CN103396655A - Potting adhesive for magnetorheological dampers, and preparation and application methods thereof - Google Patents
Potting adhesive for magnetorheological dampers, and preparation and application methods thereof Download PDFInfo
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Abstract
The invention discloses a potting adhesive for magnetorheological dampers, which comprises an epoxy resin component and a curing agent component, wherein the epoxy resin component comprises the following components in parts by weight: 100 parts of bisphenol A epoxy resin, 1-45 parts of reactive diluent and 1-45 parts of polyether toughener; and the curing agent component comprises the following components in parts by weight: 1-25 parts of aliphatic polyamine, 1-25 parts of low-molecular polyamide and 1-45 parts of iminazole curing agent. The invention also provides a preparation method and application method of the potting adhesive for magnetorheological dampers.
Description
Technical field
The present invention relates to the MR damper field, be specifically related to a kind of MR damper joint sealant and preparation and application thereof.
Background technology
MR damper is a kind of new type vibration isolator of applying magnetic flow liquid, half ACTIVE CONTROL that can be used for vibrating, its advantage be damping force continuously along contrary adjustable, the damping force variable range is wide, response is rapid, environment resistant strong, simple in structure and the required input energy is low, at aspects such as controllable suspension system, household electrical appliance, artificial limb vibroshock and buildings vibration dampings, be used widely.MR damper is to realize vibration damping by the viscosity that electromagnetic conversion is controlled magnetic flow liquid (Magnetorhelogical Fluids, be called for short MRF), its essence is that solenoid by deoscillator inside fills/cuts off the power supply to realize electromagnetic conversion; So-called magnetic flow liquid mainly is comprised of base fluid (water, ethylene glycol, synthetic motor oil, mineral oil, silicone oil etc.), magnetic-particle (ferrocobalt, iron-nickel alloy, carbonyl iron dust etc.) and additive (oleic acid, silica gel, Si oxide etc.) three parts.Because the characteristic of magnetic flow liquid often easily causes corrosion to cause magnetic flow liquid to leak to the surface coated insulating material of deoscillator solenoid.Therefore the insulating material that is coated on the solenoid surface not only need with coil in insulated wire have very high cohesive strength and high globality, and need anti-magnetic flow liquid etch, leakage field is not non-conductive, duration of service long, be easy to safeguard, safe and reliable.Generally by encapsulated epoxy resin joint sealant in the deoscillator solenoid, address these problems at present.
In MR damper, the particular surroundings of solenoid has higher requirements to the performance of the epoxy pouring sealant that uses, not only needs to carry out the integral insulation coating to solenoid, the most important thing is effectively to prevent that magnetic flow liquid from leaking.The deoscillator solenoid that general room temperature curing type epoxy pouring sealant (being mainly to using amine as solidifying agent) is processed often is difficult to resist the magnetic flow liquid etch and leaks; The hot type epoxy pouring sealant, because needs could solidify through high bake for a long time, easily partly damages non-refractory in solenoid, also is not suitable for damper winding is carried out to encapsulation process.Therefore, a kind of novel ambient temperature curable of exploitation and the epoxy pouring sealant processing deoscillator solenoid of anti-magnetic flow liquid seem particularly important.
The disclosed technical scheme of prior art such as Chinese patent CN101460760A, this patent is disclosed to be had in the controllable vehicle suspension system of controllable magnetorheological fluid strut, in patent, claim has " polymer overmold moulding solenoid " and " the Overmolded solenoid of polymer ", but concrete pressure polymerization thing coating material and operation is not done to detailed requirement and explanation; In addition in the magnetorheological dampers of the disclosed unlatching yield strength with increase of Chinese patent CN102112776A, have and mention " for example nonmagnetic substance guarantees that solenoid is positioned at the correct position of central part ", but concrete pressure polymerization thing coating material and operation are not done to detailed requirement and explanation.
In MR damper, the environment for use of solenoid has higher requirement to intensity and the globality of epoxy pouring sealant; What in addition, the consideration dosing technology was selected usually is self-vulcanizing two component epoxy joint sealant.But all there are two problems in most of self-vulcanizing bicomponent epoxy resin joint sealants: 1, due to self-vulcanizing, epoxy and solidifying agent two component reaction are insufficient, make thermotolerance and mechanical strength after solidifying greatly reduce, affected globality and the reliability of solenoid in the MR damper; 2, because curing speed is too fast, operable time is very short, to dosing technology, brings very large difficulty.Because gap between between MR damper solenoid electricity magnetic induction line is very little, by common joint sealant with use common dosing technology to be difficult to make solenoid to reach service requirements.This is with regard to requiring the epoxy pouring sealant that uses to have low viscosity and long operating time, in conjunction with the rational dosing technology of science, make epoxy pouring sealant fully embedding advance solenoid, and after solidifying and coil have good globality.
Summary of the invention
The present invention is for the problem that the prior art that solves exists, and provides a kind of and meets in MR damper that the viscosity that solenoid uses is low, operable time is long, physical strength is good, globality is high, anti-magnetic flow liquid, prevented the double-component epoxy resin embedding adhesive that magnetic flow liquid leaks.
For solving the problems of the technologies described above, the present invention takes following technical scheme:
1) a kind of MR damper joint sealant, comprise epoxy resin ingredient and curing agent component, and described epoxy resin ingredient comprises by weight:
100 parts of bisphenol A epoxide resins;
1～45 part of reactive thinner;
1～45 part of polyether-type toughner;
Described curing agent component is for by weight:
1～25 part of aliphatic polyamine;
1～25 part of polymeric amide;
1～45 part of imidazole curing agent.
2) in the present invention the 1st) in an embodiment of described joint sealant, the average molecular mass of described polymeric amide is 300～2900.
3) in the present invention the 1st) or the 2nd) in an embodiment of described joint sealant, described reactive thinner is the single epoxy group(ing) thinner of aliphatics.
4) the of the present invention the 3rd) in an embodiment of described joint sealant, the single epoxy group(ing) thinner of described aliphatics is selected from least a in propylene oxide, propylene oxide methyl ether, propylene oxide ethyl ether, epoxy chloropropane, R-GLYCIDOL, epoxidation octene, glycidyl allyl ether, butylglycidyl ether, methyl propenoic acid glycidyl ether and 2-ethylhexyl glycidyl ether.
5) the of the present invention the 1st) the-the 4th) in an embodiment of the described joint sealant of any one, described polyether-type toughner is selected from least a in N-204, N-210, N-215, N-225, N-230, N-303, N-330, T-9503, T-9907 and T-9903.
6) the of the present invention the 1st) the-the 5th) in an embodiment of the described joint sealant of any one, described aliphatic polyamine is selected from least a in quadrol, hexanediamine, diethylaminopropylamine, dimethyl diamino octadiene and tetramethyl-diamino octadiene.
7) the of the present invention the 1st) the-the 6th) in an embodiment of the described joint sealant of any one, described polymeric amide is selected from least a in V-115, V-125, V-140, G-250 and G-2000.
8) the of the present invention the 1st) the-the 7th) in an embodiment of the described joint sealant of any one, described imidazole curing agent is liquid imidazole curing agent.
Described liquid imidazole curing agent is commonly referred to as at normal temperatures (0-35 ℃) and is the imidazole curing agent of liquid state.
9) the of the present invention the 1st) the-the 8th) in an embodiment of the described joint sealant of any one, described imidazole curing agent is selected from 2-ethyl-4-methylimidazole, 1-benzyl-2-ethyl imidazol(e), 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-benzyl-4, at least a in 5-bis-(cyanogen ethoxy methylene) imidazoles and 1-amino-ethyl-glyoxal ethyline.
10) the of the present invention the 1st) the-the 9th) in an embodiment of the described joint sealant of any one, the mass ratio of described epoxy resin ingredient and described curing agent component is 3.5～7:1.
11) a kind of the present invention the 1st) the-the 10th) in the described MR damper of any one with the preparation method of joint sealant, comprise
I) preparation of epoxy resin ingredient: by adding the polyether-type toughner of 1～45 portion of reactive thinner and 1～45 part in 100 parts of bisphenol A epoxide resins, be uniformly mixed; Preferred said components stirs 20～30min in reactor, stirring velocity is 5～30rpm;
Ii) the preparation of curing agent component comprises: by 1～25 part of aliphatic polyamine, 1～25 part of Versamid and 1～45 part of imidazole curing agent, be uniformly mixed.Preferred said components stirs 20～30min and mixes in reactor, rotating speed 100～300rpm.
12) a kind of the present invention the 1st) the-the 10th) in the described MR damper of any one with the using method of joint sealant, comprising:
I) by epoxy resin ingredient and solidifying agent component by weight 3.5～7:1 mix and blend;
Ii) the MR damper solenoid be impregnated in to described epoxy pouring sealant and carry out encapsulating;
Iii) that the MR damper solenoid after encapsulating is vertically standing, joint sealant is solidified.
13) in the present invention the 12nd) in an embodiment of described using method, at step I i) in, adopt technique of vacuum pressure for dipping electrical the MR damper solenoid to be carried out to the encapsulating of epoxy pouring sealant.
In using method of the present invention, preferably, also can be before carrying out encapsulating, by MR damper solenoid dry 24～48h under 100～110 ℃;
In a preferred implementation of using method of the present invention, shown in using method comprise:
By epoxy resin ingredient and solidifying agent component by weight 3.5～7:1 mix and blend; If room temperature during lower than 15 ℃, can first be placed in epoxy resin ingredient 60 ℃ of baking oven preheating 5～10min and mix;
By MR damper solenoid dry 24～48h under 100～110 ℃; Then the MR damper solenoid is put into to the vacuum pressure impregnation still, negative pressure-0.99 in maintenance 10～20min system～-0.95MPa, the epoxy pouring sealant input dipping still by mixing, then increase by 0.3～0.4Mpa pressure, keep pressure 10～20min, pressure release is to normal pressure.Obtain the MR damper of described encapsulating.
Advantage of the present invention is:
1, adopt aliphatic polyamine and imidazole curing agent to be equipped with again the solidifying agent that a small amount of Versamid mixes, not only can realize at normal temperatures solidifying but also introduce the water-fast and solvent-proof characteristic of imidazole curing agent, make this epoxy resin embedding adhesive have fabulous anti-magnetic flow liquid feature, can solve the problem that magnetic flow liquid leaks;
2, prepared epoxy glue heat-resistance index reaches 150-170 ℃ and tensile strength and reaches 40-50MPa, meets the encapsulating requirement of solenoid in MR damper;
3, by regulating each component ratio in mixed curing agent, make the operating time reach 30～50min, reach 1～2h set time;
4, related epoxy pouring sealant, in conjunction with technique of vacuum pressure for dipping electrical, can effectively be filled gap minimum in solenoid, avoids occurring air gap, further improves globality and the anti-magnetic flow liquid ability of coil.
Embodiment
The present invention is described in detail below in conjunction with embodiment, but scope of the present invention is not limited to following examples.
Embodiment 1
The MR damper joint sealant of the present embodiment, comprise epoxy resin ingredient and curing agent component, and described epoxy resin ingredient comprises by weight:
100 parts of bisphenol A epoxide resins;
1 part of reactive thinner;
1 part of polyether-type toughner;
Described curing agent component is for by weight:
25 parts of aliphatic polyamines;
1 part of polymeric amide (average molecular mass 2900);
45 parts of imidazole curing agents.
The preparation method of above-mentioned joint sealant, comprise
I) preparation of epoxy resin ingredient: by in 100 parts of bisphenol A epoxide resins, adding the polyether-type toughner of 1 portion of reactive thinner and 1 part, then in reactor, stir 20～30min, stirring velocity is 5～30rpm;
Ii) the preparation of curing agent component comprises: by 25 parts of aliphatic polyamines, 1 part of Versamid and 45 parts of imidazole curing agents, then stir 20～30min and mix, rotating speed 100～300rpm in reactor.
The method of solenoid in the joint sealant embedding MR damper of the present embodiment comprises:
1) before encapsulating, by MR damper solenoid dry 24～48h under 100～110 ℃;
When 2) encapsulating starts, epoxy resin ingredient and solidifying agent component, by weight 3.5:1, are stirred to 10～20min;
3) the cooling good MR damper solenoid of drying is put into to the vacuum pressure impregnation still, negative pressure-0.99 in maintenance 10～20min system～-0.95MPa, by the described dipping still of epoxy pouring sealant input that mixes, then increase by 0.3～0.4Mpa pressure, keep pressure 10～20min, pressure release is to normal pressure;
4) after encapsulating finishes, keep the MR damper solenoid vertically to place 1～2h, treat that joint sealant solidifies.
Prepared epoxy glue heat-resistance index reach 163.8 and tensile strength reach 42.9MPa, meet the encapsulating requirement of solenoid in MR damper.
Embodiment 2
MR damper joint sealant of the present invention, comprise epoxy resin ingredient and curing agent component, and described epoxy resin ingredient comprises by weight:
100 parts of bisphenol A epoxide resins;
25 parts of reactive thinners;
25 parts of polyether-type toughner;
Described curing agent component is for by weight:
15 parts of aliphatic polyamines;
15 parts of Versamids (average molecular mass 2900);
25 parts of imidazole curing agents.
The preparation method of above-mentioned joint sealant, comprise
I) preparation of epoxy resin ingredient: by in 100 parts of bisphenol A epoxide resins, adding the polyether-type toughner of 25 portions of reactive thinners and 25 parts, then in reactor, stir 20～30min, stirring velocity is 5～30rpm;
Ii) the preparation of curing agent component comprises: by 15 parts of aliphatic polyamines, 15 parts of Versamids and 25 parts of imidazole curing agents, then stir 20～30min and mix, rotating speed 100～300rpm in reactor.
The method of solenoid in the joint sealant embedding MR damper of the present embodiment comprises:
1) before encapsulating, by MR damper solenoid dry 24～48h under 100～110 ℃;
When 2) encapsulating starts, epoxy resin ingredient and solidifying agent component, by weight 5:1, are stirred to 10～20min;
3) the cooling good MR damper solenoid of drying is put into to the vacuum pressure impregnation still, negative pressure-0.99 in maintenance 10～20min system～-0.95MPa, by the described dipping still of epoxy pouring sealant input that mixes, then increase by 0.3～0.4Mpa pressure, keep pressure 10～20min, pressure release is to normal pressure;
4) after encapsulating finishes, keep the MR damper solenoid vertically to place 1～2h, treat that joint sealant solidifies.
Prepared epoxy glue heat-resistance index reaches 165.8 ℃ and reaches 43.7MPa with tensile strength, meets the encapsulating requirement of solenoid in MR damper.
Embodiment 3
MR damper joint sealant of the present invention, comprise epoxy resin ingredient and curing agent component, and described epoxy resin ingredient comprises by weight:
100 parts of bisphenol A epoxide resins;
45 parts of reactive thinners;
45 parts of polyether-type toughner;
Described curing agent component is for by weight:
1 part of aliphatic polyamine;
25 parts of polymeric amide (average molecular mass 2000);
45 parts of imidazole curing agents.
The preparation method of above-mentioned joint sealant, comprise
I) preparation of epoxy resin ingredient: by in 100 parts of bisphenol A epoxide resins, adding the polyether-type toughner of 45 portions of reactive thinners and 45 parts, then in reactor, stir 20～30min, stirring velocity is 5～30rpm;
Ii) the preparation of curing agent component comprises: by 1 part of aliphatic polyamine, 25 parts of Versamids and 45 parts of imidazole curing agents, then stir 20～30min and mix, rotating speed 100～300rpm in reactor.
The method of solenoid in the joint sealant embedding MR damper of the present embodiment comprises:
1) before encapsulating, by MR damper solenoid dry 24～48h under 100～110 ℃;
When 2) encapsulating starts, epoxy resin ingredient and solidifying agent component, by weight 7:1, are stirred to 10～20min;
3) the cooling good MR damper solenoid of drying is put into to the vacuum pressure impregnation still, negative pressure-0.99 in maintenance 10～20min system～-0.95MPa, by the described dipping still of epoxy pouring sealant input that mixes, then increase by 0.3～0.4Mpa pressure, keep pressure 10～20min, pressure release is to normal pressure;
4) after encapsulating finishes, keep the MR damper solenoid vertically to place 1～2h, treat that joint sealant solidifies.
Prepared epoxy glue heat-resistance index reaches 165.7 ℃ and reaches 43.1MPa with tensile strength, meets the encapsulating requirement of solenoid in MR damper;
Embodiment 4
A kind of MR damper joint sealant, comprise epoxy resin ingredient and curing agent component, and described epoxy resin ingredient comprises by weight:
100 parts of bisphenol A epoxide resins;
45 parts of reactive thinners;
45 parts of polyether-type toughner;
Described curing agent component is for by weight:
25 parts of aliphatic polyamines;
25 parts of polymeric amide (average molecular mass 1000);
45 parts of imidazole curing agents.
The preparation method of above-mentioned joint sealant, comprise
I) preparation of epoxy resin ingredient: by in 100 parts of bisphenol A epoxide resins, adding the polyether-type toughner of 45 portions of reactive thinners and 45 parts, then in reactor, stir 20～30min, stirring velocity is 5～30rpm;
Ii) the preparation of curing agent component comprises: by 25 parts of aliphatic polyamines, 25 parts of Versamids and 45 parts of imidazole curing agents, then stir 20～30min and mix, rotating speed 100～300rpm in reactor.
The method of solenoid in the joint sealant embedding MR damper of the present embodiment comprises:
1) before encapsulating, by MR damper solenoid dry 24～48h under 100～110 ℃;
When 2) encapsulating starts, epoxy resin ingredient and solidifying agent component, by weight 6:1, are stirred to 10～20min;
3) the cooling good MR damper solenoid of drying is put into to the vacuum pressure impregnation still, negative pressure-0.99 in maintenance 10～20min system～-0.95MPa, by the described dipping still of epoxy pouring sealant input that mixes, then increase by 0.3～0.4Mpa pressure, keep pressure 10～20min, pressure release is to normal pressure;
4) after encapsulating finishes, keep the MR damper solenoid vertically to place 1～2h, treat that joint sealant solidifies.
Prepared epoxy glue heat-resistance index reaches 165.2 ℃ and reaches 43.5MPa with tensile strength, meets the encapsulating requirement of solenoid in MR damper.
In table 1 this patent, embodiment and common joint sealant contrast MR damper embedding result of use
| Project | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Common joint sealant |
| Heat-resistance index/℃ | 163.8 | 165.8 | 165.7 | 165.2 | 148.9 |
| Tensile strength/MPa | 42.9 | 43.7 | 43.1 | 43.5 | 39.7 |
| Dosing technology | Vacuum encapsulation | Vacuum encapsulation | Vacuum encapsulation | Vacuum encapsulation | Directly embedding |
| The embedding effect | Pore-free | Pore-free | Pore-free | Pore-free | Pore |
| Anti-magnetic flow liquid reliability | Do not ftracture | Do not ftracture | Do not ftracture | Do not ftracture | Cracking |
Claims (13)
1. a MR damper joint sealant, comprise epoxy resin ingredient and curing agent component,
Described epoxy resin ingredient comprises by weight:
100 parts of bisphenol A epoxide resins;
1～45 part of reactive thinner;
1～45 part of polyether-type toughner;
Described curing agent component is for by weight:
1～25 part of aliphatic polyamine;
1～25 part of polymeric amide;
1～45 part of imidazole curing agent.
2. joint sealant according to claim 1, is characterized in that, the average molecular mass of described polymeric amide is 300～2900.
3. joint sealant according to claim 1 and 2, is characterized in that, described reactive thinner is the single epoxy group(ing) thinner of aliphatics.
4. joint sealant according to claim 3, it is characterized in that, the single epoxy group(ing) thinner of described aliphatics is selected from least a in propylene oxide, propylene oxide methyl ether, propylene oxide ethyl ether, epoxy chloropropane, R-GLYCIDOL, epoxidation octene, glycidyl allyl ether, butylglycidyl ether, methyl propenoic acid glycidyl ether and 2-ethylhexyl glycidyl ether.
5. the described joint sealant of any one according to claim 1-4, is characterized in that, described polyether-type toughner is selected from least a in N-204, N-210, N-215, N-225, N-230, N-303, N-330, T-9503, T-9907 and T-9903.
6. the described joint sealant of any one according to claim 1-5, is characterized in that, described aliphatic polyamine is selected from least a in quadrol, hexanediamine, diethylaminopropylamine, dimethyl diamino octadiene and tetramethyl-diamino octadiene.
7. the described joint sealant of any one according to claim 1-6, is characterized in that, described polymeric amide is selected from least a in V-115, V-125, V-140, G-250 and G-2000.
8. the described joint sealant of any one according to claim 1-7, is characterized in that, described imidazole curing agent is liquid imidazole curing agent.
9. the described joint sealant of any one according to claim 1-8, it is characterized in that, described imidazole curing agent is selected from 2-ethyl-4-methylimidazole, 1-benzyl-2-ethyl imidazol(e), 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-benzyl-4, at least a in 5-bis-(cyanogen ethoxy methylene) imidazoles and 1-amino-ethyl-glyoxal ethyline.
10. the described joint sealant of any one according to claim 1-9, is characterized in that, the mass ratio of described epoxy resin ingredient and described curing agent component is 3.5～7:1.
11. in one kind according to claim 1-10, the described MR damper of any one, with the preparation method of joint sealant, comprises
I) preparation of epoxy resin ingredient: by adding the polyether-type toughner of 1～45 portion of reactive thinner and 1～45 part in 100 parts of bisphenol A epoxide resins, be uniformly mixed; Preferred said components stirs 20～30min in reactor, stirring velocity is 5～30rpm;
Ii) the preparation of curing agent component comprises: by 1～25 part of aliphatic polyamine, 1～25 part of Versamid and 1～45 part of imidazole curing agent, be uniformly mixed.Preferred said components stirs 20～30min and mixes in reactor, rotating speed 100～300rpm.
12. the described MR damper of any one using method of joint sealant in a kind according to claim 1-10 comprises:
I) by epoxy resin ingredient and solidifying agent component by weight 3.5～7:1 mix and blend;
Ii) the MR damper solenoid be impregnated in to described epoxy pouring sealant and carry out encapsulating;
Iii) that the MR damper solenoid after encapsulating is vertically standing, joint sealant is solidified.
13. using method according to claim 12, is characterized in that, at step I i) in, adopt technique of vacuum pressure for dipping electrical the MR damper solenoid to be carried out to the encapsulating of epoxy pouring sealant.
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| CN109021503A (en) * | 2018-07-26 | 2018-12-18 | 安徽同佳电子科技有限公司 | It is a kind of insulation, impact resistance electromagnetic coil encapsulating material preparation method |
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| CN106318298B (en) * | 2015-06-15 | 2019-07-30 | 株洲时代电气绝缘有限责任公司 | It is used to prepare curing agent component system, epoxy pouring sealant and its application of normal temperature cure cracking resistance epoxy pouring sealant |
| CN105670545A (en) * | 2016-04-12 | 2016-06-15 | 苏州胜信大成光网科技有限公司 | Glue for optical fibers and preparation method of glue |
| CN106520045A (en) * | 2016-11-05 | 2017-03-22 | 上海大学 | An epoxy damping adhesive curable at room temperature and a preparing method thereof |
| CN106520045B (en) * | 2016-11-05 | 2019-06-25 | 上海大学 | A kind of epoxy damping glue of room-temperature-curable and preparation method thereof |
| CN109021503A (en) * | 2018-07-26 | 2018-12-18 | 安徽同佳电子科技有限公司 | It is a kind of insulation, impact resistance electromagnetic coil encapsulating material preparation method |
| CN111732922A (en) * | 2020-07-15 | 2020-10-02 | 凯碧塑胶制品（惠州）有限公司 | Epoxy resin adhesive and application method thereof |
| CN112391139A (en) * | 2020-11-10 | 2021-02-23 | 中国船舶重工集团公司第七0七研究所 | Pouring sealant for potting stator of limited-angle motor and potting method |
| CN114231228A (en) * | 2021-11-01 | 2022-03-25 | 北京理工大学 | Magnetorheological repairing material, preparation method thereof and oil pipeline repairing method |
| CN114231228B (en) * | 2021-11-01 | 2022-10-25 | 北京理工大学 | Magnetorheological repairing material, preparation method thereof and oil pipeline repairing method |
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| CN103396655B (en) | 2015-12-02 |
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