CN106301761B - 一种基于密码杂凑算法的压缩方法及装置 - Google Patents
一种基于密码杂凑算法的压缩方法及装置 Download PDFInfo
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- CN106301761B CN106301761B CN201610647528.7A CN201610647528A CN106301761B CN 106301761 B CN106301761 B CN 106301761B CN 201610647528 A CN201610647528 A CN 201610647528A CN 106301761 B CN106301761 B CN 106301761B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/06—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols the encryption apparatus using shift registers or memories for block-wise or stream coding, e.g. DES systems or RC4; Hash functions; Pseudorandom sequence generators
- H04L9/0643—Hash functions, e.g. MD5, SHA, HMAC or f9 MAC
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L2209/00—Additional information or applications relating to cryptographic mechanisms or cryptographic arrangements for secret or secure communication H04L9/00
- H04L2209/12—Details relating to cryptographic hardware or logic circuitry
- H04L2209/125—Parallelization or pipelining, e.g. for accelerating processing of cryptographic operations
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CN106301761B true CN106301761B (zh) | 2019-04-09 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108737073B (zh) * | 2018-06-22 | 2021-09-28 | 北京智芯微电子科技有限公司 | 分组加密运算中抵抗能量分析攻击的方法和装置 |
CN109547192B (zh) * | 2018-11-08 | 2020-11-03 | 北京大学 | Sm3密码杂凑算法的并行化优化方法 |
CN113741972B (zh) * | 2021-08-20 | 2023-08-25 | 深圳市风云实业有限公司 | 一种sm3算法的并行处理方法及电子设备 |
CN116260572B (zh) * | 2023-02-21 | 2024-01-23 | 成都海泰方圆科技有限公司 | 数据杂凑处理方法、数据验证方法及电子设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102761414A (zh) * | 2011-04-26 | 2012-10-31 | 航天信息股份有限公司 | 一种sm3密码杂凑算法及确定其中的变量字的方法 |
CN103457719A (zh) * | 2013-07-23 | 2013-12-18 | 国家密码管理局商用密码检测中心 | 一种对sm3密码算法hmac模式的侧信道能量分析方法 |
CN104092534A (zh) * | 2014-07-09 | 2014-10-08 | 昆腾微电子股份有限公司 | 实现sm3密码杂凑算法中的迭代压缩的方法 |
CN104579656A (zh) * | 2014-12-31 | 2015-04-29 | 北京时代民芯科技有限公司 | 一种椭圆曲线公钥密码sm2算法的硬件加速协处理器 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102761414A (zh) * | 2011-04-26 | 2012-10-31 | 航天信息股份有限公司 | 一种sm3密码杂凑算法及确定其中的变量字的方法 |
CN103457719A (zh) * | 2013-07-23 | 2013-12-18 | 国家密码管理局商用密码检测中心 | 一种对sm3密码算法hmac模式的侧信道能量分析方法 |
CN104092534A (zh) * | 2014-07-09 | 2014-10-08 | 昆腾微电子股份有限公司 | 实现sm3密码杂凑算法中的迭代压缩的方法 |
CN104579656A (zh) * | 2014-12-31 | 2015-04-29 | 北京时代民芯科技有限公司 | 一种椭圆曲线公钥密码sm2算法的硬件加速协处理器 |
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Address after: 100192, room 2, building 66, C District, Zhongguancun Dongsheng Science Park, No. 305 Xiao Dong Road, Beijing, Haidian District Co-patentee after: STATE GRID INFORMATION & TELECOMMUNICATION GROUP Co.,Ltd. Patentee after: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Co-patentee after: STATE GRID CORPORATION OF CHINA Address before: 100192, room 2, building 66, C District, Zhongguancun Dongsheng Science Park, No. 305 Xiao Dong Road, Beijing, Haidian District Co-patentee before: STATE GRID INFORMATION & TELECOMMUNICATION GROUP Co.,Ltd. Patentee before: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Co-patentee before: State Grid Corporation of China |
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Effective date of registration: 20191118 Address after: 102299 1st floor, building 12, courtyard 79, Shuangying West Road, science and Technology Park, Changping District, Beijing Co-patentee after: STATE GRID INFORMATION & TELECOMMUNICATION GROUP Co.,Ltd. Patentee after: Beijing Smart core semiconductor technology Co.,Ltd. Co-patentee after: STATE GRID CORPORATION OF CHINA Address before: 100192, room 2, building 66, C District, Zhongguancun Dongsheng Science Park, No. 305 Xiao Dong Road, Beijing, Haidian District Co-patentee before: STATE GRID INFORMATION & TELECOMMUNICATION GROUP Co.,Ltd. Patentee before: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Co-patentee before: STATE GRID CORPORATION OF CHINA |
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