CN106375924B - Promote the method, apparatus and system of MEMS microphone package yield rate - Google Patents
Promote the method, apparatus and system of MEMS microphone package yield rate Download PDFInfo
- Publication number
- CN106375924B CN106375924B CN201610780932.1A CN201610780932A CN106375924B CN 106375924 B CN106375924 B CN 106375924B CN 201610780932 A CN201610780932 A CN 201610780932A CN 106375924 B CN106375924 B CN 106375924B
- Authority
- CN
- China
- Prior art keywords
- chip
- mems
- testing result
- silicon chip
- location information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 55
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 55
- 239000010703 silicon Substances 0.000 claims abstract description 55
- 238000012360 testing method Methods 0.000 claims abstract description 51
- 230000035945 sensitivity Effects 0.000 claims abstract description 50
- 238000005538 encapsulation Methods 0.000 claims abstract description 24
- 230000001737 promoting effect Effects 0.000 claims abstract description 15
- 230000007547 defect Effects 0.000 claims abstract description 11
- 238000001514 detection method Methods 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 4
- 238000012797 qualification Methods 0.000 claims description 4
- 238000003860 storage Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 11
- 230000006870 function Effects 0.000 description 10
- 238000012545 processing Methods 0.000 description 9
- 238000007689 inspection Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000004590 computer program Methods 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 241001269238 Data Species 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 231100000768 Toxicity label Toxicity 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R29/00—Monitoring arrangements; Testing arrangements
- H04R29/004—Monitoring arrangements; Testing arrangements for microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
Abstract
The invention discloses a kind of method, apparatus and system for promoting MEMS microphone package yield rate, this method comprises: recording the location information of all MEMS chips on silicon chip；It obtains and the testing result that open defect detects is carried out to the MEMS chip on silicon chip；It obtains and obtained original sensitivities is electrically measured to the MEMS chip progress on silicon chip；It is formed such that testing result, original sensitivities encapsulation record corresponding with location information；It is recorded according to encapsulation, the MEMS chip on position for selecting testing result and original sensitivities qualified is as MEMS chip to be packaged；Matched dedicated IC chip is selected according to the original sensitivities of MEMS chip to be packaged, forms the chip portfolio information being packaged.
Description
Technical field
The present invention relates to electro-acoustic product technical fields, more particularly it relates to a kind of promotion MEMS microphone package
The method, apparatus and system of yield rate.
Background technique
MEMS microphone refers to the microphone products processed with MEMS technology, is also referred to as silicon microphone.MEMS
Microphone includes MEMS chip and application-specific integrated circuit (ASIC) chip two parts, two chips be encapsulated in one by PCB and metal outside
In the SMD surface mount device of shell combination.MEMS chip includes the backplane and a piece of elastic silicon fiml of silicon materials production, is being received
When to sound signal (acoustic pressure), will so that corresponding deformation occurs for elastic silicon fiml, and therefore change elastic silicon fiml and backplane it
Between spacing, and then acoustic pressure is converted into corresponding capacitance variation amount.Dedicated IC chip is sensed for detecting MEMS chip
Capacitance variation amount, and be converted into output of the electric signal as MEMS microphone.
Structure composition based on MEMS microphone, influencing its key factor for encapsulating yield rate includes: lacking for MEMS chip
Fall into control (defect control), MEMS chip original sensitivities (raw sensitivity) and MEMS chip with it is dedicated
The matching of IC chip.Currently, the encapsulation for MEMS microphone, the powder injection molding for only having carried out MEMS chip substantially (is referred specifically to
Open defect), due to influencing MEMS chip encapsulation yield rate, there are also other two very crucial factors, so, MEMS Mike
The encapsulation yield rate of wind still can be promoted further.
Summary of the invention
It is an object of the present invention to provide a kind of new technical solutions for promoting MEMS microphone package yield rate.
According to the first aspect of the invention, a kind of method for promoting MEMS microphone package yield rate is provided comprising:
Record the location information of all MEMS chips on silicon chip；
It obtains and the testing result that automatic optics inspection obtains is carried out to the MEMS chip on the silicon chip；
It obtains and obtained original sensitivities is electrically measured to the MEMS chip progress on the silicon chip；
It is formed such that testing result, original sensitivities encapsulation record corresponding with location information；
Recorded according to the encapsulation, select MEMS chip on testing result and the original sensitivities position of qualification as
MEMS chip to be packaged；
According to the original sensitivities of the MEMS chip to be packaged matched dedicated IC chip is selected, is formed and be packaged
Chip portfolio information.
Optionally, the method also includes:
According to obtained original sensitivities, MEMS chips all on the silicon chip are divided into different chipsets,
In, the MEMS chip of same chip group is arranged to match the dedicated IC chip of identical gain, and the MEMS core of different chipsets
Piece is arranged to match the dedicated IC chip of different gains.
Optionally, the method also includes:
Generation location information wafer figure corresponding with chipset is carried out to all MEMS chips on the silicon chip to show
Show control, wherein each chipset is arranged to that display is marked by different wafer figures.
Optionally, the method also includes:
All MEMS chips on the silicon chip are carried out to generate location information wafer figure corresponding with testing result
Display control, wherein all kinds of testing results are arranged to show by the label that same wafer figure is distinguished.
According to the second aspect of the invention, a kind of device for promoting MEMS microphone package yield rate is provided comprising:
For recording the module of the location information of all MEMS chips on silicon chip；
For obtaining the module for carrying out the testing result that automatic optics inspection obtains to the MEMS chip on the silicon chip；
For obtaining the module for carrying out electrically measuring obtained original sensitivities to the MEMS chip on the silicon chip；
It is used to form the module so that testing result, original sensitivities encapsulation record corresponding with location information；
For being recorded according to the encapsulation, the MEMS core on position for selecting testing result and original sensitivities qualified
Module of the piece as MEMS chip to be packaged；
For selecting matched dedicated IC chip according to the original sensitivities of the MEMS chip to be packaged, formation is sealed
The module of the chip portfolio information of dress.
Optionally, described device further include: for will own on the silicon chip according to obtained original sensitivities
MEMS chip is divided into the module of different chipsets, wherein the MEMS chip of same chip group is arranged to match identical increasing
The dedicated IC chip of benefit, and the MEMS chip of different chipsets is arranged to match the dedicated IC chip of different gains.
Optionally, described device further include: generate position letter for carrying out to all MEMS chips on the silicon chip
Cease the module of the display control of wafer figure corresponding with chipset, wherein each chipset is arranged to through different crystalline substances
Display is marked in circle diagram.
Optionally, described device further include: generate position letter for carrying out to all MEMS chips on the silicon chip
Cease the module of the display control of wafer figure corresponding with testing result, wherein all kinds of testing results are arranged to by same
The label that wafer figure is distinguished is shown.
According to a third aspect of the present invention, a kind of device for promoting MEMS microphone package yield rate, including storage are provided
Device and processor, for storing instruction, described instruction is operated for controlling the processor to execute root the memory
According to method described in first aspect present invention.
According to a fourth aspect of the present invention, a kind of system for promoting MEMS microphone package yield rate is provided comprising:
Automatic optical detection device for carrying out open defect detection to the MEMS chip on silicon chip, and provides detection
As a result；
CV test device, for carrying out electrical measurement to the MEMS chip on silicon chip, with the determination MEMS chip
Original sensitivities；
According to a second aspect of the present invention or the device of promotion MEMS microphone package yield rate described in the third aspect；With
And
Display device, the data provided for showing the device for promoting MEMS microphone package yield rate, the data are extremely
It less include chip portfolio information.
A beneficial effect of the invention is that the method for the present invention, apparatus and system pass through to influence MEMS microphone envelope
Three key factors of dress yield rate are intervened, and the encapsulation yield rate of MES microphone is effectively increased.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even
With its explanation together principle for explaining the present invention.
Fig. 1 is the flow chart that a kind of embodiment of method of MEMS microphone package yield rate is promoted according to the present invention；
Fig. 2 is the square frame principle that a kind of embodiment of device of MEMS microphone package yield rate is promoted according to the present invention
Figure；
Fig. 3 is that the box for the another embodiment of device that MEMS microphone package yield rate is promoted according to the present invention is former
Reason figure；
Fig. 4 is the square frame principle that a kind of embodiment of system of MEMS microphone package yield rate is promoted according to the present invention
Figure；
Fig. 5 is a form of wafer figure that testing result is marked.
Fig. 6 is a form of wafer figure that chipset is marked.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
Fig. 1 is a kind of flow chart of the embodiment according to the present invention for promoting MEMS microphone package yield rate.According to
Shown in Fig. 1, the method for the present invention includes the following steps:
Step S101 records the location information of all MEMS chips on silicon chip.
More MEMS chip, such as thousands of, even up to ten thousand MEMS chips are usually formed on one piece of silicon chip, most
Eventually by cutting the individual chip individual of molding.
The silicon chip is, for example, circle, and each MEMS chip is arranged according to certain rules on a silicon substrate, such as embark on journey,
It arranges in column, and line space is equal and column pitch is equal, in another example arranging at circular array, therefore, each MEMS chip is in silicon substrate
On piece has determining position, and corresponding location information can be row, column array etc. according to arrangement mode.
Therefore, record silicon chip on all MEMS chips location information can according to silicon chip specification and MEMS chip
The location information of arrangement mode load on a silicon substrate, to refer to the MEMS chip on corresponding position by location information.
Step S102 is obtained and is carried out the testing result that open defect detects to the MEMS chip on institute's silicon chip.
The open defect has damaged, chip deforms, cleannes are not up to standard etc. for example including chip.The detection can manually be seen
The typing for completing and manually completing by input unit testing result is examined, automatic optics inspection (Automated can also be passed through
Optical Inspection, AOI) device replaces the artificial open defect for searching chip, and generates testing result.
After obtaining testing result, the wafer figure of the testing result of display reflection each position MEMS chip can be passed through
(wafer Map) provides intuitive judgement, in this way, the method for the present invention can also include: to MEMS chips all on silicon chip into
Row generates the step of display control of location information wafer figure corresponding with testing result, wherein all kinds of testing results are set
It is set to and is shown by the label that same wafer figure is distinguished, such as display is marked by green in normal chip, it is abnormal
Display is marked in the usual red of chip, but also also can carry out phase region to different types of abnormal chips according to testing result
Other label display.
Fig. 5 is the black and white pattern that the wafer figure of corresponding testing result label is shown on MEMS chip position, MEMS
Chip is covered with the entire border circular areas of pattern, and stain shown in pattern is abnormal chips position, and normal chip is at this
It is invisible in black and white pattern.
Step S102 is obtained and is electrically measured obtained original sensitivities to the MEMS chip progress on silicon chip.
Electrical property measurement can be carried out by CV tester, can characterize the original of corresponding chip according to the result electrically measured
Sensitivity.The CV test refers specifically to capacitor voltage characteristic test, in the case where applying identical voltage under, the variable quantity of capacitance
Bigger, then original sensitivities are higher, therefore, can characterize original sensitivities by the variable quantity of capacitance.
Here, different original sensitivities ranges should match the dedicated IC chip of different gains according to encapsulation requirement, therefore,
It is same chip group that the MEMS chip that can will match identical dedicated IC chip, which is denoted as, i.e. the MEMS chip quilt of same chip group
It is configured to the dedicated IC chip of matching identical gain, and the MEMS chip of different chipsets is arranged to match different gains
Dedicated IC chip.
After the original sensitivities for obtaining MEMS chip, the original sensitive of display reflection each position MEMS chip can be passed through
The wafer figure of degree provides intuitive judgement, in this way, the method for the present invention can also include: to carry out to MEMS chips all on silicon chip
The step of generating the display control of location information wafer figure corresponding with chipset, wherein each chipset is arranged to logical
It crosses different wafer figures and display is marked, i.e., only label shows the MEMS chip of same chip group, example in a wafer figure
Such as the position where showing the MEMS chip of corresponding chipset by red-label in wafer figure.
Fig. 6 is the black and white pattern that a wafer figure of corresponding chip group echo is shown on MEMS chip position, pattern
Shown in stain be corresponding chipset MEMS chip position.
Step S103 is formed such that the encapsulation corresponding with location information of testing result, original sensitivities records, i.e., every
Record includes the original of location information, the testing result of MEMS chip on corresponding position and the MEMS chip on corresponding position
Sensitivity.The record can be for example tabular form, chain sheet form etc..
Step S104 selects the MEMS on testing result and the original sensitivities position of qualification according to packaged record
Chip is as MEMS chip to be packaged.
Here, the normal range (NR) screening original sensitivities qualification of the original sensitivities limited can be required according to encapsulation
MEMS chip.
Step S105 selects matched dedicated IC chip according to the original sensitivities of MEMS chip to be packaged, is formed and carried out
The chip portfolio information of encapsulation.
The step is specially to be required according to encapsulation, and gain and the original sensitivities of MEMS chip to be packaged is selected to match
Dedicated IC chip.
For the embodiment of above-mentioned division chipset, which can select a MEMS to be packaged in a chipset
Chip carries out the matching of dedicated IC chip, and then forms the chip portfolio information of all MEMS chips to be packaged in the chipset.
Here, the dedicated IC chip of every money gain is only capable of and same chip group for the dedicated IC chip of single gain
MEMS chip to be packaged matches, therefore, it is necessary to prepare the dedicated IC chip of a plurality of gains according to chip portfolio information, with matching
The MEMS chip to be packaged of different chipsets.And for the dedicated IC chip with calibration function, (calibration function can be biasing
Voltage and/or gain calibration), then large range of original sensitivities can be matched by the calibration to dedicated IC chip, i.e.,
With two chipsets, even more chipsets.
In this way, completing the envelope of MEMS chip to be packaged with corresponding dedicated IC chip according to the requirement of the chip portfolio information
Dress can control three key factors for influencing encapsulation yield rate, so that encapsulation yield rate is greatly improved.
The present invention also provides a kind of device for promoting MEMS microphone package yield rate, Fig. 2 is one kind of this kind of device
The frame principle figure of embodiment.
According to Fig.2, which includes the location information for recording all MEMS chips on silicon chip
Module 201；For obtaining the module for carrying out the testing result that automatic optics inspection obtains to the MEMS chip on silicon chip
202；For obtaining the module 203 for carrying out electrically measuring obtained original sensitivities to the MEMS chip on silicon chip；For shape
At the module 204 for making testing result, original sensitivities encapsulation record corresponding with location information；For being remembered according to encapsulation
Record, module of the MEMS chip on position for selecting testing result and original sensitivities qualified as MEMS chip to be packaged
205；And for selecting matched dedicated IC chip according to the original sensitivities of MEMS chip to be packaged, formation is packaged
Chip portfolio information module 206.
The device 200 can further include the original sensitivities obtained for basis, by MEMS all on silicon chip
Chip is divided into the module (not shown) of different chipsets, wherein the MEMS chip of same chip group is arranged to
Dedicated IC chip with identical gain, and the MEMS chip of different chipsets is arranged to match the application-specific integrated circuit core of different gains
Piece.
The device 200 can further include for MEMS chips all on silicon chip carry out generate location information with
The module (not shown) of the display control of the corresponding wafer figure of chipset, wherein each chipset is arranged to pass through
Display is marked in different wafer figures.
The device 200 can further include for MEMS chips all on silicon chip carry out generate location information with
The module (not shown) of the display control of the corresponding wafer figure of testing result, wherein all kinds of testing results are arranged to
It is shown by the label that same wafer figure is distinguished.
Fig. 3 is the frame principle figure of the another embodiment of the device.According to Fig.3, which includes storage
Device 301 and processor 302, for storing instruction, instruction is operated for control processor 302 to execute root memory 301
According to the method for promotion MEMS microphone package yield rate of the invention.
The device 300 can further include input unit 304, communication device 306, interface arrangement 303 and display dress
Set 305 etc..Wherein, communication device 306 has for example been able to carry out wired or wireless communication, includes testing result and original to obtain
Various data including sensitivity, and/or send the various data including chip portfolio information.Interface arrangement 303 is for example
Including USB interface, RS232 interface, RS485 interface, network interface etc..Input unit 304 such as may include touch screen, key,
To input various information, such as location information.Display device 305 is, for example, liquid crystal display, touch display screen etc., to show core
Piece combined information, various wafer figures etc..Although multiple devices are shown in FIG. 3, apparatus of the present invention 300 can be related to only
And partial devices therein, for example, processor 301, memory 302 etc..
The present invention also provides a kind of system for promoting MEMS microphone package yield rate, Fig. 4 is a kind of reality of the system
Apply the frame principle figure of mode.According to Fig.4, which includes automatic optical detection device 401, CV test device
402, device 200 or 300, display device 403.Wherein, automatic optical detection device 401 is used for the MEMS chip on silicon chip
Open defect detection is carried out, and testing result is provided；CV test device 402 is used to carry out electrically the MEMS chip on silicon chip
Measurement, to determine the original sensitivities of MEMS chip；Device 200 or 300 is used for according to the testing result of MEMS chip and original
Sensitivity obtains chip portfolio information；Display device 403 is used for the data that display device 200 or 300 provides, and the data are at least
Including chip portfolio information, to indicate that operator completes the encapsulation of MEMS microphone.
The difference of the various embodiments described above primary focus description and other embodiments, but those skilled in the art should be clear
Chu, the various embodiments described above can according to need exclusive use or are combined with each other.
All the embodiments in this specification are described in a progressive manner, same and similar portion between each embodiment
Divide cross-reference, each embodiment focuses on the differences from other embodiments, but those skilled in the art
Member is it should be understood that the various embodiments described above can according to need exclusive use or be combined with each other.In addition, for dress
It sets, for the embodiment of system, since it is corresponding with embodiment of the method, so describe fairly simple, related place ginseng
See the explanation of the corresponding part of embodiment of the method.The apparatus embodiments described above are merely exemplary, wherein making
It may or may not be physically separated for the module of separate part description.
The present invention can be device, method and/or computer program product.Computer program product may include computer
Readable storage medium storing program for executing, containing for making processor realize the computer-readable program instructions of various aspects of the invention.
Computer readable storage medium, which can be, can keep and store the tangible of the instruction used by instruction execution equipment
Equipment.Computer readable storage medium for example can be-- but it is not limited to-- storage device electric, magnetic storage apparatus, optical storage
Equipment, electric magnetic storage apparatus, semiconductor memory apparatus or above-mentioned any appropriate combination.Computer readable storage medium
More specific example (non exhaustive list) includes: portable computer diskette, hard disk, random access memory (RAM), read-only deposits
It is reservoir (ROM), erasable programmable read only memory (EPROM or flash memory), static random access memory (SRAM), portable
Compact disk read-only memory (CD-ROM), digital versatile disc (DVD), memory stick, floppy disk, mechanical coding equipment, for example thereon
It is stored with punch card or groove internal projection structure and the above-mentioned any appropriate combination of instruction.Calculating used herein above
Machine readable storage medium storing program for executing is not interpreted that instantaneous signal itself, the electromagnetic wave of such as radio wave or other Free propagations lead to
It crosses the electromagnetic wave (for example, the light pulse for passing through fiber optic cables) of waveguide or the propagation of other transmission mediums or is transmitted by electric wire
Electric signal.
Computer-readable program instructions as described herein can be downloaded to from computer readable storage medium it is each calculate/
Processing equipment, or outer computer or outer is downloaded to by network, such as internet, local area network, wide area network and/or wireless network
Portion stores equipment.Network may include copper transmission cable, optical fiber transmission, wireless transmission, router, firewall, interchanger, gateway
Computer and/or Edge Server.Adapter or network interface in each calculating/processing equipment are received from network to be counted
Calculation machine readable program instructions, and the computer-readable program instructions are forwarded, for the meter being stored in each calculating/processing equipment
In calculation machine readable storage medium storing program for executing.
Computer program instructions for executing operation of the present invention can be assembly instruction, instruction set architecture (ISA) instructs,
Machine instruction, machine-dependent instructions, microcode, firmware instructions, condition setup data or with one or more programming languages
The source code or object code that any combination is write, the programming language include the programming language-of object-oriented such as
Smalltalk, C++ etc., and conventional procedural programming languages-such as " C " language or similar programming language.Computer
Readable program instructions can be executed fully on the user computer, partly execute on the user computer, be only as one
Vertical software package executes, part executes on the remote computer or completely in remote computer on the user computer for part
Or it is executed on server.In situations involving remote computers, remote computer can pass through network-packet of any kind
It includes local area network (LAN) or wide area network (WAN)-is connected to subscriber computer, or, it may be connected to outer computer (such as benefit
It is connected with ISP by internet).In some embodiments, by utilizing computer-readable program instructions
Status information carry out personalized customization electronic circuit, such as programmable logic circuit, field programmable gate array (FPGA) or can
Programmed logic array (PLA) (PLA), the electronic circuit can execute computer-readable program instructions, to realize each side of the invention
Face.
Referring herein to according to the method for the embodiment of the present invention, the flow chart of device (system) and computer program product and/
Or block diagram describes various aspects of the invention.It should be appreciated that flowchart and or block diagram each box and flow chart and/
Or in block diagram each box combination, can be realized by computer-readable program instructions.
These computer-readable program instructions can be supplied to general purpose computer, special purpose computer or other programmable datas
The processor of processing unit, so that a kind of machine is produced, so that these instructions are passing through computer or other programmable datas
When the processor of processing unit executes, function specified in one or more boxes in implementation flow chart and/or block diagram is produced
The device of energy/movement.These computer-readable program instructions can also be stored in a computer-readable storage medium, these refer to
It enables so that computer, programmable data processing unit and/or other equipment work in a specific way, thus, it is stored with instruction
Computer-readable medium then includes a manufacture comprising in one or more boxes in implementation flow chart and/or block diagram
The instruction of the various aspects of defined function action.
Computer-readable program instructions can also be loaded into computer, other programmable data processing units or other
In equipment, so that series of operation steps are executed in computer, other programmable data processing units or other equipment, to produce
Raw computer implemented process, so that being executed in computer, other programmable data processing units or other equipment
Instruction implementation flow chart and/or block diagram in one or more boxes specified in function action.
The flow chart and block diagram in the drawings show the system of multiple embodiments according to the present invention, method and computer journeys
The architecture, function and operation in the cards of sequence product.In this regard, each box in flowchart or block diagram can generation
One module of table, program segment or a part of instruction, the module, program segment or a part of instruction include one or more use
The executable instruction of the logic function as defined in realizing.In some implementations as replacements, function marked in the box
It can occur in a different order than that indicated in the drawings.For example, two continuous boxes can actually be held substantially in parallel
Row, they can also be executed in the opposite order sometimes, and this depends on the function involved.It is also noted that block diagram and/or
The combination of each box in flow chart and the box in block diagram and or flow chart, can the function as defined in executing or dynamic
The dedicated hardware based system made is realized, or can be realized using a combination of dedicated hardware and computer instructions.It is right
For those skilled in the art it is well known that, by hardware mode realize, by software mode realize and pass through software and
It is all of equal value that the mode of combination of hardware, which is realized,.
Various embodiments of the present invention are described above, above description is exemplary, and non-exclusive, and
It is not limited to disclosed each embodiment.Without departing from the scope and spirit of illustrated each embodiment, for this skill
Many modifications and changes are obvious for the those of ordinary skill in art field.The selection of term used herein, purport
In the principle for best explaining each embodiment.
Claims (10)
1. a kind of method for promoting MEMS microphone package yield rate characterized by comprising
Record the location information of all MEMS chips on silicon chip；
It obtains and the testing result that open defect detects is carried out to the MEMS chip on the silicon chip；
It obtains and obtained original sensitivities is electrically measured to the MEMS chip progress on the silicon chip；
It is formed such that testing result, original sensitivities encapsulation record corresponding with location information；
It is recorded according to the encapsulation, the MEMS chip on position for selecting testing result and original sensitivities qualified is as wait seal
Fill MEMS chip；
Matched dedicated IC chip is selected according to the original sensitivities of the MEMS chip to be packaged, forms the chip being packaged
Combined information.
2. the method according to claim 1, wherein the method also includes:
According to obtained original sensitivities, MEMS chips all on the silicon chip are divided into different chipsets, wherein same
The MEMS chip of one chipset is arranged to match the dedicated IC chip of identical gain, and the MEMS chip of different chipsets is set
It is set to the dedicated IC chip of matching different gains.
3. according to the method described in claim 2, it is characterized in that, the method also includes:
All MEMS chips on the silicon chip generate with the display control of location information wafer figure corresponding with chipset
System, wherein each chipset is arranged to that display is marked by different wafer figures.
4. the method according to claim 1, wherein the method also includes:
All MEMS chips on the silicon chip generate with the display of location information wafer figure corresponding with testing result
Control, wherein all kinds of testing results are arranged to show by the label that same wafer figure is distinguished.
5. a kind of device for promoting MEMS microphone package yield rate characterized by comprising
For recording the module of the location information of all MEMS chips on silicon chip；
For obtaining the module for carrying out the testing result that open defect detects to the MEMS chip on the silicon chip；
For obtaining the module for carrying out electrically measuring obtained original sensitivities to the MEMS chip on the silicon chip；
It is used to form the module so that testing result, original sensitivities encapsulation record corresponding with location information；
For being recorded according to the encapsulation, select MEMS chip on testing result and the original sensitivities position of qualification as
The module of MEMS chip to be packaged；
For selecting matched dedicated IC chip according to the original sensitivities of the MEMS chip to be packaged, is formed and be packaged
The module of chip portfolio information.
6. device according to claim 5, which is characterized in that described device further include:
For according to obtained original sensitivities, MEMS chips all on the silicon chip to be divided into the mould of different chipsets
Block, wherein the MEMS chip of same chip group is arranged to match the dedicated IC chip of identical gain, and different chipset
MEMS chip is arranged to match the dedicated IC chip of different gains.
7. device according to claim 6, which is characterized in that described device further include:
It is shown for carrying out generation location information wafer figure corresponding with chipset to all MEMS chips on the silicon chip
Show the module of control, wherein each chipset is arranged to that display is marked by different wafer figures.
8. device according to claim 5, which is characterized in that described device further include:
For carrying out generating location information wafer figure corresponding with testing result to all MEMS chips on the silicon chip
The module of display control, wherein all kinds of testing results are arranged to show by the label that same wafer figure is distinguished.
9. a kind of device for promoting MEMS microphone package yield rate, including memory and processor, which is characterized in that described to deposit
For storing instruction, described instruction is operated for controlling the processor to execute and appoint according to claim 1 in 4 reservoir
Method described in one.
10. a kind of system for promoting MEMS microphone package yield rate characterized by comprising
Automatic optical detection device for carrying out open defect detection to the MEMS chip on silicon chip, and provides testing result；
CV test device, for carrying out electrical measurement to the MEMS chip on silicon chip, with the original of the determination MEMS chip
Sensitivity；
The device of promotion MEMS microphone package yield rate described in any one of claim 5 to 9；And
Display device, the data provided for showing the device for promoting MEMS microphone package yield rate, the data are at least wrapped
Include chip portfolio information.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610780932.1A CN106375924B (en) | 2016-08-31 | 2016-08-31 | Promote the method, apparatus and system of MEMS microphone package yield rate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610780932.1A CN106375924B (en) | 2016-08-31 | 2016-08-31 | Promote the method, apparatus and system of MEMS microphone package yield rate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106375924A CN106375924A (en) | 2017-02-01 |
| CN106375924B true CN106375924B (en) | 2019-02-01 |
Family
ID=57899299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610780932.1A Active CN106375924B (en) | 2016-08-31 | 2016-08-31 | Promote the method, apparatus and system of MEMS microphone package yield rate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106375924B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101263077A (en) * | 2005-09-09 | 2008-09-10 | 皇家飞利浦电子股份有限公司 | A method of manufacturing a mems capacitor microphone, a stack of foils comprising such a mems capacitor microphone, an electronic device comprising such a mems capacitor microphone and use of the ele |
| WO2010084236A1 (en) * | 2009-01-21 | 2010-07-29 | Nokia Corporation | Improved microphone package |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7202552B2 (en) * | 2005-07-15 | 2007-04-10 | Silicon Matrix Pte. Ltd. | MEMS package using flexible substrates, and method thereof |
-
2016
- 2016-08-31 CN CN201610780932.1A patent/CN106375924B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101263077A (en) * | 2005-09-09 | 2008-09-10 | 皇家飞利浦电子股份有限公司 | A method of manufacturing a mems capacitor microphone, a stack of foils comprising such a mems capacitor microphone, an electronic device comprising such a mems capacitor microphone and use of the ele |
| WO2010084236A1 (en) * | 2009-01-21 | 2010-07-29 | Nokia Corporation | Improved microphone package |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106375924A (en) | 2017-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112382582A (en) | Wafer test classification method and system | |
| US9865512B2 (en) | Dynamic design attributes for wafer inspection | |
| CN105716536B (en) | A kind of 3-dimensional digital speckle interference method for synchronously measuring and device | |
| CN108549606A (en) | interface test method and device | |
| CN109738881A (en) | Scaling method, device and the readable storage medium storing program for executing of flight time depth mould group | |
| CN110082666A (en) | Chip testing analysis method, device, equipment and storage medium | |
| US11199505B2 (en) | Machine learning enhanced optical-based screening for in-line wafer testing | |
| CN107239403A (en) | A kind of positioning problems method and apparatus | |
| CN105241580A (en) | Temperature calibration method and terminal | |
| CN105629148B (en) | The test method and test equipment of multiple modules in test circuit | |
| TW201514513A (en) | Adaptive electrical testing of wafers | |
| TW201533456A (en) | Wafer test data analysis method | |
| CN106375924B (en) | Promote the method, apparatus and system of MEMS microphone package yield rate | |
| CN116860530A (en) | Chip testing method, device, equipment and storage medium | |
| CN113348358B (en) | Loosely coupled inspection and metrology system for mass production process monitoring | |
| US8565910B2 (en) | Manufacturing execution system (MES) including a wafer sampling engine (WSE) for a semiconductor manufacturing process | |
| US8560994B1 (en) | Enabling statistical testing using deterministic multi-corner timing analysis | |
| KR20140042326A (en) | Electric test system for pcb(printed circuit board) and method thereof | |
| CN110059712A (en) | The detection method and device of abnormal data | |
| CN109901054A (en) | The function coverage model measurement point extracting method and system of fixed and floating conversion circuit | |
| CN112214389A (en) | Public testing method, device, terminal and storage medium | |
| US10416034B2 (en) | Method and system for analysis of pixelated capacitive sensor signals | |
| JP6447319B2 (en) | Stress analysis method, stress analysis apparatus, and stress analysis program | |
| CN105808806A (en) | Time sequence analysis method and time sequence analysis apparatus for integrated circuit | |
| CN104319244B (en) | Positioning method of failure center point of chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191113 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co., Ltd Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Gore Co., Ltd. |
|
| TR01 | Transfer of patent right |