CN106317771A - Prepreg, preparation method of prepreg and composite material - Google Patents
Prepreg, preparation method of prepreg and composite material Download PDFInfo
- Publication number
- CN106317771A CN106317771A CN201510400381.7A CN201510400381A CN106317771A CN 106317771 A CN106317771 A CN 106317771A CN 201510400381 A CN201510400381 A CN 201510400381A CN 106317771 A CN106317771 A CN 106317771A
- Authority
- CN
- China
- Prior art keywords
- prepreg
- preparation
- glue solution
- mixed glue
- powder body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
The invention provides a prepreg, a preparation method of the prepreg and a composite material. The preparation method comprises the following steps: adding dielectric powder into melt epoxy resin, and stirring to form a mixed glue solution; adding the mixed glue solution into a glue film machine for gel forming so as to form a glue film; and adding a fiber body and the glue film into an impregnation machine for performing continuous hot pressing so as to form the prepreg. According to the invention, the condition that a solvent is used in the step of forming the mixed glue solution is avoided, gaps formed by the residual solvent in the prepreg forming process are further reduced, sedimentation of the dielectric powder in the mixed glue solution is reduced, and finally, the mechanical strength of the prepreg is improved; meanwhile, because the dielectric powder has a high dielectric constant, the prepreg has a relatively high dielectric constant; and moreover, the prepared prepreg does not need to be cut and spliced, antennas of complicated shapes can be directly formed, and the environmental pollution is avoided.
Description
Technical field
The present invention relates to prepreg preparing technical field, in particular to a kind of prepreg, its preparation method and composite.
Background technology
Prepreg is the semi-finished product (middle base material) preparing fiber-reinforced resin matrix compound material, and the quality of its quality directly decides
The performance of composite products component is good and bad.The production technology of prepreg mainly has wet method and dry method two kinds at present.Wet method is also named molten
Liquid infusion process, it needs to use a large amount of volatile solvent.Dry method is also hot melt, has resin in production efficiency height, prepreg
The controllability of content is strong, low-volatile, presentation quality are good and the feature such as excellent combination property, it has also become domestic and international composite
The study hotspot of industry and application trend.
Prior art generally use solution dipping method prepare prepreg.But, when using solution dipping method to prepare prepreg,
It is generally of following shortcoming: the solvent used in technique can be to environment, and the prepreg formed often remains one
Quantitative solvent, thus in prepreg, when causing molding, easily form hole, and then the composite property of impact.For upper
State problem, there is presently no effective solution.
Summary of the invention
Present invention is primarily targeted at a kind of prepreg of offer, its preparation method and composite, to eliminate prepreg in molding
Time the space impact on composite property that formed.
To achieve these goals, according to an aspect of the invention, it is provided the preparation method of a kind of prepreg, this preparation side
Method comprises the following steps: dielectric powder body is added melted epoxy resin, and stirs to be formed mixed glue solution, mixed glue solution intermediary
The percentage by weight of electricity powder body is 60～85wt%；Corpus fibrosum and mixed glue solution are carried out impregnation process to form prepreg.
Further, melted epoxy resin is prepared from by carrying out heating under conditions of 50 DEG C～150 DEG C.
Further, the step of impregnation process includes: mixed glue solution is put into adhesive film machine and carries out plastic to form glued membrane；By fiber
Body and glued membrane put into the laggard row continuous hot-press containing dipping machine to form prepreg.
Further, in the step of plastic, gelling temperature is 50 DEG C～150 DEG C.
Further, in the step of continuous hot-press, hot pressing temperature is 50～150 DEG C, and hot pressing pressure is 5～15kg/cm2。
Further, the viscosity of epoxy resin is 10000～40000CPS.
Further, dielectric powder body is Ca-Ti ore type crystalline texture or the inorganic particle of composite perofskite type crystalline texture.
Further, a diameter of 2～50 μm of dielectric powder body.
Further, corpus fibrosum be shaped as fibre bundle or fabric, and the kind of corpus fibrosum is flaxen fiber, carbon fiber, glass
Any one or more in glass fiber, polypropylene, aramid fiber and basalt fibre.
According to a further aspect in the invention, it is provided that a kind of prepreg, this prepreg is prepared by the preparation method of above-mentioned prepreg
Form.
According to a further aspect in the invention, it is provided that a kind of composite, this composite is solid by carrying out above-mentioned prepreg
Obtain after change.
Application technical scheme, the present invention is by adding dielectric powder body after epoxy resin carries out hot melt, and stirs with shape
Become mixed glue solution, thus avoid in the step forming mixed glue solution, use solvent, and then decrease in the mistake forming prepreg
The space produced due to residual solvent in journey, eliminates the impact on composite property of space that prepreg formed when molding,
Further reduce the sedimentation in mixed glue solution of the dielectric powder body, and owing to decreasing the space in prepreg, thus improve pre-
The mechanical strength of leaching material；Simultaneously as dielectric powder body has high dielectric constant so that prepreg to have higher dielectric normal
Number；Further, due to preparation method molding not by hot extrusion of this prepreg, so that prepared prepreg need not enter
Row cutting is spliced and directly can be formed complex-shaped antenna, and will not be to environment.
Accompanying drawing explanation
The Figure of description of the part constituting the application is used for providing a further understanding of the present invention, and the present invention's is schematic real
Execute example and illustrate for explaining the present invention, being not intended that inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 shows the schematic flow sheet of the preparation method of the prepreg that embodiment of the present invention provided.
Detailed description of the invention
It should be noted that in the case of not conflicting, the embodiment in the application and the feature in embodiment can be mutually combined.
Describe the present invention below with reference to the accompanying drawings and in conjunction with the embodiments in detail.
It should be noted that term used herein above merely to describe detailed description of the invention, and be not intended to restricted root according to this Shen
Illustrative embodiments please.As used herein, unless the context clearly indicates otherwise, otherwise singulative is also intended to
Including plural form, additionally, it should be understood that, when using term " to comprise " in this manual and/or time " including ",
It indicates existing characteristics, step, operation, device, assembly and/or combinations thereof.
From background technology, prior art generally uses solution dipping method prepare prepreg, use yet with in technique
Solvent can be to environment, and the prepreg formed often remains a certain amount of solvent, thus holds when causing molding
In prepreg, easily form hole, and then the composite property of impact.The present inventor studies for the problems referred to above,
Provide the preparation method of a kind of prepreg.As it is shown in figure 1, this preparation method comprises the following steps: dielectric powder body is added molten
The epoxy resin melted, and stir to be formed mixed glue solution, the percentage by weight of mixed glue solution dielectric powder body is 60～85wt%；Will
Corpus fibrosum and mixed glue solution carry out impregnation process to form prepreg.
Above-mentioned preparation method is by adding dielectric powder body after epoxy resin carries out hot melt, and stirs to be formed mixed glue solution, thus
Avoid in the step forming mixed glue solution, use solvent, and then decrease during forming prepreg due to residual solvent
And the space produced, eliminate the impact on composite property of space that prepreg formed when molding, further reduce Jie
Electricity powder body sedimentation in mixed glue solution, and owing to decreasing the space in prepreg, thus improve the mechanical strength of prepreg；
Simultaneously as dielectric powder body has high dielectric constant, so that prepreg has higher dielectric constant；Further, due to this
The molding not by hot extrusion of the preparation method of prepreg so that prepared prepreg need not carry out cutting splicing and direct
Complex-shaped antenna can be formed, and will not be to environment.
The illustrative embodiments of preparation method of the prepreg provided according to the present invention is provided.But, this
A little illustrative embodiments can be implemented by multiple different form, and should not be construed to be limited solely to set forth herein
Embodiment.It should be appreciated that these embodiments are provided so that disclosure herein is thorough and complete, and will
The design of these illustrative embodiments is fully conveyed to those of ordinary skill in the art.
First, dielectric powder body is added melted epoxy resin, and stirs to be formed mixed glue solution, mixed glue solution dielectric powder body
Percentage by weight be 60～85wt%.The technique that those skilled in the art can select suitable hot melt according to actual process demand
Parameter, it is preferable that melted epoxy resin is prepared from by carrying out heating under conditions of 50 DEG C～150 DEG C.Above-mentioned preferably
Parameter area can make epoxy resin and dielectric powder body the most preferably mix.
The material of above-mentioned dielectric powder body can select according to prior art, it is preferable that dielectric powder body is Ca-Ti ore type crystallization knot
Structure or the inorganic particle of composite perofskite type crystalline texture.It is further preferable that the material of dielectric powder body selected from Barium metatitanate., strontium titanates,
Magnesium titanate, calcium titanate, barium strontium titanate, calcium Barium metatitanate., lead titanates, lead zirconate titanate, zirconium lanthanium titanate lead, lanthanium titanate barium, metatitanic acid
Zirconium barium, titanium dioxide, hafnium oxide, lead magnesio-niobate, barium magnesium niobate, Lithium metaniobate, potassium niobate, tantalic acid aluminum strontium, potassium tantallum niobate (KTH),
In strontium barium niobate, lead bariun niobate, titanium niobate barium, bismuth tantalate strontium, bismuth titanates, Barium metatitanate. rubidium or CaCu 3 Ti 4 O any one or
Or it is multiple.
The diameter of above-mentioned mixed glue solution dielectric powder body can be set according to the actual requirements, it is preferable that the diameter of dielectric powder body
It is 2～50 μm.Above-mentioned preferred diameter range can make the prepreg ultimately formed have higher dielectric constant.Meanwhile, on
The viscosity stating mixed glue solution epoxy resin can also be set according to the actual requirements, it is preferable that the viscosity of epoxy resin is
10000～40000CPS.Above-mentioned preferred range of viscosities can make epoxy resin preferably mix with dielectric powder body.
Dielectric powder body is added after completing to carry out epoxy resin hot melt, and after stirring to be formed the step of mixed glue solution, will mixing
Glue is put into adhesive film machine and is carried out plastic to form glued membrane.Those skilled in the art can select suitably according to actual process demand
The technological parameter of plastic, it is preferable that in the step of plastic, gelling temperature is 50 DEG C～150 DEG C.Above-mentioned preferred temperature range energy
The glued membrane enough making mixed glue solution be formed has better performance.
Complete to put into mixed glue solution adhesive film machine carry out plastic with form glued membrane step after, corpus fibrosum and glued membrane are put into impregnation
Continuous hot-press is carried out to form prepreg after machine.Those skilled in the art can select suitable hot pressing according to actual process demand
Technological parameter, it is preferable that in the step of continuous hot-press, hot pressing temperature is 50～150 DEG C, and hot pressing pressure is 5～15kg/cm2。
Above-mentioned preferred parameter area can make corpus fibrosum preferably infiltrate in entrance glued membrane and form prepreg.
The material of above-mentioned corpus fibrosum can select according to prior art, in a preferred embodiment, and the shape of corpus fibrosum
Shape is fibre bundle or fabric, and the kind of corpus fibrosum is flaxen fiber, carbon fiber, glass fibre, polypropylene, aramid fiber and the Black Warrior
Any one or more in rock fiber.It is further preferable that corpus fibrosum is non-twist aramid fiber bundle, plain weave electron level fiber cloth or titanium
Silicate fiber cloth.
Present invention also provides a kind of prepreg, this prepreg is prepared from by the preparation method of above-mentioned prepreg, and this preimpregnation
Material is to include epoxy resin, dielectric powder body and the impregnated composite of corpus fibrosum.Owing to dielectric powder body has high dielectric constant, from
And make prepreg have higher dielectric constant；And prepared prepreg need not carry out cutting splicing and directly can form shape
The antenna that shape is complicated, and will not be to environment；Further, it is by by melted for epoxy resin and formed due to this prepreg
So that dielectric powder body there is in prepreg higher dispersibility so as to get prepreg there is more preferable uniformity, with
The prepreg that in prior art prepared by solution application infusion process is compared, and the prepreg of the application has more preferable mechanical strength.
The preparation method of the prepreg that the application provides is further illustrated below in conjunction with embodiment.
Embodiment 1
The step of the preparation method of the prepreg that the present embodiment provides includes:
The epoxy resin that viscosity is 20000CPS carries out at 70 DEG C adding after hot melt Barium metatitanate. as dielectric powder body, and stir
To form mixed glue solution, a diameter of 10 μm of its dielectric powder body, and the percentage by weight of mixed glue solution dielectric powder body is
70wt%；Mixed glue solution is put into and adhesive film machine carries out at 80 DEG C plastic to form glued membrane；Finally non-twist aramid fiber bundle and
Above-mentioned glued membrane put into containing after dipping machine hot pressing temperature be 100 DEG C, hot pressing pressure be 10kg/cm2Under conditions of carry out continuous hot-press with
Form prepreg.
Embodiment 2
The step of the preparation method of the prepreg that the present embodiment provides includes:
The epoxy resin that viscosity is 10000CPS carries out at 50 DEG C adding after hot melt calcium titanate as dielectric powder body, and stir
To form mixed glue solution, a diameter of 2 μm of its dielectric powder body, and the percentage by weight of mixed glue solution dielectric powder body is 65wt%；
Mixed glue solution is put into and adhesive film machine carries out at 50 DEG C plastic to form glued membrane；Finally plain weave electron level fiber cloth and above-mentioned glue
Film put into containing after dipping machine hot pressing temperature be 100 DEG C, hot pressing pressure be 5kg/cm2Under conditions of carry out continuous hot-press to form preimpregnation
Material.
Embodiment 3
The step of the preparation method of the prepreg that the present embodiment provides includes:
The epoxy resin that viscosity is 40000CPS carries out at 150 DEG C adding after hot melt titanium dioxide as dielectric powder body, and stir
Mix to form mixed glue solution, a diameter of 50 μm of its dielectric powder body, and the percentage by weight of mixed glue solution dielectric powder body is
85wt%；Mixed glue solution is put into and adhesive film machine carries out at 150 DEG C plastic to form glued membrane；Finally titan silicate fiber cloth and
Above-mentioned glued membrane put into containing after dipping machine hot pressing temperature be 150 DEG C, hot pressing pressure be 15kg/cm2Under conditions of carry out continuous hot-press with
Form prepreg.
Embodiment 1
The step of the preparation method of the prepreg that the present embodiment provides includes:
The epoxy resin that viscosity is 40000CPS carries out at 150 DEG C adding after hot melt titanium dioxide as dielectric powder body, and stir
Mix to form mixed glue solution, a diameter of 50 μm of its dielectric powder body, and the percentage by weight of mixed glue solution dielectric powder body is
50wt%；Mixed glue solution is put into and adhesive film machine carries out at 150 DEG C plastic to form glued membrane；Finally titan silicate fiber cloth and
Above-mentioned glued membrane put into containing after dipping machine hot pressing temperature be 150 DEG C, hot pressing pressure be 15kg/cm2Under conditions of carry out continuous hot-press with
Form prepreg.
Comparative example 2
The step of the preparation method of the prepreg that the present embodiment provides includes:
After being dissolved by the epoxy resin solvent that viscosity is 20000CPS, addition Barium metatitanate. is as dielectric powder body, and stirs to be formed mixed
Rubber alloy liquid, a diameter of 30 μm of its dielectric powder body, and the percentage by weight of mixed glue solution dielectric powder body are 70wt%；Will
Mixed glue solution is placed in the glue groove containing dipping machine；After finally non-twist aramid fiber bundle being continued to pass through the mixed glue solution in glue groove, carry out
Baking processes to remove solvent to form prepreg.
It is pre-that above-described embodiment 1 to 3 and comparative example 1 are provided by application dielectrometer (being produced by AET company of Japan)
Leaching material carries out the test of dielectric constant, and test result is as shown in table 1.
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Comparative example 1 | Comparative example 2 | |
| Dielectric constant | 20.1 | 18.9 | 21.4 | 16.4 | 15.6 |
From table 1 it follows that the dielectric constant of prepreg that comparative example 1 and comparative example 2 obtain is respectively 16.4 and 15.6；
And the dielectric constant of the prepreg of embodiment 1 to 3 preparation is 18.9～21.4, obviously higher than Jie of the prepreg that comparative example obtains
Electric constant.
As can be seen from the above description, the above embodiments of the present invention achieve following technique effect: the present invention passes through will
Epoxy resin adds dielectric powder body after carrying out hot melt, and stirs to be formed mixed glue solution, thus avoids and forming mixed glue solution
Step uses solvent, and then decreases the space produced due to residual solvent during forming prepreg, eliminate pre-
The space that leaching material is formed when the molding impact on composite property, further reduces dielectric powder body sinking in mixed glue solution
Fall, and owing to decreasing the space in prepreg, thus improve the mechanical strength of prepreg；Simultaneously as dielectric powder body tool
There is high dielectric constant, so that prepreg has higher dielectric constant；Further, due to the preparation method of this prepreg it is not
The molding by hot extrusion, so that prepared prepreg need not carry out cutting splicing and directly can form complex-shaped sky
Line, and will not be to environment.
These are only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art,
The present invention can have various modifications and variations.All within the spirit and principles in the present invention, any amendment of being made, equivalent,
Improve, should be included within the scope of the present invention.
Claims (11)
1. the preparation method of a prepreg, it is characterised in that described preparation method comprises the following steps:
Dielectric powder body is added melted epoxy resin, and stirs to be formed mixed glue solution, be situated between described in described mixed glue solution
The percentage by weight of electricity powder body is 60～85wt%；
Corpus fibrosum and described mixed glue solution are carried out impregnation process to form described prepreg.
Preparation method the most according to claim 1, it is characterised in that described melted epoxy resin is by 50 DEG C～150 DEG C
Under conditions of carry out heating and be prepared from.
Preparation method the most according to claim 1, it is characterised in that the step of described impregnation process includes:
Described mixed glue solution is put into adhesive film machine and carries out plastic to form glued membrane；
Corpus fibrosum and described glued membrane are put into containing dipping machine laggard row continuous hot-press to form described prepreg.
Preparation method the most according to claim 3, it is characterised in that in the step of described plastic, gelling temperature is 50 DEG C～150 DEG C.
Preparation method the most according to claim 3, it is characterised in that in the step of described continuous hot-press, hot pressing temperature is
50～150 DEG C, hot pressing pressure is 5～15kg/cm2。
Preparation method the most according to any one of claim 1 to 5, it is characterised in that the viscosity of described epoxy resin is
10000～40000CPS.
Preparation method the most according to any one of claim 1 to 5, it is characterised in that described dielectric powder body is Ca-Ti ore type
Crystalline texture or the inorganic particle of composite perofskite type crystalline texture.
Preparation method the most according to claim 7, it is characterised in that a diameter of 2～50 μm of described dielectric powder body.
Preparation method the most according to any one of claim 1 to 5, it is characterised in that described corpus fibrosum be shaped as fiber
Restraint or fabric, and the kind of described corpus fibrosum is flaxen fiber, carbon fiber, glass fibre, polypropylene, aramid fiber and the Black Warrior
Any one or more in rock fiber.
10. a prepreg, it is characterised in that described prepreg is by the preparation of the prepreg according to any one of claim 1 to 9
Method is prepared from.
11. 1 kinds of composites, it is characterised in that after described composite is by solidifying the prepreg described in claim 10
Obtain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510400381.7A CN106317771A (en) | 2015-07-08 | 2015-07-08 | Prepreg, preparation method of prepreg and composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510400381.7A CN106317771A (en) | 2015-07-08 | 2015-07-08 | Prepreg, preparation method of prepreg and composite material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106317771A true CN106317771A (en) | 2017-01-11 |
Family
ID=57726157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510400381.7A Pending CN106317771A (en) | 2015-07-08 | 2015-07-08 | Prepreg, preparation method of prepreg and composite material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106317771A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103351581A (en) * | 2013-07-19 | 2013-10-16 | 广东生益科技股份有限公司 | High-dielectric-constant resin composition and application thereof |
| CN104194272A (en) * | 2014-09-03 | 2014-12-10 | 苏州苏月新材料有限公司 | Basalt fiber prepreg and preparation method thereof |
| CN104356605A (en) * | 2014-12-11 | 2015-02-18 | 哈尔滨广龙通用航空科技有限公司 | Light prepreg for unmanned aerial vehicle shell and preparation method of prepreg |
-
2015
- 2015-07-08 CN CN201510400381.7A patent/CN106317771A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103351581A (en) * | 2013-07-19 | 2013-10-16 | 广东生益科技股份有限公司 | High-dielectric-constant resin composition and application thereof |
| CN104194272A (en) * | 2014-09-03 | 2014-12-10 | 苏州苏月新材料有限公司 | Basalt fiber prepreg and preparation method thereof |
| CN104356605A (en) * | 2014-12-11 | 2015-02-18 | 哈尔滨广龙通用航空科技有限公司 | Light prepreg for unmanned aerial vehicle shell and preparation method of prepreg |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105504695B (en) | A kind of corrosion-resistant vinyl ester resin SMC sheet shape moulding compound of high-strength and high-modulus and preparation method thereof | |
| CN105837956B (en) | A kind of fibre reinforced ethylene propylene diene rubber anti-yaw damper material and preparation method | |
| CN101096443A (en) | Method for preparing epoxy sheet mould plastic | |
| CN107987473A (en) | A kind of vacuum-bag process epoxy resin for prepreg and preparation method thereof | |
| CN105038142A (en) | Preparing method of hot-melt prepreg of novolac epoxy resin | |
| CN107406607B (en) | Two-component epoxy resin composition for fiber-reinforced composite material, and fiber-reinforced composite material | |
| WO2015019679A1 (en) | Reinforcing material, reinforced matrix resin, fiber-reinforced resin complex, and method for producing reinforcing material | |
| TWI723133B (en) | Manufacturing method of fiber reinforced composite material | |
| CN105694421B (en) | A kind of fiber reinforced thermolplastic composite material and preparation method thereof | |
| CN104497484B (en) | A kind of preparation method of 3 D weaving rubber coating carbon fibre reinforced composite | |
| CN107250224A (en) | The manufacture method of resin supplying material, preform and fiber-reinforced resin | |
| KR101367035B1 (en) | Manufacturing method of composite bipolar plate | |
| CN105968726B (en) | Epoxy resin with double cross-linked network structures and preparation method thereof | |
| CN106317771A (en) | Prepreg, preparation method of prepreg and composite material | |
| CN110253878B (en) | Selective laser sintering part and preparation method and application thereof | |
| CN107686657A (en) | A kind of prepreg and preparation method thereof | |
| CN110408065A (en) | It is a kind of braiding or automatic fiber placement thermoplastic resin base continuous fibers prepreg preparation method | |
| US9789648B2 (en) | Method of using high push force to fabricate composite material containing carbon material | |
| CN108673968A (en) | A kind of composite material for cars laminate | |
| CN107932933B (en) | Fiber composite material and method for producing same by using RTM (resin transfer molding) method | |
| CN106566200A (en) | Epoxy resin composite based on toughening modification | |
| JP2019199077A (en) | Method and apparatus for consolidating a bulk molding compound | |
| CN106110987B (en) | A kind of device of continuous production melamine resin | |
| CN105778426A (en) | Preparation and application of high-wettability epoxy resin composite material | |
| JP5971795B2 (en) | Carbon fiber composite resin beads, carbon fiber reinforced composite material, and method for producing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170111 |
|
| RJ01 | Rejection of invention patent application after publication |