CN106371232A - Preparation method of double-sided functional piece in TFT-LCD production technology - Google Patents
Preparation method of double-sided functional piece in TFT-LCD production technology Download PDFInfo
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- CN106371232A CN106371232A CN201610751613.8A CN201610751613A CN106371232A CN 106371232 A CN106371232 A CN 106371232A CN 201610751613 A CN201610751613 A CN 201610751613A CN 106371232 A CN106371232 A CN 106371232A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
Abstract
The invention provides a preparation method of a double-sided functional piece in a TFT-LCD production technology. According to the preparation method of the double-sided functional piece in the TFT-LCD production technology provided by the invention, the process is simple, the preparation processes of a window protection glue layer and an insulating glue layer in a traditional technology are integrated as one step; then, the window protection glue on corresponding position on the other side of the silver line position on a substrate is quickly modified to obtain insulating glue, and much time consumed on the two sides of the substrate is avoided; and through repeated preparation of the window protection glue layer and the insulating glue layer, the production time of the double-sided functional piece with function electrodes on the two sides of the substrate can be saved, and the production efficiency is improved.
Description
Technical field
The present invention relates to micro-electronic machining field, in particular to two-sided functional piece in a kind of tft-lcd manufacturing process
Preparation method.
Background technology
At present, in flat pannel display (flat panel display, abbreviation fpd) technology, due to liquid crystal display
(liquid crystal display, abbreviation lcd) have compact, save placing space the advantages of, gradually replace
Cathode ray tube (cathode ray tube, abbreviation crt), becomes the display of main flow.In various types of lcd, thin film
Field-effect transistor liquid crystal display (thin film transistor-liquid crystal display, abbreviation tft-
Lcd) there is function admirable, the advantages of suitable mass automatic production, have become as the lcd product of main flow.
Designed functional electrode shape, gained functional electrode need to be prepared in the preparation process of tft-lcd on substrate
It is connected with silver wire one by one, obtains functional sheet, need when preparing silver wire windows be protected is prepared on the functional electrode of required form
Glue-line, also will prepare insulating cement, complex process at substrate opposite side with silver wire position corresponding, require time for growing；
If preparing the two-sided functional sheet all with functional electrode, windows be protected glue need to be prepared respectively on the functional electrode of both sides,
Also insulating cement to be prepared respectively in both sides correspondence position, technique is increasingly complex, require time for longer, this makes substrate both sides all have
The production efficiency of the tft-lcd of functional electrode substantially reduces it is impossible to meet Production requirement.
In view of this, the special proposition present invention.
Content of the invention
It is an object of the invention to provide in a kind of tft-lcd manufacturing process two-sided functional piece preparation method, described
In tft-lcd manufacturing process, the preparation method of two-sided functional piece has process is simple, saving can be had to rise substrate both sides and all have
The production time of the two-sided functional piece of functional electrode, the advantages of improve production efficiency.
In order to realize the above-mentioned purpose of the present invention, spy employs the following technical solutions:
In a kind of tft-lcd manufacturing process, the preparation method of two-sided functional piece, comprises the steps:
(1) functional electrode layer is prepared on the panel of substrate both sides respectively；
(2) resist layer of required form is prepared respectively on the functional electrode layer prepared by step (1)；
(3) the functional electrode layer of step (2) gained substrate both sides is performed etching process simultaneously；
(4) resist layer of the required form on the substrate after step (3) gained etching is removed, obtain both sides and have respectively
There is the substrate of required form functional electrode；
(5) on the functional electrode with required form of substrate both sides, and side design silver wire position on substrate
Opposite side corresponding position prepare windows be protected glue-line respectively；
(6) prepare silver wire respectively at the design silver wire position of substrate both sides；
After described step (5) or step (6), to regarding of the opposite side corresponding position that silver wire position is designed on substrate
Window Protection glue is modified, and obtains insulating cement；
(7) remove the windows be protected glue on required form functional electrode on substrate, obtain two-sided functional piece.
The preparation method process is simple of two-sided functional piece in tft-lcd manufacturing process of the present invention, by form in traditional handicraft
The preparation process of protection glue-line and insulation glue-line is integrated into 1 step, afterwards can be according to practical situation, to design silver wire position on substrate
The windows be protected glue of opposite side corresponding position carry out quick modification, obtain insulating cement, it is to avoid in substrate both sides consumption
Take the plenty of time, windows be protected glue-line and the preparation of insulation glue-line are repeated, saving can be had to rise substrate both sides all there is work(
The production time of the two-sided functional piece of energy electrode, improve production efficiency.
In described step (1), substrate is glass substrate.
Before preparing functional electrode layer respectively on the panel of substrate both sides, described substrate surface is carried out.Available
The liquid such as deionized water, ethanol are carried out, and cleaning can remove dust and spot on glass substrate, prevents in glass base
On piece, the functional electrode of preparation produces impact it is ensured that the performance of functional electrode, after carrying out after the volatilization of substrate surface cleanout fluid again
Continuous technique, can accelerate the volatilization of substrate surface cleanout fluid by the way of heating up.
The method that described step (1) prepares functional electrode layer on the panel of substrate both sides respectively includes sputtering, vacuum is steamed
Plating, ion plating or chemical vapor deposition.Functional electrode layer is prepared on the panel of substrate both sides, preferably carries out simultaneously, contribute to saving
Province substrate both sides all have the production time of the tft-lcd of functional electrode, improve production efficiency.
Described functional electrode layer is preferably ito layer, in tft-lcd manufacturing process, ito (indium tin oxide, oxygen
Change indium stannum) rely on its own excellent characteristic, it is widely used in making transparent display electrode.
The resist layer of required form is prepared respectively on the functional electrode layer prepared by step (1) in described step (2)
Method include photoetching process or stencil methods.
Described photoetching process comprises the steps:
Prepare resist layer on functional electrode layer, using ultraviolet by there is the template of required form to resist layer
Carry out illumination, remove the resist layer crossed by ultraviolet illumination, obtain that there is the not against corrosion by ultraviolet illumination of required form
Oxidant layer.
Resist in photoetching process is preferably photoresist, and photoresist has two kinds, positive photoresist (positive
) and negative sense photoresist (negative photoresist) photoresist；Positive photoresist is one kind of photoresist, its photograph
Part to light can be dissolved in photoresistance developer solution, and the part without shining light will not be dissolved in photoresistance developer solution；Negative sense photoresist is
One kind of photoresist, it shines the part of light and will not be dissolved in photoresistance developer solution, and the part without shining light can be dissolved in photoresistance and show
Shadow liquid.
The mode preferably employing spin coating prepares described resist layer, and that is, in preparation process, substrate is around geometric center
Rotate in the horizontal direction, resist automatic film paving is made by centrifugal force, improve plastic film mulch efficiency, obtain resist in uniform thickness
Layer.
Described stencil methods comprise the steps:
On functional electrode layer, the mode using mould printing directly prepares the resist layer with required form.
Using the mode of mould printing, the resist layer of required form directly can be prepared on functional electrode layer,
Compare photoetching process, be not required to carry out plastic film mulch, be not required to remove unnecessary resist, contribute to saving substrate both sides and all there is functional electrode
Two-sided functional piece production time, improve production efficiency.
According to can resist property, substrate both sides functional electrode layer has the resist layer of required form
In preparation process, substrate both sides can be manufactured separately, after side functional electrode layer is prepared the resist layer of required form, preferably
Solidified, then the resist layer of required form is prepared on opposite side functional electrode layer, preferably by opposite side functional electrode
After the resist layer solidification of the required form prepared on layer, then gained substrate is carried out follow-up both sides etching technics simultaneously.
According to the property of the resist being used, can be irradiated using ultraviolet modified, or heating makes the modes such as solvent volatilization
Carry out the solidification of the resist layer of required form.
Before the functional electrode layer of step (2) gained substrate both sides is performed etching process, to having functional electrode simultaneously
The substrate both sides of layer and required form resist layer are carried out.Can the liquid such as deionized water be carried out, cleaning can be gone
The dust producing in previous process except substrate both sides and spot, prevent the impact to subsequent etching processes, according to practical situation,
Carry out subsequent technique again after the cleanout fluid volatilization of substrate both sides, waving of substrate surface cleanout fluid can be accelerated by the way of heating up
Send out.
Using solvent, the resist layer dissolving of the required form of the substrate both sides after step (3) gained etching is removed.Root
According to the resist being used, dissolved from suitable solvent, aqueous solvent can be deionized water, developer solution etc., You Jirong
Agent is ethanol, ether, acetone or benzene etc..
After the resist layer of the required form of substrate both sides is removed, respectively obtain the work(of required form in substrate both sides
Can electrode layer.The many of required form can be prepared according to design needs, repeat the above steps (1)-(4) in substrate both sides respectively
Layer function electrode layer, then carry out subsequent technique.
Silver wire is prepared in described step (6) by the way of printing on substrate.
Preferably nanometer silver is scattered in solvent, nanometer silver liquidus is printed afterwards on substrate, afterwards can be using intensification etc.
Mode makes solvent volatilize, and obtains nano-silver thread；Each functional electrode on substrate is connected with 1 nano-silver thread respectively, described receives
Rice silver wire should extend to substrate edge, is easy to be connected with miscellaneous part.
The mode that the windows be protected glue of the opposite side corresponding position designing silver wire position on substrate is modified includes
Photoresist is added on the windows be protected glue of opposite side corresponding position that silver wire position is designed on substrate and passes through ultraviolet lighting
Inject interpolation sclerosing agent in row solidification, or the windows be protected glue of opposite side corresponding position of design silver wire position on substrate to enter
Row solidification.
Described photoresist is preferably photo-crosslinking type photoresist, fast reaction can be obtained crosslinking net by after ultraviolet light
Structure, the windows be protected glue together with the opposite side corresponding position designing silver wire position on substrate solidifies, and forms insulating cement,
And the bond strength of gained insulating cement is better than windows be protected glue, make removing is carried out to windows be protected glue, will not be to insulating cement
Bonding with substrate produces impact.
Described sclerosing agent can be aliphatic sclerosing agent, alicyclic sclerosing agent, amide sclerosing agent, aromatic hardener etc., excellent
Elect alicyclic sclerosing agent as, the viscosity of alicyclic sclerosing agent relatively low it is easy to be added, and the response time is very fast, is easy to quick
Solidification, can make the windows be protected glue designing the opposite side corresponding position of silver wire position on substrate modified solid using sclerosing agent
Change, form insulating cement, can suitably heat up and reduce its hardening time, strengthen the bond strength with substrate, the combination of gained insulating cement
Intensity is better than windows be protected glue, makes carrying out removing to windows be protected glue, will not produce impact to the bonding of insulating cement and substrate.
Adding photoresist or the mode of sclerosing agent is dispensing.Preferably employ high speed point gum machine and carry out dispensing operation, to improve
Production efficiency.
The bond strength of windows be protected glue and functional electrode, natural degumming can be reduced, be easy to using intensification or low temperature regime
Remove the windows be protected glue on required form functional electrode on substrate, obtain two-sided functional piece.
Compared with prior art, the invention has the benefit that
The preparation method process is simple of two-sided functional piece in tft-lcd manufacturing process of the present invention, by form in traditional handicraft
The preparation process of protection glue-line and insulation glue-line is integrated into 1 step, afterwards can be according to practical situation, to design silver wire position on substrate
The windows be protected glue of opposite side corresponding position carry out quick modification, obtain insulating cement, it is to avoid in substrate both sides consumption
Take the plenty of time, windows be protected glue-line and the preparation of insulation glue-line are repeated, saving can be had to rise substrate both sides all there is work(
The production time of the two-sided functional piece of energy electrode, improve production efficiency.
Brief description
In order to be illustrated more clearly that the specific embodiment of the invention or technical scheme of the prior art, below will be to concrete
In embodiment or description of the prior art the accompanying drawing of required use be briefly described it should be apparent that, below describe in
Accompanying drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not paying creative work
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
The structural representation of the etching device that Fig. 1 is used by the embodiment of the present invention 1 etching process；
Reference:
1- etching groove；2- filter tank；3- defecator；
4- circulating device；Groove before 5- filter；6- filters pit.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, technical scheme is clearly and completely described, but
It is it will be understood to those of skill in the art that following described embodiment is a part of embodiment of the present invention rather than whole
Embodiment, is merely to illustrate the present invention, and is not construed as limiting the scope of the present invention.Based on the embodiment in the present invention, ability
The every other embodiment that domain those of ordinary skill is obtained under the premise of not making creative work, broadly falls into the present invention and protects
The scope of shield.Unreceipted actual conditions person in embodiment, the condition according to normal condition or manufacturer's suggestion is carried out.Agents useful for same
Or the unreceipted production firm person of instrument, being can be by the commercially available conventional products bought and obtain.
In describing the invention, it should be noted that term " " center ", " on ", D score, "left", "right", " vertical ",
The orientation of instruction such as " level ", " interior ", " outward " or position relationship are based on orientation shown in the drawings or position relationship, merely to
Be easy to describe the present invention and simplify description, rather than instruction or the hint device of indication or element must have specific orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.Additionally, term " first ", " second ",
" the 3rd " is only used for describing purpose, and it is not intended that indicating or hint relative importance.
In describing the invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or is integrally connected；Can
To be to be mechanically connected or electrical connection；Can be to be joined directly together it is also possible to be indirectly connected to by intermediary, Ke Yishi
The connection of two element internals.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Embodiment 1
In a kind of tft-lcd manufacturing process, the preparation method of two-sided functional piece, comprises the steps:
(1) on the panel of substrate both sides, ito functional electrode layer is formed respectively by magnetron sputtering (sputter)；
(2) adopt photoetching process, the side functional electrode layer prepared by step (1) is prepared the resist of required form
Layer；
(3) adopt the resist layer to the required form on step (2) gained ito functional electrode layer for ultraviolet light 1min
Solidified；
(4) adopt photoetching process, the opposite side functional electrode layer prepared by step (1) is prepared the resist of required form
Layer；
(5) adopt the resist layer to the required form on step (4) gained ito functional electrode layer for ultraviolet light 1min
Solidified；
(6) adopt etching device as shown in Figure 1, the functional electrode layer of step (5) gained substrate both sides is carried out simultaneously
Etching processing；Etching liquid can use hcl, hno3、h2The mixed solution of o, volume ratio is hcl:hno3: h2O=9:1:6, etching liquid
Middle h+Concentration be preferably 6.5mol/l；
(7) use benzene to remove the resist layer dissolving of the required form on the substrate after step (6) gained etching, obtain
Both sides are respectively provided with the substrate of required form functional electrode；
(8) on the functional electrode with required form of substrate both sides, and side design silver wire position on substrate
Opposite side corresponding position prepare windows be protected glue-line respectively；
(9) prepare silver wire respectively at the design silver wire position of substrate both sides；
(10) dispensing on the windows be protected glue of opposite side corresponding position of silver wire position is designed on substrate and adds light friendship
Connection type photoresist is simultaneously solidified by ultraviolet light 1min, obtains insulating cement；
(11) remove the windows be protected glue on required form functional electrode on substrate, obtain two-sided functional piece.
Etching device structure used by the present embodiment is as shown in figure 1, described etching device includes one or more etching groove 1 Hes
Filter tank 2；It is provided with defecator in described filter tank 2；Described filter tank 2 is connected by pipeline with each etching groove 1 respectively；Institute
State filter tank 2 to be connected by pipeline with circulating device, described circulating device is connected by pipeline with each etching groove 1 respectively.
The present embodiment etching device structure is simple, constitutes closed circuit between etching groove 1, filter tank 2 and circulating device, carves
Erosion liquid can circulate between etching groove 1, filter tank 2 and circulating device, by filter tank 2, etching liquid is filtered, mistake
Leach due to the carrying out of etching technics, the waste residue being mixed with etching liquid, ensure that etching technics is continuously continual and carry out, energy
Enough improve production efficiencies and the utilization ratio of etching liquid.
Described defecator is filter net device, and described filter net device includes one or more layers filter screen being superimposed, described filter screen
Filter tank 2 is divided into groove 5 and filter pit 6 before filter by device, and before wherein filtering, groove 5 is connected by pipeline with each etching groove 1 respectively, filter
Pit 6 is connected by pipeline with circulating device.
Filter net device can effectively be filtered to the waste residue in etching liquid it is ensured that the quality of filter liquor is it is ensured that etch work
Being normally carried out of skill.Multistorey strainer mesh can be set, be favorably improved filter efficiency it is ensured that the quality of filter liquor.
Arbitrary etching groove 1 position is higher than filter tank 2 tip position.
The position of etching groove 1 is set above filter tank 2, contributes to making the etching liquid in etching groove 1 rely on gravity, from
Dynamic outflow, flows in filter tank 2, and energy saving is it is ensured that etching liquid flows.
Described filter tank 2 is connected by pipeline with each etching groove 1 bottom respectively.
Etching liquid outlet in etching groove 1 is arranged on etching groove 1 bottom, contributes to produced useless in etching groove 1
Slag in time exclusion is it is ensured that the quality of etching liquid is it is ensured that etching technics is continuous, efficiently, carry out in high quality in etching groove 1.
Described circulating device is higher than arbitrary etching groove 1 top.
The position of circulating device is set above arbitrary etching groove 1, circulating device can will be passed through in filter tank 2
The etching liquid of filter takes out height, and along pipeline, relies on gravity, automatically flow out, flow in filter tank 2, energy saving is it is ensured that etching liquid follows
Circulation moves.
Described circulating device is connected by pipeline with each etching groove 1 top respectively.Contribute to the etching liquid through filtering
Smoothly flow back in etching groove 1 it is ensured that being smoothed out of circulating of etching liquid.
Each etching groove 1 is connected with feed tube respectively.Described feed tube is used for the interpolation of new etching liquid or supplement, described enter
In liquid pipe, valve is set, for controlling interpolation or the magnitude of recruitment of new etching liquid.
It is respectively provided with cover plate on each etching groove 1.Contribute to preventing etching liquid to be contaminated.
Filter tank 2 cover plate is arranged on filter tank 2.Contribute to preventing etching liquid to be contaminated.
On every pipeline that described circulating device is connected with each etching groove 1, it is respectively provided with valve, in certain etching groove 1
In the case of not performing etching technique, can be by corresponding valve closing, then etching liquid after filtering is no longer flow into this etching groove 1
In.
Described circulating device is pump.
Be respectively provided with spray equipment on each etching groove 1, spray equipment can to sticking in etching groove 1, pipeline in/out
Waste residue at mouthful is carried out removing.
A kind of using method of above-mentioned etching device, comprises the steps:
Add etching liquid in etching groove 1, open circulating device, make etching liquid successively along etching groove 1, filter tank 2, circulation
Device, the direction of etching groove 1 are circulated flowing, perform etching technique in etching groove 1, according to practical situation, to filter tank 2
In waste residue cleared up.
The using method process is simple of etching device of the present invention, etching liquid reuse during for circulating, and and
Shi Jinhang filtration, it is ensured that the quality of etching liquid, can be carried out to the waste residue of accumulation in filter tank 2 according to actually used situation
Clear up in time, this process is not required to shut down, and can be carried out continuously etching technics, it is possible to increase the utilization effect of production efficiency and etching liquid
Rate.
Embodiment 2
In a kind of tft-lcd manufacturing process, the preparation method of two-sided functional piece, comprises the steps:
(1) on the panel of substrate both sides, ito functional electrode layer is formed respectively by magnetron sputtering (sputter)；
(2) adopt stencil methods, the side functional electrode layer prepared by step (1) prepares the against corrosion of required form
Oxidant layer；
(3) adopt the resist layer to the required form on step (2) gained ito functional electrode layer for ultraviolet light 1min
Solidified；
(4) adopt stencil methods, the opposite side functional electrode layer prepared by step (1) is prepared the anti-of required form
Erosion oxidant layer；
(5) adopt the resist layer to the required form on step (4) gained ito functional electrode layer for ultraviolet light 1min
Solidified；
(6) adopt etching device as shown in Figure 1, the functional electrode layer of step (5) gained substrate both sides is carried out simultaneously
Etching processing；Etching liquid can use hcl, hno3、h2The mixed solution of o, volume ratio is hcl:hno3: h2O=9:1:6, etching liquid
Middle h+Concentration be preferably 6.5mol/l；
(7) use benzene to remove the resist layer dissolving of the required form on the substrate after step (6) gained etching, obtain
Both sides are respectively provided with the substrate of required form functional electrode；
(8) on the functional electrode with required form of substrate both sides, and side design silver wire position on substrate
Opposite side corresponding position prepare windows be protected glue-line respectively；
(9) dispensing interpolation on the windows be protected glue of opposite side corresponding position of silver wire position is designed on substrate alicyclic
Sclerosing agent, 5min solidify afterwards complete, and obtain insulating cement；
(10) prepare silver wire respectively at the design silver wire position of substrate both sides；
(11) remove the windows be protected glue on required form functional electrode on substrate, obtain two-sided functional piece.
Although illustrate and describing the present invention with specific embodiment, but it will be appreciated that without departing substantially from the present invention's
Many other changes can be made in the case of spirit and scope and change.It is, therefore, intended that in the following claims
Including all such changes and modifications belonging in the scope of the invention.
Claims (10)
1. in a kind of tft-lcd manufacturing process the preparation method of two-sided functional piece it is characterised in that comprising the steps:
(1) functional electrode layer is prepared on the panel of substrate both sides respectively；
(2) resist layer of required form is prepared respectively on the functional electrode layer prepared by step (1)；
(3) the functional electrode layer of step (2) gained substrate both sides is performed etching process simultaneously；
(4) resist layer of the required form on the substrate after step (3) gained etching is removed, obtain both sides and be respectively provided with institute
Need the substrate of shape functional electrode；
(5) on the functional electrode with required form of substrate both sides, and the another of silver wire position is designed in side on substrate
Side corresponding position prepares windows be protected glue-line respectively；
(6) prepare silver wire respectively at the design silver wire position of substrate both sides；
After described step (5) or step (6), the form of the opposite side corresponding position that substrate designs silver wire position is protected
Shield glue is modified, and obtains insulating cement；
(7) remove the windows be protected glue on required form functional electrode on substrate, obtain two-sided functional piece.
2. in a kind of tft-lcd manufacturing process according to claim 1 two-sided functional piece preparation method, its feature exists
In in described step (1), substrate is glass substrate.
3. in a kind of tft-lcd manufacturing process according to claim 1 two-sided functional piece preparation method, its feature exists
In, the method that described step (1) prepares functional electrode layer on the panel of substrate both sides respectively include sputtering, vacuum evaporation, from
Son plating or chemical vapor deposition.
4. in a kind of tft-lcd manufacturing process according to claim 1 two-sided functional piece preparation method, its feature exists
In the method that the resist layer of required form is prepared respectively on the functional electrode layer prepared by step (1) in described step (2)
Including photoetching process or stencil methods.
5. in a kind of tft-lcd manufacturing process according to claim 4 two-sided functional piece preparation method, its feature exists
In described photoetching process comprises the steps:
Prepare resist layer on functional electrode layer, by the template with required form, resist layer is carried out using ultraviolet
Illumination, removes the resist layer crossed by ultraviolet illumination, obtain having required form not by the resist layer of ultraviolet illumination.
6. in a kind of tft-lcd manufacturing process according to claim 5 two-sided functional piece preparation method, its feature exists
In preparing described resist layer by the way of spin coating.
7. in a kind of tft-lcd manufacturing process according to claim 4 two-sided functional piece preparation method, its feature exists
In described stencil methods comprise the steps:
On functional electrode layer, the mode using mould printing directly prepares the resist layer with required form.
8. in a kind of tft-lcd manufacturing process according to claim 1 two-sided functional piece preparation method, its feature exists
In described step (6) is middle to prepare silver wire by the way of printing on substrate.
9. in a kind of tft-lcd manufacturing process according to claim 1 two-sided functional piece preparation method, its feature exists
In including the mode that is modified of windows be protected glue of the opposite side corresponding position that silver wire position is designed on substrate in substrate
Add photoresist on the windows be protected glue of opposite side corresponding position of upper design silver wire position and carried out by ultraviolet light
Add sclerosing agent in solidification, or the windows be protected glue of opposite side corresponding position of design silver wire position on substrate to carry out admittedly
Change.
10. in a kind of tft-lcd manufacturing process according to claim 9 two-sided functional piece preparation method, its feature exists
In adding photoresist or the mode of sclerosing agent is dispensing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610751613.8A CN106371232A (en) | 2016-08-29 | 2016-08-29 | Preparation method of double-sided functional piece in TFT-LCD production technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610751613.8A CN106371232A (en) | 2016-08-29 | 2016-08-29 | Preparation method of double-sided functional piece in TFT-LCD production technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106371232A true CN106371232A (en) | 2017-02-01 |
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| JPH0468315A (en) * | 1990-07-09 | 1992-03-04 | Seiko Epson Corp | Transparent conductive film and production thereof |
| US20020081761A1 (en) * | 2000-12-27 | 2002-06-27 | Chien-Chih Chen | Method of manufacturing a display unit of a flat display panel having a wide viewing angle |
| CN103294306A (en) * | 2013-05-09 | 2013-09-11 | 晟光科技股份有限公司 | Simplified production method for capacitive touch screen |
| CN103862897A (en) * | 2014-02-27 | 2014-06-18 | 黄石瑞视光电技术股份有限公司 | Touch screen ITO (Indium Tin Oxide) glass screen printing process |
| CN104298407A (en) * | 2013-07-15 | 2015-01-21 | E和H有限公司 | Electrostatic capacity type touch screen panel and method for fabricating the same |
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- 2016-08-29 CN CN201610751613.8A patent/CN106371232A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0468315A (en) * | 1990-07-09 | 1992-03-04 | Seiko Epson Corp | Transparent conductive film and production thereof |
| US20020081761A1 (en) * | 2000-12-27 | 2002-06-27 | Chien-Chih Chen | Method of manufacturing a display unit of a flat display panel having a wide viewing angle |
| CN103294306A (en) * | 2013-05-09 | 2013-09-11 | 晟光科技股份有限公司 | Simplified production method for capacitive touch screen |
| CN104298407A (en) * | 2013-07-15 | 2015-01-21 | E和H有限公司 | Electrostatic capacity type touch screen panel and method for fabricating the same |
| CN103862897A (en) * | 2014-02-27 | 2014-06-18 | 黄石瑞视光电技术股份有限公司 | Touch screen ITO (Indium Tin Oxide) glass screen printing process |
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