CN106322130B

CN106322130B - Lighting lamp

Info

Publication number: CN106322130B
Application number: CN201610693495.XA
Authority: CN
Inventors: 叶伟炳
Original assignee: Dongguan Wenyu Industrial Co Ltd
Current assignee: Dongguan Wenyu Industrial Co Ltd
Priority date: 2016-08-18
Filing date: 2016-08-18
Publication date: 2020-01-03
Anticipated expiration: 2036-08-18
Also published as: CN106322130A

Abstract

A lighting lamp comprises a mounting module, an LED module, a heat dissipation module, a fixed base and a reinforced heat dissipation piece. The heat dissipation module comprises a heat dissipation main plate body, a heat dissipation assembly and two heat dissipation columns, wherein the first end of the heat dissipation main plate body is fixed with the second mounting surface, and the heat dissipation assembly comprises a plurality of first heat dissipation fins and a plurality of second heat dissipation fins. The heat dissipation module of the lighting lamp can quickly and timely dissipate heat transmitted to the installation module by the LED module to the outside rapidly by arranging the heat dissipation main board body, the heat dissipation assembly and the two heat dissipation cylinders, and the installation module and the fixed base can also play a role in auxiliary heat dissipation, so that the heat dissipation effect can be improved, and the requirement of the lamp with large heat productivity is met.

Description

Lighting lamp

Technical Field

The invention relates to the technical field of heat dissipation, in particular to an illuminating lamp.

Background

Generally, in an existing lamp, a light emitting element is generally mounted on an aluminum substrate, and then the aluminum substrate is mounted on a housing of the lamp, and heat generated by the light emitting element during normal light emission needs to be transferred to the aluminum substrate and then transferred to the outside air through the housing, so as to achieve a heat dissipation effect.

However, the heat dissipation effect is limited by the structure of the aluminum substrate, and it is difficult to meet the requirements of the lamp with high power, high brightness and large heat generation amount, and further, the casing of the lamp is usually made of plastic, which has poor heat dissipation performance, plays more roles of protection and decoration, and affects the heat dissipation path between the aluminum substrate and the outside air, and has poor heat dissipation effect, and especially, it is difficult to meet the requirements of the lamp with high power, high brightness and large heat generation amount.

Disclosure of Invention

Therefore, there is a need for a lighting device with a good heat dissipation effect.

A lighting fixture, comprising:

the mounting module comprises a transition plate body, a mounting plate body and a connecting piece, wherein the mounting plate body is attached to the transition plate body, the side surface, away from the transition plate body, of the mounting plate body is provided with a first mounting surface, the side surface, away from the mounting plate body, of the transition plate body is provided with a second mounting surface, the connecting piece sequentially penetrates through the mounting plate body and the transition plate body, and the connecting piece is fixed with the mounting plate body and the transition plate body respectively;

the LED module comprises a plurality of LED lamp banks, the LED lamp banks are sequentially arranged on the first mounting surface at intervals, each LED lamp bank comprises a plurality of LED chips and a strip-shaped carrier, the strip-shaped carrier is attached to the first mounting surface, and the LED chips are sequentially arranged on the side surface, far away from the mounting plate body, of the strip-shaped carrier at intervals;

the heat dissipation module comprises a heat dissipation main plate body, a heat dissipation assembly and two heat dissipation columns, wherein the first end of the heat dissipation main plate body is fixed with the second installation surface, the heat dissipation main plate body is provided with a first fixing surface and a second fixing surface which are oppositely arranged, the heat dissipation assembly comprises a plurality of first heat dissipation fins and a plurality of second heat dissipation fins, the first heat dissipation fins are sequentially arranged on the first fixing surface at intervals, the second heat dissipation fins are sequentially arranged on the second fixing surface at intervals, the first ends of the heat dissipation columns are fixed with the second installation surface, one of the heat dissipation columns sequentially penetrates through the first heat dissipation fins, and the other heat dissipation column sequentially penetrates through the second heat dissipation fins;

the fixed base is respectively connected with the second end of the heat dissipation main plate body and the second end of the heat dissipation column body; and

the reinforced heat dissipation module comprises a reinforced heat dissipation column body, wherein the reinforced heat dissipation column body is provided with a hollow structure with openings at two ends, a reinforced heat dissipation cavity is formed in the reinforced heat dissipation column body, reinforced heat dissipation holes are formed in the side wall of the heat dissipation column body and are communicated with the reinforced heat dissipation cavity, the reinforced heat dissipation column body comprises a reinforced heat dissipation body and a reinforced heat dissipation extension portion, the reinforced heat dissipation body is accommodated in the reinforced heat dissipation cavity, two ends of the reinforced heat dissipation body are respectively fixed with a second mounting surface and a fixing base, one end of the reinforced heat dissipation extension portion is connected with the reinforced heat dissipation body, and the other end of the reinforced heat dissipation extension portion penetrates through the reinforced heat dissipation holes and is exposed.

In one embodiment, the heat dissipation cylinder is provided with a plurality of the enhanced heat dissipation holes, the enhanced heat dissipation member is provided with a plurality of enhanced heat dissipation extension portions, and each enhanced heat dissipation extension portion penetrates through one enhanced heat dissipation hole in a one-to-one correspondence manner.

In one embodiment, the heat dissipation enhancing body has a cylindrical structure.

In one embodiment, the heat dissipation extensions are radially distributed around a central axis of the enhanced heat dissipation body.

In one embodiment, the heat dissipation enhancing extension has an ellipsoidal structure.

In one embodiment, an end of the enhanced heat dissipation extension portion away from the enhanced heat dissipation body is connected to the heat dissipation main board.

In one embodiment, a gap is formed between the enhanced heat dissipation body and the inner side wall of the heat dissipation cylinder.

The heat dissipation module of the lighting lamp can quickly and timely dissipate heat transmitted to the installation module by the LED module to the outside rapidly by arranging the heat dissipation main board body, the heat dissipation assembly and the two heat dissipation cylinders, and the installation module and the fixed base can also play a role in auxiliary heat dissipation, so that the heat dissipation effect can be improved, and the requirement of the lamp with large heat productivity is met.

Drawings

Fig. 1 is a schematic structural diagram of a lighting fixture according to an embodiment of the invention;

FIG. 2 is a schematic view of the lighting fixture shown in FIG. 1 from another viewing angle;

FIG. 3 is an enlarged view of FIG. 2 at A;

FIG. 4 is a schematic view of the lighting fixture shown in FIG. 1 from another viewing angle;

FIG. 5 is a sectional view taken along line A-A of FIG. 4;

FIG. 6 is a schematic structural diagram of a heat dissipating column according to another embodiment of the present invention;

FIG. 7 is a schematic structural diagram of a heat dissipating column according to another embodiment of the present invention;

FIG. 8 is a schematic view of a partial structure of a lighting fixture according to another embodiment of the present invention;

FIG. 9 is a schematic view of a partial structure of a lighting fixture according to another embodiment of the present invention;

fig. 10 is a schematic structural view of a mounting plate according to another embodiment of the present invention.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

For example, a lighting fixture, comprising: the mounting module comprises a transition plate body, a mounting plate body and a connecting piece, wherein the mounting plate body is attached to the transition plate body, the side surface, away from the transition plate body, of the mounting plate body is provided with a first mounting surface, the side surface, away from the mounting plate body, of the transition plate body is provided with a second mounting surface, the connecting piece sequentially penetrates through the mounting plate body and the transition plate body, and the connecting piece is fixed with the mounting plate body and the transition plate body respectively; the LED module comprises a plurality of LED lamp banks, the LED lamp banks are sequentially arranged on the first mounting surface at intervals, each LED lamp bank comprises a plurality of LED chips and a strip-shaped carrier, the strip-shaped carrier is attached to the first mounting surface, and the LED chips are sequentially arranged on the side surface, far away from the mounting plate body, of the strip-shaped carrier at intervals; the heat dissipation module comprises a heat dissipation main plate body, a heat dissipation assembly and two heat dissipation columns, wherein the first end of the heat dissipation main plate body is fixed with the second installation surface, the heat dissipation main plate body is provided with a first fixing surface and a second fixing surface which are oppositely arranged, the heat dissipation assembly comprises a plurality of first heat dissipation fins and a plurality of second heat dissipation fins, the first heat dissipation fins are sequentially arranged on the first fixing surface at intervals, the second heat dissipation fins are sequentially arranged on the second fixing surface at intervals, the first ends of the heat dissipation columns are fixed with the second installation surface, one of the heat dissipation columns sequentially penetrates through the first heat dissipation fins, and the other heat dissipation column sequentially penetrates through the second heat dissipation fins; the fixed base is respectively connected with the second end of the heat dissipation main plate body and the second end of the heat dissipation column body; the reinforced heat dissipation module comprises a heat dissipation module, a reinforced heat dissipation column body and a reinforced heat dissipation extension part, wherein the heat dissipation column body is provided with a hollow structure with openings at two ends, a reinforced heat dissipation cavity is formed in the reinforced heat dissipation column body, reinforced heat dissipation holes are formed in the side wall of the heat dissipation column body and are communicated with the reinforced heat dissipation cavity, the reinforced heat dissipation column body comprises a reinforced heat dissipation body and a reinforced heat dissipation extension part, the reinforced heat dissipation body is accommodated in the reinforced heat dissipation cavity, two ends of the reinforced heat dissipation body are respectively fixed with a second mounting surface and a fixing base, one end of the reinforced heat dissipation extension part is connected with the reinforced heat dissipation body, and the other end of the reinforced heat dissipation extension part.

To further illustrate the above-mentioned lighting fixture, referring to fig. 1 and fig. 2 together, another example is that the lighting fixture 10 includes: the LED module comprises an installation module 100, an LED module 200, a heat dissipation module 300 and a fixed base 400, wherein the LED module 200 is arranged on the installation module 100, and the heat dissipation module 300 is connected with the installation module 100. The mounting module 100 is used for directly transferring heat generated by the LED module during normal light emission to the heat dissipation module 300, and dissipating the heat from the heat dissipation module 300 to the external environment, so as to achieve a heat dissipation effect and ensure the normal working performance of the LED module 200. The fixing base 400 is connected with the heat dissipation module 300, and the lighting fixture 10 is installed through the fixing base 400 to support and fix.

Referring to fig. 4 and 5, the mounting module 100 includes a transition board 110, a mounting board 120 and a connecting member 130, the mounting board 120 is attached to the transition board 110, the mounting board 120 is used for mounting the LED module, the mounting board 120 directly transfers heat generated by the LED module during normal light emission to the transition board 110, and the transition board 110 transfers the heat to the heat dissipation module. For example, the transition plate body is in intimate contact with the mounting plate body.

Referring to fig. 5, the connecting member 130 sequentially penetrates through the mounting plate 120 and the transition plate 110, and the connecting member 130 is fixed to the mounting plate 120 and the transition plate 110, so that the mounting plate 120 and the transition plate 110 can be better fixed by the connecting member 130. For example, the connecting member is a threaded fastener, such as a screw, a bolt or a nut, and the connecting member is screwed with the mounting plate and the transition plate respectively for better assembling the mounting plate and the transition plate together.

Referring to fig. 5, a side of the mounting plate 120 away from the transition plate 110 has a first mounting surface 121, that is, the first mounting surface 121 is located on the mounting plate 120 and away from the side of the transition plate 110, and the first mounting surface 121 is used for mounting an LED module, for example, the first mounting surface has a planar structure. For example, the mounting plate body has a rectangular body-like structure.

Referring to fig. 5, a side of the transition board body 110 away from the mounting board body 120 has a second mounting surface 111, that is, the second mounting surface 111 is located on the transition board body 110 and away from the side of the mounting board body 120, and the second mounting surface 111 mounts the heat dissipation module, for example, the second mounting surface has a planar structure. For example, the transition plate body has a rectangular body-like structure.

Referring to fig. 1, the LED module 200 includes a plurality of LED light banks 210, and the LED light banks 210 are sequentially disposed on the first mounting surface 121 of the mounting plate 120 at intervals, for example, the LED light banks are distributed in a rectangular array. For example, the lighting fixture further comprises a power driving module, and the LED chip is electrically connected to the power driving module and is configured to supply power to the LED chip.

Referring to fig. 1, the LED light bar 210 includes a plurality of LED chips 211 and a bar-shaped carrier 212, the bar-shaped carrier 212 is attached to the first mounting surface 121, and the plurality of LED chips 211 are sequentially disposed on a side surface of the bar-shaped carrier 212 away from the mounting plate 120 at intervals. For example, the material of the strip-shaped carrier is a heat conductive material, e.g., the heat conductive material is a metal or an alloy, e.g., the material of the strip-shaped carrier is an aluminum alloy.

Referring to fig. 5, the heat dissipation module 300 includes a heat dissipation main board 310, a heat dissipation assembly 320 and two heat dissipation columns 330, wherein a first end of the heat dissipation main board 310 is fixed to the second mounting surface 111, and the heat dissipation main board can rapidly and timely absorb heat transferred from the LED module to the mounting board and the transition board and dissipate the heat.

Referring to fig. 5, the heat dissipating main plate 310 has a first fixing surface 311 and a second fixing surface 312 disposed opposite to each other. The heat dissipation assembly 320 comprises a plurality of first heat dissipation fins 321 and a plurality of second heat dissipation fins 322, the plurality of first heat dissipation fins 321 are sequentially arranged on the first fixing surface 311 at intervals, the plurality of first heat dissipation fins 321 are arranged on the second fixing surface 312 at intervals, the plurality of first heat dissipation fins 321 and the plurality of second heat dissipation fins 322 can greatly share the heat dissipation load of the heat dissipation main plate body, the heat can be effectively dissipated to the outside, the problem of local overheating of the installation plate body can be avoided, the heat dissipation surface area of the heat dissipation module can be effectively improved, the heat dissipation and ventilation degree can be further improved by arranging the heat dissipation fins at intervals, the overall heat dissipation effect of the lighting lamp can be improved, and the requirement of the lamp with large heat dissipation can be met.

Referring to fig. 5, the first ends of the heat dissipating columns 330 are fixed to the second mounting surface 111, one of the heat dissipating columns sequentially penetrates through the plurality of first heat dissipating fins 321, and the other heat dissipating column sequentially penetrates through the plurality of second heat dissipating fins 322, so that heat on the transition plate can be rapidly transferred to the plurality of first heat dissipating fins 321 and the plurality of second heat dissipating fins 322 by the arrangement of the heat dissipating columns 330, and in addition, can be rapidly transferred to the fixing base 400, so as to further improve the overall heat dissipating effect of the lighting fixture.

Referring to fig. 2, a fixing base 400 is respectively connected to the second end of the heat dissipating main plate 310 and the second end of the heat dissipating column 330, and the fixing base 400 is used for performing a heat dissipating operation together with the heat dissipating module, so as to further improve a heat dissipating effect of the lighting fixture. In addition, the fixed base is also used for supporting and fixing.

For further improving the heat dissipation effect of the heat dissipation assembly 320, for example, please refer to fig. 3, the surface of the first heat dissipation fin 321 is provided with heat dissipation insections 321a, and the heat dissipation insections 321a are connected, so that the heat dissipation surface area of the first heat dissipation fin can be further improved for improving the heat dissipation effect of the lighting fixture; for another example, the structure of the second heat sink is the same as the structure of the second heat sink.

The heat dissipation module 300 of the lighting fixture 10 can quickly and timely dissipate heat transferred from the LED module 200 to the installation module 100 to the outside quickly by the arrangement of the heat dissipation main plate 310, the heat dissipation assembly 320 and the two heat dissipation columns 330, and the installation module 100 and the fixing base 400 can also play a role in auxiliary heat dissipation, so that the heat dissipation effect can be improved to meet the requirement of a large heat dissipation fixture.

For further enhancing the heat conduction and dissipation effects of the lighting fixture, for example, please refer to fig. 6, the lighting fixture further includes an enhanced heat dissipation member 500, the heat dissipation post 330 has a hollow structure with two open ends, an enhanced heat dissipation cavity 331 is formed in the heat dissipation post 330, an enhanced heat dissipation hole 332 is formed on the sidewall of the heat dissipation post 330, the enhanced heat dissipation hole is communicated with the enhanced heat dissipation cavity, the enhanced heat dissipation member 500 includes an enhanced heat dissipation body 510 and an enhanced heat dissipation extension portion 520, the enhanced heat dissipation body is accommodated in the enhanced heat dissipation cavity, two ends of the enhanced heat dissipation body are respectively fixed to the second mounting surface and the fixing base, one end of the enhanced heat dissipation extension portion is connected to the enhanced heat dissipation body, and the other end of the enhanced heat dissipation extension portion is inserted through the enhanced heat dissipation hole and exposed outside the heat dissipation module, in this way, by providing the reinforced heat dissipation member 500, the heat conduction and heat dissipation effects of the lighting fixture can be further enhanced.

In order to further enhance the heat conduction and dissipation effects of the lighting fixture, for example, the heat dissipation cylinder is provided with a plurality of the enhanced heat dissipation holes, the enhanced heat dissipation member is provided with a plurality of enhanced heat dissipation extension portions, and each enhanced heat dissipation extension portion is penetrated with one enhanced heat dissipation hole in a one-to-one correspondence manner; for another example, the enhanced heat dissipation body has a circular columnar structure; for another example, the plurality of heat dissipation extension portions are radially distributed along the central axis of the enhanced heat dissipation body; for another example, the heat dissipation enhancing extension has an ellipsoidal structure; for another example, one end of the enhanced heat dissipation extension part, which is far away from the enhanced heat dissipation body, is connected with the heat dissipation main board body; for another example, an interval is arranged between the reinforced heat dissipation body and the inner side wall of the heat dissipation column, so that the heat conduction and heat dissipation effects of the lighting lamp can be further enhanced.

For further enhancing the heat conduction and dissipation effect of the lighting fixture, for example, please refer to fig. 7, the lighting fixture further includes an auxiliary heat conduction member 600, the auxiliary heat conduction member 600 includes an auxiliary heat conduction cylinder 610, an auxiliary heat conduction connection plate 620, a first auxiliary heat conduction collar 630 and a second auxiliary heat conduction collar 640, the heat dissipation cylinder 330 has a hollow structure with two open ends, the auxiliary heat conduction cylinder is accommodated inside the heat dissipation cylinder, two ends of the auxiliary heat conduction cylinder are respectively fixed to the second mounting surface and the fixed base, two ends of the auxiliary heat conduction connection plate are respectively connected to the auxiliary heat conduction cylinder and the inner side wall of the heat dissipation cylinder, the first auxiliary heat conduction collar is sleeved outside the auxiliary heat conduction cylinder, the first auxiliary heat conduction collar is connected to the auxiliary heat conduction connection plate, and the second auxiliary heat conduction collar is sleeved outside the first auxiliary heat conduction collar, and the second auxiliary heat conduction sleeve ring is connected with the auxiliary heat conduction connecting plate, the auxiliary heat conduction cylinder is connected with the space between the first auxiliary heat conduction sleeve ring, the first auxiliary heat conduction sleeve ring and the second auxiliary heat conduction sleeve ring as well as the second auxiliary heat conduction sleeve ring and the inner side wall of the heat dissipation cylinder, so that the heat conduction and heat dissipation effects of the lighting lamp can be further enhanced by arranging the auxiliary heat conduction piece 600.

In order to further enhance the heat conduction and dissipation effects of the lighting fixture, for example, the first auxiliary heat conduction collar has a circular ring structure; for another example, the second auxiliary heat conducting collar has a circular ring structure; for another example, a distance between the auxiliary heat-conducting cylinder and the first auxiliary heat-conducting collar is equal to a distance between the first auxiliary heat-conducting collar and the second auxiliary heat-conducting collar; for another example, the auxiliary heat conducting member is provided with a plurality of auxiliary heat conducting connecting plates, and the plurality of auxiliary heat conducting connecting plates are sequentially arranged at intervals; as another example, the thermally conductive cylinder has a circular cylindrical structure; for another example, the auxiliary heat conducting connecting plates are distributed in a central symmetry manner with the central axis of the heat conducting column, so that the heat conducting and radiating effects of the lighting lamp can be further enhanced.

In order to achieve the effect of buffering and damping the overall structure of the lighting fixture, especially the effect of buffering and damping the first heat sink and the second heat sink, the user protects the LED module mounted on the mounting board, and further improves the heat conduction and heat dissipation effects, for example, referring to fig. 8, the lighting fixture 700 further includes a buffering and heat dissipation module 710, the buffering and heat dissipation module 710 includes a plurality of first spiral elastic members 711 and a plurality of second spiral elastic members 712, the plurality of first spiral elastic members 711 are all sleeved outside one of the heat dissipation columns, two adjacent first heat sinks 321 are respectively abutted against two ends of one of the first spiral elastic members 711, the plurality of second spiral elastic members 712 are all sleeved outside the other heat dissipation column, two adjacent second heat sinks 322 are respectively abutted against two ends of one of the second spiral elastic members 712, like this, can play through setting up buffering heat dissipation module 710 right the overall structure of lighting lamp plays buffering absorbing effect, especially right first fin reaches the second fin plays buffering absorbing effect, and user protection installs on the mounting plate body the LED module, in addition, still with improving heat conduction and radiating effect. For example, the spiral elastic member is a spring, and the material of the spiral elastic member is metal.

For example, the first spiral elastic member and the second spiral elastic member are made of aluminum alloy; for another example, a plurality of the first heat dissipation fins are arranged in parallel with each other; for another example, a plurality of the second heat dissipation fins are arranged in parallel with each other; for another example, the two heat dissipation columns are arranged in parallel; for another example, the fixed base has a rectangular body-like structure; for another example, the width of the first heat sink decreases gradually from the direction from the mounting module to the fixing base.

In order to better assemble the lighting fixture, i.e. to better install the lighting fixture, for example, referring to fig. 2, the lighting fixture further includes an assembling assembly 800, the assembling assembly 800 includes a limiting rail 810 and two supporting legs 820, the two supporting legs are both disposed on the side of the fixing base away from the heat dissipating main plate, a space is disposed between the two supporting legs, the limiting rail is disposed on the side of the fixing base away from the heat dissipating main plate, the limiting rail is disposed between the two supporting legs, the two supporting legs are axially symmetrically disposed with the limiting rail as the center, the supporting legs are gradually inclined toward the direction away from the fixing base, so that the assembling assembly 800 can better assemble the lighting fixture, namely, the installation operation of the lighting fixture can be better carried out.

For example, the limiting guide rail comprises two limiting strips, and the two limiting strips are both arranged on the side surface of the fixed base far away from the heat dissipation main plate body; for another example, the limiting strip comprises a first bending part and a second bending part, the first bending part is vertically connected with the second bending part, and one side of the first bending part, which is far away from the second bending part, is fixed with the fixing base; as another example, two of the position-limiting strips are arranged in parallel; for another example, the end of the support leg far away from the fixed base is provided with a screw hole; as another example, the fitting assembly further includes a threaded fitting, the threaded fitting extends through the threaded hole, and the threaded fitting is threadably coupled to the threaded hole.

In order to improve the light utilization rate and the lighting effect of the LED module, for example, referring to fig. 9, the lighting fixture light processing module 900 includes a plurality of light processing assemblies 910, each light processing assembly 910 is correspondingly disposed on a side surface of one of the strip carriers 212 away from the mounting plate 120, the light processing assembly 910 includes a left light processing film 911 and a right light processing film 912, the left light processing film 911 and the right light processing film 912 are both disposed on the side surface of the strip carrier 212 away from the mounting plate, the LED chip is located between the left light processing film and the right light processing film, and the side surfaces of the left light processing film and the right light processing film away from the strip carrier are both provided with a reflective curved surface, so that when the light of the LED module is emitted onto the reflective curved surface, the light-reflecting curved surface can refract/reflect light and is used for improving the light utilization rate and the lighting effect of the LED module.

For example, a plurality of the strip-shaped carriers are arranged in parallel with each other; as another example, the distance between two adjacent LED chips is equal; as another example, the light-reflecting surface has a curved structure in the shape of a continuous wave; for another example, an electroplated aluminum layer is arranged on the surface of the right light treatment film, and the light-reflecting curved surface is formed; in another example, the strip-shaped carrier has a rectangular parallelepiped structure.

It can be understood that, since the installation plate body is directly attached to the transition plate body, that is, the installation plate body and the transition plate body are fixed by simply relying on the connecting piece, it is difficult to protect the LED module disposed on the installation plate body, for example, when the overall structure of the lighting fixture is impacted by external force, the transition plate body and the installation plate body can generate resonance phenomenon, that is, the installation plate body can generate vibration phenomenon, especially, the contact position between the transition plate body and the installation plate body can generate opposite acting force respectively, so as to aggravate the vibration problem of the installation plate body, easily cause connected vibration to the LED module mounted on the installation plate body, and even damage the LED module, for example, damage the LED chip, especially the LED module, for example, the LED chip is used as a precise electronic component, it is necessary to take a buffering protection measure for the LED module to buffer the acting force applied by the mounting plate to the LED module to resist the external impact on the lighting fixture from the outside, and therefore, the buffering performance of the mounting plate needs to be improved to reduce the resonance problem of the mounting plate and the transition plate when the lighting fixture is impacted by the external force, so as to play a buffering role and further protect the LED module better. Therefore, it is necessary to improve the buffering performance of the mounting board to better protect the LED module, and to ensure the normal heat dissipation and/or heat conduction performance of the mounting board.

In order to improve the buffering performance of the mounting board, so as to better protect the LED module, and further ensure the normal heat dissipation and/or heat conduction performance of the mounting board, for example, in an embodiment, the mounting board includes a heat conduction film layer, a heat transfer film layer, and a buffer film layer, which are sequentially stacked, the transition board is attached to a side surface of the buffer film layer away from the heat transfer film layer, the LED module is disposed on the heat conduction film layer, the heat generated by the LED module is directly transferred to the heat conduction film layer, the heat on the heat conduction film layer is directly and timely transferred to the buffer film layer by the heat transfer film layer, and finally, the buffer film layer transfers the heat to the transition board, and the buffer film layer plays a heat conduction role and also has a certain heat dissipation role to ensure that the mounting board transfers the heat generated by the LED module to the transition board, the transition plate body transfers the residual heat to the heat dissipation module, and the heat dissipation module dissipates the heat to the external environment; on the other hand, what is more important is that the buffer function is achieved, namely the buffer function can absorb the acting force applied by the transition plate body to the installation plate body, so that severe vibration of the installation plate body is reduced, the LED module is protected better, and the service life of the LED module is prolonged.

In order to improve the buffering performance of the mounting board, so as to better protect the LED module, and further ensure the normal heat dissipation and/or heat conduction performance of the mounting board, for example, please refer to fig. 10, the mounting board 120 includes a heat conducting film layer 122, a heat transferring film layer 123 and a buffering film layer 124, the light emitting surface is located on a side surface of the heat conducting film layer 230 away from the heat transferring film layer 240, the bonding surface is located on a side surface of the buffering film layer 250 away from the heat transferring film layer 240, the LED module is disposed on a side surface of the heat conducting film layer 230 away from the heat transferring film layer 240, and the transition board is bonded to the side surface of the buffering film.

In order to make the heat conducting film layer, the heat transferring film layer and the buffer film layer combined more tightly, for example, the side of the heat conducting film layer facing the heat conducting film layer is provided with a plurality of first combining portions, the side of the heat transferring film layer facing the heat conducting film layer is provided with a plurality of first embedding grooves, each combining portion is embedded in one embedding groove in a one-to-one correspondence manner, the outer side wall of each first combining portion is in tight contact with the inner side wall of each first embedding groove, the side of the heat transferring film layer facing the buffer film layer is provided with a plurality of second combining portions, the side of the buffer film layer facing the heat transferring film layer is provided with a plurality of second embedding grooves, and each second combining portion is embedded in one embedding groove in a one-to-one correspondence manner, so that the occluding force and the contact area between the second combining portions can be improved, and further the heat conducting film layer can be made to be more tightly, The heat transfer film layer and the buffer film layer are bonded to each other more tightly.

It can be understood that the heat conducting film layer is used as a structural layer directly contacting with the LED module, and therefore, the heat conducting performance of the heat conducting film layer must be ensured first, so that the heat conducting film layer can quickly and timely transfer the heat generated by the LED module to the heat conducting film layer, and in addition, the heat conducting film layer must have good heat dissipation performance to share and bear the heat generated by the LED module, and on this basis, the heat conducting film layer must have a certain buffering performance to better protect the LED module.

For example, in the mounting plate body of the lighting fixture of an embodiment, the heat conducting film layer includes the following components in parts by mass:

20 to 35 portions of silica gel, 5 to 7.8 portions of nitrile rubber, 10 to 15 portions of polycarbonate, 10 to 20 portions of polylactic acid, 5 to 8.5 portions of organic silicon resin, 4 to 7.5 portions of polyurethane resin, 12 to 17 portions of acrylic resin, 3 to 4.5 portions of polyesteramide resin, 10 to 15 portions of ethylene propylene diene monomer, 2 to 16 portions of polyethylene terephthalate, 0.1 to 0.25 portion of nano zinc oxide, 0.1 to 0.25 portion of nano magnesium oxide, 0.1 to 0.25 portion of nano nickel oxide, 0.1 to 0.56 portion of single-walled carbon nanotube, 0.1 to 0.46 portion of multi-walled carbon nanotube, 0.1 to 0.35 portion of nano graphene and 1 to 1.5 portions of heat-conducting auxiliary agent.

Firstly, the heat-conducting film layer prepared from the components is selected from silica gel and ethylene propylene diene monomer as matrix materials, and 20-35 parts of silica gel can enable the heat-conducting film layer to have certain flexibility and play a role of a hardness regulator, so that the problem that the heat-conducting film layer is easy to break due to the introduction of a heat-conducting material is solved; in addition, 20-35 parts of silica gel and 10-15 parts of ethylene propylene diene monomer are compounded, so that the heat conducting film layer has good stiffness, toughness and elasticity, and has certain buffering and impact resistance properties, so that the LED module is protected better; further, 5-7.8 parts of nitrile rubber, 10-15 parts of polycarbonate, 10-20 parts of polylactic acid, 5-8.5 parts of organic silicon resin, 4-7.5 parts of polyurethane resin, 12-17 parts of acrylic resin, 3-4.5 parts of polyesteramide resin and 2-16 parts of polyethylene glycol terephthalate are compounded to form a main framework of the heat-conducting film layer, so that the heat-conducting film layer has good mechanical strength, and 0.1-0.25 part of nano zinc oxide, 0.1-0.25 part of nano magnesium oxide, 0.1-0.25 part of nano nickel oxide, 0.1-0.56 part of single-walled carbon nanotube, 0.1-0.46 part of multi-walled carbon nanotube, 0.1-0.35 part of nano graphene and 1-1.5 part of heat-conducting auxiliary agent are dispersed on the main framework of the heat-conducting film layer.

Secondly, adopting 0.1 to 0.25 part of nano zinc oxide, 0.1 to 0.25 part of nano magnesium oxide, 0.1 to 0.25 part of nano nickel oxide, 0.1 to 0.56 part of single-walled carbon nanotube, 0.1 to 0.46 part of multi-walled carbon nanotube, 0.1 to 0.35 part of nano graphene and 1 to 1.5 parts of heat-conducting auxiliary agent as a main body heat-radiating framework, the heat-radiating framework can be well dispersed in a system consisting of 20 to 35 parts of silica gel, 5 to 7.8 parts of nitrile rubber, 10 to 15 parts of polycarbonate, 10 to 20 parts of polylactic acid, 5 to 8.5 parts of organic silicon resin, 4 to 7.5 parts of polyurethane resin, 12 to 17 parts of acrylic resin, 3 to 4.5 parts of polyesteramide resin, 10 to 15 parts of ethylene propylene diene monomer and 2 to 16 parts of polyethylene terephthalate, and a plurality of micro heat-radiating channels with three-dimensional structures are formed, so that the heat-conducting membrane layer has good performance, and the heat-conducting membrane layer can timely and quickly transmit heat to the LED in a heat-conducting module And the heat transfer film layer also has better heat dissipation performance and can share and bear the heat generated by the LED module.

In order to further improve the buffering performance and the heat conducting performance of the heat conducting film layer, for example, in the mounting plate body of the lighting fixture of an embodiment, the heat conducting film layer includes the following components in parts by mass:

20 to 35 portions of silica gel, 5 to 7.8 portions of nitrile rubber, 1 to 1.5 portions of pyrophyllite, 10 to 15 portions of polycarbonate, 10 to 20 portions of polylactic acid, 5 to 8.5 portions of organic silicon resin, 4 to 7.5 portions of polyurethane resin, 12 to 17 portions of acrylic resin, 3 to 4.5 portions of polyesteramide resin, 10 to 15 portions of ethylene propylene diene monomer, 2 to 16 portions of polyethylene terephthalate, 1 to 3.5 portions of epoxy resin, 0.5 to 1.5 portions of phenolic resin, 1.5 to 3.5 portions of polyethylene, 1.6 to 5.6 portions of polypropylene, 1.5 to 4.5 portions of crosslinked polyethylene, 4.5 to 6.5 portions of polyester resin, 1.5 to 3.5 portions of polyether resin, 0.1 to 0.32 portion of vinyl triethoxysilane, 0.1 to 0.25 portion of nano zinc oxide, 0.25 portion of nano magnesium oxide, 0.1 to 6.25 portions of nano nickel oxide, 0.1 to 0.5 portions of nano multi-walled carbon nanotube, 1.46 to 1.5 portions of nano multi-walled carbon nanotube, 0.1-0.35 part of nano graphene, 0.1-0.35 part of nano calcium carbonate and 5-6.5 parts of heat conduction auxiliary agent; the heat conduction auxiliary agent comprises graphite powder, carbon black and metal powder, and the metal powder comprises silver powder, copper powder or/and iron powder.

It can be understood that the heat transfer film layer is located between the heat conduction film layer and the buffer film layer, and the heat transfer film layer mainly plays a role of heat transfer, so as to transfer heat on the heat conduction film layer to the buffer film layer quickly and timely.

For example, in the mounting plate body of the lighting fixture of an embodiment, the heat transfer film layer includes the following components in parts by mass:

35 to 45 portions of silica gel, 25 to 32 portions of ethylene-vinyl acetate copolymer, 15 to 20 portions of polyolefin, 5 to 10.5 portions of polycarbonate, 15 to 25 portions of polylactic acid, 6 to 8.5 portions of polyethylene glycol terephthalate, 1 to 1.5 portions of methyl silicone oil, 1 to 1.5 portions of dimethyl silicone oil, 1 to 1.5 portions of ethyl silicone oil, 0.5 to 1 portion of curing agent, 0.1 to 0.25 portion of nano aluminum oxide, 0.1 to 0.25 portion of nano aluminum nitride, 0.1 to 0.25 portion of nano boron nitride, 0.1 to 0.25 portion of nano silicon dioxide, 0.1 to 0.35 portion of carbon nano tube, 0.1 to 0.35 portion of nano graphene and 1.2 to 2.3 portions of auxiliary heat transfer powder.

Firstly, 1-1.5 parts of methyl silicone oil, 1-1.5 parts of dimethyl silicone oil and 1-1.5 parts of ethyl silicone oil are used as a flexible modifier for the heat transfer film layer, and 35-45 parts of silica gel is used for the heat transfer film layer, so that the heat transfer film layer has better buffering performance and is matched with the buffering film layer to generate excellent buffering performance; in addition, the heat transfer film layer adopts 25 to 32 parts of ethylene-vinyl acetate copolymer, 15 to 20 parts of polyolefin, 5 to 10.5 parts of polycarbonate, 15 to 25 parts of polylactic acid and 6 to 8.5 parts of polyethylene glycol terephthalate as the main skeleton of the heat transfer film layer, so that the problem of over-flexibility caused by adding various types of silicone oil and silica gel can be overcome, and the heat transfer film layer has the advantages of good elasticity and deformation resistance.

Secondly, heat transfer nano particles, namely 0.1 to 0.25 part of nano aluminum oxide, 0.1 to 0.25 part of nano aluminum nitride, 0.1 to 0.25 part of nano boron nitride, 0.1 to 0.25 part of nano silicon dioxide, 0.1 to 0.25 part of carbon nano tube and 0.1 to 0.35 part of nano graphene are embedded in the silica gel-plastic-silicone oil matrix of the heat transfer film layer, so that the heat transfer performance of the heat transfer film layer can be enhanced, the heat on the heat transfer film layer can be quickly and timely transferred to the buffer film layer, the problem of enhanced brittleness caused by the addition of the heat transfer nano particles can be solved, and the advantages of both heat transfer performance and buffer performance are realized.

In order to further improve the heat conduction performance of the heat transfer film layer, for example, the auxiliary heat transfer powder includes at least one of iron powder, carbon-coated iron powder, nickel powder, carbon-coated nickel powder, silver powder, and gold powder, so that the heat conduction performance of the heat transfer film layer can be further improved.

It can be understood that, because the buffer film layer is directly attached to the transition plate body, the buffer film layer needs to have better buffering performance to absorb the acting force transmitted from the transition plate body and achieve the effect of reducing the vibration of the installation plate body, i.e. the shock-absorbing performance is achieved.

For example, in the mounting plate body of the lighting fixture of an embodiment, the buffer film layer includes the following components in parts by mass:

20 to 25 portions of liquid silicon rubber, 4 to 5.5 portions of hydrogen-containing silicone oil, 1 to 1.5 portions of methyl silicone oil, 1 to 1.5 portions of dimethyl silicone oil, 1 to 1.5 portions of ethyl silicone oil, 1 to 1.5 portions of phenyl silicone oil, 1 to 1.5 portions of methyl ethoxy silicone oil, 1 to 1.5 portions of methyl vinyl silicone oil, 35 to 38 portions of ethylene-vinyl acetate copolymer, 10 to 15 portions of polyolefin, 5 to 8.5 portions of polycarbonate and 14 to 18 portions of polylactic acid, 5.5 to 8.5 portions of polyethylene glycol terephthalate, 1 to 5 portions of silane coupling agent, 1 to 5 portions of catalyst, 0.5 to 1 portion of amine inhibitor, 0.1 to 0.15 portion of nano graphene, 0.1 to 0.15 portion of silver powder, 0.1 to 0.15 portion of aluminum powder, 0.1 to 0.15 portion of zinc powder, 0.1 to 0.15 portion of copper powder, 0.1 to 0.15 portion of nano zinc oxide whisker, 0.1 to 0.15 portion of potassium titanate whisker and 0.1 to 0.15 portion of silicon nitride whisker. Wherein the catalyst is a platinum catalyst.

Firstly, the buffer film layer adopts 20 to 25 parts of liquid silicon rubber, 4 to 5.5 parts of hydrogen-containing silicone oil, 1 to 1.5 parts of methyl silicone oil, 1 to 1.5 parts of dimethyl silicone oil, 1 to 1.5 parts of ethyl silicone oil, 1 to 1.5 parts of phenyl silicone oil, 1 to 1.5 parts of methyl ethoxy silicone oil and 1 to 1.5 parts of methyl vinyl silicone oil as flexible main bodies, and then 35 to 38 parts of ethylene-vinyl acetate copolymer, 10 to 15 parts of polyolefin, 5 to 8.5 parts of polycarbonate, 14 to 18 parts of polylactic acid and 5.5 to 8.5 parts of polyethylene glycol terephthalate are added to make up the problem of overlarge flexibility caused by a silica gel system, so that the buffer film layer has the advantages of flexibility and elasticity, can absorb acting force transmitted from the transition plate body, achieve the effect of reducing the vibration of the installation plate body, namely achieve the shock absorption performance, the LED module is used for better protecting the LED module.

Secondly, the buffer film layer adopts nano graphene 0.1-0.15 parts, silver powder 0.1-0.15 parts, aluminum powder 0.1-0.15 parts, zinc powder 0.1-0.15 parts, copper powder 0.1-0.15 parts, nano zinc oxide whisker 0.1-0.15 parts, potassium titanate whisker 0.1-0.15 parts and silicon nitride whisker 0.1-0.15 parts as heat conduction auxiliary additives, so that the buffer film layer can be well dispersed in an organic structure layer of the buffer film layer, and can also have good heat conduction performance so as to transmit the heat transmitted by the heat conduction film layer to the transition plate body again.

In order to optimize the thickness between the layers of the mounting plate body, for example, the thickness ratio of the heat conducting film layer, the heat transfer film layer and the buffer film layer is 1: (0.3-0.5): (0.1-0.2), wherein the thickness ratio of the heat conducting film layer to the heat transfer film layer to the buffer film layer is 1: 0.4: 0.2, so that the thickness between the layers of the mounting plate body can be optimized.

Other embodiments of the present invention further include a lighting fixture that can be implemented by combining technical features of the above embodiments.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A lighting fixture, comprising:

the heat dissipation module comprises a heat dissipation main plate body, a heat dissipation assembly and two heat dissipation columns, wherein the first end of the heat dissipation main plate body is fixed with the second installation surface, the heat dissipation main plate body is provided with a first fixing surface and a second fixing surface which are oppositely arranged, the heat dissipation assembly comprises a plurality of first heat dissipation fins and a plurality of second heat dissipation fins, the first heat dissipation fins are sequentially arranged on the first fixing surface at intervals, the second heat dissipation fins are sequentially arranged on the second fixing surface at intervals, the first ends of the heat dissipation columns are fixed with the second installation surface, one of the heat dissipation columns sequentially penetrates through the first heat dissipation fins, and the other heat dissipation column sequentially penetrates through the second heat dissipation fins; the surface of the first radiating fin is provided with radiating insections, and a plurality of radiating insections are connected; the structure of the second radiating fin is the same as that of the second radiating fin;

the reinforced heat dissipation module comprises a reinforced heat dissipation column body, a second mounting surface and a fixing base, wherein the reinforced heat dissipation column body is provided with a hollow structure with openings at two ends, a reinforced heat dissipation cavity is formed in the reinforced heat dissipation column body, reinforced heat dissipation holes are formed in the side wall of the heat dissipation column body and are communicated with the reinforced heat dissipation cavity, the reinforced heat dissipation column body comprises a reinforced heat dissipation body and a reinforced heat dissipation extension part, the reinforced heat dissipation body is accommodated in the reinforced heat dissipation cavity, two ends of the reinforced heat dissipation body are respectively fixed with the second mounting surface and the fixing base, one end of the reinforced heat dissipation extension part is connected with the reinforced heat dissipation body, and the other end of the reinforced heat dissipation extension part penetrates;

the lighting lamp further comprises an assembly component, the assembly component comprises a limiting guide rail and two abutting support legs, the two abutting support legs are arranged on the side face, far away from the heat dissipation main plate body, of the fixed base, a gap is formed between the two abutting support legs, the limiting guide rail is arranged on the side face, far away from the heat dissipation main plate body, of the fixed base, the limiting guide rail is located between the two abutting support legs, the two abutting support legs are axially symmetrically distributed by taking the limiting guide rail as the center, and the abutting support legs are gradually inclined towards the direction far away from the fixed base; the limiting guide rail comprises two limiting strips, the two limiting strips are arranged in parallel, and the two limiting strips are arranged on the side surface of the fixed base, which is far away from the heat dissipation main plate body; the limiting strip comprises a first bending part and a second bending part, the first bending part is vertically connected with the second bending part, and one side edge of the first bending part, which is far away from the second bending part, is fixed with the fixed base; the end part, far away from the fixed base, of the abutting support leg is provided with a screw hole, the assembling component further comprises a threaded assembling part, the threaded assembling part penetrates through the screw hole, and the threaded assembling part is in threaded connection with the screw hole.

2. A lighting fixture as recited in claim 1, wherein said heat dissipation cylinder is formed with a plurality of said enhanced heat dissipation holes, said enhanced heat dissipation member is formed with a plurality of enhanced heat dissipation extensions, and each of said enhanced heat dissipation extensions is correspondingly formed with one of said enhanced heat dissipation holes.

3. The lighting fixture of claim 2, wherein the enhanced heat dissipation body has a circular cylindrical structure.

4. The lighting fixture of claim 3, wherein the plurality of extended enhanced heat dissipation portions are radially distributed around a central axis of the body.

5. The light fixture of claim 1 wherein the extended enhanced heat sink has an ellipsoidal configuration.

6. The lighting fixture of claim 1, wherein an end of the extended enhanced heat dissipation portion away from the body of the enhanced heat dissipation is connected to the main heat dissipation plate.

7. The lighting fixture of claim 1, wherein a space is provided between the enhanced heat dissipation body and the inner sidewall of the heat dissipation cylinder.