CN106375924A - Method, device and system for improving packaging finished product rate of MEMS microphone - Google Patents
Method, device and system for improving packaging finished product rate of MEMS microphone Download PDFInfo
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- CN106375924A CN106375924A CN201610780932.1A CN201610780932A CN106375924A CN 106375924 A CN106375924 A CN 106375924A CN 201610780932 A CN201610780932 A CN 201610780932A CN 106375924 A CN106375924 A CN 106375924A
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- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000004806 packaging method and process Methods 0.000 title abstract 5
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 55
- 239000010703 silicon Substances 0.000 claims abstract description 55
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 54
- 230000035945 sensitivity Effects 0.000 claims abstract description 50
- 238000001514 detection method Methods 0.000 claims abstract description 16
- 230000007547 defect Effects 0.000 claims abstract description 11
- 238000012360 testing method Methods 0.000 claims description 48
- 238000005538 encapsulation Methods 0.000 claims description 22
- 230000008878 coupling Effects 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 10
- 238000005859 coupling reaction Methods 0.000 claims description 10
- 238000002372 labelling Methods 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 6
- 238000005259 measurement Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 11
- 238000012545 processing Methods 0.000 description 10
- 238000003860 storage Methods 0.000 description 10
- 230000006870 function Effects 0.000 description 9
- 238000007689 inspection Methods 0.000 description 5
- 238000004590 computer program Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 231100000768 Toxicity label Toxicity 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R29/00—Monitoring arrangements; Testing arrangements
- H04R29/004—Monitoring arrangements; Testing arrangements for microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Abstract
The invention discloses a method, device and system for improving a packaging finished product rate of an MEMS microphone. The method comprises the steps of: recording position information of all MEMS chips on a silicon substrate; acquiring a detection result obtained by carrying out appearance defect detection on each MEMS chip on the silicon substrate; acquiring a raw sensitivity obtained by carrying out electrical property measurement on each MEMS chip on the silicon substrate; forming a packaging record which enables the detection results, the raw sensitivities and the position information to correspond to each other; according to the packaging record, using the MEMS chip at a position where both the detection result and the raw sensitivity are qualified as an MEMS chip to be packaged; and according to the raw sensitivity of the MEMS chip to be packaged, selecting a matched ASIC (Application Specific Integrated Circuit) chip, and forming chip combination information for carrying out packaging.
Description
Technical field
A kind of the present invention relates to electro-acoustic product technical field, more particularly it relates to lifting mems microphone package
The method of yield rate, apparatus and system.
Background technology
Mems mike refers to the microphone products being obtained with the processing of mems technology, is also referred to as silicon microphone.mems
Mike includes mems chip and special ic (asic) chip two parts, two chips be encapsulated in one by pcb and metal outside
In the smd surface mount device of shell combination.Mems chip includes the backplane of silicon materials making and a piece of elasticity silicon fiml, and it is receiving
During to sound signal (acoustic pressure), will make elastic silicon fiml that corresponding deformation occurs, and therefore change elastic silicon fiml and backplane it
Between spacing, and then acoustic pressure is converted into corresponding capacitance variation amount.Special ic chip is used for detecting that mems chip senses
Capacitance variation amount, and be converted into the signal of telecommunication as the output of mems mike.
Based on the structure composition of mems mike, the key factor affecting its encapsulation yield rate includes: the lacking of mems chip
Fall into control (defect control), the original sensitivities (raw sensitivity) of mems chip and mems chip with special
The coupling of ic chip.Currently for the encapsulation of mems mike, the powder injection molding substantially only having carried out mems chip (refers specifically to
Open defect), because impact mems chip package yield rate also has two other very crucial factor, so, mems Mike
The encapsulation yield rate of wind still can be lifted further.
Content of the invention
It is an object of the present invention to provide a kind of new technical scheme of lifting mems microphone package yield rate.
According to the first aspect of the invention, there is provided a kind of method of lifting mems microphone package yield rate, comprising:
The positional information of all mems chips on record silicon chip；
Obtain and the testing result that automatic optics inspection obtains is carried out to the mems chip on described silicon chip；
Obtain and the original sensitivities obtaining electrically are measured to the mems chip on described silicon chip；
It is formed such that testing result, the original sensitivities encapsulation record corresponding with positional information；
According to described encapsulation record, select the mems chip conduct in testing result and all qualified position of original sensitivities
Mems chip to be packaged；
Original sensitivities according to described mems chip to be packaged select the special ic chip of coupling, and formation is packaged
Chip portfolio information.
Optionally, methods described also includes:
According to the original sensitivities obtaining, mems chips all on described silicon chip are divided into different chipsets, its
In, the mems chip of same chip group is arranged to mate the special ic chip of identical gain, and the mems core of different chipset
Piece is arranged to mate the special ic chip of different gains.
Optionally, methods described also includes:
Mems chips all on described silicon chip are carried out generate the aobvious of the positional information wafer figure corresponding with chipset
Show control, wherein, each chipset is arranged by different wafer figures and is marked display.
Optionally, methods described also includes:
Mems chips all on described silicon chip are carried out generate the positional information wafer figure corresponding with testing result
Display control, wherein, all kinds of testing results are arranged by the labelling that same wafer figure distinguished and show.
According to the second aspect of the invention, there is provided a kind of device of lifting mems microphone package yield rate, comprising:
For recording the module of the positional information of all mems chips on silicon chip；
For obtaining the module that the mems chip on described silicon chip is carried out with the testing result that automatic optics inspection obtains；
For obtaining the module that the mems chip on described silicon chip is electrically measured with the original sensitivities obtaining；
For being formed such that the module of testing result, the original sensitivities encapsulation record corresponding with positional information；
For according to described encapsulation record, selecting the mems core in testing result and all qualified position of original sensitivities
Piece is as the module of mems chip to be packaged；
Select the special ic chip of coupling for the original sensitivities according to described mems chip to be packaged, formed and sealed
The module of the chip portfolio information of dress.
Optionally, described device also includes: for according to the original sensitivities obtaining, owning on described silicon chip
Mems chip is divided into the module of different chipsets, and wherein, the mems chip of same chip group is arranged to mate identical increasing
The special ic chip of benefit, and the mems chip of different chipset is arranged to the special ic chip of coupling different gains.
Optionally, described device also includes: for carrying out to mems chips all on described silicon chip generating position letter
Cease the module of the display control of wafer figure corresponding with chipset, wherein, each chipset is arranged by different crystalline substances
Circle diagram is marked display.
Optionally, described device also includes: for carrying out to mems chips all on described silicon chip generating position letter
Cease the module of the display control of wafer figure corresponding with testing result, wherein, all kinds of testing results are arranged by same
The labelling that wafer figure is distinguished shows.
According to a third aspect of the present invention, there is provided a kind of device of lifting mems microphone package yield rate, including storage
Device and processor, described memorizer is used for store instruction, and described instruction is used for controlling described processor to be operated to execute root
According to the method described in first aspect present invention.
According to a fourth aspect of the present invention, there is provided a kind of system of lifting mems microphone package yield rate, comprising:
Automatic optical detection device, for carrying out open defect detection to the mems chip on silicon chip, and provides detection
Result；
Cv test device, for electrically being measured to the mems chip on silicon chip, to determine described mems chip
Original sensitivities；
The device of the lifting mems microphone package yield rate according to a second aspect of the present invention or described in the third aspect；With
And,
Display device, for the data of the device offer of display lifting mems microphone package yield rate, described data is extremely
Include chip portfolio information less.
One of the present invention has the beneficial effects that, the inventive method, apparatus and system pass through to impact mems mike envelope
Three key factors of dress yield rate are intervened, and effectively increase the encapsulation yield rate of mes mike.
By the detailed description to the exemplary embodiment of the present invention referring to the drawings, the further feature of the present invention and its
Advantage will be made apparent from.
Brief description
Combined in the description and the accompanying drawing of the part that constitutes description shows embodiments of the invention, and even
It is used for together explaining the principle of the present invention with its explanation.
Fig. 1 is a kind of flow chart of the embodiment of method lifting mems microphone package yield rate according to the present invention；
Fig. 2 is a kind of square frame principle of the embodiment of device lifting mems microphone package yield rate according to the present invention
Figure；
Fig. 3 is that the square frame of the another embodiment of device lifting mems microphone package yield rate according to the present invention is former
Reason figure；
Fig. 4 is a kind of square frame principle of the embodiment of system lifting mems microphone package yield rate according to the present invention
Figure；
Fig. 5 is a form of wafer figure that testing result is marked.
Fig. 6 is a form of wafer figure that chipset is marked.
Specific embodiment
To describe the various exemplary embodiments of the present invention now with reference to accompanying drawing in detail.It should also be noted that unless other have
Body illustrates, the positioned opposite, numerical expression of the part otherwise illustrating in these embodiments and step and numerical value do not limit this
The scope of invention.
Description only actually at least one exemplary embodiment is illustrative below, never as to the present invention
And its application or any restriction using.
May be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
When in the case of, described technology, method and apparatus should be considered a part for description.
In all examples with discussion shown here, any occurrence should be construed as merely exemplary, and not
It is as restriction.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter expression similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then do not need it is further discussed in subsequent accompanying drawing.
Fig. 1 is a kind of flow chart of embodiment of the lifting mems microphone package yield rate according to the present invention.According to
Shown in Fig. 1, the inventive method comprises the steps:
Step s101, the positional information of all mems chips on record silicon chip.
More mems chip generally formed on one piece of silicon chip, for example thousands of, even up to ten thousand mems chips,
Individual by cutting the single chip of molding eventually.
This silicon chip be, for example, circle, each mems chip on a silicon substrate according to certain regular array, for example embark on journey,
Arrange in column, and line space is equal and column pitch is equal, and for example circular array arrangement, therefore, each mems chip is in silicon substrate
On piece, there is defined location, corresponding positional information can be row, column array etc. according to arrangement mode.
Therefore, on record silicon chip, the positional information of all mems chips can be according to silicon chip specification and mems chip
The positional information that arrangement mode on a silicon substrate loads, to refer to the mems chip on correspondence position by positional information.
Step s102, obtains the testing result that the mems chip on institute's silicon chip is carried out with open defect detection obtains.
This open defect for example includes chip breakage, chip deform, cleannes are not up to standard etc..This detection can manually be seen
Examine and complete and the typing of testing result is manually completed it is also possible to pass through automatic optics inspection (automated by input equipment
Optical inspection, aoi) device replaces the artificial open defect searching chip, and generate testing result.
After obtaining testing result, can be by the wafer figure of the testing result of display reflection each position mems chip
(wafer map) provides and intuitively judges, so, the inventive method can also include: mems chips all on silicon chip are entered
The step that row generates the positional information display control of wafer figure corresponding with testing result, wherein, all kinds of testing results are set
It is set to the labelling by same wafer figure is distinguished and show, such as normal chip is marked display by green, abnormal
Chip generally redness is marked display, but also can be also carried out phase region according to testing result to different types of abnormal chips
Other labelling shows.
Fig. 5 is the black and white pattern of the wafer figure showing corresponding testing result labelling on mems chip position, mems
Chip is covered with the whole border circular areas of pattern, and the stain shown in pattern is abnormal chips position, and normal chip is at this
Invisible in black and white pattern.
Step s102, obtains and is electrically measured, to the mems chip on silicon chip, the original sensitivities obtaining.
This electrical measurement can be carried out by cv tester, just can characterize the original of corresponding chip according to the result of electrical measurement
Sensitivity.This cv test refers specifically to capacitor voltage characteristic test, under applying in the case of identical voltage, the variable quantity of capacitance
Bigger, then original sensitivities are higher, therefore, can characterize original sensitivities by the variable quantity of capacitance.
Here, different original sensitivities scopes should mate the special ic chip of different gains according to encapsulation requirement, therefore,
The mems chip that can be possible to mate identical special ic chip is designated as being same chip group, i.e. the mems chip quilt of same chip group
It is configured to mate the special ic chip of identical gain, and the mems chip of different chipset is arranged to mate different gains
Special ic chip.
After the original sensitivities obtaining mems chip, can be original sensitive by display reflection each position mems chip
The wafer figure of degree provides and intuitively judges, so, the inventive method can also include: mems chips all on silicon chip are carried out
The step generating the positional information display control of wafer figure corresponding with chipset, wherein, each chipset is arranged to logical
Cross different wafer figures and be marked display, show the mems chip of same chip group, example in a wafer in figure only labelling
As the position being located by the mems chip that red-label shows corresponding chipset in wafer in figure.
Fig. 6 is the black and white pattern of the wafer figure showing corresponding chip group echo on mems chip position, pattern
Shown in stain be corresponding chipset mems chip position.
Step s103, is formed such that testing result, the original sensitivities encapsulation record corresponding with positional information, that is, every
Record includes the original of positional information, the testing result of mems chip on correspondence position and the mems chip on correspondence position
Sensitivity.This record can be for example tabular form, chain sheet form etc..
Step s104, according to packaged record, selects the mems in testing result and all qualified position of original sensitivities
Chip is as mems chip to be packaged.
Here, can be qualified according to screening original sensitivities the normal range that encapsulation requires the original sensitivities limiting
Mems chip.
Step s105, the original sensitivities according to mems chip to be packaged select the special ic chip of coupling, and formation is carried out
The chip portfolio information of encapsulation.
This step is specially and is required according to encapsulation, selects gain to match with the original sensitivities of mems chip to be packaged
Special ic chip.
For the embodiment of above-mentioned division chipset, this step can select a mems to be packaged in a chipset
Chip carries out the coupling of special ic chip, and then forms the chip portfolio information of all mems chips to be packaged in this chipset.
Here, for the special ic chip of single gain, the special ic chip of every money gain is only capable of and same chip group
Mems chip to be packaged matches, accordingly, it would be desirable to prepare the special ic chip of many moneys gain according to chip portfolio information, to mate
The mems chip to be packaged of different chipsets.And for the special ic chip with calibration function, (calibration function can be biasing
Voltage and/or gain calibration), then that is, can be by large range of original sensitivities be mated to the calibration of special ic chip,
Join two chipsets, or even more chipset.
So, the envelope of mems chip to be packaged and corresponding special ic chip is completed according to the requirement of this chip portfolio information
Dress, just can control three key factors of impact encapsulation yield rate, and then encapsulation yield rate is greatly improved.
Present invention also offers a kind of device of lifting mems microphone package yield rate, Fig. 2 is one kind of this kind of device
The frame principle figure of embodiment.
According to Fig. 2, this device 200 1 aspect includes the positional information for recording all mems chips on silicon chip
Module 201；For obtaining the module that the mems chip on silicon chip is carried out with the testing result that automatic optics inspection obtains
202；For obtaining the module 203 that the mems chip on silicon chip is electrically measured with the original sensitivities obtaining；For shape
Become to make the module 204 of testing result, the original sensitivities encapsulation record corresponding with positional information；For according to encapsulation note
Mems chip on all qualified position of record, selection testing result and original sensitivities is as the module of mems chip to be packaged
205；And, select the special ic chip of coupling for the original sensitivities according to mems chip to be packaged, formation is packaged
Chip portfolio information module 206.
This device 200 can further include for according to the original sensitivities obtaining, by mems all on silicon chip
Chip is divided into the module (not shown) of different chipsets, and wherein, the mems chip of same chip group is arranged to
Join the special ic chip of identical gain, and the mems chip of different chipset is arranged to mate the special ic core of different gains
Piece.
This device 200 can further include for mems chips all on silicon chip are carried out generate positional information with
The module (not shown) of the corresponding display control of wafer figure of chipset, wherein, each chipset is arranged by
Different wafer figures is marked display.
This device 200 can further include for mems chips all on silicon chip are carried out generate positional information with
The module (not shown) of the corresponding display control of wafer figure of testing result, wherein, all kinds of testing results are arranged to
Shown by the labelling that same wafer figure is distinguished.
Fig. 3 is the frame principle figure of the another embodiment of this device.According to Fig. 3, this device 300 includes storing
Device 301 and processor 302, memorizer 301 is used for store instruction, instructs and is operated to execute root for control process device 302
Method according to the lifting mems microphone package yield rate of the present invention.
This device 300 can further include input equipment 304, communicator 306, interface arrangement 303 and display dress
Put 305 etc..Wherein, communicator 306 for example can carry out there is wired or wireless communication, to obtain including testing result and original
Sensitivity is in interior various data, and/or sends the various data including chip portfolio information.Interface arrangement 303 is for example
Including usb interface, rs232 interface, rs485 interface, network interface etc..Input equipment 304 for example can include touch screen, button etc.,
To input various information, such as positional information.Display device 305 is, for example, LCDs, touch display screen etc., to show core
Piece combined information, various wafer figure etc..Although figure 3 illustrates multiple devices, apparatus of the present invention 300 can only relate to
And partial devices therein, for example, processor 301, memorizer 302 etc..
Present invention also offers a kind of system of lifting mems microphone package yield rate, Fig. 4 is a kind of real of this system
Apply the frame principle figure of mode.According to Fig. 4, this system 400 includes automatic optical detection device 401, cv test device
402nd, device 200 or 300, display device 403.Wherein, automatic optical detection device 401 is used for the mems chip on silicon chip
Carry out open defect detection, and testing result is provided；Cv test device 402 is used for the mems chip on silicon chip is carried out electrically
Measurement, to determine the original sensitivities of mems chip；Device 200 or 300 is used for according to the testing result of mems chip and original
Sensitivity, obtains chip portfolio information；Display device 403 is used for the data that display device 200 or 300 provides, and this data is at least
Including chip portfolio information, to indicate that operator complete the encapsulation of mems mike.
The description of the various embodiments described above primary focus and the difference of other embodiment, but those skilled in the art should be clear
Chu, the various embodiments described above can be used alone as needed or be combined with each other.
Each embodiment in this specification is all described by the way of going forward one by one, identical similar portion between each embodiment
Divide cross-reference, what each embodiment stressed is the difference with other embodiment, but people in the art
Member is it should be understood that the various embodiments described above can be used alone as needed or be combined with each other.In addition, for dress
Put, for the embodiment of system, because it is corresponding with embodiment of the method, so describing fairly simple, related part ginseng
See the explanation of the corresponding part of embodiment of the method.Device embodiment described above is only schematically, wherein makees
The module illustrating for separating component can be or may not be physically separate.
The present invention can be device, method and/or computer program.Computer program can include computer
Readable storage medium storing program for executing, containing for making processor realize the computer-readable program instructions of various aspects of the invention.
Computer-readable recording medium can be can keep and store by instruction execution equipment use instruction tangible
Equipment.Computer-readable recording medium for example may be-but not limited to-storage device electric, magnetic storage apparatus, optical storage
Equipment, electromagnetism storage device, semiconductor memory apparatus or above-mentioned any appropriate combination.Computer-readable recording medium
More specifically example (non exhaustive list) includes: portable computer diskette, hard disk, random access memory (ram), read-only deposits
Reservoir (rom), erasable programmable read only memory (eprom or flash memory), static RAM (sram), portable
Compact disk read only memory (cd-rom), digital versatile disc (dvd), memory stick, floppy disk, mechanical coding equipment, for example thereon
Be stored with the punch card of instruction or groove internal projection structure and above-mentioned any appropriate combination.Calculating used herein above
Machine readable storage medium storing program for executing is not construed as the electromagnetic wave of instantaneous signal itself, such as radio wave or other Free propagations, leads to
Cross the electromagnetic wave (for example, by the light pulse of fiber optic cables) of waveguide or the propagation of other transmission mediums or pass through wire transfer
The signal of telecommunication.
Computer-readable program instructions as described herein can from computer-readable recording medium download to each calculate/
Processing equipment, or outer computer or outer is downloaded to by network, such as the Internet, LAN, wide area network and/or wireless network
Portion's storage device.Network can include copper transmission cable, fiber-optic transfer, be wirelessly transferred, router, fire wall, switch, gateway
Computer and/or Edge Server.Adapter in each calculating/processing equipment or network interface receive meter from network
Calculation machine readable program instructions, and forward this computer-readable program instructions, for being stored in the meter in each calculating/processing equipment
In calculation machine readable storage medium storing program for executing.
For execute the present invention operation computer program instructions can be assembly instruction, instruction set architecture (isa) instruction,
Machine instruction, machine-dependent instructions, microcode, firmware instructions, condition setup data or with one or more programming language
Source code or object code that combination in any is write, described programming language includes OO programming language such as
Smalltalk, c++ etc., and the procedural programming languages of routine such as " c " language or similar programming language.Computer
Readable program instructions fully can execute on the user computer, partly execute on the user computer, as one solely
Vertical software kit execution, part partly execute or on the user computer on the remote computer completely in remote computer
Or execute on server.In the situation being related to remote computer, remote computer can pass through the network bag of any kind
Include LAN (lan) or wide area network (wan) is connected to subscriber computer, or it may be connected to outer computer (such as profit
With ISP come by Internet connection).In certain embodiments, by using computer-readable program instructions
Status information carry out personalized customization electronic circuit, such as Programmable Logic Device, field programmable gate array (fpga) or can
Programmed logic array (PLA) (pla), this electronic circuit can execute computer-readable program instructions, thus realizing each side of the present invention
Face.
Referring herein to method according to embodiments of the present invention, device (system) and computer program flow chart and/
Or block diagram describes various aspects of the invention.It should be appreciated that each square frame of flow chart and/or block diagram and flow chart and/
Or in block diagram each square frame combination, can be realized by computer-readable program instructions.
These computer-readable program instructions can be supplied to general purpose computer, special-purpose computer or other programmable data
The processor of processing meanss, thus produce a kind of machine so that these instructions are by computer or other programmable data
During the computing device of processing meanss, create work(specified in one or more of flowchart and/or block diagram square frame
The device of energy/action.These computer-readable program instructions can also be stored in a computer-readable storage medium, these refer to
Order makes computer, programmable data processing unit and/or other equipment work in a specific way, thus, be stored with instruction
Computer-readable medium then includes a manufacture, and it is included in one or more of flowchart and/or block diagram square frame
The instruction of the various aspects of function/action of regulation.
Computer-readable program instructions can also be loaded into computer, other programmable data processing unit or other
So that executing series of operation steps on computer, other programmable data processing unit or miscellaneous equipment, to produce on equipment
Raw computer implemented process, so that execute on computer, other programmable data processing unit or miscellaneous equipment
Instruction flowchart and/or the function/action specified in square frame of one or more of block diagram.
Flow chart in accompanying drawing and block diagram show the system of multiple embodiments according to the present invention, method and computer journey
The architectural framework in the cards of sequence product, function and operation.At this point, each square frame in flow chart or block diagram can generation
A part for one module of table, program segment or instruction, a part for described module, program segment or instruction comprises one or more use
Executable instruction in the logic function realizing regulation.At some as the function of in the realization replaced, being marked in square frame
Can be to occur different from the order being marked in accompanying drawing.For example, two continuous square frames can essentially be held substantially in parallel
OK, they can also execute sometimes in the opposite order, and this is depending on involved function.It is also noted that block diagram and/or
Each square frame in flow chart and the combination of the square frame in block diagram and/or flow chart, can be with the function of execution regulation or dynamic
The special hardware based system made is realizing, or can be realized with combining of computer instruction with specialized hardware.Right
For those skilled in the art it is well known that, realized by hardware mode, realize by software mode and pass through software and
The mode of combination of hardware is realized being all of equal value.
It is described above various embodiments of the present invention, described above is exemplary, and non-exclusive, and
It is not limited to disclosed each embodiment.In the case of the scope and spirit without departing from illustrated each embodiment, for this skill
For the those of ordinary skill in art field, many modifications and changes will be apparent from.The selection of term used herein, purport
In the principle best explaining each embodiment.
Claims (10)
1. a kind of method of lifting mems microphone package yield rate is it is characterised in that include:
The positional information of all mems chips on record silicon chip；
Obtain the testing result that the mems chip on described silicon chip is carried out with open defect detection obtains；
Obtain and the original sensitivities obtaining electrically are measured to the mems chip on described silicon chip；
It is formed such that testing result, the original sensitivities encapsulation record corresponding with positional information；
According to described encapsulation record, select mems chip in testing result and all qualified position of original sensitivities as waiting to seal
Dress mems chip；
Original sensitivities according to described mems chip to be packaged select the special ic chip of coupling, form the chip being packaged
Combined information.
2. method according to claim 1 is it is characterised in that methods described also includes:
According to the original sensitivities obtaining, mems chips all on described silicon chip are divided into different chipsets, wherein, with
The mems chip of one chipset is arranged to mate the special ic chip of identical gain, and the mems chip of different chipset is set
It is set to the special ic chip of coupling different gains.
3. method according to claim 2 is it is characterised in that methods described also includes:
Mems chips all on described silicon chip are carried out generate the display control of the positional information wafer figure corresponding with chipset
System, wherein, each chipset is arranged by different wafer figures and is marked display.
4. method according to claim 1 is it is characterised in that methods described also includes:
Mems chips all on described silicon chip are carried out generate the display of the positional information wafer figure corresponding with testing result
Control, wherein, all kinds of testing results are arranged by the labelling that same wafer figure distinguished and show.
5. a kind of device of lifting mems microphone package yield rate is it is characterised in that include:
For recording the module of the positional information of all mems chips on silicon chip；
For obtaining the module that the mems chip on described silicon chip is carried out with the testing result that open defect detection obtains；
For obtaining the module that the mems chip on described silicon chip is electrically measured with the original sensitivities obtaining；
For being formed such that the module of testing result, the original sensitivities encapsulation record corresponding with positional information；
For according to described encapsulation record, selecting the mems chip conduct in testing result and all qualified position of original sensitivities
The module of mems chip to be packaged；
Select the special ic chip of coupling for the original sensitivities according to described mems chip to be packaged, formation is packaged
The module of chip portfolio information.
6. device according to claim 5 is it is characterised in that described device also includes:
For according to the original sensitivities obtaining, mems chips all on described silicon chip being divided into the mould of different chipsets
Block, wherein, the mems chip of same chip group is arranged to mate the special ic chip of identical gain, and different chipset
Mems chip is arranged to mate the special ic chip of different gains.
7. device according to claim 6 is it is characterised in that described device also includes:
For carrying out to mems chips all on described silicon chip generating the aobvious of the positional information wafer figure corresponding with chipset
Show the module of control, wherein, each chipset is arranged by different wafer figures and is marked display.
8. device according to claim 5 is it is characterised in that described device also includes:
For carrying out to mems chips all on described silicon chip generating the positional information wafer figure corresponding with testing result
The module of display control, wherein, all kinds of testing results are arranged by the labelling that same wafer figure distinguished and show.
9. a kind of device of lifting mems microphone package yield rate, including memorizer and processor it is characterised in that described deposit
Reservoir is used for store instruction, and described instruction is used for controlling described processor to be operated to execute according in Claims 1-4
Method described in one.
10. a kind of system of lifting mems microphone package yield rate is it is characterised in that include:
Automatic optical detection device, for carrying out open defect detection to the mems chip on silicon chip, and provides testing result；
Cv test device, for electrically being measured to the mems chip on silicon chip, to determine the original of described mems chip
Sensitivity；
The device of the lifting mems microphone package yield rate any one of claim 5 to 9；And,
Display device, for the data of the device offer of display lifting mems microphone package yield rate, described data is at least wrapped
Include chip portfolio information.
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|---|---|---|---|---|
| US20070013036A1 (en) * | 2005-07-15 | 2007-01-18 | Silicon Matrix Pte Ltd | MEMS package using flexible substrates, and method thereof |
| CN101263077A (en) * | 2005-09-09 | 2008-09-10 | 皇家飞利浦电子股份有限公司 | A method of manufacturing a mems capacitor microphone, a stack of foils comprising such a mems capacitor microphone, an electronic device comprising such a mems capacitor microphone and use of the ele |
| WO2010084236A1 (en) * | 2009-01-21 | 2010-07-29 | Nokia Corporation | Improved microphone package |
-
2016
- 2016-08-31 CN CN201610780932.1A patent/CN106375924B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070013036A1 (en) * | 2005-07-15 | 2007-01-18 | Silicon Matrix Pte Ltd | MEMS package using flexible substrates, and method thereof |
| CN101263077A (en) * | 2005-09-09 | 2008-09-10 | 皇家飞利浦电子股份有限公司 | A method of manufacturing a mems capacitor microphone, a stack of foils comprising such a mems capacitor microphone, an electronic device comprising such a mems capacitor microphone and use of the ele |
| WO2010084236A1 (en) * | 2009-01-21 | 2010-07-29 | Nokia Corporation | Improved microphone package |
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Effective date of registration: 20191113 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co., Ltd Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Gore Co., Ltd. |
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