CN106373916A - Electroplating machine station alignment module and wafer suction disc thereof - Google Patents
Electroplating machine station alignment module and wafer suction disc thereof Download PDFInfo
- Publication number
- CN106373916A CN106373916A CN201610924424.6A CN201610924424A CN106373916A CN 106373916 A CN106373916 A CN 106373916A CN 201610924424 A CN201610924424 A CN 201610924424A CN 106373916 A CN106373916 A CN 106373916A
- Authority
- CN
- China
- Prior art keywords
- wafer
- sucker
- suction disc
- electroplating machine
- adsorption plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
The invention discloses an electroplating machine station alignment module and a wafer suction disc for the alignment module. The key improvement point of the suction disc lies in that an absorption surface is a rough surface. By the alignment module and the wafer suction disc, the probability of generating vacuum absorption due to moisture existing in back surfaces of the suction disc and a wafer can be reduced, and thus, the breakage rate of the wafer is reduced.
Description
Technical field
The present invention relates to a kind of electroplating machine alignment modules and the wafer suction disc for this alignment modules.
Background technology
Electro-coppering (ecp) is a kind of copper-depositing on surface film in wafer by way of plating, and completes thin copper film technique
Processing procedure, it is widely used in advanced field of semiconductor manufacture.Typically complete ecp process can include plating, side washing and
Three steps of annealing.During ecp, due to depositing the difference of copper film thickness, different plating modes can be taken.For plating
Thicker copper film, generally requires the mode taking two step plating, specific process is first to electroplate a part of copper film, washes wafer
The electroplate liquid on surface, the step not doing side washing and annealing, wafer is sent back in wafer cassette (foup), and then wafer is sent to machine again
Platform simultaneously carries out second step plating, to be electroplated onto required copper film thickness, after plating terminates, then carries out side washing and the step of annealing
Suddenly.
Due to the requirement of board hardware, wafer all has to pass through the mistake of be aligned before being sent to electroplating bath for plating copper wiring
Journey.The detailed process of be aligned is as follows: shown in seeing figures.1.and.2, wafer is placed on three support posts of alignment modules
Face；Sucker in alignment modules is located between three support posts, and sucker holds up wafer bottom-up, and is produced by gas outlet
Raw suction holds wafer；Then wafer rotation is driven by sucker, so that the recess of wafer is rotated to the orientation requiring；Inhale afterwards
Disk discharges suction, and wafer is placed on above support post, and then sucker is recovered to bottom.Then mechanical arm catches wafer
It is placed in electroplating bath.
However, it has been found that above-mentioned this two step plating modes during reality, due to electroplating it in the first step
Afterwards, only wafer has been carried out with the action of a cleaning, there is no the process annealed, and after first step plating terminates, wafer
Quickly it is sent into board again, lead to wafer rear may have the residual of steam, and the steam of this residual, do certainly in wafer
During be aligned, by the contact with sucker, may be left on above sucker, if this wafer operation is more, steam can
Can remain more, and because existing sucker and wafer rear are all very smooth, the steam between sucker and wafer may
Make to produce vac sorb between them.Thus leading to after discharging in force of suction cup, sucker wafer may be also had one to
Under pulling force, pulling force lead between wafer and support post produce one shock, lead to wafer crush.
Content of the invention
The present invention seeks to: for above-mentioned technical problem, propose a kind of electroplating machine alignment modules and be used for this be aligned
The wafer suction disc of module, to reduce sucker with wafer rear because steam there is a possibility that to produce vac sorb, thus reduce
The fragment rate of wafer.
In order to achieve the above object, the present invention adopts the technical scheme that:
This electroplating machine alignment modules wafer suction disc provided by the present invention, its key improvements point is the suction of described sucker
Attached face is matsurface.
The present invention, on the basis of technique scheme, also includes following preferred version:
By the lines of outwardly convex is formed on the adsorption plane of described sucker, and described adsorption plane is made to become described thick
Matte.Or,
By forming, on the adsorption plane of described sucker, the lines caving inward, and described adsorption plane is made to become described thick
Matte.
The roughness of described adsorption plane is preferably 0.4～100 μm of ra.More preferably 25～50 μm of ra.
This electroplating machine alignment modules provided by the present invention, including alignment stage, along the circumferential direction uniform intervals are solid
Due at least three support posts in described alignment stage, it is arranged between each described support post and being capable of oscilaltion
Sucker, its key improvements is: described sucker adopts above-mentioned structure.
Preferably, described support post is provided with three altogether.
The invention has the advantage that
Traditional electroplating machine alignment modules wafer suction disc is that structure is, has two annulus on the sucker of smooth surface
The gas outlet of shape, when sucker contact wafer, the negative pressure being formed by gas outlet, by wafer adsorption on sucker.And
When gas outlet stops suction, wafer is placed on above support column, and departs from sucker.As above-mentioned background material institute
State, due to the presence of steam, vac sorb may be produced in sucker and wafer rear when gas outlet stops suction,
Lead to also there is suction between sucker and wafer, this suction can haul wafer when sucker resets downwards and impinge upon
Above dagger, wafer is led to crush.
And the present invention passes through to increase the roughness of the adsorption plane of sucker, the smooth adsorption plane in conventional art is changed to coarse
Adsorption plane, thus reduce sucker and wafer rear to there is a possibility that to produce vac sorb due to steam, significantly reduces
The fragment rate of wafer.
Brief description
The invention will be described further with specific embodiment below in conjunction with the accompanying drawings:
Fig. 1 is the structural representation of traditional electroplating machine alignment modules；
Fig. 2 is the structural representation of traditional electroplating machine alignment modules wafer suction disc；
Fig. 3 is the structural representation of the embodiment of the present invention this electroplating machine alignment modules wafer suction disc；
Fig. 4 is the schematic diagram being directed at wafer using this electroplating machine of the embodiment of the present invention come alignment modules, wherein sucker
It is blocked not shown；
Wherein: 1- sucker, 101- adsorption plane, 101a- lines, 102- gas outlet, 2- alignment stage, 3- support post, 4-
Wafer.
Specific embodiment
Fig. 3 and Fig. 4 shows a specific embodiment of the present invention this electroplating machine alignment modules, with traditional electroplating machine
Platform alignment modules identical is that this alignment modules also includes: alignment stage 2, along the circumferential direction uniform intervals are fixed on described right
At least three (the present embodiment be specially three) support posts 3 on quasi- platform 2, it is arranged between each support post 3 and energy
The sucker 1 of enough oscilaltions (also can be around own axis).Sucker 1 has the adsorption plane fitted during work with wafer 4 absorption
101, sucker 1 is provided with gas outlet 102.
The key improvements of the present embodiment are: the adsorption plane 101 of described sucker 1 is matsurface, rather than conventional suction cups structure
The shiny surface being adopted.
The coarse adsorption plane of above-mentioned sucker at least can be realized by following two modes:
First kind of way, by forming the lines 101a of outwardly convex on the adsorption plane 101 of described sucker 1, and makes
Described adsorption plane 101 becomes described matsurface.
The second way, by forming, on the adsorption plane 101 of described sucker 1, the lines 101a caving inward, and makes
Described adsorption plane 101 becomes described matsurface.
Inventor finds through many experiments, when the roughness in sucker suction face 101 is 0.4～100 μm of ra, wafer
Percentage of damage substantially reduces, and when especially roughness is 25～50 μm of ra, effect is optimum.
With reference to shown in Fig. 4, during practical application, wafer 4 is placed on above three support posts 3 of alignment modules；Be aligned
Sucker 1 in module is located between three support posts 3, and sucker 1 holds up wafer bottom-up, and passes through sucker gas outlet
The suction of 102 generations holds wafer 4；Then drive wafer 4 to rotate by sucker 1, so that recess on wafer is rotated to requiring
Orientation；Posterior sucker 1 release suction so that wafer is placed on above support post 3 by support, then sucker 1 is recovered to bottom
Portion.Afterwards, wafer is caught to be placed in electroplating bath by mechanical arm.
Certainly, above-described embodiment only technology design to illustrate the invention and feature, its object is to make people much of that
Solution present disclosure is simultaneously implemented according to this, can not be limited the scope of the invention with this.All according to major technique of the present invention
Equivalent transformation or modification that the spirit of scheme is done, all should be included within the scope of the present invention.
Claims (7)
1. a kind of electroplating machine alignment modules wafer suction disc it is characterised in that: the adsorption plane (101) of described sucker (1) be coarse
Face.
2. electroplating machine alignment modules wafer suction disc as claimed in claim 1 it is characterised in that: by described sucker (1)
The upper lines (101a) forming outwardly convex of adsorption plane (101), and make described adsorption plane (101) become described matsurface.
3. electroplating machine alignment modules wafer suction disc as claimed in claim 1 it is characterised in that: by described sucker (1)
Adsorption plane (101) above form the lines (101a) caving inward, and make described adsorption plane (101) become described matsurface.
4. electroplating machine alignment modules wafer suction disc as claimed in claim 1 it is characterised in that: described adsorption plane (101)
Roughness is 0.4～100 μm of ra.
5. electroplating machine alignment modules wafer suction disc as claimed in claim 4 it is characterised in that: described adsorption plane (101)
Roughness is 25～50 μm of ra.
6. a kind of electroplating machine alignment modules, including alignment stage (2), along the circumferential direction uniform intervals are fixed on described be aligned and put down
At least three support posts (3) on platform (2), it is arranged between each described support post (3) and is capable of the suction of oscilaltion
Disk (1) is it is characterised in that described sucker (1) is using the structure as any one of Claims 1 to 5.
7. electroplating machine alignment modules as claimed in claim 6 are it is characterised in that described support post (3) is provided with three altogether
Root.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610924424.6A CN106373916A (en) | 2016-10-24 | 2016-10-24 | Electroplating machine station alignment module and wafer suction disc thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610924424.6A CN106373916A (en) | 2016-10-24 | 2016-10-24 | Electroplating machine station alignment module and wafer suction disc thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106373916A true CN106373916A (en) | 2017-02-01 |
Family
ID=57895928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610924424.6A Pending CN106373916A (en) | 2016-10-24 | 2016-10-24 | Electroplating machine station alignment module and wafer suction disc thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106373916A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050095101A (en) * | 2004-03-25 | 2005-09-29 | 삼성전자주식회사 | Apparatus of picking up thin chips in die attach process |
| CN101131917A (en) * | 2006-08-23 | 2008-02-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Temperature control device of etching equipment and its method for controlling wafer temperature |
| CN101246836A (en) * | 2007-02-14 | 2008-08-20 | 东京毅力科创株式会社 | Substrate carrying platform and process method for its surface |
-
2016
- 2016-10-24 CN CN201610924424.6A patent/CN106373916A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050095101A (en) * | 2004-03-25 | 2005-09-29 | 삼성전자주식회사 | Apparatus of picking up thin chips in die attach process |
| CN101131917A (en) * | 2006-08-23 | 2008-02-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Temperature control device of etching equipment and its method for controlling wafer temperature |
| CN101246836A (en) * | 2007-02-14 | 2008-08-20 | 东京毅力科创株式会社 | Substrate carrying platform and process method for its surface |
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Application publication date: 20170201 |
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