causes the technical problem of tympanum pathological changes.
The present invention provides a kind of bone conduction module, including Upper gasket, lower gasket and bracing frame;Support frame as described above is arranged There is support frame as described above, support frame as described above lower end is provided with described lower gasket;
It is provided with vibrating device in the cavity that described Upper gasket, support frame as described above and described lower gasket are formed;
Described vibrating device includes substrate and at least a piece of piezoelectric patches;Described substrate is arranged on described Upper gasket;
It is provided with the through hole that at least one can reduce conductance acoustic pressure on the substrate.
Further, the piezoelectric patches of described vibrating device is located on upper surface and/or the lower surface of described substrate.
Further, described substrate is provided with multiple through holes, and described through hole is arranged around described piezoelectric patches.
Further, support frame as described above or described lower gasket are provided with the wire guide passing through for connecting line.
Further, it is provided with the interior concave station for installing Upper gasket, described substrate setting inside support frame as described above upper end On described inner convex platform;Described Upper gasket is provided with the outer lug boss coincideing with inner convex platform.
Further, support frame as described above upper end is provided with described substrate, is provided with described Upper gasket on the substrate.
Further, described Upper gasket is provided with salient point;A diameter of 3-6mm of described salient point, highly for 0.3- 1.0mm.
Further, the thickness of described substrate and piezoelectric patches is than for 1/4-1.
Further, described lower gasket is provided with the noise reduction layer of noise reduction, noise reduction layer adopts acoustical cotton, polyester fiber Make Deng material.
The present invention also provides a kind of hearing device, using bone conduction module described above.
Bone conduction module and hearing device that the present invention provides, sound is passed to use by the mode being capable of bone conduction Person, using the principle of bone vibration, vibration is passed on the skull of oneself, by skull, is transferred directly to internal auricularis, no Need eardrum, so have by oneself in ears, two ears are completely without carrying the baby;This avoid because can't hear the external world Sound and the accident that causes;
It is provided with through hole on substrate simultaneously, the quality of substrate can be reduced, so can reduce piezoelectric patches and produce in vibration Raw conductance acoustic pressure simultaneously improves amplitude simultaneously;Due to adopting bone conduction;Sound hole is not needed, such hearing device tool on hearing device There is water-proof function.
Brief description
In order to be illustrated more clearly that the specific embodiment of the invention or technical scheme of the prior art, below will be to concrete In embodiment or description of the prior art the accompanying drawing of required use be briefly described it should be apparent that, below describe in Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not paying creative work Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the explosive view of bone conduction module provided in an embodiment of the present invention;
Fig. 2 is the axonometric chart of bone conduction module provided in an embodiment of the present invention;
Fig. 3 is the vertical section structure schematic diagram of bone conduction module shown in Fig. 2;
Fig. 4 is the structural representation of substrate in bone conduction module shown in Fig. 1.
Icon:100- bracing frame;101- wire guide;Concave station in 102-;200- Upper gasket;201- salient point;300- Lower gasket;301- noise reduction layer;400- piezoelectric patches;500- substrate;501- through hole.
Specific embodiment
Below in conjunction with accompanying drawing, technical scheme is clearly and completely described with the enforcement it is clear that described Example is a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill The every other embodiment that personnel are obtained under the premise of not making creative work, broadly falls into the scope of protection of the invention.
In describing the invention, it should be noted that term " " center ", " on ", D score, "left", "right", " vertical ", The orientation of instruction such as " level ", " interior ", " outward " or position relationship are based on orientation shown in the drawings or position relationship, merely to Be easy to describe the present invention and simplify description, rather than instruction or the hint device of indication or element must have specific orientation, With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.Additionally, term " first ", " second ", " the 3rd " is only used for describing purpose, and it is not intended that indicating or hint relative importance.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or is integrally connected;Can To be to be mechanically connected or electrical connection;Can be to be joined directly together it is also possible to be indirectly connected to by intermediary, Ke Yishi The connection of two element internals.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition Concrete meaning in invention.
Fig. 1 is the explosive view of bone conduction module provided in an embodiment of the present invention;Fig. 2 is that bone provided in an embodiment of the present invention passes The axonometric chart of guide module;Fig. 3 is the vertical section structure schematic diagram of bone conduction module shown in Fig. 2;Fig. 4 is bone conduction mould shown in Fig. 1 The structural representation of substrate in block.
As shown in Figure 1, Figure 2, Figure 3 shows, provide a kind of bone conduction module in the present invention, including Upper gasket 200, lower gasket 300 With bracing frame 100;Described Upper gasket 200 is provided with support frame as described above 100, arranges in support frame as described above 100 lower end State lower gasket 300;
It is provided with vibration dress in the cavity that described Upper gasket 200, support frame as described above 100 and described lower gasket 300 are formed Put;
Described vibrating device includes substrate 500 and at least a piece of piezoelectric patches 400;Described substrate 500 is arranged on described upper pad On piece 200;
The through hole 501 that at least one can reduce conductance acoustic pressure is provided with described substrate 500.
In the present embodiment, bracing frame 100 is cylindrical shape;On the opening of bracing frame 100 upper and lower ends, it is respectively arranged with Upper gasket 200 and lower gasket 300, Upper gasket 200 can with human contact, thus the vibration of piezoelectric patches 400 is passed to skull, Thus enabling a person to hear sound.
Piezoelectric patches 400 is piezoelectric ceramic piece;When alternating voltage puts on piezoelectric ceramics, will be with the change of voltage and frequency Change and produce mechanical vibration.On the other hand, when vibrating piezoelectric ceramics, then electric charge can be produced.Piezoelectric ceramic piece can be used as a kind of electricity Sub- pronunciation component, puts into piezoelectric ceramics dielectric material in the middle of two panels copper circular electrode, hands over when connecting on two plate electrodes During streaming audio signal, piezoelectric patches 400 can vibrate with signal frequency change, that is, produce corresponding sound.
When piezoelectric patches 400 drives substrate 500 vibration, the vibration of substrate 500 can produce conductance acoustic pressure in cavity; By through hole 501 is arranged on substrate 500, the conductance acoustic pressure producing in cavity can be reduced, reduce leakage sound, and can be lifted Amplitude, so can improve the definition of bone conduction.
Bracing frame 100 material can adopt plastics or rubber, and the height of bracing frame 100 is 1-9mm;Bracing frame 100 is When cylinder, Upper gasket 200 and lower gasket 300 are circle;When bracing frame 100 is polygonal, Upper gasket 200 with The shape of pad 300 is identical with the shape of bracing frame 100.
Substrate 500 can also be able to fasten for flexible fixation with the connection of bracing frame 100;Cavity internal vibration device with There is a certain distance between lower gasket 300;It is flexible contact between Upper gasket 200 and substrate 500 or piezoelectric patches 400.
On above-described embodiment basis further, described piezoelectric patches 400 is monolithic or biplate, described piezoelectric patches 400 It is located at respectively on upper surface and/or the lower surface of described substrate 500.When piezoelectric patches 400 is a piece of, piezoelectric patches is permissible It is arranged on the upper surface of substrate 500 it is also possible to be arranged on the lower surface of substrate 500;When piezoelectric patches 400 is two panels Wait, be respectively provided with substrate 500 upper and lower surface a piece of, two panels piezoelectric patches is connected by the way of electrical parallel;In two panels piezoelectric patches When applying an AC signal on 400 vibrating device, vibration will be produced, the driving voltage of this bone conduction module is 1- 100Vpp.
Piezoelectric patches 400 is single layer structure, can also be structure more than double-decker and bilayer.
On above-described embodiment basis, further, described substrate 500 is provided with multiple through holes 501, and described logical Hole 501 is arranged around described piezoelectric patches 400.
As shown in figure 4, multiple through holes 501 are had on substrate 500, shaking of substrate 500 so can be reduced to a greater extent The raw conductance acoustic pressure of movable property;In order that piezoelectric patches 400 can preferably be contacted with substrate 500, in piezoelectric patches 400 and substrate 500 The position of contact, substrate 500 is intact, does not have through hole 501.
Substrate 500 material can be using metal, carbon fiber, glass fibre, Reinforced structure pottery and plastics.
On above-described embodiment basis, further, support frame as described above 100 or described lower gasket 300 are provided with use The wire guide 101 passing through in connecting line.
As shown in figure 3, being provided with the wire guide 101 that connecting line passes through on bracing frame 100, connecting line is from wire guide 101 Pass through and be connected with vibrating device later;Connecting line is two, connects with the positive and negative electrode of piezoelectric patches 400 respectively.
Crammed using glue in wire guide 101, so whole bone conduction module has good water proofing property.
Wire guide 101 can also be arranged on lower gasket 300, and the effect of wire guide 101 is the through hole for connecting line 501, it is arranged on position as shown in Figure 3, facilitate the production of bracing frame 100.
On above-described embodiment basis, further, support frame as described above 100 is provided with for installing pad inside upper end The interior concave station 102 of piece 200, described substrate 500 is arranged on described inner convex platform;Described Upper gasket 200 is provided with and inner convex platform kiss The outer lug boss closed.
As Fig. 3, a depressed part is provided with bracing frame 100, a lobe is provided with Upper gasket 200;On Lobe on pad 200 can be coincide with the depressed part of bracing frame 100;Or lobe is set on bracing frame 100, upper Depressed part is arranged on pad 200;The connection of so Upper gasket 200 and bracing frame 100.
There is an annular interior concave station 102 on bracing frame 100 top, Upper gasket 200 has one can with annular in The outer lug boss that concave station 102 coincide;The edge of substrate is contacted with interior concave station 102, and the outer lug boss of Upper gasket 200 is just by the side of substrate Edge is fixed on interior concave station 102.Such connection, makes bracing frame 100, substrate and Upper gasket 200 form the company of more firm stable Connect.
On above-described embodiment basis, further, support frame as described above 100 upper end is provided with described substrate 500, in institute State and described Upper gasket 200 is provided with substrate 500.
In the present embodiment, bracing frame 100 upper end installation base plate 500, substrate 500 is installed Upper gasket 200;Upper gasket 200 are not contacted with bracing frame 100, by this way bracing frame 100, substrate and Upper gasket 200 link together.
The edge of substrate is provided with inner groovy;When producing, facilitate the production of substrate, improve the production effect of substrate Rate.
On above-described embodiment basis, further, described Upper gasket 200 is provided with salient point 201;Described salient point 201 a diameter of 3-6mm, highly for 0.3-1.0mm.
As shown in figure 3, salient point 201 is on Upper gasket 200, directly can contact with skull, be achieved in passing sound Pass people.The material of salient point 201 can be plastics or rubber.
One panel can also be arranged on salient point 201, contacted with the skull of human body by panel;Such as in Upper gasket The panel of one silica gel material is set on 200.
Salient point 201 is located at the home position of Upper gasket 200;General Upper gasket 200 is circle, if adopting other shapes, It is arranged on the center of Upper gasket 200.
On above-described embodiment basis, further, the thickness of described substrate and piezoelectric patches 400 ratio is for 1/4-1.
The thickness ratio of substrate and piezoelectric patches 400 controls between 1/4 to 1 times, such scope, piezoelectric patches 400 and substrate The vibrating device being formed has more preferable vibrating effect.
On above-described embodiment basis, further, described lower gasket 300 is provided with the noise reduction layer of noise reduction 301.
As shown in figure 1, there being noise reduction layer 301 on lower gasket 300, noise reduction layer 301 is polyester fiber or acoustical cotton;In substrate The air borne sound producing when vibration presses to noise reduction layer 301 and propagates, and is absorbed by noise reduction layer 301, so can improve sound transmission Quality.
Noise reduction layer 301 is the shape matching with bracing frame 100 internal cavity, so when lower gasket 300 is pacified with bracing frame 100 When dress, the conductance sound pressure energy in cavity is enough all contacted with noise reduction layer 301, plays more preferable erasure effect, improves entirety Tonequality.
The present invention also provides a kind of hearing device, becomes hearing device using bone conduction modular manufacture described above.
Hearing device can be bone conduction earphone, and bone conduction earphone includes head hoop, earphone cord, has plug on earphone cord;? Adjusting means is had on head hoop, adjusting means can on have switch;Also include pcb board, mike and accumulator etc..
Bone conduction module can be applied convenient in sonifer and earphone etc., thus realizing bone conduction earphone and bone conduction hearing aid The production of device;Using earphone and the sonifer of bone conduction, noise can be reduced;Because aerial conduction, can be all of sound around Sound is all sent to internal ear by tympanum, and bone conduction is only transferred directly to internal ear oneself sound to be listened by skull.
Using the hearing device of bone conduction, there is excellent water resistance, long-time use will not be because of sweat or rainwater The reason machinery is caused damage;The earphone of bone conduction does not have sound hole, and such water is just not easily accessible in earphone.
The hearing device of bone conduction is not necessary in the ear put into people, has very much side to the health safeguarded within ear Help;Conventional earphone puts the ear of people into, air bound in ear, and the sweat volatilization of secretion is not gone out, and time length can be grown Antibacterial, causes tympanum pathological changes, thus audition can constantly decline.
In addition, conventional earphone can be damaged to the cranial nerve and auditory nerve of people by electromagnetic wave, and bone conduction earphone, Do not produce electromagnetic wave, simultaneously bone conduction earphone smooth surface, easily clean, and traditional conductance earphone inside easily deposits antibacterial.
Bone conduction module and hearing device that the present invention provides, sound is passed to use by the mode being capable of bone conduction Person, using the principle of bone vibration, vibration is passed on the skull of oneself, by skull, is transferred directly to internal auricularis, no Need eardrum, so have by oneself in ears, two ears are completely without carrying the baby;This avoid because can't hear the external world Sound and the accident that causes;
It is provided with through hole 501 on substrate 500 simultaneously, the quality of substrate 500 can be reduced, so can reduce piezoelectric patches The 400 conductance acoustic pressures producing in vibration simultaneously improve amplitude simultaneously;Due to adopting bone conduction;Sound hole is not needed on hearing device, So hearing device has water-proof function.
Finally it should be noted that:Various embodiments above only in order to technical scheme to be described, is not intended to limit;To the greatest extent Pipe has been described in detail to the present invention with reference to foregoing embodiments, it will be understood by those within the art that:Its according to So the technical scheme described in foregoing embodiments can be modified, or wherein some or all of technical characteristic is entered Row equivalent;And these modifications or replacement, do not make the essence of appropriate technical solution depart from various embodiments of the present invention technology The scope of scheme.

Claims (10)

1. a kind of bone conduction module is it is characterised in that include Upper gasket, lower gasket and bracing frame;Support frame as described above is arranged There is described Upper gasket, support frame as described above lower end is provided with described lower gasket;
It is provided with vibrating device in the cavity that described Upper gasket, support frame as described above and described lower gasket are formed;
Described vibrating device includes substrate and at least a piece of piezoelectric patches;Described substrate is arranged on support frame as described above;
It is provided with the through hole that at least one can reduce conductance acoustic pressure on the substrate.
2. bone conduction module according to claim 1 is it is characterised in that the piezoelectric patches of described vibrating device is located at described base On the upper surface of plate and/or lower surface.
3. bone conduction module according to claim 2 is it is characterised in that be provided with multiple through holes on described substrate, and institute State through hole to arrange around described piezoelectric patches.
4. bone conduction module according to claim 1 is it is characterised in that be provided with support frame as described above or described lower gasket The wire guide passing through for connecting line.
5. bone conduction module according to claim 1 is it is characterised in that be provided with for pacifying inside support frame as described above upper end Load onto the interior concave station of pad, described substrate is arranged on described inner convex platform;Described Upper gasket is provided with outer with what inner convex platform coincide Boss.
6. bone conduction module according to claim 1 is it is characterised in that support frame as described above upper end is provided with described substrate, It is provided with described Upper gasket on the substrate.
7. bone conduction module according to claim 1 is it is characterised in that be provided with salient point on described Upper gasket;Described convex A diameter of 3-6mm of point, highly for 0.3-1.0mm.
8. bone conduction module according to claim 1 is it is characterised in that the thickness of described substrate and piezoelectric patches is than for 1/ 4-1.
9. the bone conduction module according to any one of claim 1-8 is it is characterised in that be provided with energy on described lower gasket The noise reduction layer of enough noise reductions.
10. a kind of hearing device is it is characterised in that adopt the bone conduction module described in any one of claim 1-9.
CN201611102348.7A 2016-12-05 2016-12-05 Bone conduction module and hearing device Pending CN106385653A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107801114A (en) * 2017-02-10 2018-03-13 深圳市启元数码科技有限公司 A kind of waterproof bone conduction earphone and its waterproof sealing method
CN108712699A (en) * 2018-06-20 2018-10-26 昆山快乐岛运动电子科技有限公司 High tone quality osteoacusis water-proof earplug
CN109061904A (en) * 2018-09-29 2018-12-21 深圳前海格物致知科技有限公司 A kind of intelligent glasses
CN109547911A (en) * 2018-12-05 2019-03-29 常州波速传感器有限公司 Orient the ultrasonic wave mould group of sounding
CN109640205A (en) * 2018-12-07 2019-04-16 深圳朗凡创新科技有限公司 A kind of rubber vibrating diaphragm applied to osteoacusis sounding device
CN111031426A (en) * 2019-12-12 2020-04-17 东莞市高坚电子科技有限公司 Earphone waterproof construction and bone conduction earphone

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002025989A1 (en) * 2000-09-21 2002-03-28 Han Sung Chan Subminiature bone conduction speaker
CN102685284A (en) * 2011-03-17 2012-09-19 宏达国际电子股份有限公司 Electronic device
CN103929702A (en) * 2014-04-17 2014-07-16 北京信息科技大学 Double-piezoelectric-type bone conduction auditory device based on displacement amplification
CN206237575U (en) * 2016-12-05 2017-06-09 苏州攀特电陶科技股份有限公司 Osteoacusis module and hearing device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002025989A1 (en) * 2000-09-21 2002-03-28 Han Sung Chan Subminiature bone conduction speaker
CN102685284A (en) * 2011-03-17 2012-09-19 宏达国际电子股份有限公司 Electronic device
CN103929702A (en) * 2014-04-17 2014-07-16 北京信息科技大学 Double-piezoelectric-type bone conduction auditory device based on displacement amplification
CN206237575U (en) * 2016-12-05 2017-06-09 苏州攀特电陶科技股份有限公司 Osteoacusis module and hearing device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107801114A (en) * 2017-02-10 2018-03-13 深圳市启元数码科技有限公司 A kind of waterproof bone conduction earphone and its waterproof sealing method
CN107801114B (en) * 2017-02-10 2023-06-16 深圳市启元数码科技有限公司 Waterproof bone conduction earphone and waterproof sealing method thereof
CN108712699A (en) * 2018-06-20 2018-10-26 昆山快乐岛运动电子科技有限公司 High tone quality osteoacusis water-proof earplug
CN109061904A (en) * 2018-09-29 2018-12-21 深圳前海格物致知科技有限公司 A kind of intelligent glasses
CN109547911A (en) * 2018-12-05 2019-03-29 常州波速传感器有限公司 Orient the ultrasonic wave mould group of sounding
CN109640205A (en) * 2018-12-07 2019-04-16 深圳朗凡创新科技有限公司 A kind of rubber vibrating diaphragm applied to osteoacusis sounding device
CN111031426A (en) * 2019-12-12 2020-04-17 东莞市高坚电子科技有限公司 Earphone waterproof construction and bone conduction earphone
CN111031426B (en) * 2019-12-12 2023-11-14 东莞市高坚电子科技有限公司 Bone conduction earphone with waterproof construction

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