CN106320546B - A kind of water-proof heat-insulating slab - Google Patents
A kind of water-proof heat-insulating slab Download PDFInfo
- Publication number
- CN106320546B CN106320546B CN201610843010.0A CN201610843010A CN106320546B CN 106320546 B CN106320546 B CN 106320546B CN 201610843010 A CN201610843010 A CN 201610843010A CN 106320546 B CN106320546 B CN 106320546B
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- Prior art keywords
- thermal insulation
- insulation board
- junction
- layer
- mounting hole
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Links
- 238000009413 insulation Methods 0.000 claims abstract description 69
- 238000001035 drying Methods 0.000 claims abstract description 20
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 15
- 239000000565 sealant Substances 0.000 claims description 10
- 238000007596 consolidation process Methods 0.000 claims description 2
- 238000004321 preservation Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical group [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
- E04B1/78—Heat insulating elements
- E04B1/80—Heat insulating elements slab-shaped
- E04B1/803—Heat insulating elements slab-shaped with vacuum spaces included in the slab
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/76—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to heat only
- E04B1/78—Heat insulating elements
- E04B1/80—Heat insulating elements slab-shaped
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/66—Sealings
- E04B1/665—Sheets or foils impervious to water and water vapor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/24—Structural elements or technologies for improving thermal insulation
- Y02A30/242—Slab shaped vacuum insulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B80/00—Architectural or constructional elements improving the thermal performance of buildings
- Y02B80/10—Insulation, e.g. vacuum or aerogel insulation
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Acoustics & Sound (AREA)
- Building Environments (AREA)
- Floor Finish (AREA)
- Thermal Insulation (AREA)
Abstract
The present invention provides a kind of water-proof heat-insulating slab, it is characterized in that, the thermal insulation board includes the first thermal insulation board and the second thermal insulation board, first thermal insulation board further includes the first junction, and first junction and the first thermal insulation board form " L " step, second thermal insulation board further includes the second junction, and the second junction forms " L " step with the second thermal insulation board；First thermal insulation board and the second thermal insulation board are made of outside plate and inner panel, and the outside plate wraps up the inner panel, and the outside plate includes hydrophobic layer, outer protection board, vacuum layer and drying layer, and the vacuum layer is between the outer protection board and drying layer；The hydrophobic layer is located at the top of the outer protection board.The present invention designs water-proof heat-insulating slab, and outside plate is equipped with hydrophobic layer, vacuum layer and drying layer, and multilayer proofing prevents moisture from entering inner panel, thermal insulation board use can be made more permanent.
Description
Technical field
The present invention relates to a kind of thermal insulation board technical field more particularly to a kind of water-proof heat-insulating slabs.
Background technology
Thermal insulation board is said easy-to-understand exactly to the plank of building heat preservation.Thermal insulation board it be with polystyrene resin be original
Material is plus other supplementary materials and poly- inclusion, by heating mixing injecting catalyst simultaneously, then extrusion molding extrusion molding and manufacture
Rigid foam plate, have moisture-proof, water resistance, reduction building envelope thickness can be made, to increase interior
Usable floor area.
However, thermal insulation board in the prior art generally comprises outside plate and inner panel, inner panel is protected by outside plate, due to thermal insulation board meeting
It is arranged within the walls, moisture is bigger, but since existing thermal insulation board is without drying layer, so moisture is easily accessible inner panel,
It is easy that thermal insulation board is made to damage, so these problems demands solve.
Invention content
Technical problem solved by the invention is realized using following technical scheme：
A kind of water-proof heat-insulating slab, which is characterized in that the thermal insulation board include the first thermal insulation board and the second thermal insulation board, first
Thermal insulation board further includes the first junction, and the first junction forms " L " step with the first thermal insulation board, and the second thermal insulation board further includes
Second junction, and the second junction forms " L " step with the second thermal insulation board；
First thermal insulation board and the second thermal insulation board are made of outside plate and inner panel, and the outside plate wraps up the inner panel,
The outside plate includes hydrophobic layer, outer protection board, vacuum layer and drying layer, and the vacuum layer is located at the outer protection board and drying
Between layer；The hydrophobic layer is located at the top of the outer protection board；
The drying layer includes sealant, drier and supporting layer, and the drier is formed in the support layer surface,
The sealant is set on the drier, and drier is sealed between the sealant and the supporting layer, described dry
Drying prescription is located at the supporting layer far from the inner panel side.
Further, the first mounting hole and card slot are set on first junction, the card slot is kept the temperature towards first
Plate inboard width is more than towards the width on the outside of the first thermal insulation board, on the card slot single-row layout and the first junction, is formed and is blocked
Slot group, pocket set both ends are respectively equipped at least one first mounting hole, and the depth of the first mounting hole is less than the first junction
Thickness；The second mounting hole and buckle are set on second junction, the buckle is small towards the second thermal insulation board inboard width
In towards the width on the outside of the second thermal insulation board, on the buckle slot single-row layout and the second junction, formation buckle group, buckle group
Both ends are respectively equipped at least one second mounting hole, and the second mounting hole runs through the second junction；
Wherein, the card slot is groove-like, and the buckle is convex, and the buckle is mutually matched with card slot.
Further, the drier may be located on the supporting layer far from the vacuum layer side.
Beneficial effects of the present invention：
The present invention designs water-proof heat-insulating slab, and outside plate is equipped with hydrophobic layer, vacuum layer and drying layer, and hydrophobic layer makes water droplet upper
It is not easy to retain, vacuum layer makes steam be not easy to propagate, in addition the steam that last drying layer is absorbed into, such multilayer is anti-
Shield, prevents moisture from entering inner panel, thermal insulation board use can be made more permanent, and the connection between two pieces of this thermal insulation board is also very convenient,
Card slot design is easily disassembled.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described.
Fig. 1 is a kind of waterproof thermal-insulated plate structure schematic diagram；
Fig. 2 is the cross section structure schematic diagram in the directions A-A ' in Fig. 1；
Fig. 3 is water-proof heat-insulating slab part-structure schematic diagram；
Fig. 4 is dry schematic diagram of a layer structure in water-proof heat-insulating slab outside plate；
Fig. 5 is the first thermal insulation board planar structure schematic diagram；
Fig. 6 is the directions B-B ' cross section structure schematic diagram in Fig. 5；
Fig. 7 is the second thermal insulation board planar structure schematic diagram；
Fig. 8 is the directions C-C ' cross section structure schematic diagram in Fig. 7.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment shall fall within the protection scope of the present invention.
As shown in Figure 1, a kind of water-proof heat-insulating slab, which is characterized in that the thermal insulation board includes the first thermal insulation board 1 and second
Thermal insulation board 2, the first thermal insulation board 31 further includes the first junction 31, and the first junction 31 and the first thermal insulation board 1 form " L " platform
Rank, the second thermal insulation board 2 further includes the second junction 32, and the second junction 31 and the second thermal insulation board 2 form " L " step；From
It can be seen that, the first thermal insulation board is connected with " L " the step complementation of the second thermal insulation board junction two in figure.
As shown in Figure 2 and Figure 3, wherein first thermal insulation board, 1 and second thermal insulation board 2 is by 5 groups of outside plate 4 and inner panel
At the outside plate 4 wraps up the inner panel 5, and the outside plate 4 includes hydrophobic layer 40, outer protection board 41, vacuum layer 42 and drying layer
43, the vacuum layer 42 is between the outer protection board 41 and drying layer 43；The hydrophobic layer 40 is located at the outer protection board
41 top；Outside plate is equipped with hydrophobic layer, vacuum layer and drying layer, and hydrophobic layer makes water droplet be not easy to retain upper, and vacuum layer is
Steam is not allowed to propagate into, in addition the steam that last drying layer is absorbed into, such multilayer proofing, prevent in moisture entrance
Plate can make thermal insulation board use more permanent.
As shown in Figure 4, wherein the drying layer 43 includes sealant 431, drier 432 and supporting layer 433, described
Drier 432 is formed in 433 surface of the supporting layer, and the sealant is set on the drier 432, and by drier 432
It is sealed between the sealant 431 and the supporting layer 433, the drier 432 is located at the supporting layer 433 far from described
5 side of inner panel, drier can be calcium oxide, can be very good absorption steam in this way, and also sealant is close by drier
Envelope, will not fall off.
As shown in Figure 5, Figure 6, wherein the first mounting hole 11 and card slot 12 are set on first junction 31, it is described
Card slot 12 is more than the width towards 1 outside of the first thermal insulation board, 12 single-row layout of the card slot towards 1 inboard width of the first thermal insulation board
With on the first junction 31, formation pocket set, pocket set both ends are respectively equipped at least one first mounting hole 11, and first fixes
The depth in hole 11 is less than the thickness of the first junction 31, and it is known from figures that, card slot is located at the edge of the first junction, and compared with
Narrow portion is directed towards outside；As shown in Figure 7, Figure 8, wherein the second mounting hole 21 and card are set on second junction 32
Button 22, the buckle 22 are less than the width towards 2 outside of the second thermal insulation board, the buckle towards 2 inboard width of the second thermal insulation board
On 22 single-row layout of slot and the second junction 32, buckle group is formed, buckle group both ends are respectively equipped at least one second mounting hole
21, and the second mounting hole 21 run through the second junction 32, from figure it can be seen that, buckle be located at the second junction close to second protect
The edge of warm plate side, and on the outside of roomy larger direction；Wherein, the card slot 12 is groove-like, and the buckle 22 is protrusion
Shape, and the buckle 22 is mutually matched with card slot 12；As shown in Figure 5, Figure 7, two structures are opposite is clamped, and buckle is inserted directly into card
In slot, consolidation process is carried out with screw by the mounting hole at both ends, the connection between two pieces of this thermal insulation board is also very convenient, card slot
It designs easily disassembled.
Another preferred embodiment, wherein the thickness of first thermal insulation board, 1 and second thermal insulation board 2 is a, and described first hands over
The thickness for meeting place 31 is b, and 12 depth of card slot is c, and the thickness of the second junction 32 is d+e, and e is the height of the buckle 22；Its
In, a is equal to b+d+e, after ensureing two thermal insulation board superpositions in this way, moreover it is possible to ensure that an integral smoothness, the c are less than institute
B is stated, the d+e is less than a.
Another preferred embodiment, 12 depth c of the card slot are more than or equal to the height e of the buckle 22.
Another preferred embodiment, first junction, 31 thickness b are equal to the thickness a of the first protection board of half 1；It is described
Thickness d+the e of second junction 32 is equal to the thickness a of the second protection board of half 2.
Another preferred embodiment, the drier may be located on the supporting layer far from the vacuum layer side.
The present invention designs water-proof heat-insulating slab, and outside plate is equipped with hydrophobic layer, vacuum layer and drying layer, and hydrophobic layer makes water droplet upper
It is not easy to retain, vacuum layer is that steam is not allowed to propagate into, in addition the steam that last drying layer is absorbed into, such multilayer is anti-
Shield, prevents moisture from entering inner panel, thermal insulation board use can be made more permanent, and the connection between two pieces of this thermal insulation board is also very convenient,
Card slot design is easily disassembled.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
With within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention god.
Claims (2)
1. a kind of water-proof heat-insulating slab, which is characterized in that the water-proof heat-insulating slab includes：
First thermal insulation board (1), the second thermal insulation board (2), first thermal insulation board (1) and second thermal insulation board (2) include inner panel
(5) and outside plate (4),
The inner panel (5) is wrapped up by the outside plate (4)；
The outside plate (4) includes drying layer (43), vacuum layer (42), outer protection board (41) and hydrophobic layer (40),
Between the drying layer (43) and the outer protection board (41), the hydrophobic layer (40) is located at the vacuum layer (42)
Above the outer protection board (41),
The drying layer includes supporting layer (433), drier (432) and sealant (431),
The drier (432) is formed in the supporting layer (433) surface, and the sealant (431) is set to the drier
(432) top, and the drier (432) is sealed by the supporting layer (433) and the sealant (431), the drier
(432) it is located at the supporting layer (433) far from the inner panel (5) side；
First junction (31), first junction (31) are set on first thermal insulation board, first junction
(31) " L " shape step is formed with first thermal insulation board (1), the first junction (31) thickness is equal to half first
The thickness of thermal insulation board (1)；
Second junction (32), second junction (32) are set on second thermal insulation board, second junction
(32) " L " shape step is formed with second thermal insulation board (2), the thickness of second junction (32) is equal to half the
The thickness of two thermal insulation boards (2)；
First junction (31) includes：
Card slot (12), the card slot (12) are groove-like, and single-row layout is on first junction (31), and the card slot
(12) it is more than towards the width on the inside of first thermal insulation board (1) towards the width on the outside of first thermal insulation board (1)；
First mounting hole (11), first mounting hole (11) are located at the card slot (12) both ends, and equipped at least one, described
The depth of first mounting hole (11) is less than the thickness of first junction (31)；
Second junction (32) includes：
Buckle (22), the buckle (22) be convex, single-row layout on second junction (32) and with the card slot
(12) it is mutually matched, the buckle (22) is less than towards the width on the inside of second thermal insulation board (2) towards second heat preservation
Width on the outside of plate (2), and the buckle (22) is located at second junction (32) close to second thermal insulation board (2) one
Side；
Second mounting hole (21), second mounting hole (21) are located at described buckle (22) both ends, and equipped at least one, described
Second mounting hole (21) is through second junction (32)；
The buckle (12) is inserted directly into the card slot (12), and utilizes first mounting hole of the screw by both ends
(11) and second mounting hole (21) carries out consolidation process.
2. a kind of water-proof heat-insulating slab as described in claim 1, it is characterised in that：The drier (432) may be located on institute
State side of the supporting layer (433) far from the vacuum layer (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610843010.0A CN106320546B (en) | 2014-09-02 | 2014-09-02 | A kind of water-proof heat-insulating slab |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410441851.XA CN104196138B (en) | 2014-09-02 | 2014-09-02 | A kind of water-proof heat-insulating slab |
| CN201610843010.0A CN106320546B (en) | 2014-09-02 | 2014-09-02 | A kind of water-proof heat-insulating slab |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410441851.XA Division CN104196138B (en) | 2014-09-02 | 2014-09-02 | A kind of water-proof heat-insulating slab |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106320546A CN106320546A (en) | 2017-01-11 |
| CN106320546B true CN106320546B (en) | 2018-07-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410441851.XA Active CN104196138B (en) | 2014-09-02 | 2014-09-02 | A kind of water-proof heat-insulating slab |
| CN201610841913.5A Active CN106436938B (en) | 2014-09-02 | 2014-09-02 | A kind of water-proof heat-insulating slab |
| CN201610841912.0A Active CN106499072B (en) | 2014-09-02 | 2014-09-02 | A kind of water-proof heat-insulating slab |
| CN201610843010.0A Active CN106320546B (en) | 2014-09-02 | 2014-09-02 | A kind of water-proof heat-insulating slab |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410441851.XA Active CN104196138B (en) | 2014-09-02 | 2014-09-02 | A kind of water-proof heat-insulating slab |
| CN201610841913.5A Active CN106436938B (en) | 2014-09-02 | 2014-09-02 | A kind of water-proof heat-insulating slab |
| CN201610841912.0A Active CN106499072B (en) | 2014-09-02 | 2014-09-02 | A kind of water-proof heat-insulating slab |
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| CN (4) | CN104196138B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107082177A (en) * | 2017-05-27 | 2017-08-22 | 句容市鼎盛纸箱包装有限公司 | A kind of moistureproof carton |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN106499072A (en) | 2017-03-15 |
| CN106320546A (en) | 2017-01-11 |
| CN104196138A (en) | 2014-12-10 |
| CN106436938A (en) | 2017-02-22 |
| CN106499072B (en) | 2018-12-21 |
| CN106436938B (en) | 2019-01-08 |
| CN104196138B (en) | 2016-11-23 |
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