CN106341953B - A kind of cutting method of high-precision PCB circuit board technique edges - Google Patents
A kind of cutting method of high-precision PCB circuit board technique edges Download PDFInfo
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- CN106341953B CN106341953B CN201611051169.5A CN201611051169A CN106341953B CN 106341953 B CN106341953 B CN 106341953B CN 201611051169 A CN201611051169 A CN 201611051169A CN 106341953 B CN106341953 B CN 106341953B
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- circuit board
- pcb circuit
- plate
- cutting
- screw rod
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of cutting methods of high-precision PCB circuit board technique edges of wiring board processing technique field, and specific step is as follows for the cutting method of the high-precision PCB circuit board technique edges: the punching of S1:PCB wiring board；S2: installation PCB circuit board；S3: PCB circuit board is cut；S4 divides PCB circuit board, and the cutting method of the high-precision PCB circuit board technique edges, by the fixation of clamp device, so that PCB circuit board is more stable when cutting, by laser processing, precision is improved.
Description
Technical field
The present invention relates to wiring board processing technique field, specially a kind of cutting side of high-precision PCB circuit board technique edges
Method.
Background technique
It is needed in PCB circuit board process there are technique edges around assist side, the effect of technique edges is in order to just
In the processing to PCB circuit board, but technique edges do not have any help for the PCB circuit board completed the process, and therefore, it is necessary to will
Technique edges are to casting out, and existing technique edges minimizing technology is inaccurate, for this purpose, we have proposed a kind of high-precision PCB circuit board
The clamp device of technique edges.
Summary of the invention
The purpose of the present invention is to provide a kind of clamp devices of high-precision PCB circuit board technique edges, to solve above-mentioned back
The inaccurate problem of the existing technique edges minimizing technology proposed in scape technology.
To achieve the above object, the invention provides the following technical scheme: a kind of clamping of high-precision PCB circuit board technique edges
Device, including bottom plate, the left end at the top of the bottom plate are equipped with position retaining plate, four groups of positioning columns are provided at the top of the bottom plate,
Positioning column described in four groups is respectively positioned on the right side of position retaining plate, and four groups of positioning column rectangular in form are arranged in the top of bottom plate, the bottom
Right end at the top of plate is equipped with adjustable plate, and the ontology of the adjustable plate has extended transversely through screw rod, and screw rod and adjustable plate pass through spiral shell
Line adaptation connection, the right end of the screw rod are connected with rocker arm, and the left end of the screw rod is connected with pressing plate, positioning column position described in four groups
In the left side of pressing plate.
Preferably, the right side wall of the position retaining plate and the left side wall of pressing plate are bonded with Rubber shock-absorbing pad.
Preferably, the right side wall of the pressing plate is connected with bearing, and the left end of the screw rod is fixedly connected with the inner ring of bearing.
Preferably, specific step is as follows for the cutting method of the high-precision PCB circuit board technique edges:
The punching of S1:PCB wiring board: PCB circuit board being fixed, is punched to the technique edges of PCB circuit board, the quantity in hole
It is four groups, and the position in four groups of holes is adapted with the position of four groups of positioning columns with size respectively with size；
S2: installation PCB circuit board: the PCB circuit board for having beaten hole in step S1 is obtained, and PCB circuit board is placed in bottom
Four holes on plate, and in PCB circuit board are corresponded with four groups of positioning columns respectively, and rotating arm drives spiral shell by rocker arm
Bar moves to left, and the band dynamic pressure plate that moves to left of screw rod moves to left, and since pressing plate right side wall is connect by bearing with screw rod, pressing plate will not be because of
The rotation of screw rod and rotate, pressing plate is against the right side wall of PCB circuit board, and the setting of the Rubber shock-absorbing pad on pressing plate and position retaining plate is slow
Pressure caused by the collision between pressing plate and position retaining plate and PCB circuit board is rushed；
S3: cut to PCB circuit board: PCB circuit board and clamp device after will be fixed in step S2 be placed in laser and cut
Under ceding of Taiwan face, the path for being cut by laser platform adjustment is finished, when cutting, is divided into transverse cuts and longitudinally cutting, transverse cuts with
Longitudinally cutting to be divided into two steps, the cutting angle of plane where first step laser and PCB circuit board is 30 ° -60 °, second
The cutting angle of plane where walking laser and PCB circuit board is 120 ° -150 °；
S4 divides PCB circuit board: the PCB circuit board after cutting in step S3 being removed from clamp device, is broken by hand
Mode the technique edges in PCB circuit board are broken down.
Preferably, the drilling method in the step S1 is punched by the way of drilling, to PCB during punching
Wiring board carries out plus water cooling treatment.
Preferably, the internal diameter of aperture is greater than the outer diameter 1-1.2mm of positioning column in PCB circuit board in the step S1.
Preferably, it is 1.2-1.4mm that depth is cut by laser in the step S3.
Compared with prior art, the beneficial effects of the present invention are: the cutting method of the high-precision PCB circuit board technique edges,
By the fixation of clamp device, so that PCB circuit board is more stable when cutting, by laser processing, precision is improved.
Detailed description of the invention
Fig. 1 is clamp device structural schematic diagram of the present invention；
Fig. 2 is work flow diagram of the present invention.
In figure: 1 bottom plate, 2 position retaining plates, 3 positioning columns, 4 adjustable plates, 5 screw rods, 6 rocker arms, 7 pressing plates.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, the present invention provides a kind of technical solution: a kind of clamp device of high-precision PCB circuit board technique edges,
Including bottom plate 1, the left end at 1 top of bottom plate is equipped with position retaining plate 2, and the top of the bottom plate 1 is provided with four groups of positioning columns 3,
Positioning column 3 described in four groups is respectively positioned on the right side of position retaining plate 2, and four groups of 3 rectangular in form of positioning column are arranged in the top of bottom plate 1, institute
The right end for stating 1 top of bottom plate is equipped with adjustable plate 4, and the ontology of the adjustable plate 4 has extended transversely through screw rod 5, and screw rod 5 and adjusting
Plate 4 is connected by threaded adapter, and the right end of the screw rod 5 is connected with rocker arm 6, and the left end of the screw rod 5 is connected with pressing plate 7, and four
The group positioning column 3 is located at the left side of pressing plate 7.
Wherein, the right side wall of the position retaining plate 2 and the left side wall of pressing plate 7 are bonded with Rubber shock-absorbing pad, reduce position retaining plate
2, the collision between pressing plate 7 and PCB circuit board, the right side wall of the pressing plate 7 are connected with bearing, the left end of the screw rod 5 and axis
The inner ring held is fixedly connected.
Embodiment one
A kind of cutting method of high-precision PCB circuit board technique edges, the cutting method of the high-precision PCB circuit board technique edges
Specific step is as follows:
The punching of S1:PCB wiring board: PCB circuit board is fixed, the technique edges of PCB circuit board are punched, drilling method
It is punched by the way of drilling, PCB circuit board is carried out during punching plus water cooling treatment, the quantity in hole are four
Group, and the position in four groups of holes is adapted with the position of four groups of positioning columns 3 with size respectively with size, aperture in PCB circuit board
Internal diameter is greater than the outer diameter 1mm of positioning column 3；
S2: installation PCB circuit board: the PCB circuit board for having beaten hole in step S1 is obtained, and PCB circuit board is placed in bottom
Four holes on plate 1, and in PCB circuit board are corresponded with four groups of positioning columns 3 respectively, and rotating arm 6 passes through 6 band of rocker arm
Dynamic screw rod 5 moves to left, and the band dynamic pressure plate 7 that moves to left of screw rod 5 moves to left, and since 7 right side wall of pressing plate is connect by bearing with screw rod 5, presses
Plate 7 will not because of screw rod 5 rotation and rotate, pressing plate 7 is against the right side wall of PCB circuit board, the rubber on pressing plate 7 and position retaining plate 2
The setting of glue resilient cushion has buffered pressure caused by the collision between pressing plate 7 and position retaining plate 2 and PCB circuit board；
S3: cut to PCB circuit board: PCB circuit board and clamp device after will be fixed in step S2 be placed in laser and cut
Under ceding of Taiwan face, the path for being cut by laser platform adjustment is finished, when cutting, is divided into transverse cuts and longitudinally cutting, transverse cuts with
Longitudinally cutting to be divided into two steps, the cutting angle of plane where first step laser and PCB circuit board is 30 °, and second step swashs
The cutting angle of plane where light and PCB circuit board is 120 °, and laser cutting depth is 1.2mm；
S4 divides PCB circuit board: the PCB circuit board after cutting in step S3 being removed from clamp device, is broken by hand
Mode the technique edges in PCB circuit board are broken down.
Embodiment two
A kind of cutting method of high-precision PCB circuit board technique edges, the cutting method of the high-precision PCB circuit board technique edges
Specific step is as follows:
The punching of S1:PCB wiring board: PCB circuit board is fixed, the technique edges of PCB circuit board are punched, drilling method
It is punched by the way of drilling, PCB circuit board is carried out during punching plus water cooling treatment, the quantity in hole are four
Group, and the position in four groups of holes is adapted with the position of four groups of positioning columns 3 with size respectively with size, aperture in PCB circuit board
Internal diameter is greater than the outer diameter 1.1mm of positioning column 3；
S2: installation PCB circuit board: the PCB circuit board for having beaten hole in step S1 is obtained, and PCB circuit board is placed in bottom
Four holes on plate 1, and in PCB circuit board are corresponded with four groups of positioning columns 3 respectively, and rotating arm 6 passes through 6 band of rocker arm
Dynamic screw rod 5 moves to left, and the band dynamic pressure plate 7 that moves to left of screw rod 5 moves to left, and since 7 right side wall of pressing plate is connect by bearing with screw rod 5, presses
Plate 7 will not because of screw rod 5 rotation and rotate, pressing plate 7 is against the right side wall of PCB circuit board, the rubber on pressing plate 7 and position retaining plate 2
The setting of glue resilient cushion has buffered pressure caused by the collision between pressing plate 7 and position retaining plate 2 and PCB circuit board；
S3: cut to PCB circuit board: PCB circuit board and clamp device after will be fixed in step S2 be placed in laser and cut
Under ceding of Taiwan face, the path for being cut by laser platform adjustment is finished, when cutting, is divided into transverse cuts and longitudinally cutting, transverse cuts with
Longitudinally cutting to be divided into two steps, the cutting angle of plane where first step laser and PCB circuit board is 45 °, and second step swashs
The cutting angle of plane where light and PCB circuit board is 135 °, and laser cutting depth is 1.3mm；
S4 divides PCB circuit board: the PCB circuit board after cutting in step S3 being removed from clamp device, is broken by hand
Mode the technique edges in PCB circuit board are broken down.
Embodiment three
A kind of cutting method of high-precision PCB circuit board technique edges, the cutting method of the high-precision PCB circuit board technique edges
Specific step is as follows:
The punching of S1:PCB wiring board: PCB circuit board is fixed, the technique edges of PCB circuit board are punched, drilling method
It is punched by the way of drilling, PCB circuit board is carried out during punching plus water cooling treatment, the quantity in hole are four
Group, and the position in four groups of holes is adapted with the position of four groups of positioning columns 3 with size respectively with size, aperture in PCB circuit board
Internal diameter is greater than the outer diameter 1.2mm of positioning column 3；
S2: installation PCB circuit board: the PCB circuit board for having beaten hole in step S1 is obtained, and PCB circuit board is placed in bottom
Four holes on plate 1, and in PCB circuit board are corresponded with four groups of positioning columns 3 respectively, and rotating arm 6 passes through 6 band of rocker arm
Dynamic screw rod 5 moves to left, and the band dynamic pressure plate 7 that moves to left of screw rod 5 moves to left, and since 7 right side wall of pressing plate is connect by bearing with screw rod 5, presses
Plate 7 will not because of screw rod 5 rotation and rotate, pressing plate 7 is against the right side wall of PCB circuit board, the rubber on pressing plate 7 and position retaining plate 2
The setting of glue resilient cushion has buffered pressure caused by the collision between pressing plate 7 and position retaining plate 2 and PCB circuit board；
S3: cut to PCB circuit board: PCB circuit board and clamp device after will be fixed in step S2 be placed in laser and cut
Under ceding of Taiwan face, the path for being cut by laser platform adjustment is finished, when cutting, is divided into transverse cuts and longitudinally cutting, transverse cuts with
Longitudinally cutting to be divided into two steps, the cutting angle of plane where first step laser and PCB circuit board is 60 °, and second step swashs
The cutting angle of plane where light and PCB circuit board is 150 °, and laser cutting depth is 1.4mm；
S4 divides PCB circuit board: the PCB circuit board after cutting in step S3 being removed from clamp device, is broken by hand
Mode the technique edges in PCB circuit board are broken down.
By the experimental data of above three groups of embodiments, we show that the technique edges of the PCB circuit board in embodiment two are torn open
It is minimum to the damage ratio of PCB circuit board except effect is best, for this purpose, we show that optimum implementation is embodiment two.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (4)
1. a kind of cutting method of high-precision PCB circuit board technique edges, positions PCB circuit board using clamp device, institute
Stating clamp device includes bottom plate (1), it is characterised in that: the left end at the top of the bottom plate (1) is equipped with position retaining plate (2), the bottom
Four groups of positioning columns (3) are provided at the top of plate (1), positioning column described in four groups (3) is respectively positioned on the right side of position retaining plate (2), and four groups
Positioning column (3) rectangular in form is arranged in the top of bottom plate (1), and the right end at the top of the bottom plate (1) is equipped with adjustable plate (4), institute
The ontology for stating adjustable plate (4) has extended transversely through screw rod (5), and screw rod (5) is connect with adjustable plate (4) by threaded adapter, described
The right end of screw rod (5) is connected with rocker arm (6), and the left end of the screw rod (5) is connected with pressing plate (7), positioning column described in four groups (3) position
In the left side of pressing plate (7)；The right side wall of the position retaining plate (2) and the left side wall of pressing plate (7) are bonded with Rubber shock-absorbing pad；It is described
The right side wall of pressing plate (7) is connected with bearing, and the left end of the screw rod (5) is fixedly connected with the inner ring of bearing；
Specific step is as follows for the cutting method of the high-precision PCB circuit board technique edges:
The punching of S1:PCB wiring board: PCB circuit board being fixed, is punched to the technique edges of PCB circuit board, and the quantity in hole is four
Group, and the position in four groups of holes is adapted with the position of four groups of positioning columns (3) with size respectively with size；
S2: installation PCB circuit board: the PCB circuit board for having beaten hole in step S1 is obtained, and PCB circuit board is placed in bottom plate (1)
On, and four holes in PCB circuit board are corresponded with four groups of positioning columns (3) respectively, and rotating arm (6) passes through rocker arm (6)
Moving to left for screw rod (5) is driven, band dynamic pressure plate (7) that moves to left of screw rod (5) moves to left, since pressing plate (7) right side wall passes through bearing and spiral shell
Bar (5) connection, pressing plate (7) will not because of screw rod (5) rotation and rotate, pressing plate (7) is against the right side wall of PCB circuit board, pressure
The setting of plate (7) and the Rubber shock-absorbing pad on position retaining plate (2) has buffered between pressing plate (7) and position retaining plate (2) and PCB circuit board
Pressure caused by collision；
S3: cut to PCB circuit board: PCB circuit board and clamp device after will be fixed in step S2 be placed in laser cutting platform
Under face, the path for being cut by laser platform adjustment is finished, when cutting, is divided into transverse cuts and longitudinally cutting, transverse cuts and longitudinal direction
Cutting is divided into two steps, and the cutting angle of plane where first step laser and PCB circuit board is 30 ° -60 °, and second step swashs
The cutting angle of plane where light and PCB circuit board is 120 ° -150 °；
S4 divides PCB circuit board: the PCB circuit board after cutting in step S3 being removed from clamp device, the side broken by hand
Formula breaks down the technique edges in PCB circuit board.
2. a kind of cutting method of high-precision PCB circuit board technique edges according to claim 1, it is characterised in that: described
Drilling method in step S1 is punched by the way of drilling, carries out during punching to PCB circuit board plus water is cooling
Processing.
3. a kind of cutting method of high-precision PCB circuit board technique edges according to claim 1, it is characterised in that: described
The internal diameter of aperture is greater than the outer diameter 1-1.2mm of positioning column (3) in PCB circuit board in step S1.
4. a kind of cutting method of high-precision PCB circuit board technique edges according to claim 1, it is characterised in that: described
It is 1.2-1.4mm that depth is cut by laser in step S3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611051169.5A CN106341953B (en) | 2016-11-25 | 2016-11-25 | A kind of cutting method of high-precision PCB circuit board technique edges |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611051169.5A CN106341953B (en) | 2016-11-25 | 2016-11-25 | A kind of cutting method of high-precision PCB circuit board technique edges |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106341953A CN106341953A (en) | 2017-01-18 |
| CN106341953B true CN106341953B (en) | 2019-03-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611051169.5A Active CN106341953B (en) | 2016-11-25 | 2016-11-25 | A kind of cutting method of high-precision PCB circuit board technique edges |
Country Status (1)
| Country | Link |
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| CN (1) | CN106341953B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107744917A (en) * | 2017-11-22 | 2018-03-02 | 苏州市亿利华电子有限公司 | A kind of pcb board glue spreading apparatus of quick-clamping |
| CN111642082B (en) * | 2020-06-11 | 2021-04-23 | 华蓥市盈胜电子有限公司 | Paster tool and paster process for mobile phone mainboard |
| TWI787869B (en) * | 2021-06-17 | 2022-12-21 | 英業達股份有限公司 | Universal carrier |
| CN117835566B (en) * | 2024-03-06 | 2024-05-17 | 梨树全创科技有限公司 | Cutting method of high-precision PCB (printed circuit board) process edge |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204795987U (en) * | 2015-06-29 | 2015-11-18 | 智恩电子(大亚湾)有限公司 | Circuit board fixator |
| CN105228356A (en) * | 2015-11-05 | 2016-01-06 | 中国电子科技集团公司第四十五研究所 | Printing positioning mechanism for circuit boards with various dimensions and specifications and use method thereof |
| CN105328384A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Locating clamp for laser cutting of circuit boards |
| CN205057311U (en) * | 2015-09-18 | 2016-03-02 | 重庆营志电子有限公司 | Printed circuit board laser drilling machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM416964U (en) * | 2011-07-18 | 2011-11-21 | Jyh-Cheng Huang | Printed circuit board micro-adjustment jig |
-
2016
- 2016-11-25 CN CN201611051169.5A patent/CN106341953B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204795987U (en) * | 2015-06-29 | 2015-11-18 | 智恩电子(大亚湾)有限公司 | Circuit board fixator |
| CN205057311U (en) * | 2015-09-18 | 2016-03-02 | 重庆营志电子有限公司 | Printed circuit board laser drilling machine |
| CN105228356A (en) * | 2015-11-05 | 2016-01-06 | 中国电子科技集团公司第四十五研究所 | Printing positioning mechanism for circuit boards with various dimensions and specifications and use method thereof |
| CN105328384A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Locating clamp for laser cutting of circuit boards |
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| Publication number | Publication date |
|---|---|
| CN106341953A (en) | 2017-01-18 |
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Effective date of registration: 20190820 Address after: 518000 South Side of the First Industrial Zone of Xiashiwei Village, Fuyong Town, Baoan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Heng Baoshi wiring board Co., Ltd Address before: 432900 Industrial Park, Xiaochang Economic Development Zone, Xiaogan, Hubei, China Patentee before: Hubei Hui Hui Circuit Technology Co., Ltd. |
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