CN106366916A - Normal temperature curable epoxy modified organic silicone resin, preparation method thereof and application - Google Patents
Normal temperature curable epoxy modified organic silicone resin, preparation method thereof and application Download PDFInfo
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- CN106366916A CN106366916A CN201610802894.5A CN201610802894A CN106366916A CN 106366916 A CN106366916 A CN 106366916A CN 201610802894 A CN201610802894 A CN 201610802894A CN 106366916 A CN106366916 A CN 106366916A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/10—Block or graft copolymers containing polysiloxane sequences
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- Polymers & Plastics (AREA)
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Abstract
The invention belongs to the technical field of coatings, and discloses normal temperature curable epoxy modified organic silicone resin, a preparation method thereof and an application. The preparation method includes the steps: sequentially adding 10-20 parts of organic silicone intermediate, 1-2 parts of silane coupling agents and 11-27 parts of solvents into a reactor by weight, uniformly stirring the materials, increasing temperature to reach 50-90 DEG C, adding 0.01-0.1 part of catalysts and performing reaction for 2-5 hours to obtain organic silicone polymer; adding 5-30 parts of epoxy resin and 5-30 parts of solvents into the organic silicone polymer, uniformly stirring the materials, increasing the temperature to reach 60-90 DEG C and performing reaction for 3-6 hours to obtain the normal temperature curable epoxy modified organic silicone resin. The epoxy modified organic silicone resin is high in silicon content (up to 75%), has excellent storage stability, can be applied to metal high-temperature-resistant anticorrosion coatings and has the advantages of high temperature resistance, corrosion resistance, good adhesive force, high hardness and the like.
Description
Technical field
The invention belongs to technical field of coatings is and in particular to a kind of normal-temperature curing epoxy modified organic silicone resin and its preparation
Method and application.
Background technology
With the continuous development of China's modern industry, particularly the sending out of the industry such as metallurgy, petrochemical industry, Aero-Space and military project
Exhibition, the application of high-temperature service and auxiliary facility gets more and more, but metal material in hot environment easily and in the air oxygen
There is oxidation reaction or react with organic solvent, acid, alkali, produce corrosion phenomena, so that metal material gradually loses by force
Spend and lead to structural disappearance, become the hidden danger of various accidents.Therefore, high-temperature service surface typically all needs application high-temperature resistant anti-corrosive
Coating is protected, and to prevent metal material oxide etch, extends the service life of high-temperature service.
Organic siliconresin is that the wherein bond energy of si-o is 460kj/mol by the polymer with-si-o-si- as molecular backbone
Bond energy far above c-c so that organic siliconresin has excellent thermostability, simultaneously silicones also have good weatherability,
The performances such as ultraviolet aging resistance, humidity and hydrophobicity.But, organic siliconresin there is also significant drawback, for example, need high temperature (150-
200 DEG C) solidification and hardening time is longer, film organic solvent resistance is poor, mechanical strength bad to the adhesive force of base material is inadequate
Deng which greatly limits its widespread adoption.Epoxy resin has good solvent resistance, significantly bonds
Property, excellent mechanical property, are modified to organic siliconresin using epoxy resin, can significantly improve its adhesive force and solvent resistant
Performance.
Report with regard to epoxide modified organic strand of resin is a lot of both at home and abroad at present, but the epoxy modified silicone tree of report
The silicone content of fat is low, and needs hot setting.Z.ahmad etc. utilizes γ-glycidyl ether oxygen propyl trimethoxy silicane, ammonia
Phenyltrimethoxysila,e, the epoxy modified silicone resin of tetraethoxysilane preparation, its silicone content is only 25%, and needs
To solidify under 130 DEG C of high temperature.Chinese patent cn102031061a utilizes Bisphenol-a Epoxy Resin, the silane containing amino even
Connection agent, the epoxy modified silicone resin of methyl or phenyl alkoxy silane preparation, this resin needs hot setting, and adheres to
Power is poor.Patent cn102559048a and cn102206322 complicated process of preparation, are required for reacting under the high temperature conditions.Patent
The epoxy novolac modified organic silicone resin of cn103059304a preparation, its silicone content is very low, and only up to 33%.
Content of the invention
In place of solving the shortcoming and defect of above prior art, the primary and foremost purpose of the present invention is to provide a kind of room temperature
The preparation method of cured epoxy modified organic silicone resin.
Another object of the present invention is to providing a kind of normal-temperature curing epoxy modification preparing by said method to have
Machine silicones.
It is still another object of the present invention to provide above-mentioned normal-temperature curing epoxy modified organic silicone resin is high temperature resistant anti-in metal
Application in rotten coating.
The object of the invention is achieved through the following technical solutions:
A kind of preparation method of normal-temperature curing epoxy modified organic silicone resin, including following preparation process:
By weight, sequentially add in reactor 10～20 parts of silicone intermediates, 1～2 part of silane coupler, 11
～27 parts of solvents, stir, and are warming up to 50～90 DEG C, are subsequently adding 0.01～0.1 part of catalyst, react 2～5h, are had
Organosilicon polymer；Then 5～30 parts of epoxy resin, 5～30 parts of solvents are added in gained organosilicon polymer, stirring is all
Even, it is warming up to 60～90 DEG C of reaction 3～6h, obtain described normal-temperature curing epoxy modified organic silicone resin.
Described silicone intermediate is selected from following structure general formula:
Wherein x and y is identical or different, selected from c1～c6Straight or branched alkyl or phenyl.
Preferably, described silicone intermediate is DOW CORNING rsn-6018, DOW CORNING lx-0301, DOW CORNING pmx-
0156th, at least one in DOW CORNING pmx-0930, watt gram sy-300.
Described silane coupler refers to amino silicane coupling agent, preferably aminopropyl trimethoxysilane, aminopropyl three second
In TMOS, aminophenyl triethoxysilane, phenylaminomethyl trimethoxy silane, aminoethylaminopropyl trimethoxy silane
At least one.
Described solvent is preferably toluene, dimethylbenzene, butanone, Ketohexamethylene, ethyl acetate, butyl acetate, n-butyl alcohol, tetrahydrochysene
At least one in furan.
Described catalyst is preferably dibutyl tin laurate, zinc naphthenate, hydrochloric acid, nitric acid, salicylic acid, tetramethyl hydrogen
At least one in amine-oxides.
Described epoxy resin is preferably at least one in Bisphenol-a Epoxy Resin e20, e21, e42, e44, e51.
A kind of normal-temperature curing epoxy modified organic silicone resin, is prepared by said method.
Application in metal fire-resistant anticorrosion paint for the above-mentioned normal-temperature curing epoxy modified organic silicone resin, concrete application walks
Suddenly as follows:
Normal-temperature curing epoxy modified organic silicone resin is mixed with amine curing agent, is brushed in metal after stirring
On base material, place 5～9 days under room temperature, after being fully cured, obtain epoxy modified silicone resin film.
Described amine curing agent is preferably ethylenediamine, diethylenetriamine, phenylenediamine, polyamide curing agent such as polyamide
650th, polyamide 6 51, at least one in pnenolic aldehyde amine hardener such as t31.
The reaction principle figure of normal-temperature curing epoxy modified organic silicone resin of the present invention is as shown in figure 1, wherein r ' is
ch3、ch2ch3Deng group, r " it is h, ch3、ch2ch3Deng atom or group.
The preparation method of the present invention and obtained product have the advantage that and beneficial effect:
(1) preparation method of the present invention is prepared using substep, and epoxy modified silicone resin is by the organosilicon containing amino
Polymer and epoxy resin react and are obtained, and general reaction is quick, efficient, and process is simple, condition are easy to control, and course of reaction is stable,
Concordance is good.
(2) epoxy modified silicone resin of present invention preparation, by the effect of silane coupler, solves epoxy resin
The problem bad with the organic siliconresin compatibility is so that resin can store steadily in the long term.Simultaneously because silane coupler, epoxy
The effect of resin, so that film has good adhesive force to metal surface, additionally has high hardness, the film after solidification
Hardness is up to 6h, makes coated metal be difficult to scratch, has Pleiotropic Protections.
(3) epoxy modified silicone resin of present invention preparation, due to this resin can normal temperature cure, its range of application is non-
Often extensive.Simultaneously because silicone content height (reaching as high as 75%) is so that the film after solidification can be long-term under 400 DEG C of high temperature
Use, therefore can be widely applied to various industrial equipments.
Brief description
Fig. 1 is the reaction principle figure of normal-temperature curing epoxy modified organic silicone resin of the present invention.
Specific embodiment
With reference to embodiment, the present invention is described in further detail, but embodiments of the present invention not limited to this.
Embodiment 1
(1) by 10g silicone intermediate lx-0301,1g silane coupler aminopropyl trimethoxysilane, 11g solvent ring
Hexanone is added sequentially in the there-necked flask of 250ml, stirs, and is heated to 50 DEG C, is subsequently adding 0.01g catalyst two
Dibutyl tin laurate, reacts 2h, obtains organosilicon polymer.
(2) 5g epoxy resin e20,5g solvent cyclohexanone is added sequentially in above-mentioned there-necked flask, stirs, heating
It is warming up to 60 DEG C and continues reaction 3h, obtain epoxy modified silicone resin.
(3) take the above-mentioned epoxy modified silicone resin of 10g, mixed with 1g polyamide curing agent, brush after stirring
It is coated on q235 steel plate, place 5 days under room temperature, obtain epoxy modified silicone resin film.Its performance test results such as table 1 institute
Show.
Embodiment 2
(1) will be molten to 10g silicone intermediate lx-0301,1.5g silane coupler aminopropyl triethoxysilane, 11.5g
Agent dimethylbenzene is added sequentially in the there-necked flask of 250ml, stirs, and is heated to 60 DEG C, is subsequently adding 0.03g catalysis
Agent dibutyl tin laurate, reacts 3h, obtains organosilicon polymer.
(2) 10g epoxy resin e44,10g solvent xylene is added sequentially in above-mentioned there-necked flask, stirs, plus
Heat is warming up to 70 DEG C and continues reaction 4h, obtains epoxy modified silicone resin.
(3) take the above-mentioned epoxy modified silicone resin of 10g, mixed with 1.5g polyamide curing agent, after stirring
Brush on q235 steel plate, place 6 days under room temperature, obtain epoxy modified silicone resin film.Its performance test results such as table 1
Shown.
Embodiment 3
(1) by 15g silicone intermediate rsn-6018,2g silane coupler aminophenyl triethoxysilane, 17g solvent second
Acid butyl ester is added sequentially in the there-necked flask of 250ml, stirs, and is heated to 70 DEG C, is subsequently adding 0.05g catalyst
Zinc naphthenate, reacts 4h, obtains organosilicon polymer.
(2) 20g epoxy resin e44,20g solvent acetic acid butyl ester is added sequentially in above-mentioned there-necked flask, stirs,
It is heated to 80 DEG C and continues reaction 5h, obtain epoxy modified silicone resin.
(3) take the above-mentioned epoxy modified silicone resin of 10g, mixed with 2g polyamide curing agent, brush after stirring
It is coated on q235 steel plate, place 7 days under room temperature, obtain epoxy modified silicone resin film.Its performance test results such as table 1 institute
Show.
Embodiment 4
(1) by 20g silicone intermediate rsn-6018,1g silane coupler phenylaminomethyl trimethoxy silane, 21g solvent
Ketohexamethylene is added sequentially in the there-necked flask of 250ml, stirs, and is heated to 80 DEG C, is subsequently adding 0.1g catalyst
Zinc naphthenate, reacts 5h, obtains organosilicon polymer.
(2) 25g epoxy resin e51,25g solvent cyclohexanone is added sequentially in above-mentioned there-necked flask, stirs, plus
Heat is warming up to 90 DEG C and continues reaction 6h, obtains epoxy modified silicone resin.
(3) take the above-mentioned epoxy modified silicone resin of 10g, mixed with 2g firming agent diethylenetriamine, stir
After brush on q235 steel plate, under room temperature place 8 days, obtain epoxy modified silicone resin film.Its performance test results is such as
Shown in table 1.
Embodiment 5
(1) by 25g silicone intermediate sy-300,2g silane coupler aminoethylaminopropyl trimethoxy silane, 27g bis-
The mixed solvent of toluene and Ketohexamethylene is added sequentially in the there-necked flask of 250ml, stirs, and is heated to 90 DEG C, so
Add 0.1g catalyst salicylic acid afterwards, react 3h, obtain organosilicon polymer.
(2) mixed solvent of 15g epoxy resin e20,15g dimethylbenzene and Ketohexamethylene is added sequentially to above-mentioned there-necked flask
In, stir, be heated to 60 DEG C and continue reaction 6h, obtain epoxy modified silicone resin.
(3) take the above-mentioned epoxy modified silicone resin of 10g, mixed with 1.5g polyamide curing agent, after stirring
Brush on q235 steel plate, place 9 days under room temperature, obtain epoxy modified silicone resin film.Its performance test results such as table 1
Shown.
Embodiment 6
(1) by 15g silicone intermediate sy-300,2g silane coupler aminopropyl trimethoxysilane, 17g butyl acetate
It is added sequentially in the there-necked flask of 250ml with the mixed solvent of dimethylbenzene, stirs, be heated to 70 DEG C, Ran Houjia
Enter 0.04g catalyst salicylic acid, react 4h, obtain organosilicon polymer.
(2) mixed solvent of 30g epoxy resin e42,30g butyl acetate and dimethylbenzene is added sequentially to above-mentioned three mouthfuls of burnings
In bottle, stir, be heated to 70 DEG C and continue reaction 4h, obtain epoxy modified silicone resin.
(3) take the above-mentioned epoxy modified silicone resin of 10g, mixed with 2g firming agent t31, brush after stirring
On q235 steel plate, place 7 days under room temperature, obtain epoxy modified silicone resin film.Its performance test results is as shown in table 1.
Table one
Above-mentioned test result is with reference to following testing standard:
Coating solvent resistant wiping algoscopy, gb/t 23989-2009；
Stroke lattice measuring adhesive force of paint and varnish paint film, gb/t 9286-1998；
Paint and varnish pencil method measures hardness of paint film, gb/t 6739-2006.
Above-described embodiment is the present invention preferably embodiment, but embodiments of the present invention are not subject to above-described embodiment
Limit, other any spirit without departing from the present invention and the change made under principle, modification, replacement, combine, simplify,
All should be equivalent substitute mode, be included within protection scope of the present invention.
Claims (10)
1. a kind of preparation method of normal-temperature curing epoxy modified organic silicone resin is it is characterised in that include following preparation process:
By weight, sequentially add in reactor 10～20 parts of silicone intermediates, 1～2 part of silane coupler, 11～27
Part solvent, stirs, is warming up to 50～90 DEG C, is subsequently adding 0.01～0.1 part of catalyst, reacts 2～5h, obtains organosilicon
Polymer；Then 5～30 parts of epoxy resin, 5～30 parts of solvents are added in gained organosilicon polymer, stir, rise
Temperature, to 60～90 DEG C of reaction 3～6h, obtains described normal-temperature curing epoxy modified organic silicone resin.
2. a kind of normal-temperature curing epoxy modified organic silicone resin according to claim 1 preparation method it is characterised in that:
Described silicone intermediate is selected from following structure general formula:
Wherein x and y is identical or different, selected from c1～c6Straight or branched alkyl or phenyl.
3. a kind of normal-temperature curing epoxy modified organic silicone resin according to claim 2 preparation method it is characterised in that:
Described silicone intermediate includes DOW CORNING rsn-6018, DOW CORNING lx-0301, DOW CORNING pmx-0156, DOW CORNING pmx-
0930th, at least one in watt gram sy-300.
4. a kind of normal-temperature curing epoxy modified organic silicone resin according to claim 1 preparation method it is characterised in that:
Described silane coupler include aminopropyl trimethoxysilane, aminopropyl triethoxysilane, aminophenyl triethoxysilane,
At least one in phenylaminomethyl trimethoxy silane, aminoethylaminopropyl trimethoxy silane.
5. a kind of normal-temperature curing epoxy modified organic silicone resin according to claim 1 preparation method it is characterised in that:
Described solvent include toluene, dimethylbenzene, butanone, Ketohexamethylene, ethyl acetate, butyl acetate, n-butyl alcohol, in oxolane extremely
Few one kind.
6. a kind of normal-temperature curing epoxy modified organic silicone resin according to claim 1 preparation method it is characterised in that:
Described catalyst include dibutyl tin laurate, zinc naphthenate, hydrochloric acid, nitric acid, salicylic acid, in Tetramethylammonium hydroxide
At least one.
7. a kind of normal-temperature curing epoxy modified organic silicone resin according to claim 1 preparation method it is characterised in that:
Described epoxy resin includes at least one in Bisphenol-a Epoxy Resin e20, e21, e42, e44, e51.
8. a kind of normal-temperature curing epoxy modified organic silicone resin it is characterised in that: by described in any one of claim 1～7
Method prepares.
9. application in metal fire-resistant anticorrosion paint for the normal-temperature curing epoxy modified organic silicone resin described in claim 8,
It is characterized in that concrete application step is as follows:
Normal-temperature curing epoxy modified organic silicone resin is mixed with amine curing agent, is brushed in metal base after stirring
On, place 5～9 days under room temperature, after being fully cured, obtain epoxy modified silicone resin film.
10. normal-temperature curing epoxy modified organic silicone resin according to claim 9 is in metal fire-resistant anticorrosion paint
Application it is characterised in that: described amine curing agent includes ethylenediamine, diethylenetriamine, phenylenediamine, polyamide curing agent, phenol
At least one in aldehyde amine hardener.
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| CN201610802894.5A CN106366916B (en) | 2016-09-05 | 2016-09-05 | A kind of normal-temperature curing epoxy modified organic silicone resin and the preparation method and application thereof |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106905703A (en) * | 2017-03-27 | 2017-06-30 | 北京化工大学 | A kind of preparation method of epoxy modified silicone resin exotic material |
| CN107189543A (en) * | 2017-07-22 | 2017-09-22 | 厦门市诚安毅科技有限公司 | A kind of preparation of Nanometer blue fluorescent ink |
| CN109181532A (en) * | 2018-09-18 | 2019-01-11 | 湖北兴瑞硅材料有限公司 | A kind of room temperature curing organosilicon coating and preparation method thereof |
| CN109354971A (en) * | 2018-10-22 | 2019-02-19 | 福州臻美网络科技有限公司 | A kind of corrosion-resistant epoxy coating for building |
| CN109897503A (en) * | 2019-03-08 | 2019-06-18 | 胡志忠 | A kind of normal temperature cure modifying epoxy resin by organosilicon coating and the preparation method and application thereof |
| CN112226158A (en) * | 2020-10-14 | 2021-01-15 | 湘江涂料科技有限公司 | Epoxy modified polysiloxane primer-topcoat coating and preparation method thereof |
| CN112358792A (en) * | 2020-11-09 | 2021-02-12 | 海隆石油产品技术服务（上海）有限公司 | Powder coating composition for blowout preventer and preparation method thereof |
| CN112760007A (en) * | 2020-12-30 | 2021-05-07 | 江西瀚泰新材料科技有限公司 | Organic silicon modified epoxy resin paint film and preparation method thereof |
| CN113292730A (en) * | 2021-04-16 | 2021-08-24 | 虎皇新材料科技集团有限公司 | Modified organic silicon resin, preparation method thereof and normal-temperature curing coating |
| CN113881318A (en) * | 2021-11-09 | 2022-01-04 | 嘉兴学院 | Normal-temperature curing anti-icing coating and preparation method thereof |
| CN116285663A (en) * | 2023-03-24 | 2023-06-23 | 西南林业大学 | Organic composite material for anti-skid coating |
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| US6632892B2 (en) * | 2001-08-21 | 2003-10-14 | General Electric Company | Composition comprising silicone epoxy resin, hydroxyl compound, anhydride and curing catalyst |
| CN102206322B (en) * | 2010-03-30 | 2012-09-26 | 江苏力宝建材工业有限公司 | Epoxy-modified organic silicone resin for manufacturing composite glue, and processing technology thereof |
| CN102504755B (en) * | 2011-12-02 | 2014-01-22 | 北京天山新材料技术股份有限公司 | Epoxy resin modified two-component silicone rubber adhesive |
| CN103059304B (en) * | 2012-12-21 | 2015-02-18 | 海洋化工研究院有限公司 | Preparation and application of long-acting anticorrosion temperature-resistant coating |
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2016
- 2016-09-05 CN CN201610802894.5A patent/CN106366916B/en not_active Expired - Fee Related
Cited By (12)
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| CN106905703A (en) * | 2017-03-27 | 2017-06-30 | 北京化工大学 | A kind of preparation method of epoxy modified silicone resin exotic material |
| CN107189543A (en) * | 2017-07-22 | 2017-09-22 | 厦门市诚安毅科技有限公司 | A kind of preparation of Nanometer blue fluorescent ink |
| CN109181532A (en) * | 2018-09-18 | 2019-01-11 | 湖北兴瑞硅材料有限公司 | A kind of room temperature curing organosilicon coating and preparation method thereof |
| CN109354971A (en) * | 2018-10-22 | 2019-02-19 | 福州臻美网络科技有限公司 | A kind of corrosion-resistant epoxy coating for building |
| CN109897503A (en) * | 2019-03-08 | 2019-06-18 | 胡志忠 | A kind of normal temperature cure modifying epoxy resin by organosilicon coating and the preparation method and application thereof |
| CN112226158A (en) * | 2020-10-14 | 2021-01-15 | 湘江涂料科技有限公司 | Epoxy modified polysiloxane primer-topcoat coating and preparation method thereof |
| CN112358792A (en) * | 2020-11-09 | 2021-02-12 | 海隆石油产品技术服务（上海）有限公司 | Powder coating composition for blowout preventer and preparation method thereof |
| CN112358792B (en) * | 2020-11-09 | 2022-05-10 | 海隆石油产品技术服务（上海）有限公司 | Powder coating composition for blowout preventer and preparation method thereof |
| CN112760007A (en) * | 2020-12-30 | 2021-05-07 | 江西瀚泰新材料科技有限公司 | Organic silicon modified epoxy resin paint film and preparation method thereof |
| CN113292730A (en) * | 2021-04-16 | 2021-08-24 | 虎皇新材料科技集团有限公司 | Modified organic silicon resin, preparation method thereof and normal-temperature curing coating |
| CN113881318A (en) * | 2021-11-09 | 2022-01-04 | 嘉兴学院 | Normal-temperature curing anti-icing coating and preparation method thereof |
| CN116285663A (en) * | 2023-03-24 | 2023-06-23 | 西南林业大学 | Organic composite material for anti-skid coating |
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