CN106340502A - Chip substrate with concave part and chip package same - Google Patents
Chip substrate with concave part and chip package same Download PDFInfo
- Publication number
- CN106340502A CN106340502A CN201510401304.3A CN201510401304A CN106340502A CN 106340502 A CN106340502 A CN 106340502A CN 201510401304 A CN201510401304 A CN 201510401304A CN 106340502 A CN106340502 A CN 106340502A
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- China
- Prior art keywords
- chip substrate
- chip
- recess
- conductive part
- chamber
- Prior art date
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Abstract
The invention relates to a chip substrate used for chip mounting. The chip substrate with a concave part comprises conductive parts stacked in one direction to form the chip substrate, insulating parts stacked alternately with the conductive parts and electrically isolated from the conductive parts, a cavity recessed by a predetermined depth in the area of the insulating parts on the chip substrate, and the concave part separated from the cavity outside the cavity and recessed by a predetermined depth. According to the invention, an adhesive is coated onto the previously formed concave part to prevent the adhesive from being exposed to light emitted from an optical element and denatured; the bonding reliability of a lens is improved; without an expensive and endurable adhesive and additional materials, the cost is reduced by using a conventional material; and the chip substrate which uses an inexpensive conventional bonding material can be applied to expensive UV-C (Deep UV) package.
Description
Technical field
The present invention relates to a kind of chip attachment chip substrate, include recess more particularly, to a kind of
Chip substrate and include the chip package of the chip substrate of recess using this.
Background technology
It was the space in order to form pasting chip in chip raw sheet in the past, carried out to above chip raw sheet
Machining or chemical etching.Disclose by right in Ebrean Registered Patent the 10-0986211st
It is etched above the plate shape metal raw plate of unprocessed corner and form the manufacture method mounting space.
The optical element such as attachment uv or led on the unit chip substrate that the former disk of diced chip cuts
When chip is, for improving light reflective properties, define the space with shape wide at the top and narrow at the bottom.By inciting somebody to action
The lens seals that chip attachment uses molding in the space being thusly-formed mount space, have manufactured chip envelope
Dress.
Now, it is being exposed to from optics with the bonding agent (si etc.) used by process that lens are sealed
The light of element chip such as uv transmitting, but bonding agent does not have patience to this, and elapsed time bonding agent is just
, there is the reliability reducing encapsulation in degeneration or hardening.
Prior art literature
(patent documentation) Ebrean Registered Patent the 10-0986211st
Content of the invention
Problems to be solved by the invention
For solving described technical problem, the purpose of the present invention is a kind of chip substrate structure of offer, at this
Recess is provided with board structure, and blocks bonding agent and expose to the light launched from optical element.
More specifically, the purpose of the present invention is for providing a kind of chip substrate and lens arrangement, in this chip
The recess of coat lens bonding agent is provided with substrate and lens arrangement, and block bonding agent to from
The light of optical element transmitting exposes.
For solution to problem
Aim to solve the problem that a kind of chip substrate bag of the inclusion recess according to the present embodiment of described technical problem
Include: conductive part, it stacks in one direction and constitutes chip substrate；Insulation division, it is led with described
Electric portion is alternately stacked, conductive part described in electrical isolation；Chamber, it is above described chip substrate
Including the desired depth that is recessed on the region of described insulation division；And recess, it is in the outside in described chamber and institute
State chamber to separate and the desired depth that is recessed.
Preferably, described recess is continuously formed along the outer surface in described chamber.
The described chip substrate including recess may also include outer wall, is formed at the sky separating with described chamber
Between, separate the formation space of described chamber and described recess.
Preferably, the thickness of the sealing member depending highly on for sealing described chip substrate of described outer wall
Degree.
Preferably, described conductive part or insulation division are formed as multiple, and described chamber is including at least three institutes
The region fovea superior stating insulation division described in conductive part and at least two is formed.
Preferably, described insulation division is by being formed at the anodic oxide coating bonding of at least one side of conductive part
To described conductive part, conductive part described in electrical isolation.
The described chip substrate including recess may also include concavo-convex, and it is in the described insulation by described intracavity
Formed with predetermined height, with the chip being formed at attachment on each described conductive part surface of portion's isolation
Electrode portion bonding.
Aim to solve the problem that a kind of chip substrate of the inclusion recess according to the present embodiment of described technical problem
Sealing member includes sealing, and it is used for annular seal space, this chamber to direction stacking conductive part and
It is alternately stacked with described conductive part and the chip substrate of the insulation division of conductive part described in electrical isolation composition
The area depression desired depth of the described insulation division of inclusion above；And shielding part, it is formed at described close
, so that corresponding to recess, this recess is separated with described chamber in the outside in described chamber and recessed for the one side in envelope portion
Sunken desired depth.
Preferably, the thickness of described shielding part depends on the thickness of described recess and described chamber and described recessed
Separation distance between portion.
Preferably, described shielding part is formed at the one of described sealing with the thickness including described recess
Face, so that the light that shielding comes from the one side reflection of described sealing enters into described recess.
Preferably, described shielding part is made up of the material for blocking described light, so that shielding is from institute
The light stating the one side reflection of sealing enters into described recess.
Aim to solve the problem that a kind of chip package bag of the inclusion recess according to the present embodiment of described technical problem
Include chip substrate；Optical element, this optical element is mounted on described intracavity；And sealing member, it is right
The one side of recess described in Ying Yu is formed with shielding part, and is glued by being formed at the bonding agent of described recess
Connect, to seal described chamber, wherein, institute's book is stated chip substrate and included conductive part, and it is in a direction
Upper stacking and constitute chip substrate；Insulation division, it is alternately stacked with described conductive part, electrical isolation
Described conductive part；Chamber, the region fovea superior of its described insulation division of inclusion above described chip substrate
Sunken desired depth；And recess, it is separated and the desired depth that is recessed with described chamber in the outside in described chamber.
The effect of invention
The invention has the advantages that by bonding agent is applied to preformed recess, Neng Goufang
Only bonding agent exposes and degeneration to the light launched from optical element, improves the bonding reliability of lens.And
And, do not require the use of high price and have indefatigable bonding agent, because using conventional material without additional material
Material, and reduces cost, can be applied to the uv-c of high price using cheap conventional adhesivess
(deep uv) encapsulates.
Brief description
Fig. 1 is the perspective view of the chip substrate representing the inclusion recess according to one embodiment of the invention.
Fig. 2 is the sealing member of the chip substrate representing the inclusion recess according to one embodiment of the invention
Accompanying drawing.
Fig. 3 is the chip representing the chip substrate using the inclusion recess according to one embodiment of the invention
The accompanying drawing of the sealing member of encapsulation.
Fig. 4 is the chip representing the chip substrate using the inclusion recess according to one embodiment of the invention
The accompanying drawing of the shielding example of encapsulation.
Description of reference numerals
10: chip raw sheet 100: chip substrate
110: conductive part 120: insulation division
130: chamber 140: recess
150: outer wall 160: concavo-convex
170: electrode instruction unit 200: sealing member
210: sealing 220: shielding part
300: chip 400: bonding agent
Specific embodiment
Description below only illustrates the principle of the present invention.Even if clearly not retouching in this manual
State or illustrate, those skilled in the art can implement the former of the present invention in the spirit and scope of the present invention
Manage and create multiple devices.The conditional language occurring in this manual and embodiment are merely intended to make
The design of the present invention is understood, and they are not limited to embodiment and the bar mentioned in description
Part.
In order that the people with general knowledge in the technical field of the invention can be easily implemented with this
Bright, and it is understandable so that the above objects, features and advantages of the present invention is become apparent from, with reference to attached
Figure and specific embodiment are described in further detail to the present invention.
When the present invention is described, judge illustrating as being not necessarily to of known technology related to the present invention
Ground or obscure idea of the invention, description is omitted.With reference to the accompanying drawings to according to bag of the present invention
The preferred embodiment including the chip substrate of recess is described in detail, for convenience of explanation, as chip
Illustrate taking uv led as a example.
Fig. 1 is that expression is saturating according to the chip substrate 100 of the inclusion recess 140 of one embodiment of the invention
View.
With reference to Fig. 1, the chip substrate 100 of the inclusion recess 140 according to the present embodiment includes conductive part
110th, insulation division 120, chamber 130, recess 140, outer wall 150, concavo-convex 160 and electrode instruction unit
170.
Apply electrode in the present embodiment conductive part 110 to the chip 300 of attachment.That is, it is to chip 300
Apply electrode, conductive part 110 formed by conductive material, the bottom of conductive part 110 be formed with electrode
The bonding such as pcb substrate, and be applied in electrode from outside.In the present embodiment, conductive part 110 can be by
Aluminium plate is formed.
Be to apply electrode respectively to the electrode portion of chip 300, insulation division 120 by conductive part 110 electrically every
From.That is, it is the electrode applying anode and negative electrode to chip 300 respectively, electrical isolation conductive part 110,
And each conductive part 110 isolated can be applied in anode and negative electrode respectively from outside.
Additionally, being to apply electrode at least two chips in the present embodiment, conductive part 110 is formed as
Multiple.I.e. with reference to Fig. 1, three conductive parts 110 can be bonded with a unit substrate 100.
And, in the present embodiment, it is to apply Different electrodes at least two chips and isolate multiple conductions
Portion 110, insulation division 120 is formed as multiple.I.e. with reference to Fig. 1, three in a unit substrate 100
Two insulation divisions 120 can be formed between individual conductive part 110.
In the present embodiment, insulation division 120 can be formed with the dielectric film of synthetic resin material.Now, profit
With the bonding conductive part such as liquid phase adhesive 110 and insulation division 120, for improving bonding force, by synthetic resin
The bonding film of material is clipped between conductive part 110 and insulation division 120 and can carry out bonding.Now, for more
Plus raising bonding force, in the High Temperature High Pressure room that can keep the temperature and pressure higher than room temperature and normal pressure
Executable technique for sticking.Additionally, after bonding plane is passed through mechanically or chemically to give roughness,
Technique for sticking can be carried out.
I.e. in conductive part 110 and the insulation division 120 of the present embodiment, at least one side to conductive part 110,
Preferably, the face in opposing insulation portion 120 is carried out with anodic oxidation (anodizing) process, by this conductive part
110 can bond to insulation division 120.When i.e. conductive part 110 is made of aluminum, for improving bonding force,
Anodized can be carried out to each bonding plane it is also possible to so carrying out sun before technique for sticking
The surface of pole oxidation processes gives roughness.
Additionally, in the present embodiment, such as conductive part 110 is aluminium base 100, insulation division 120 can pass through
Anodized is carried out to the face in facing conductive portion 110 and bonding to be formed.
Subsequently, in the present embodiment, for forming the space of pasting chip 300, including the chip of recess 140
Substrate 100 includes chamber 130, and this chamber 130 becomes to the inner side direction spill of conductive part 110.I.e. with reference to Fig. 1
And Fig. 2, the surface of the substrate 100 of pasting chip 300 spill compared with exterior face becomes.I.e. substrate 100 has
There is the shape forming outer wall 150 in the periphery of the part of pasting chip 300.
I.e. in the present embodiment, on the conductive part in space that chip attachment is formed in chamber 130, in attachment
After chip, chamber 130 is sealed with lens etc., and chip package can be manufactured.
And, may also include recess 140 in the present embodiment chip substrate 100.
With reference to Fig. 1, the recess 140 according to the present embodiment is in 130 points of outside and the described chamber in described chamber 130
Every and the desired depth that is recessed.
" outside in chamber 130 " refer on chip substrate 100 than chamber 130 closer to outside side shape
Become, " separation " refers to that the underlapped female in chamber 130 is formed as shown in Figure 1 with interval.
Form the outer wall in the formation space of separate chamber 130 and recess 140 by these intervals as shown in Figure 2
150, outer wall 150 shields and enters in recess 140 from the uv line of uv led transmitting.
Preferably, it is continuously formed along chamber 130 in the present embodiment recess 140.Manufacturing chip envelope
During dress, for the contact area between expanding for the sealing member 200 of sealing, the continuous landform of recess 140
Become and being capable of bonding force between lift-off seal part 200 and chip substrate 100.And, because of continuous landform
Become, when bonding agent 400 is injected into recess 140, can be carried out by only injection technology once
Injection, therefore, favourable in process aspect.
But in view of being the technique forming recess 140, if recess 140 is segmented into two recesses.
I.e. with reference to Fig. 4, by forming the recess 140 according to the present embodiment, it is prevented from bonding agent 400
Expose and degeneration to the uv line of primary emission, improve the bonding reliability of lens.
And, may also include concavo-convex 160 in the present embodiment chip attachment substrate 100.
On the surface of each conductive part that the present embodiment concavo-convex 160 is isolated by insulation division in chamber 130 with
Predetermined height is formed, bonding with the electrode portion being formed at chip.
The present embodiment concavo-convex 160 on the surface of each conductive part 110 isolated by insulation division 120 with
Predetermined height is formed, bonding with the electrode portion being formed at chip 300.I.e. concavo-convex 160 in conductive part
On 110 surface, with reference to Fig. 1, centered on insulation division on the surface of the conductive part 110 of both sides shape
Become.
I.e. concavo-convex 160 on the surface of two conductive parts 110 isolated by insulation division 120 with predetermined altitude
Formed.Concavo-convex 160 is that the electrode being applied to conductive part 110 is applied to the electrode portion of the chip 300 mounting
Plus, preferably formed by conductive material, or can be the gold being caused by gold concavo-convex 160.
It is that there is the upside-down mounting that there is electrode portion in optical element lower end in the chip 300 of the present embodiment attachment
During chip 300 structure, electrode portion is formed at the core relative with conductive part 110 surface being formed with chamber 130
The one side of piece 300, concavo-convex 160 bond to the electrode portion being formed at opposite side and can be applied in electricity
Pole.
With reference to Fig. 3, Fig. 3 is to represent to paste on the chip 300 attachment substrate 100 according to above-described embodiment
The accompanying drawing of chip 300 encapsulation of cartridge chip 300, in Fig. 3, the electrode portion of chip 300 is formed at chip
300 bottom surface, when chip 300 is mounted on substrate 100, the electrode portion of chip 300 bonds to and is formed at
Concavo-convex the 160 of substrate 100.
Therefore, in the present embodiment, concavo-convex 160 are formed at the place that there is chip 300 on aluminium base 100
(electrode part), or in another embodiment, concavo-convex 160 can be previously formed in the electrode of chip
Portion, or the electrode portion body of chip is formed such that have can play concavo-convex 160 effect thickness and glue
It is connected on aluminium base 100.
Additionally, with reference to Fig. 3, chip 300 attachment substrate 100 also may be used for welding electrode portion and concavo-convex 160
Including the solder (not shown) being formed on concavo-convex 160 surfaces.The plating being formed in uvchip electrode portion
Layer (not shown) and concavo-convex 160 can pass through hot ultrasonic (thermo-sonic) welding bonding, or concavo-convex
Forming solder (not shown) on 160 surfaces and pass through welding being capable of bonding.
Additionally, electrode instruction be may also include according to the chip substrate 100 of the inclusion recess 140 of the present embodiment
Portion 170.
With reference to Fig. 1, as mentioned above in the present embodiment chip substrate 100 between two conductive parts 110 shape
Become to have insulation division 120, therefore the conductive part 110 isolated by insulation division 120 can be applied respectively different
Electrode.Therefore, pre-established by being marked to the surface of only conductive part 110 as mark
If the conductive part 110 of note part be applied in (+) pole, can be more prone to judge conductive part 110
Electrode.
Referring to Fig. 2, the sealing to the chip substrate 100 of the inclusion recess 140 according to the present embodiment
Part 200 illustrates.
Sealing 210 and shielding part 220 are included according to the sealing member 200 of the present embodiment.
Sealing 210 is used for annular seal space 130, this chamber 130 to direction stacking conductive part and
It is alternately stacked with described conductive part and the chip substrate of the insulation division of conductive part described in electrical isolation composition
The area depression desired depth of the described insulation division of inclusion above 100.
I.e. with reference to Fig. 2 it is preferable that sealing 210 is formed as circular lens.Now, circle depends on
In the shape in the chamber 130 sealing and the recess 140 of the outside being formed at chamber 130, according to the chip base of Fig. 1
Plate 100 includes the chamber 130 of circle and circular recess 140, and the therefore shape of sealing 210 is also circle
Shape.Thus, the shape meeting of the chamber 130 according to chip substrate 100 for the shape of sealing 210 and recess 140
Change.
Shielding part 220 is formed at the one side of described sealing 210 so that corresponding to recess 140, this is recessed
Portion 140 is separated and the desired depth that is recessed with described chamber 130 in the outside in described chamber 130.
I.e. with reference to Fig. 2, shielding part 220 along sealing 210 circular edge line may be formed to have pre-
Determine the annular of thickness.
Now, the thickness of shielding part 220 is in view of the thickness of described recess 140 and described chamber 130 and described
The separation distance of recess 140 and can determine.
I.e. when the thickness of shielding part 220 is thinner than the thickness of recess 140, can not shield as shown in Figure 4
The light coming from lens face reflection enters into recess 140.And it is preferable that as shown in Figure 3 in shielding
When portion 220 is formed at the region all including recess 140 and outer wall 150, the entrance to light can more be pacified
Entirely carry out secondary shielding.
Referring to Fig. 3, the chip package of the inclusion recess 140 according to one embodiment of the invention is entered
Row explanation.
Chip substrate 100, optical element 300 and sealing member are included according to the chip package of the present embodiment
200.
In the present embodiment, chip substrate 100 includes conductive part 110, and it stacks and structure in one direction
Become chip substrate 100；Insulation division 120, it is alternately stacked with described conductive part 110, electrical isolation
Described conductive part 110；Chamber 130, its depression on the region including described insulation division 120 is predetermined deep
Degree；And recess 140, it is separated and the pre- depthkeeping that is recessed with described chamber 130 in the outside in described chamber 130
Degree.
Optical element is mounted in chamber 130.
And, sealing member 200 is formed with shielding part 220 in the one side corresponding to described recess 140, and
By being formed at bonding agent 400 bonding of described recess 140, to seal described chamber 130.
Above according to the chip substrate 100 of the present embodiment, optical element and sealing member 200 are corresponding to above-mentioned
Each composition of embodiment, therefore omits the description here.
In a word, according to the present invention, it is coated on preformed recessed as shown in Figure 4 by bonding agent 400
Portion, is prevented from bonding agent and exposes and degeneration to the light launched from optical element, improves sealing member (thoroughly
Mirror) bonding reliability.And, do not require the use of high price and have indefatigable bonding agent 400, because utilizing
Conventional material is without additional materials, and reduces cost, the energy using cheap conventional adhesivess
Enough it is applied to uv-c (deep uv) encapsulation of high price.
Foregoing description only relates to the description of a specific embodiment of the technical spirit of the present invention, and this
Bright those skilled in the art must not depart from the basic feature of the present invention to carry out different modifications or to change
Become.
Therefore, presently disclosed embodiment and accompanying drawing are not limited to the technology essence of the present invention
God, but in order to describe this technical spirit, and the scope of the present invention should not necessarily be limited by described embodiment and
Accompanying drawing.Protection scope of the present invention should be determined by claim, and institute in equivalent scope
The explanation having technical spirit all should fall within the scope of the present invention.
Claims (13)
1. a kind of chip substrate including recess is it is characterised in that include:
Conductive part, it stacks in one direction and constitutes chip substrate；
Insulation division, it is alternately stacked with described conductive part, conductive part described in electrical isolation；
Chamber, its depression on the region of the described insulation division of inclusion above described chip substrate is pre-
Depthkeeping degree；And
Recess, separates and the desired depth that is recessed in outside and the described chamber in described chamber.
2. the chip substrate including recess according to claim 1 is it is characterised in that described recessed
Portion is continuously formed along the outer surface in described chamber.
3. the chip substrate including recess according to claim 1 is it is characterised in that also wrap
Include:
Outer wall, it is formed at the space separating with described chamber, separates and isolates described chamber and described recessed
The formation space in portion.
4. the chip substrate including recess according to claim 3 is it is characterised in that described outer
The thickness of the sealing member depending highly on for sealing described chip substrate of wall.
5. the chip substrate including recess according to claim 1 is it is characterised in that described lead
Electric portion or insulation division are formed as multiple, described chamber include at least two described in conductive part and
The region fovea superior of at least one described insulation division is formed.
6. the chip substrate including recess according to claim 1 it is characterised in that described absolutely
Edge bonds to described conduction by being formed at the anodic oxide coating of at least one side of conductive part
Portion, conductive part described in electrical isolation.
7. the chip substrate including recess according to claim 1 is it is characterised in that also wrap
Include:
Concavo-convex, it is in each the described conductive part table isolated by described insulation division by described intracavity
Formed with predetermined height on face, bonding with the electrode portion of the chip being formed at attachment.
8. a kind of sealing member of the chip substrate including recess is it is characterised in that include:
Sealing, it is used for annular seal space, this chamber to direction stacking conductive part and with
Described conductive part is alternately stacked and the core of the insulation division of conductive part described in electrical isolation composition
The area depression desired depth of the described insulation division of inclusion above plate base；And
Shielding part, it is formed at the one side of described sealing so that corresponding to recess, this recess
Separate and the desired depth that is recessed with described chamber in the outside in described chamber.
9. the sealing member of the chip substrate including recess according to claim 8, its feature exists
Thickness in, described shielding part depends on the thickness of described recess and described chamber and described recessed
Separation distance between portion.
10. the sealing member of the chip substrate including recess according to claim 8, its feature exists
In described shielding part is formed at the one of described sealing with the thickness including described recess
Face, so as the light that shielding comes from the reflection of the one side of described sealing enter into described recessed
Portion.
The sealing member of 11. chip substrates including recess according to claim 8, its feature exists
In described shielding part is made up of the material for blocking described light, so that shielding is from institute
The light stating the one side reflection of sealing enters into described recess.
The sealing member of 12. chip substrates including recess according to claim 8, its feature exists
In described shielding part is formed at bonding between described sealing and described chip substrate
Face.
A kind of 13. chip packages including recess are it is characterised in that include:
Chip substrate, this chip substrate includes conductive part, and it stacks in one direction and constitutes
Chip substrate；Insulation division, it is alternately stacked with described conductive part, described in electrical isolation
Conductive part；Chamber, its desired depth that is recessed on the region including described insulation division；And it is recessed
Portion, it is separated and the desired depth that is recessed with described chamber in the outside in described chamber；
Optical element, this optical element is mounted on described intracavity；And
Sealing member, this sealing member is formed with shielding part in the one side corresponding to described recess, and leads to
Cross the bonding agent bonding being formed at described recess, to seal described chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510401304.3A CN106340502A (en) | 2015-07-09 | 2015-07-09 | Chip substrate with concave part and chip package same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510401304.3A CN106340502A (en) | 2015-07-09 | 2015-07-09 | Chip substrate with concave part and chip package same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106340502A true CN106340502A (en) | 2017-01-18 |
Family
ID=57826966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510401304.3A Pending CN106340502A (en) | 2015-07-09 | 2015-07-09 | Chip substrate with concave part and chip package same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106340502A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108574035A (en) * | 2017-03-14 | 2018-09-25 | 现代自动车株式会社 | External light-emitting for vehicle encapsulates |
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| CN103875084A (en) * | 2011-10-05 | 2014-06-18 | 普因特工程有限公司 | Method for manufacturing a can package-type optical device, and optical device manufactured thereby |
| CN203707127U (en) * | 2014-01-14 | 2014-07-09 | 深圳市晶台股份有限公司 | COB packaging structure with low thermal resistance and high luminous efficiency |
| CN203733847U (en) * | 2013-12-25 | 2014-07-23 | 深圳市瑞丰光电子股份有限公司 | Led packaging structure |
| CN103999554A (en) * | 2011-12-15 | 2014-08-20 | 普因特工程有限公司 | Optical device integrated with driving circuit and power supply circuit, method for manufacturing optical device substrate used therein, and substrate thereof |
| CN104576905A (en) * | 2013-10-10 | 2015-04-29 | 普因特工程有限公司 | Method for Mounting Chip and Chip Package |
| CN104659194A (en) * | 2013-11-20 | 2015-05-27 | 普因特工程有限公司 | Chip Substrate Having a Lens Insert |
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2015
- 2015-07-09 CN CN201510401304.3A patent/CN106340502A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103875084A (en) * | 2011-10-05 | 2014-06-18 | 普因特工程有限公司 | Method for manufacturing a can package-type optical device, and optical device manufactured thereby |
| CN103999554A (en) * | 2011-12-15 | 2014-08-20 | 普因特工程有限公司 | Optical device integrated with driving circuit and power supply circuit, method for manufacturing optical device substrate used therein, and substrate thereof |
| CN104576905A (en) * | 2013-10-10 | 2015-04-29 | 普因特工程有限公司 | Method for Mounting Chip and Chip Package |
| CN104659194A (en) * | 2013-11-20 | 2015-05-27 | 普因特工程有限公司 | Chip Substrate Having a Lens Insert |
| CN203733847U (en) * | 2013-12-25 | 2014-07-23 | 深圳市瑞丰光电子股份有限公司 | Led packaging structure |
| CN203707127U (en) * | 2014-01-14 | 2014-07-09 | 深圳市晶台股份有限公司 | COB packaging structure with low thermal resistance and high luminous efficiency |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108574035A (en) * | 2017-03-14 | 2018-09-25 | 现代自动车株式会社 | External light-emitting for vehicle encapsulates |
| CN108574035B (en) * | 2017-03-14 | 2022-07-26 | 现代自动车株式会社 | External light emitting diode package for vehicle |
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Application publication date: 20170118 |