CN106366995A - High-elasticity high-heat-dissipation adhesive - Google Patents
High-elasticity high-heat-dissipation adhesive Download PDFInfo
- Publication number
- CN106366995A CN106366995A CN201610750597.0A CN201610750597A CN106366995A CN 106366995 A CN106366995 A CN 106366995A CN 201610750597 A CN201610750597 A CN 201610750597A CN 106366995 A CN106366995 A CN 106366995A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A high-elasticity high-heat-dissipation adhesive is characterized by being prepared from a substrate and solid filler, the weight ratio of the substrate to the solid filler is 1:4 to 1:8, the solid filler comprises, by weight, 40-60 parts of silicon carbon particles, 20-40 parts of silicon dioxide particles and 35-60 parts of aluminum oxide particles, and the substrate comprises, by weight, 100 parts of epoxy resin modified by silica gel, 2-4 parts of silane coupling agent, 40-60 parts of curing agent, 20-40 parts of diluent, 5-10 parts of defoaming agent and 10-20 parts of dispersing agent. By adding high-heat-dissipation silicon carbon particles, silicon dioxide particles and aluminum oxide particles to the adhesive, strength is improved, and the heat transmission capacity of the cured adhesive is improved.
Description
Technical field
The present invention relates to adhesive field, more particularly to a kind of binding agent of high resiliency height radiating.
Background technology
With the development of technology, the measure of precision more and more higher of some dynamic equipment, to basic requirement also more and more higher, especially
It is to propose tightened up requirement to basic anti-seismic performance.Example bonds as used in epoxy resin between dynamic equipment and basis
Agent can effectively reduce equipment and shake to basic destruction, simultaneously as epobond epoxyn is chemical grouting material, it is right
Acidity of Aikalinity also has certain repellence, and equipment is played a very good protection.
But, because the fragility of epoxy resin is big, frangible during sharp pounding, relatively high power and/or larger speed are moved
Equipment, existing epoxy resin grouting material can not meet the requirement of higher and higher freedom from vibration and impact resistance, meanwhile, ring
The cost of oxygen tree fat grouting material is also higher.Therefore, it is badly in need of developing a kind of resistance to compression and rupture strength is higher and the binding agent of low cost,
With produced vibrations when avoiding dynamic equipment to run, this is accomplished by seeking the larger adhesive material of elasticity.
Content of the invention
It is an object of the invention to avoiding weak point of the prior art and providing that a kind of elasticity is big, radiating efficiency is high
Binding agent.
The purpose of the present invention is achieved through the following technical solutions:
There is provided a kind of high resiliency high radiating binding agent it is characterised in that being made up of substrate and solid fillers, substrate and described solid-state
The weight of filler is than for 1: 4 to 1: 8；
Wherein, the parts by weight of described solid fillers consist of:
Silicon-carbide particle 40-60
Silica dioxide granule 20-40
Alumina particle 35-60；
The parts by weight of described substrate consist of:
The modified epoxy resin 100 of silica gel
Silane couplent 2-4
Firming agent 40-60
Diluent 20-40
Defoamer 5-10
Dispersant 10-20.
Or, provide a kind of high resiliency high radiating binding agent it is characterised in that being made up of substrate and solid fillers, substrate with
The weight of described solid fillers is than for 1: 4 to 1: 8；
Wherein, the parts by weight of described solid fillers consist of:
Silicon-carbide particle 40-60
Silica dioxide granule 20-40
Alumina particle 35-60；
The parts by weight of described substrate consist of:
Epoxy resin 100
Silica gel 30-60
Silane couplent 5-10
Firming agent 40-60
Diluent 10-20
Defoamer 10-20
Dispersant 20-40.
According to embodiments of the invention, wherein, described solid fillers also include heat radiating metal nano-particle.
According to embodiments of the invention, wherein, described heat radiating metal nano-particle includes ferrum, copper, aluminum and its alloy, and its
Parts by weight are 5-10, and particle size is 50-200 nanometer.
According to embodiments of the invention, wherein, the particle diameter of described silicon-carbide particle, silica dioxide granule and alumina particle
For 0.5-2 micron.
According to embodiments of the invention, wherein, described dispersant is high molecular polymer.
According to embodiments of the invention, wherein, described defoamer is siliceous class defoamer.
According to embodiments of the invention, wherein, described firming agent is alicyclic ring ammonia or polyetheramine.
According to embodiments of the invention, wherein, described diluent is epoxy radicals diluent.
Beneficial effects of the present invention:
Compared with prior art, high resiliency provided by the present invention high radiating binding agent does not only have epoxide group, has silicon simultaneously
The modified epoxy resin of glue or silica gel, give the higher adhesive strength of binding agent and toughness；And the alicyclic ring employed in firming agent
Ammonia and polyetheramine, then further increase toughness and the intensity of grouting material, effectively reduces dynamic equipment to basic impact and shake
Dynamic, extend the service life on equipment and basis；Simultaneously as silica gel modified epoxy has epoxy resin and poly- ammonia simultaneously
The dual property of ester, so have more preferable resistance to water and oil resistivity；The carborundum of high radiating, silicon dioxide and aluminium oxide granule
Grain, improves intensity, and improves the capacity of heat transmission after binding agent solidification；Add the nano-particle of the metals such as ferrum, thermal diffusivity
It is further enhanced, and be formed about decalescence point so that curing rate gets a promotion in nano-particle, and its parts by weight
For 5-10, do not interfere with the electric conductivity of binding agent it is ensured that the insulating properties of binding agent.
Specific embodiment
With reference to embodiments the present invention is described in further detail.
Embodiment 1
A kind of high resiliency high radiating binding agent is provided, is made up of substrate and solid fillers, the weight of substrate and described solid fillers
Than for 1: 8；
Wherein, the parts by weight of described solid fillers consist of:
Silicon-carbide particle 60
Silica dioxide granule 40
Alumina particle 50；
The parts by weight of described substrate consist of:
The modified epoxy resin 100 of silica gel
Silane couplent 2
Firming agent 40
Diluent 20
Defoamer 5
Dispersant 10.
Wherein, the particle diameter of described silicon-carbide particle, silica dioxide granule and alumina particle is 0.5-2 micron.Described
Dispersant is high molecular polymer.Described defoamer is siliceous class defoamer.Described firming agent is alicyclic ring ammonia or polyetheramine.Institute
Stating diluent is epoxy radicals diluent.The modified epoxy resin of described silica gel, is by under acidity or alkaline environment, by silica gel
Carry out being cross-linked to form copolymer with epoxy resin.
Embodiment 2
A kind of high resiliency high radiating binding agent is provided, is made up of substrate and solid fillers, the weight of substrate and described solid fillers
Than for 1: 4；
Wherein, the parts by weight of described solid fillers consist of:
Silicon-carbide particle 40
Silica dioxide granule 30
Alumina particle 50；
The parts by weight of described substrate consist of:
The modified epoxy resin 100 of silica gel
Silane couplent 2
Firming agent 40
Diluent 40
Defoamer 5
Dispersant 10.
Wherein, described solid fillers also include heat radiating metal nano-particle.Described heat radiating metal nano-particle include ferrum,
Copper, aluminum and its alloy, and its parts by weight is 5-10, particle size is 50-200 nanometer.Described silicon-carbide particle, silicon dioxide
The particle diameter of granule and alumina particle is 0.5-2 micron.Described dispersant is high molecular polymer.Described defoamer be containing
Silicon class defoamer.Described firming agent is alicyclic ring ammonia or polyetheramine.Described diluent is epoxy radicals diluent.
Embodiment 3
There is provided a kind of high resiliency high radiating binding agent it is characterised in that being made up of substrate and solid fillers, substrate and described solid-state
The weight of filler is than for 1: 5；
Wherein, the parts by weight of described solid fillers consist of:
Silicon-carbide particle 50
Silica dioxide granule 30
Alumina particle 40；
The parts by weight of described substrate consist of:
Epoxy resin 100
Silica gel 40
Silane couplent 10
Firming agent 50
Diluent 10
Defoamer 20
Dispersant 30.
Wherein, described solid fillers also include heat radiating metal nano-particle.Described heat radiating metal nano-particle include ferrum,
Copper, aluminum and its alloy, and its parts by weight is 5-10, particle size is 50-200 nanometer.Described silicon-carbide particle, silicon dioxide
The particle diameter of granule and alumina particle is 0.5-2 micron.Described dispersant is high molecular polymer.Described defoamer be containing
Silicon class defoamer.Described firming agent is alicyclic ring ammonia or polyetheramine.Described diluent is epoxy radicals diluent.
Finally it should be noted that above example is merely to illustrate technical scheme rather than the present invention is protected
The restriction of scope, although being explained in detail to the present invention with reference to preferred embodiment, those of ordinary skill in the art should manage
Solution, technical scheme can be modified or equivalent, without deviating from technical solution of the present invention essence and
Scope.
Claims (9)
1. a kind of high resiliency high radiating binding agent it is characterised in that being made up of substrate and solid fillers, filled out with described solid-state by substrate
The weight of material is than for 1: 4 to 1: 8；
Wherein, the parts by weight of described solid fillers consist of:
Silicon-carbide particle 40-60
Silica dioxide granule 20-40
Alumina particle 35-60；
The parts by weight of described substrate consist of:
The modified epoxy resin 100 of silica gel
Silane couplent 2-4
Firming agent 40-60
Diluent 20-40
Defoamer 5-10
Dispersant 10-20.
2. a kind of high resiliency high radiating binding agent it is characterised in that being made up of substrate and solid fillers, filled out with described solid-state by substrate
The weight of material is than for 1: 4 to 1: 8；
Wherein, the parts by weight of described solid fillers consist of:
Silicon-carbide particle 40-60
Silica dioxide granule 20-40
Alumina particle 35-60；
The parts by weight of described substrate consist of:
Epoxy resin 100
Silica gel 30-60
Silane couplent 5-10
Firming agent 40-60
Diluent 10-20
Defoamer 10-20
Dispersant 20-40.
3. high resiliency according to claim 1 and 2 high radiating binding agent is it is characterised in that described solid fillers also include
Heat radiating metal nano-particle.
4. high resiliency according to claim 3 high radiating binding agent is it is characterised in that described heat radiating metal nano-particle bag
Include ferrum, copper, aluminum and its alloy, and its parts by weight is 5-10.
5. high resiliency according to claim 1 and 2 high radiating binding agent is it is characterised in that described silicon-carbide particle, dioxy
The particle diameter of silicon carbide particle and alumina particle is 0.5-2 micron.
6. high resiliency according to claim 1 and 2 high radiating binding agent is it is characterised in that described dispersant is high score
Sub- polymer.
7. high resiliency according to claim 1 and 2 high radiating binding agent is it is characterised in that described defoamer is siliceous
Class defoamer.
8. high resiliency according to claim 1 and 2 high radiating binding agent is it is characterised in that described firming agent is alicyclic ring ammonia
Or polyetheramine.
9. high resiliency according to claim 1 and 2 high radiating binding agent is it is characterised in that described diluent is epoxy radicals
Diluent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610750597.0A CN106366995A (en) | 2016-08-30 | 2016-08-30 | High-elasticity high-heat-dissipation adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610750597.0A CN106366995A (en) | 2016-08-30 | 2016-08-30 | High-elasticity high-heat-dissipation adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106366995A true CN106366995A (en) | 2017-02-01 |
Family
ID=57903053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610750597.0A Pending CN106366995A (en) | 2016-08-30 | 2016-08-30 | High-elasticity high-heat-dissipation adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106366995A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107337464A (en) * | 2016-12-29 | 2017-11-10 | 宣城晶瑞新材料有限公司 | A kind of inorganic high-temperature resistant adhesive and preparation method thereof |
| CN108644658A (en) * | 2018-04-23 | 2018-10-12 | 东莞市闻誉实业有限公司 | Headlamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101440267A (en) * | 2008-12-09 | 2009-05-27 | 张家港西一新型汽车配件有限公司 | Adhesive for shock resistance structure of automobile |
| CN102391818A (en) * | 2011-09-29 | 2012-03-28 | 秦会斌 | Insulated thermal conductive adhesive and preparation method thereof |
| CN102417337A (en) * | 2011-09-02 | 2012-04-18 | 中国石油化工股份有限公司 | Polyurethane modified epoxy resin grouting material |
| CN102719210A (en) * | 2011-03-30 | 2012-10-10 | 中国科学院理化技术研究所 | Adhesive with insulating and heat-conducting properties used at ultralow temperature |
-
2016
- 2016-08-30 CN CN201610750597.0A patent/CN106366995A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101440267A (en) * | 2008-12-09 | 2009-05-27 | 张家港西一新型汽车配件有限公司 | Adhesive for shock resistance structure of automobile |
| CN102719210A (en) * | 2011-03-30 | 2012-10-10 | 中国科学院理化技术研究所 | Adhesive with insulating and heat-conducting properties used at ultralow temperature |
| CN102417337A (en) * | 2011-09-02 | 2012-04-18 | 中国石油化工股份有限公司 | Polyurethane modified epoxy resin grouting material |
| CN102391818A (en) * | 2011-09-29 | 2012-03-28 | 秦会斌 | Insulated thermal conductive adhesive and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107337464A (en) * | 2016-12-29 | 2017-11-10 | 宣城晶瑞新材料有限公司 | A kind of inorganic high-temperature resistant adhesive and preparation method thereof |
| CN108644658A (en) * | 2018-04-23 | 2018-10-12 | 东莞市闻誉实业有限公司 | Headlamp |
| CN108644658B (en) * | 2018-04-23 | 2021-02-05 | 东莞市闻誉实业有限公司 | Lighting lamp |
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| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170201 |
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| WD01 | Invention patent application deemed withdrawn after publication |