CN106322129A - Lamp - Google Patents
Lamp Download PDFInfo
- Publication number
- CN106322129A CN106322129A CN201610693106.3A CN201610693106A CN106322129A CN 106322129 A CN106322129 A CN 106322129A CN 201610693106 A CN201610693106 A CN 201610693106A CN 106322129 A CN106322129 A CN 106322129A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat radiation
- plate body
- parts
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
Abstract
A lamp comprises a mounting module, an LED module, a heat radiation module, a fixed base and a buffer heat radiation module. The heat radiation module comprises a heat radiation mainboard body, a heat radiation assembly and two heat radiation columns. The first end and the second mounting face of the heat radiation mainboard body are fixed. The heat radiation assembly comprises a plurality of first cooling fins and a plurality of second cooling fins. The heat radiation module of the lamp is provided with the heat radiation mainboard body, the heat radiation assembly and the two heat radiation columns, and therefore heat transmitted to the mounting module from the LED module can be fast radiated to the outside in time; and the mounting module and the fixed base can achieve the function of assisting in heat radiation, and therefore the heat radiation effect can be improved so as to meet the requirement of the lamp with the high heating value.
Description
Technical field
The present invention relates to technical field of heat dissipation, particularly relate to a kind of light fixture.
Background technology
Common, luminescence component is typically arranged on aluminium base by existing light fixture, afterwards, then aluminium base is arranged on lamp
On the housing of tool, luminescence component produces heat when normal luminous to be needed to be transferred on aluminium base, then outside being transferred to by shell
In boundary's air, to reach radiating effect.
But, it being limited to the structure of aluminium base, its radiating effect is limited, it is more difficult to meet high-power and high-luminance and caloric value is big
Light fixture requirement, further, the housing of light fixture is usually plastic material, and its heat dispersion is poor, play more protection and
The effect of decoration, it can affect the heat dissipation path of aluminium base and outside air on the contrary, and radiating effect is poor, the most difficult high-power
The light fixture requirement that high brightness caloric value is big.
Summary of the invention
Based on this, it is necessary to provide a kind of preferable light fixture of radiating effect.
A kind of light fixture, including:
Installing module, described installation module includes transition plate body, installs plate body and connector, described installing plate show consideration for together in
On described transition plate body, described installation plate body has the first installed surface, described transition plate body away from the side of described transition plate body
Side away from described installation plate body has the second installed surface, and described connector wears described installation plate body and described transition successively
Plate body, and described connector fixes with described installation plate body and described transition plate body respectively；
LED module, described LED module includes that multiple LED is arranged, and multiple described LED row is arranged at intervals at described successively
On first installed surface, described LED package includes multiple LED chip and bar shaped carrier, and described bar shaped carrier fits in described first
On installed surface, multiple described LED chip are arranged at intervals on the described bar shaped carrier side away from described installation plate body successively；
Heat radiation module, described heat radiation module includes heat-dissipating main body, radiating subassembly and two heat radiation cylinders, described heat radiation master
First end of plate body fixes with described second installed surface, and described heat-dissipating main body has and is oppositely arranged the first stationary plane and second
Stationary plane, described radiating subassembly includes multiple first fin and multiple second fin, and multiple described first fin are successively
Being arranged at intervals at described first stationary plane, multiple described second fin are arranged at intervals at described second stationary plane successively, described
First end of heat radiation cylinder fixes with described second installed surface, and one of them described heat radiation cylinder wears multiple described the successively
One fin, another described heat radiation cylinder wears multiple described second fin successively；
Firm banking, described firm banking respectively with the second end of described heat-dissipating main body and the second of described heat radiation cylinder
End connects；And
Buffering heat radiation module, described buffering heat radiation module includes multiple first spiral elasticity part and multiple second spiral elasticity
Part, it is external that multiple described first spiral elasticity parts are all placed on one of them described thermal column, and adjacent two described first dissipate
The two ends of backing first spiral elasticity part described with respectively support, and multiple described second spiral elasticity parts are all placed on another
Individual described thermal column is external, and the two ends of two adjacent described second fin, second spiral elasticity part described with respectively are supported
Hold.
Wherein in an embodiment, the material of described first spiral elasticity part and described second spiral elasticity part is aluminum
Alloy.
Wherein in an embodiment, multiple described first fin are arranged in parallel.
Wherein in an embodiment, multiple described second fin are arranged in parallel.
Wherein in an embodiment, two described heat radiation cylinders are arranged in parallel.
Wherein in an embodiment, described firm banking has cuboid shape structure.
Wherein in an embodiment, the width of described first fin by described installation module to described firm banking
Gradually successively decrease in direction.
The heat radiation module of above-mentioned light fixture is by arranging heat-dissipating main body, radiating subassembly and two heat radiation cylinders, it is possible to quickly
And scattered and disappeared to the external world rapidly by the heat being transferred to install on module by LED module in time, and module and the fixing end, are installed
Seat can also play auxiliary heat dissipation effect, in such manner, it is possible to improve radiating effect, the light fixture demand big to meet caloric value.
Accompanying drawing explanation
Fig. 1 is the structural representation of the light fixture of an embodiment of the present invention；
Fig. 2 is the structural representation at another visual angle of the light fixture shown in Fig. 1；
Fig. 3 is Fig. 2 enlarged drawing at A；
Fig. 4 is the structural representation at another visual angle of the light fixture shown in Fig. 1；
Fig. 5 is the Fig. 4 cut-away view along line A-A；
Fig. 6 is the structural representation of the heat radiation cylinder of another embodiment of the present invention；
Fig. 7 is the structural representation of the heat radiation cylinder of another embodiment of the present invention；
Fig. 8 is the partial structurtes schematic diagram of the light fixture of another embodiment of the present invention；
Fig. 9 is the partial structurtes schematic diagram of the light fixture of another embodiment of the present invention；
Figure 10 is the structural representation installing plate body of another embodiment of the present invention.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.In accompanying drawing
Give the better embodiment of the present invention.But, the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, providing the purpose of these embodiments is to make to understand the disclosure more
Add thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, and it can be directly on another element
Or element placed in the middle can also be there is.When an element is considered as " connection " another element, and it can be to be directly connected to
To another element or may be simultaneously present centering elements.Term as used herein " vertical ", " level ", " left ",
For illustrative purposes only, being not offered as is unique embodiment for " right " and similar statement.
Unless otherwise defined, all of technology used herein and scientific terminology and the technical field belonging to the present invention
The implication that technical staff is generally understood that is identical.The term used the most in the description of the invention is intended merely to describe tool
The purpose of the embodiment of body, it is not intended that in limiting the present invention.Term as used herein " and/or " include one or more
Arbitrary and all of combination of relevant Listed Items.
Such as, a kind of light fixture, including: installing module, described installation module includes transition plate body, installs plate body and connection
Part, described installing plate shows consideration for together on described transition plate body, and described installation plate body has the away from the side of described transition plate body
One installed surface, described transition plate body has the second installed surface away from the side of described installation plate body, and described connector wears successively
Described installation plate body and described transition plate body, and described connector is solid mutually with described installation plate body and described transition plate body respectively
Fixed；LED module, described LED module includes that multiple LED is arranged, and multiple described LED row is arranged at intervals at described first peace successively
On dress face, described LED package includes multiple LED chip and bar shaped carrier, and described bar shaped carrier fits in described first installed surface
On, multiple described LED chip are arranged at intervals on the described bar shaped carrier side away from described installation plate body successively；Heat radiation mould
Group, described heat radiation module include heat-dissipating main body, radiating subassembly and two heat radiation cylinders, the first end of described heat-dissipating main body with
Described second installed surface fixes, and described heat-dissipating main body has and is oppositely arranged the first stationary plane and the second stationary plane, described dissipates
It is described that hot assembly includes that multiple first fin and multiple second fin, multiple described first fin are arranged at intervals at successively
First stationary plane, multiple described second fin are arranged at intervals at described second stationary plane, the first of described heat radiation cylinder successively
End fixes with described second installed surface, and one of them described heat radiation cylinder wears multiple described first fin successively, another
Individual described heat radiation cylinder wears multiple described second fin successively；Firm banking, described firm banking respectively with described heat radiation
Second end of mainboard body and the second end of described heat radiation cylinder connect；And buffering heat radiation module, described buffering heat radiation module includes
Multiple first spiral elasticity parts and multiple second spiral elasticity part, multiple described first spiral elasticity parts are all placed on one of them
Described thermal column is external, and the two ends of two adjacent described first fin, first spiral elasticity part described with respectively are supported
Holding, it is external that multiple described second spiral elasticity parts are all placed on another described thermal column, two adjacent described second heat radiations
The two ends of sheet second spiral elasticity part described with respectively support.
In order to illustrate above-mentioned light fixture further, another example is, sees also Fig. 1 and Fig. 2, and light fixture 10 wraps
Include: installing module 100, LED module 200, heat radiation module 300 and firm banking 400, LED module 200 is arranged at installation module
On 100, heat radiation module 300 is connected with installing module 100.Module 100 is installed for the heat that will produce during LED module normal luminous
Amount is transferred directly to dispel the heat on module 300, and is scattered and disappeared to external environment by heat by heat radiation module 300, is used for playing heat radiation
Effect, to guarantee the normal working performance of LED module 200.Firm banking 400 is connected with heat radiation module 300, passes through firm banking
400, for being installed by light fixture 10, play support fixation.
See also Fig. 4 and Fig. 5, module 100 be installed and include transition plate body 110, plate body 120 and connector 130 are installed,
Plate body 120 is installed and fits on transition plate body 110, plate body 120 is installed and is used for installing described LED module, plate body 120 is installed by institute
When stating LED module normal luminous produce heat be transferred directly on transition plate body 110, and again by transition plate body 110 by heat
It is transferred on described heat radiation module.Such as, described transition plate body is in close contact with described installation plate body.
Referring to Fig. 5, connector 130 wears installation plate body 120 and transition plate body 110 successively, and connector 130 is respectively
Fix with installation plate body 120 and transition plate body 110, can preferably make installation plate body 120 and mistake by arranging connector 130
Cab apron body 110 fixes.Such as, described connector is threaded fastener, and e.g., described threaded fastener is screw, screw or spiral shell
Mother, described connector is spirally connected with described installation plate body and described transition plate body respectively, is used for making described installation plate body and described mistake
Cab apron body preferably fits together.
Referring to Fig. 5, installation plate body 120 has the first installed surface 121 away from the side of transition plate body 110, say, that
First installed surface 121 is positioned to be installed on plate body 120 and away from the side of transition plate body 110, the first installed surface 121 is used for installing
LED module, such as, described first installed surface has planar structure.Such as, described installation plate body has cuboid shape structure.
Referring to Fig. 5, the side of the remotely mounted plate body of transition plate body 110 120 has the second installed surface 111, say, that
Second installed surface 111 is positioned on transition plate body 110 and the side of remotely mounted plate body 120, and the second installed surface 111 installs described dissipating
Thermal module, such as, described second installed surface has planar structure.Such as, described transition plate body has cuboid shape structure.
Refer to Fig. 1, LED module 200 and include that multiple LED row 210, multiple LED row 210 are arranged at intervals at peace successively
On first installed surface 121 of dress plate body 120, such as, multiple described LED row rectangular array distribution.Such as, described light fixture is also
Including power drives module, described LED chip is electrically connected with described power drives module, for powering to described LED chip.
Referring to Fig. 1, LED row 210 includes multiple LED chip 211 and bar shaped carrier 212, and bar shaped carrier 212 fits in
On first installed surface 121, multiple LED chip 211 are arranged at intervals at the side of the remotely mounted plate body of bar shaped carrier 212 120 successively
On.Such as, the material of described bar shaped carrier is heat-conducting, and e.g., described heat-conducting is metal or alloy, e.g., and described bar shaped
The material of carrier is aluminium alloy.
Referring to Fig. 5, heat radiation module 300 includes heat-dissipating main body 310, radiating subassembly 320 and two heat radiation cylinders 330,
First end and second installed surface 111 of heat-dissipating main body 310 fix, and described heat-dissipating main body can be by by described LED module
It is transferred to the heat on described installation plate body and described transition plate body quickly and in time absorb come and dispel the heat.
Referring to Fig. 5, heat-dissipating main body 310 has and is oppositely arranged the first stationary plane 311 and the second stationary plane 312.Heat radiation
Assembly 320 includes multiple first fin 321 and multiple second fin 322, and multiple first fin 321 are spaced setting successively
In the first stationary plane 311, multiple described second fin 322 are arranged at intervals at the second stationary plane 312, multiple first heat radiations successively
The heat radiation load of described heat-dissipating main body can greatly be shared by sheet 321 and multiple second fin 322, it is possible to effectively by heat
Amount is scattered and disappeared to the external world, for avoiding the problem occurring hot-spot on described installation plate body to occur, in such manner, it is possible to effectively carry
The cooling surface area of high described heat radiation module, and use by fin being carried out interval setting, moreover it is possible to improve heat radiation further
Ventilation levels, for improving the integral heat sink effect of described light fixture, it is possible to meet the light fixture demand that caloric value is big.
Referring to Fig. 5, the first end of heat radiation cylinder 330 fixes with described second installed surface 111, and one of them is described scattered
Plume body wears multiple described first fin 321 successively, and another described heat radiation cylinder wears multiple described second successively and dissipates
Backing 322, so, can be transferred to multiple the rapidly by arranging heat radiation cylinder 330 by the heat on described transition plate body
On one fin 321 and multiple second fin 322, additionally it is possible to be transferred to rapidly on described firm banking 400, use
In the integral heat sink effect improving described light fixture further.
Refer to Fig. 2, firm banking 400 respectively with the second end of described heat-dissipating main body 310 and described heat radiation cylinder 330
The second end connect, firm banking 400 is used for carrying out jointly carrying out heat discharging operation with described heat radiation module, for improving further
The radiating effect of described light fixture.Additionally, described firm banking is additionally operable to play support fixation.
In order to improve the radiating effect of radiating subassembly 320 further, such as, refer to Fig. 3, the table of the first fin 321
Face is offered heat radiation groove 321a, multiple heat radiation groove 321a and is connected setting, in such manner, it is possible to improve described first fin further
Cooling surface area, for improving the radiating effect of described light fixture；And for example, the structure of described second fin dissipates with described second
The identical setting of structure of backing.
The heat radiation module 300 of above-mentioned light fixture 10 is by arranging heat-dissipating main body 310, radiating subassembly 320 and two thermal columns
Body 330, it is possible to quickly and in time by the heat being transferred to install on module 100 by LED module 200 scatter and disappear rapidly to outward
Boundary, and module 100 and firm banking 400 are installed can also play auxiliary heat dissipation effect, in such manner, it is possible to improve radiating effect, with
Meet the light fixture demand that caloric value is big.
In order to further enhance heat conduction and the radiating effect of described light fixture, such as, referring to Fig. 6, described light fixture also includes
Strengthening radiating piece 500, described heat radiation cylinder 330 has the hollow structure of both ends open, forms strengthening heat radiation in heat radiation cylinder 330
Cavity 331, the sidewall of described heat radiation cylinder 330 offers strengthening louvre 332, and described strengthening louvre dissipates with described strengthening
Hot cavity connects, and strengthening radiating piece 500 includes strengthening heat radiator body 510 and strengthening heat radiation extension 520, and described strengthening heat radiation is originally
Body is placed in inside described strengthening heat-dissipating cavity, and the two ends of described strengthening heat radiator body respectively with described second installed surface and institute
Stating firm banking to fix, one end of described strengthening heat radiation extension is connected with described strengthening heat radiator body, described strengthening heat radiation
The other end of extension wears described strengthening louvre, and is placed on outside described heat radiation module, so, dissipates by arranging strengthening
Warmware 500, it is possible to further enhance heat conduction and the radiating effect of described light fixture.
In order to further enhance heat conduction and the radiating effect of described light fixture, such as, described heat radiation cylinder offers multiple institute
Stating strengthening louvre, described strengthening radiating piece arranges multiple strengthening heat radiation extension, each described strengthening heat radiation extension one
One correspondence wears a described strengthening louvre；And for example, described strengthening heat radiator body has cylindrical structure；And for example, multiple
Described heat radiation extension radially distributes with the central axis of described strengthening heat radiator body；And for example, described strengthening heat radiation extends
Portion has axiolitic structure；And for example, described strengthening heat radiation extension dissipates with described away from one end of described strengthening heat radiator body
Hot mainboard body connects；And for example, between the medial wall of described strengthening heat radiator body and described heat radiation cylinder, it is provided with interval, so,
Heat conduction and the radiating effect of described light fixture can be further enhanced.
In order to further enhance heat conduction and the radiating effect of described light fixture, such as, referring to Fig. 7, described light fixture also includes
Auxiliary heat conductive member 600, described auxiliary heat conductive member 600 includes that auxiliary heat conduction cylinder 610, auxiliary heat conduction connecting plate 620, first assist
The heat conduction collar 630 and the second auxiliary heat conduction collar 640, described heat radiation cylinder 330 has the hollow structure of both ends open, described auxiliary
Assistant director of a film or play's plume body is placed in described heat radiation column body, and the two ends of described auxiliary heat conduction cylinder respectively with described second installed surface
And described firm banking fixes, described auxiliary heat conduction connecting plate two ends respectively with described auxiliary heat conduction cylinder and described thermal column
The medial wall of body connects, and described first auxiliary heat conduction sleeve ring set is placed in outside described auxiliary heat conduction cylinder, and described first auxiliary is led
Shrink ring is connected with described auxiliary heat conduction connecting plate, and described second auxiliary heat conduction sleeve ring set is placed in the described first auxiliary heat conduction collar
Outward, and the described second auxiliary heat conduction collar is connected with described auxiliary heat conduction connecting plate, described auxiliary heat conduction cylinder and described first
Between the auxiliary heat conduction collar, between the described first auxiliary heat conduction collar and the described second auxiliary heat conduction collar and described second auxiliary
It is provided with interval between the medial wall of assistant director of a film or play's shrink ring and described heat radiation cylinder, so, by arranging auxiliary heat conductive member 600,
Heat conduction and the radiating effect of described light fixture can be further enhanced.
In order to further enhance heat conduction and the radiating effect of described light fixture, such as, the described first auxiliary heat conduction collar has
Circular ring；And for example, the described second auxiliary heat conduction collar has circular ring；And for example, described auxiliary heat conduction cylinder and institute
State the distance between the first auxiliary heat conduction collar and between the described first auxiliary heat conduction collar and the described second auxiliary heat conduction collar
Distance equal；And for example, described auxiliary heat conductive member arranges multiple described auxiliary heat conduction connecting plate, and multiple described auxiliary heat conductions connect
Plate is spaced setting successively；And for example, described heat conduction cylinder has cylindrical structure；And for example, multiple described auxiliary heat conduction connecting plates
It is centrosymmetric distribution with the central axis of described heat conduction cylinder, in such manner, it is possible to further enhance the heat conduction of described light fixture and dissipate
Thermal effect.
The effect of bumper and absorbing shock is played, especially to described first fin in order to play the overall structure to described light fixture
And described second fin plays the effect of bumper and absorbing shock, user protects the described LED module being arranged on described installation plate body,
Additionally, also with improving heat conduction and radiating effect, such as, refer to Fig. 8, described light fixture 700 also includes buffering heat radiation module 710,
Described buffering heat radiation module 710 includes multiple first spiral elasticity part 711 and multiple second spiral elasticity part 712, multiple described
It is external that first spiral elasticity part 711 is all placed on one of them described thermal column, adjacent two described first fin 321 points
The not two ends of first spiral elasticity part 711 described with support, and multiple described second spiral elasticity parts 712 are all placed on another
Individual described thermal column is external, two adjacent described second fin 322, second spiral elasticity part 712 described with respectively
Two ends support, and so, can play the overall structure to described light fixture play bumper and absorbing shock by arranging buffering heat radiation module 710
Effect, especially described first fin and described second fin are played the effect of bumper and absorbing shock, user protects installation
Described LED module on described installation plate body, additionally, also with improving heat conduction and radiating effect.Such as, spiral elasticity part is bullet
Spring, the material of described spiral elasticity part is metal.
Such as, the material of described first spiral elasticity part and described second spiral elasticity part is aluminium alloy；And for example, multiple
Described first fin is arranged in parallel；And for example, multiple described second fin are arranged in parallel；And for example, described in two
Heat radiation cylinder is arranged in parallel；And for example, described firm banking has cuboid shape structure；And for example, described first fin
Width is gradually successively decreased by the direction of described installation module to described firm banking.
In order to described light fixture preferably carries out assembly manipulation, i.e. can preferably carry out described light fixture operation is installed,
Such as, referring to Fig. 2, described light fixture also includes assembling assembly 800, and described assembling assembly 800 includes limit guide rail 810 and two
Support leg 820, support leg described in two and may be contained within the described firm banking side away from described heat-dissipating main body, and
Supporting described in two and be provided with interval between leg, described limit guide rail is arranged at described firm banking away from described heat-dissipating main
On the side of body, and described limit guide rail is supporting between leg described in two, supports leg with described spacing described in two
Be distributed setting centered by guide rail axisymmetricly, described in support leg and be gradually obliquely installed to the direction away from described firm banking,
So, by arranging assembling assembly 800, it is possible to preferably described light fixture to be carried out assembly manipulation, i.e. can be preferably to described
Light fixture carries out installing operation.
Such as, described limit guide rail includes that two positive stop strips, two positive stop strips may be contained within described firm banking away from institute
State on the side of heat-dissipating main body；And for example, described positive stop strip includes the first kink and the second kink, described first kink
Vertical with described second kink being connected, described first kink is away from a side of described second kink and the described fixing end
Seat fixes；And for example, two described positive stop strips be arranged in parallel；And for example, the leg end away from described firm banking is supported described in
Offer screw；And for example, described assembling assembly also bag Screw assembly part, described Screw assembly part wears described screw, and institute
State screw thread to turn assembly parts and be spirally connected with described screw.
In order to improve light utilization efficiency and the illuminating effect of described LED module, such as, refer to Fig. 9, described light fixture optical processing
Module 900, described optical processing module 900 includes multiple optical processing assembly 910, and each described optical processing assembly 910 1 is corresponding
Being arranged on the described bar shaped carrier 212 side away from described installation plate body 120, described optical processing assembly 910 includes a left side
Sidelight processes film 911 and right side optical processing film 912, described left side optical processing film 911 and described right side optical processing film 912 are respectively provided with
On the described bar shaped carrier 212 side away from described installation plate body, described LED chip is in described left side optical processing film and institute
Stating between the optical processing film of right side, described left side optical processing film and described right side optical processing film are equal away from the side of described bar shaped carrier
It is provided with reflective surface, so, when the light of described LED module is launched to described reflective surface, described reflective surface energy
Enough light is carried out refraction/reflection process, for improving light utilization efficiency and the illuminating effect of described LED module.
Such as, multiple described bar shaped carriers are arranged in parallel；And for example, the distance between adjacent two described LED chip
Equal；And for example, described reflective surface has the curved-surface structure of continuous print wave-like；And for example, the surface of described right side optical processing film
It is provided with electroplating aluminum coating, and forms described reflective surface；And for example, described bar shaped carrier has rectangular structure.
It is appreciated that showing consideration for conjunction owing to described installation plate body is direct with described rebound is arranged, and i.e. passes through merely to depend on
Described installation plate body and described transition plate body is fixed, it is more difficult to being arranged at described in described installation plate body by described connector
LED module plays a protective role, such as, when the overall structure of described light fixture is by external impacts, and described transition plate body and institute
Stating installing plate and know from experience generation covibration, there is seismism in the most described installing plate cognition, the most described transition plate body and institute
State and install at the contact position of plate body, respectively will produce opposite effect power, and then the vibrations that can aggravate described installation plate body are asked
Topic, easily causes related vibrations to the LED module installed on described installation plate body, even can shake bad LED module, e.g., shake bad institute
Stating LED chip, the most described LED module, e.g., described LED chip is as accurate electronic component, it is necessary to described LED
Module carries out buffer protection measure, with buffer described installation plate body to described LED module apply active force, to resist outer bound pair institute
State the external impacts that light fixture causes, based on this, need to improve the shock-absorbing capacity of described installation plate body, to reduce described installation plate body
With the described transition plate body resonance problem when described light fixture is by external impacts, it is used for playing cushioning effect, and then can be more
Protect well described LED module.Therefore, it is necessary to improve the shock-absorbing capacity of described installation plate body, preferably to protect described LED
Module, and it also requires guarantee that described installation plate body dispels the heat and/or heat conductivility normally.
In order to improve the shock-absorbing capacity of described installation plate body, preferably to protect described LED module, and it also requires guarantee
Described installation plate body dispels the heat and/or heat conductivility normally, and such as, the described installation plate body of an embodiment, including folding successively
Adding the heat conducting film layer of setting, heat-transfer film layer and buffer film layer, described transition plate body and described buffer film layer are away from described heat-transfer film
The side laminating of layer, described LED module is arranged on described heat conducting film layer, and the heat that described LED module produces is transferred directly to
On described heat conducting film layer, directly quickly and in time by the heat on described heat conducting film layer it is transferred to described by described heat-transfer film layer
On buffer film layer, finally, described buffer film layer transferring heat on described transition plate body, on the one hand described buffer film layer rises
To conductive force, and have certain thermolysis concurrently, to guarantee the heat transmission that described LED module is produced by described installation plate body
To described transition plate body, and by described transition plate body, after-heat is transferred on described heat radiation module, and by described heat radiation
Heat is scattered and disappeared to external environment by module；On the other hand, it is often more important that play cushioning effect, i.e. can absorb from described
The active force that described installation plate body is applied by transition plate body is to reduce the strenuous vibration of described installation plate body and then the most right
Described LED module is protected, to extend the service life of described LED module.
In order to improve the shock-absorbing capacity of described installation plate body, preferably to protect described LED module, and it also requires guarantee
Described installation plate body dispels the heat and/or heat conductivility normally, such as, refers to Figure 10, installs plate body 120 and includes heat conducting film layer
122, heat-transfer film layer 123 and buffer film layer 124, described exiting surface is positioned at the heat conducting film layer 230 side away from heat-transfer film layer 240
Face, described binding face is positioned at the buffer film layer 250 one side away from heat-transfer film layer 240, and described LED module is arranged at heat conducting film layer
230 fit away from the side of heat-transfer film layer 240 with buffer film layer 250 away from the side of heat-transfer film layer 240, described transition plate body.
So that described heat conducting film layer, described heat-transfer film layer and described buffer film layer the most more step up
Close, such as, described heat conducting film layer is provided with multiple first joint portion towards the side of described heat-transfer film layer, described heat-transfer film layer court
Side opening to described heat conducting film layer is provided with multiple first embedding slot, and each described joint portion one_to_one corresponding is embedded at described in one embedding
Put in groove, and the medial wall of the lateral wall of described first joint portion and described first embedding slot is in close contact, described heat-transfer film layer
Be provided with multiple second joint portion towards the side of described buffer film layer, described buffer film layer is towards the side of described heat-transfer film layer
Offering multiple second embedding slot, each described second joint portion one_to_one corresponding is embedded in the second embedding slot described in, so,
Gmatjpdumamics between can improving respectively and contact area, and then enable to described heat conducting film layer, described heat-transfer film layer and institute
State buffer film layer the tightst.
It is appreciated that described heat conducting film layer directly carries out the structure sheaf contacted as direct and described LED module, therefore,
Have to first guarantee the heat conductivility of described heat conducting film layer, so that described heat conducting film layer can be quickly and in time by described
The heat produced on LED module quickly and is in time transferred to described heat-transfer film layer, additionally, described heat conducting film layer must also be held concurrently
Have preferable heat dispersion, bear, to share, the heat that described LED module produces, and on this basis, also need to make described in lead
Hotting mask layer has certain shock-absorbing capacity concurrently, preferably to protect described LED module.
Such as, in the described installation plate body of the described light fixture of an embodiment, described heat conducting film layer includes following mass parts
Each component:
20 parts～35 parts of silica gel, nitrile rubber 5 parts～7.8 parts, Merlon 10 parts～15 parts, polylactic acid 10 parts～20
Part, organic siliconresin 5 parts～8.5 parts, polyurethane resin 4 parts～7.5 parts, acrylic resin 12 parts～17 parts, polyesteramide tree
3 parts～4.5 parts of fat, ethylene propylene diene rubber 10 parts～15 parts, polyethylene terephthalate 2 parts～16 parts, nano zine oxide
0.1 part～0.25 part, nano magnesia 0.1 part～0.25 part, nano-nickel oxide 0.1 part～0.25 part, SWCN 0.1
Part～0.56 part, multi-walled carbon nano-tubes 0.1 part～0.46 part, nano-graphene 0.1 part～0.35 part and heat conduction auxiliary agent 1 part～
1.5 part.
First, use above-mentioned each component prepare as described in heat conducting film layer by selecting silica gel and ethylene-propylene-diene monomer
Glue can make described heat conducting film layer possess certain flexible nature as basic material, 20 parts～35 parts of silica gel, plays hardness and adjusts
The effect of joint agent so that described heat conducting film layer is unlikely to produce, because introducing Heat Conduction Material, the problem that brittleness is easy to break；Additionally, silicon
The ethylene propylene diene rubber that glue is 20 parts～35 parts and 10 parts～15 parts compounds, additionally it is possible to make described heat conducting film layer be provided simultaneously with relatively
Good stiffness, toughness and elasticity, has certain buffering and impact resistance, preferably to protect described LED module；Enter one
Step, use nitrile rubber 5 parts～7.8 parts, Merlon 10 parts～15 parts, polylactic acid 10 parts～20 parts, organic siliconresin 5 parts～
8.5 parts, polyurethane resin 4 parts～7.5 parts, acrylic resin 12 parts～17 parts, polyesteramide resin 3 parts～4.5 parts, poly-to benzene
Naphthalate 2 parts～16 parts compounds, for forming the main body framework of described heat conducting film layer, on the one hand make described in lead
Hotting mask layer possesses preferable mechanical strength, on the other hand, it is possible to preferably make nano zine oxide 0.1 part～0.25 part, nano oxygen
0.1 part～0.25 part of magnesium of change, nano-nickel oxide 0.1 part～0.25 part, SWCN 0.1 part～0.56 part, many walls carbon are received
Mitron 0.1 part～0.46 part, nano-graphene 0.1 part～0.35 part and heat conduction auxiliary agent 1 part～1.5 parts are at described heat conducting film layer
Disperse in main body framework.
Secondly, nano zine oxide 0.1 part～0.25 part, nano magnesia 0.1 part～0.25 part, nano-nickel oxide are used
0.1 part～0.25 part, SWCN 0.1 part～0.56 part, multi-walled carbon nano-tubes 0.1 part～0.46 part, nano-graphene
0.1 part～0.35 part and heat conduction auxiliary agent 1 part～1.5 parts dispel the heat skeleton as main body, it is possible to preferably 20 parts～35 parts of silica gel,
Nitrile rubber 5 parts～7.8 parts, Merlon 10 parts～15 parts, polylactic acid 10 parts～20 parts, organic siliconresin 5 parts～8.5 parts,
Polyurethane resin 4 parts～7.5 parts, acrylic resin 12 parts～17 parts, polyesteramide resin 3 parts～4.5 parts, ethylene propylene diene rubber
10 parts～15 parts are disperseed in the system of polyethylene terephthalate 2 parts～16 parts composition, and form some three-dimensional knots
Micro-heat dissipation channel of structure, makes described heat conducting film layer possess preferable heat conductivility, it is possible to enable described heat conducting film layer quickly and
In time the heat produced on described LED module quickly and is in time transferred to described heat-transfer film layer, additionally, lead described in also making
Hotting mask layer has preferable heat dispersion concurrently, can share and bear the heat that described LED module produces.
In order to improve shock-absorbing capacity and the heat conductivility of described heat conducting film layer, such as, the institute of an embodiment further
Stating in the described installation plate body of light fixture, described heat conducting film layer includes each component of following mass parts:
20 parts～35 parts of silica gel, nitrile rubber 5 parts～7.8 parts, pyrophyllite 1 part～1.5 parts, Merlon 10 parts～15
Part, polylactic acid 10 parts～20 parts, organic siliconresin 5 parts～8.5 parts, polyurethane resin 4 parts～7.5 parts, acrylic resin 12 parts
～17 parts, polyesteramide resin 3 parts～4.5 parts, ethylene propylene diene rubber 10 parts～15 parts, polyethylene terephthalate 2 parts
～16 parts, epoxy resin 1 part～3.5 parts, 0.5 part～1.5 parts of phenolic resin, polyethylene 1.5 parts～3.5 parts, polypropylene 1.6 parts
～5.6 parts, crosslinked polyethylene 1.5 parts～4.5 parts, 4.5 parts～6.5 parts of polyester resin, polyether resin 1.5 parts～3.5 parts, ethylene
0.1 part～0.32 part of ethyl triethoxy silicane alkane, nano zine oxide 0.1 part～0.25 part, nano magnesia 0.1 part～0.25 part,
Nano-nickel oxide 0.1 part～0.25 part, SWCN 0.1 part～0.56 part, multi-walled carbon nano-tubes 0.1 part～0.46 part,
Nano-graphene 0.1 part～0.35 part, nano-calcium carbonate 0.1 part～0.35 part and heat conduction auxiliary agent 5 parts～6.5 parts；Wherein, described
Heat conduction auxiliary agent includes that graphite powder, white carbon black and metal powder, described metal powder include that argentum powder, copper powder are or/and iron powder.
Be appreciated that described heat-transfer film layer between described heat conducting film layer and buffer film layer, described heat-transfer film layer is main
Play heat transfer effect, the heat on described heat conducting film layer faster and is in time transferred in described buffer film layer, additionally, by
In described heat-transfer film layer near described buffer film layer, need possess preferable shock-absorbing capacity, to coordinate described buffer film layer to work in coordination with
Producing excellent shock-absorbing capacity, therefore, described heat-transfer film layer needs to obtain preferable balance in shock-absorbing capacity and heat transfer property.
Such as, in the described installation plate body of the described light fixture of an embodiment, described heat-transfer film layer includes following mass parts
Each component:
35 parts～45 parts of silica gel, ethylene-vinyl acetate copolymer 25 parts～32 parts, polyolefin 15 parts～20 parts, poly-carbon
Acid esters 5 parts～10.5 parts, polylactic acid 15 parts～25 parts, polyethylene terephthalate 6 parts～8.5 parts, methyl-silicone oil 1 part～
1.5 parts, double methyl-silicone oil 1 part～1.5 parts, ethyl silicon oil 1 part～1.5 parts, 0.5 part～1 part of firming agent, nano aluminium oxide 0.1
Part～0.25 part, nano aluminum nitride 0.1 part～0.25 part, nm-class boron nitride 0.1 part～0.25 part, nano silicon 0.1 part
～0.25 part, CNT 0.1 part～0.35 part, nano-graphene 0.1 part～0.35 part and auxiliary heat transfer powder body 1.2 parts～
2.3 part.
First, above-mentioned heat-transfer film layer uses methyl-silicone oil 1 part～1.5 parts, double methyl-silicone oil 1 part～1.5 parts and ethyl silicon
Oil 1 part～1.5 parts is as flexible modifying agent, then 35 parts～45 parts of silica gel, it is possible to make described heat-transfer film layer possess preferably buffering
Performance, produces excellent shock-absorbing capacity to coordinate described buffer film layer to work in coordination with；Additionally, above-mentioned heat-transfer film layer uses ethyl vinyl acetate
Vinyl ester copolymers 25 parts～32 parts, polyolefin 15 parts～20 parts, Merlon 5 parts～10.5 parts, polylactic acid 15 parts～25 parts
With 6 parts～8.5 parts main body framework as described heat-transfer film layer of polyethylene terephthalate, it is possible to overcome owing to adding each
The soft problem of mistake that class silicone oil and silica gel bring, makes the advantage that described heat-transfer film layer possesses good elastic and anti-deformation.
Secondly, the silica gel-plastic cement-silicone oil matrix of described heat-transfer film layer embeds heat transfer nano-particle, the most nano oxidized
0.1 part～0.25 part of aluminum, nano aluminum nitride 0.1 part～0.25 part, nm-class boron nitride 0.1 part～0.25 part, nano silicon
0.1 part～0.25 part, CNT 0.1 part～0.35 part, nano-graphene 0.1 part～0.35 part, described heat transfer can be strengthened
The heat-conductive characteristic of film layer, for quickly and being in time transferred to buffer film layer by the heat on described heat conducting film layer, moreover it is possible to
The problem that the brittleness that solution is brought due to the addition of above-mentioned heat transfer nano-particle strengthens, it is achieved that heat transfer property and shock-absorbing capacity
The advantage having concurrently.
In order to improve the heat-conductive characteristic of described heat-transfer film layer further, such as, described auxiliary heat transfer powder body include iron powder,
At least one in carbon-coated iron powder, nikel powder, carbon nickel coat powder, argentum powder and bronze, so, it is possible to improve described heat-transfer film layer further
Heat-conductive characteristic.
Being appreciated that owing to described buffer film layer directly fits with described transition plate body, described buffer film layer needs tool
Standby preferable shock-absorbing capacity, the active force being transmitted to from described transition plate body with absorption, reach to reduce described installation plate body
Vibrations effect, i.e. play shock-absorbing performance, additionally, due to described buffer film layer respectively with described heat-transfer film layer and described rebound
Showing consideration for and close, therefore, described buffer film layer must also have preferable heat conductivility, with the heat being transmitted to by described heat-transfer film layer
Amount is transferred on described transition plate body again.
Such as, in the described installation plate body of the described light fixture of an embodiment, described buffer film layer includes following mass parts
Each component:
Liquid silastic 20 parts～25 parts, containing hydrogen silicone oil 4 parts～5.5 parts, methyl-silicone oil 1 part～1.5 parts, double methyl-silicone oil
1 part～1.5 parts, ethyl silicon oil 1 part～1.5 parts, phenyl silicone oil 1 part～1.5 parts, MethylethoxylsiliconFluid Fluid 1 part～1.5 parts, first
Base vinyl silicone oil 1 part～1.5 parts, ethylene-vinyl acetate copolymer 35 parts～38 parts, polyolefin 10 parts～15 parts, poly-carbon
Acid esters 5 parts～8.5 parts, polylactic acid 14 parts～18 parts, polyethylene terephthalate 5.5 parts～8.5 parts, silane coupler 1
Part～5 parts, catalyst 1 part～5 parts, amine inhibitor 0.5 part～1 part, nano-graphene 0.1 part～0.15 part, 0.1 part of argentum powder
～0.15 part, aluminium powder 0.1 part～0.15 part, zinc powder 0.1 part～0.15 part, copper powder 0.1 part～0.15 part, nano zinc oxide crystal whisker
0.1 part～0.15 part, potassium titanate crystal whisker 0.1 part～0.15 part and silicon nitride crystal whisker 0.1 part～0.15 part.Wherein, described catalysis
Agent is platinum catalyst.
First, above-mentioned buffer film layer is by using liquid silastic 20 parts～25 parts, containing hydrogen silicone oil 4 parts～5.5 parts, methyl
Silicone oil 1 part～1.5 parts, double methyl-silicone oil 1 part～1.5 parts, ethyl silicon oil 1 part～1.5 parts, phenyl silicone oil 1 part～1.5 parts, first
Base oxethyl silicone oil 1 part～1.5 parts and methyl vinyl silicon oil 1 part～1.5 parts as flexible body, then by add ethylene-
Vinyl acetate co-polymer 35 parts～38 parts, polyolefin 10 parts～15 parts, Merlon 5 parts～8.5 parts, polylactic acid 14 parts～18
Part, polyethylene terephthalate 5.5 parts～8.5 parts are for making up the problem that the next pliability of colloidal silica frenulum is excessive, energy
Described buffer film layer is enough made to have flexibility and elastic advantage concurrently, such that it is able to what absorption was transmitted to from described transition plate body
Active force, reaches to reduce the effect of described installation plate body vibrations, i.e. plays shock-absorbing performance, for preferably protecting described LED mould
Group.
Secondly, above-mentioned buffer film layer uses nano-graphene 0.1 part～0.15 part, 0.1 part～0.15 part of argentum powder, aluminium powder
0.1 part～0.15 part, zinc powder 0.1 part～0.15 part, copper powder 0.1 part～0.15 part, nano zinc oxide crystal whisker 0.1 part～0.15
Part, potassium titanate crystal whisker 0.1 part～0.15 part and silicon nitride crystal whisker 0.1 part～0.15 part are as conduction of heat auxiliary additive, it is possible to
It is better dispersed in the organic structure layer of described buffer film layer, and described buffer film layer can also be made to have preferable heat conductivity concurrently
Can, so that the heat that described heat-transfer film layer is transmitted to is transferred on described transition plate body again.
In order to optimize the thickness between the described each layer of installation plate body, such as, described heat conducting film layer, described heat-transfer film layer and institute
The thickness proportion stating buffer film layer is 1:(0.3～0.5): (0.1～0.2), and for example, described heat conducting film layer, described heat-transfer film layer
And the thickness proportion of described buffer film layer is 1:0.4:0.2, so, it is possible to optimize the thickness between the described each layer of installation plate body.
It should be noted that other embodiments of the present invention also include that the technical characteristic in the various embodiments described above be combined with each other
Formed, it is possible to the light fixture of enforcement.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, not to above-mentioned reality
The all possible combination of each technical characteristic executed in example is all described, but, as long as the combination of these technical characteristics is not deposited
In contradiction, all it is considered to be the scope that this specification is recorded.
The above embodiment only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, but
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that, for the ordinary skill people of this area
For Yuan, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these broadly fall into the present invention's
Protection domain.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (7)
1. a light fixture, it is characterised in that including:
Installing module, described installation module includes transition plate body, installs plate body and connector, and described installing plate is shown consideration for together in described
On transition plate body, described installation plate body has the first installed surface away from the side of described transition plate body, described transition plate body away from
The side of described installation plate body has the second installed surface, and described connector wears described installation plate body and described rebound successively
Body, and described connector fixes with described installation plate body and described transition plate body respectively；
LED module, described LED module includes that multiple LED is arranged, and multiple described LED row is arranged at intervals at described first successively
On installed surface, described LED package includes multiple LED chip and bar shaped carrier, and described bar shaped carrier fits in described first and installs
On face, multiple described LED chip are arranged at intervals on the described bar shaped carrier side away from described installation plate body successively；
Heat radiation module, described heat radiation module includes heat-dissipating main body, radiating subassembly and two heat radiation cylinders, described heat-dissipating main body
The first end fix with described second installed surface, described heat-dissipating main body have be oppositely arranged the first stationary plane and second fix
Face, described radiating subassembly includes that multiple first fin and multiple second fin, multiple described first fin are spaced successively
Being arranged at described first stationary plane, multiple described second fin are arranged at intervals at described second stationary plane, described heat radiation successively
First end of cylinder fixes with described second installed surface, and one of them described heat radiation cylinder wears multiple described first successively and dissipates
Backing, another described heat radiation cylinder wears multiple described second fin successively；
Firm banking, described firm banking is respectively with the second end of the second end of described heat-dissipating main body and described heat radiation cylinder even
Connect；And
Buffering heat radiation module, described buffering heat radiation module includes multiple first spiral elasticity part and multiple second spiral elasticity part,
It is external that multiple described first spiral elasticity parts are all placed on one of them described thermal column, two adjacent described first fin
The two ends of first spiral elasticity part described with support respectively, and multiple described second spiral elasticity parts are all placed on another institute
Stating thermal column external, the two ends of two adjacent described second fin, second spiral elasticity part described with respectively support.
Light fixture the most according to claim 1, it is characterised in that described first spiral elasticity part and described second spiral elasticity
The material of part is aluminium alloy.
Light fixture the most according to claim 1, it is characterised in that multiple described first fin are arranged in parallel.
Light fixture the most according to claim 1, it is characterised in that multiple described second fin are arranged in parallel.
Light fixture the most according to claim 1, it is characterised in that two described heat radiation cylinders are arranged in parallel.
Light fixture the most according to claim 1, it is characterised in that described firm banking has cuboid shape structure.
Light fixture the most according to claim 1, it is characterised in that the width of described first fin by described installation module to
Gradually successively decrease in the direction of described firm banking.
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| CN201610693106.3A CN106322129B (en) | 2016-08-18 | 2016-08-18 | Lamp fitting |
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|---|---|---|---|
| CN201610693106.3A CN106322129B (en) | 2016-08-18 | 2016-08-18 | Lamp fitting |
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| CN106322129B CN106322129B (en) | 2020-01-03 |
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| CN106322129B (en) | 2020-01-03 |
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