CN106299714A - Meta Materials and preparation method thereof - Google Patents
Meta Materials and preparation method thereof Download PDFInfo
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Abstract
The invention provides a kind of Meta Materials and preparation method thereof.This Meta Materials includes glass substrate, ceramic substrate and connects glass substrate and the articulamentum of ceramic substrate, is additionally provided with conduction geometry between glass substrate and ceramic substrate.Glass substrate and ceramic substrate is included due in the Meta Materials that the present invention provides, so that the Meta Materials formed is not only able to effectively scavenge, decrease the Organic substance of residual in Meta Materials, reduce Meta Materials water absorption, and improve the corrosion stability of Meta Materials, and then make Meta Materials have low-loss, improve the wave transparent performance of Meta Materials.
Description
Technical field
The present invention relates to new material technology field, in particular to a kind of Meta Materials and preparation method thereof.
Background technology
Meta Materials based on polymer matrix composites, are studied extensively and profoundly.Meta Materials based on polymer matrix composites
Advantage be that intensity is high, easy to process, good electrical property, but its shortcoming is non-refractory.And what ceramic base Meta Materials disclosure satisfy that
High temperature resistant, anti-current is lost, anti-load, and the characteristic such as the saturating glass of high temperature.
The material preparing ceramic base Meta Materials in prior art is usually glass or pottery, although the two composition is identical, but performance
There is bigger difference.Wherein, owing to the compactness of glass is high, intensity is high, and dielectric constant is big, and has the performance of moisture resistance, because of
This ceramic base Meta Materials made of glass substrate, easily occurs that Meta Materials scavenges the problems such as difficulty, the organic carbon of residual；
And pottery is porous, compactness is low, and intensity is relatively low, and dielectric constant is less, and the easily moisture absorption, therefore does ceramic base with ceramic wafer
Meta Materials, also there will be Meta Materials hygroscopic, problem the most against corrosion.
Summary of the invention
Present invention is primarily targeted at a kind of Meta Materials of offer and preparation method thereof, so that Meta Materials has higher performance.
To achieve these goals, according to an aspect of the invention, it is provided a kind of Meta Materials, this Meta Materials includes glass base
Plate, ceramic substrate and connection glass substrate and the articulamentum of ceramic substrate, be additionally provided with between glass substrate and ceramic substrate and lead
Electricity geometry.
Further, it is formed between the surface corresponded to each other of the marginal portion of the marginal portion of glass substrate and ceramic substrate
It is positioned at the sunk structure of the circumferential outside of articulamentum.
Further, the thickness range of glass substrate is 0.5～30mm, and the thickness range of ceramic substrate is 0.5～30mm, connects
The thickness range of layer is 10～300 μm.
Further, Meta Materials includes at least layer glass substrate and at least two-layer ceramic substrate, between glass substrate and ceramic substrate
Every setting, between each adjacent glass substrate and ceramic substrate, it is provided with articulamentum, and the adjacent glass substrate of least one set and pottery
Conduction geometry it is provided with between substrate；Or, Meta Materials includes layer glass substrate and at least one of which ceramic substrate, pottery
Substrate is arranged between glass substrate, is provided with articulamentum, and least one set is adjacent between each adjacent glass substrate and ceramic substrate
Glass substrate and ceramic substrate between be provided with conduction geometry.
Further, conduction geometry is arranged at the surface of glass substrate or ceramic substrate, and conduction geometry and articulamentum
Connect；Or conduction geometry is arranged at the inside of articulamentum, and conduction geometry does not connects with glass substrate or ceramic substrate
Connect.
According to a further aspect in the invention, it is provided that the preparation method of a kind of Meta Materials, this preparation method comprises the following steps: will
Glass substrate, connection preparation layers and ceramic substrate stack gradually to form preparation Meta Materials, between glass substrate and ceramic substrate also
It is provided with conduction geometry；To preparation Meta Materials be treated with heat such that connection preparation layers formed articulamentum, and make glass substrate,
Articulamentum and ceramic substrate are cascading formation Meta Materials.
Further, connection preparation layers is binding agent, and the step forming preparation Meta Materials includes: in a binder, glass substrate
Surface or ceramic substrate surface formed conduction geometry, afterwards binding agent is placed between glass substrate and ceramic substrate,
Glass substrate, connection preparation layers and ceramic substrate are carried out pressing again to form preparation Meta Materials.
Further, binding agent is by the slurry formed after aluminium oxide, zirconium oxide and phosphoric acid hybrid reaction.
Further, be treated with heat such that binding agent solidify to form articulamentum.
Further, connection preparation layers is cast sheet, and the step forming preparation Meta Materials includes: at glass substrate, ceramic substrate
Or the surface of cast sheet forms conduction geometry, afterwards glass substrate, cast sheet and ceramic substrate are stacked gradually to be formed pre-
Standby Meta Materials.
Further, cast sheet sintering formation articulamentum it is treated with heat such that to obtain.
Application technical scheme, the present invention includes English glass substrate, ceramic substrate by providing one and connects glass
The Meta Materials of the articulamentum of glass substrate and ceramic substrate, includes glass substrate and ceramic base due in the Meta Materials that the present invention provides
Plate, so that the Meta Materials formed is not only able to effectively scavenge, decreases the Organic substance of residual in Meta Materials, reduces
Meta Materials water absorption, and improve the corrosion stability of Meta Materials, and then make Meta Materials have low-loss, improve the wave transparent of Meta Materials
Performance.
Accompanying drawing explanation
The Figure of description of the part constituting the application is used for providing a further understanding of the present invention, and the present invention's is schematic real
Execute example and illustrate for explaining the present invention, being not intended that inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 shows the Meta Materials of the sunk structure with the circumferential outside being positioned at articulamentum that embodiment of the present invention provided
Cross-sectional view；
Fig. 2 shows that the surface configuration of the glass substrate that embodiment of the present invention provided has cuing open of the Meta Materials of conduction geometry
Face structural representation；
Fig. 3 shows the section of the Meta Materials being internally provided with conduction geometry of the articulamentum that embodiment of the present invention provided
Structural representation；
Fig. 4 shows the structural representation of the Fang Huan group that embodiment of the present invention provided；
Fig. 5 shows the structural representation of the Fang Huan group being provided with the first bus that embodiment of the present invention provided；
Fig. 6 shows that the structure of the cross-shaped configuration that four ends that embodiment of the present invention is provided are provided with yi word pattern structure is shown
It is intended to；
Fig. 7 shows the structural representation of the conduction geometry that embodiment of the present invention provided；
Fig. 8 shows that the structure of the cross-shaped configuration that four ends that embodiment of the present invention is provided are provided with quadrilateral structure is shown
It is intended to；And
Fig. 9 shows the schematic flow sheet of the preparation method of the Meta Materials that embodiment of the present invention provided；And
Figure 10 shows the comparison diagram of embodiments of the invention 1 and the wave transparent test result of comparative example 1.
Detailed description of the invention
It should be noted that in the case of not conflicting, the embodiment in the application and the feature in embodiment can be mutually combined.
Describe the present invention below with reference to the accompanying drawings and in conjunction with the embodiments in detail.
It should be noted that term used herein above merely to describe detailed description of the invention, and be not intended to restricted root according to this Shen
Illustrative embodiments please.As used herein, unless the context clearly indicates otherwise, otherwise singulative is also intended to
Including plural form, additionally, it should be understood that, when using term " to comprise " in this manual and/or time " including ",
It indicates existing characteristics, step, operation, device, assembly and/or combinations thereof.
From background technology, the material preparing ceramic base Meta Materials in the prior art is usually glass or pottery, and the two is to the greatest extent
Pipe composition is identical, but performance has bigger difference.The ceramic base Meta Materials made of glass substrate, easily occurs that Meta Materials scavenges
Difficulty, the problem such as organic carbon of residual；Do ceramic base Meta Materials with ceramic wafer, also there will be Meta Materials hygroscopic, do not resist
The problem of erosion.The present inventor studies for the problems referred to above, it is provided that a kind of Meta Materials, its structure such as Fig. 1 to 3
Shown in, this Meta Materials includes glass substrate 10, ceramic substrate 20 and connects glass substrate 10 and the articulamentum of ceramic substrate 20
30, it is additionally provided with conduction geometry 40 between glass substrate 10 and ceramic substrate 20.
Owing to including glass substrate and ceramic substrate in above-mentioned Meta Materials, and glass has compactness height, and intensity is high, and dielectric is normal
Number is big, and the performance of moisture resistance, and it is low that pottery has compactness, and intensity is relatively low, and dielectric constant is less, and the performance of the easy moisture absorption,
So that the Meta Materials formed can scavenge effectively, decrease the Organic substance of residual in Meta Materials, reduce Meta Materials and inhale
Aqueous, and improve the corrosion stability of Meta Materials, and then make Meta Materials have low-loss, improve the wave transparent performance of Meta Materials.
In the above-mentioned Meta Materials of the present invention, glass substrate 10 and ceramic substrate 20 can be of similar shape and size,
Can also have different shape and size.Articulamentum 30 can partly or entirely be arranged at glass substrate 10 and ceramic substrate
Between 20, meanwhile, conduction geometry 40 is arranged between glass substrate 10 and ceramic substrate 20.Preferably, glass substrate
It is formed with, between the surface corresponded to each other of the marginal portion of 10 and the marginal portion of ceramic substrate 20, the week being positioned at articulamentum 30
Sunk structure outside edge, its structure is as shown in Figure 1.It is further preferable that glass substrate 10, ceramic substrate 20 and articulamentum
The edge of 30 flushes, and its structure is as shown in Figures 2 and 3.
In the above-mentioned Meta Materials of the present invention, the thickness of glass substrate 10, ceramic substrate 20 and articulamentum 30 can be according to reality
Border demand is set.Preferably, the thickness range of glass substrate 10 is 0.5～30mm, and the thickness range of ceramic substrate 20 is
0.5～30mm, the thickness range of articulamentum 30 is 10～300 μm.
In the above-mentioned Meta Materials of the present invention, the material of articulamentum 30 can be set according to prior art.Preferably, connect
Layer 30 is formed after being solidified by binding agent.It is further preferable that binding agent is made up of the material comprising aluminum phosphate and zirconium phosphate.Aluminum phosphate
It is the Binder Phase reacting to each other with phosphoric acid by aluminium oxide and zirconium oxide and obtaining with zirconium phosphate.Wherein it is preferred to, aluminium oxide is
The granule of particle diameter 5～50nm, zirconium oxide is the granule of particle diameter 5～50nm, and the concentration of phosphoric acid is 50～85wt%, and specification is for dividing
Analyse pure.Meanwhile, articulamentum 30 can also be formed after being sintered by cast sheet.
In the above-mentioned Meta Materials of the present invention, conduction geometry 40 can be arranged at glass substrate 10 or the table of ceramic substrate 20
Face, and conduction geometry 40 be connected with articulamentum 30.The set-up mode of conduction geometry 40 can enter according to prior art
Row sets.Preferably, first conduction geometry 40 can be arranged at glass substrate 10 and the surface of ceramic substrate 20, is inciting somebody to action
After glass substrate 10, microstructure brazing layer 30 and ceramic substrate 20 stack gradually connection, conduction geometry 40 is similarly
It is arranged at the surface of articulamentum 30；Being formed after articulamentum 30 is sintered by cast sheet, first conduction geometry 40 can be arranged
In the surface of cast sheet, after the cast sheet after glass substrate 10, sintering and ceramic substrate 20 are stacked gradually connection, conduction
Geometry 40 is similarly arranged at glass substrate 10 and the surface of ceramic substrate 20, and its structure is if Fig. 1 is to shown in 2.
In the above-mentioned Meta Materials of the present invention, conduction geometry 40 can also be arranged at the inside of articulamentum 30, and conducts electricity several
What structure 40 is not connected with glass substrate 10 or ceramic substrate 20.The geometry 40 that will conduct electricity is arranged in binding agent, and
Binding agent is positioned between glass substrate 10 and ceramic substrate 20, then binding agent is cured to form articulamentum 30, and on
Stating articulamentum 30 to be attached glass substrate 10 with ceramic substrate 20, its structure is as shown in Figure 3.
Conduction geometry 40 can use any conductive material, can be metal material, such as gold, silver or copper or several metal
Mixture, it is preferred to use copper, the original form of the metal material used can be solid, liquid, stream shape body or powder；
Can also be nonmetallic materials, such as electrically conductive ink.
Conduction geometry 40 can be multiple, and conduct electricity geometry 40 be made up of metal there is certain geometrical shape
Plane or stereochemical structure, such as I shape, snowflake type etc..Conduction geometry 40 is for strengthening the wave transparent performance of Meta Materials.Lead
Electricity geometry 40 is not limited only to said structure, it is also possible to be the conduction geometry that electromagnetic wave is made other responses, e.g.
Strengthen absorbing property.
Conduction geometry 40 can include multiple mutual disjunct Fang Huan group 41, and each Fang Huan group 41 includes multiple connected
Fang Huan.Multiple connected Fang Huan include: center side's ring 411 Fang Huans outside with four be connected at four angles of center side's ring 411
412.Further, the size of center side's ring 411 and outside side's ring 412 can be the same or different, preferred center side's ring 411
Equivalently-sized with outside side's ring 412, its structure is as shown in Figure 4.At least one first conduction it is provided with in outside side's ring 412
Bar 413.First bus 413 is yi word pattern bus or cross bus or latticed bus.First bus
413 quantity and arrange position can directly affect Meta Materials low-loss band and suppression wave band scope.In the present embodiment, first
Bus 413 is cross bus, and outside side's ring 412 is divided into the square hole that four sizes are identical, and its structure is as shown in Figure 5.
Preferably, what above-mentioned conduction geometry 40 also included being connected with Fang Huan group 41 and be arranged in parallel is multiple mutually discrete
Cross-shaped configuration 42.The center of center side's ring 411 is corresponding to the center of four adjacent cross-shaped configuration 42.It is to say,
Side's ring group 41 shifts to install with cross-shaped configuration 42.
In a preferred embodiment, four ends of each cross-shaped configuration 42 are provided with yi word pattern structure 43, and yi word pattern is tied
The middle part of structure 43 is connected on the end of cross-shaped configuration 43, and its structure is as shown in Figure 6.
As it is shown in fig. 7, a cross-shaped configuration 42 with said structure and four outside side's ring 412 shapes with said structure
Becoming a conduction geometry 40, the structural parameters of conduction geometry 40 are as follows: the area of conduction geometry 40 is at 4.0mm
* between 4.0mm to 6.0mm*6.0mm.The thickness of conduction geometry 40 is between 0.01 to 0.02mm.Cross is tied
Structure width is between 0.25mm to 0.35mm, between a length of 3.0mm to 4.0 of the yi word pattern structure of cross-shaped configuration.
In another preferred embodiment, in conduction geometry 40, four ends of each cross-shaped configuration 42 are provided with four
Limit shape structure 421, the middle part of quadrilateral structure 421 is connected on the end of cross-shaped configuration.In outside side's ring 412 no longer now
Arranging the first bus 413, its structure is as shown in Figure 4.The Meta Materials with said structure can wave transparent at 0GHz to 1GHz
And low-loss, 8GHz to 18GHz can be suppressed.
It is further preferable that be provided with at least one second bus 422 in quadrilateral structure 421.Further, the second bus
422 is yi word pattern bus, and quadrilateral structure 421 is divided into two quadrilateral structures；Or the second bus 422 is cross
Type bus, quadrilateral structure 421 is divided into latticed by multiple second bus 422, and its structure is as shown in Figure 8.Second
Bus 422 quantity and arrange position can directly affect Meta Materials low-loss band and suppression wave band scope.
It is several that one cross-shaped configuration 42 with said structure and four outside side's rings 412 with said structure form a conduction
What structure 40, the structural parameters of conduction geometry 40 are as follows: the area of conduction geometry 40 is at 4.0mm*4.0mm extremely
Between 6.0mm*6.0mm, the thickness of conduction geometry 40 is between 0.0016 to 0.02mm.Conduction geometry 40
For time multiple, the spacing of each conduction geometry 40 is between 1.6mm to 2.0mm.
In the above-mentioned Meta Materials of the present invention, glass substrate 10 and the quantity of ceramic substrate 20 and set-up mode can be according to reality
Demand is set.Preferably, Meta Materials includes at least layer glass substrate 10 and at least two-layer ceramic substrate 20, glass substrate
10 and ceramic substrate 20 interval arrange, be provided with articulamentum 30 between each adjacent glass substrate 10 and ceramic substrate 20, and extremely
Conduction geometry 40 it is provided with less between one group of adjacent glass substrate 10 and ceramic substrate 20.I.e. glass substrate in Meta Materials
10 and ceramic substrate 20 relation that arranges from top to bottom be A//B//A//B, wherein A is glass substrate 10, and B is ceramic substrate
20.Owing in above-mentioned Meta Materials, glass substrate 10 and ceramic substrate 20 are symmetrical structure such that it is able to reduce Meta Materials macroscopic view heat
The generation of stress, reduces the probability forming crack in Meta Materials between substrate.
In the above-mentioned Meta Materials of the present invention, Meta Materials can also include layer glass substrate 10 and at least one of which ceramic substrate 20,
Ceramic substrate 20 is arranged between glass substrate 10, is provided with articulamentum between each adjacent glass substrate 10 and ceramic substrate 20
Conduction geometry 40 it is provided with between 30, and adjacent glass substrate 10 and the ceramic substrate 20 of least one set.I.e. in Meta Materials
Glass substrate 10 and ceramic substrate 20 relation that arranges from top to bottom is A//B//A or A//B//B//A, and wherein A is glass substrate
10, B is ceramic substrate 20.Owing in above-mentioned Meta Materials, glass substrate 10 and ceramic substrate 20 are symmetrical structure such that it is able to
Reduce in Meta Materials and make to be formed between substrate the macro-thermal stress in crack, and reduce the probability of substrate warp in Meta Materials.
According to a further aspect in the invention, it is provided that the preparation method of a kind of Meta Materials, as shown in Figure 9.This preparation method includes
Following steps: stack gradually to form preparation Meta Materials, glass substrate and pottery by glass substrate, connection preparation layers and ceramic substrate
Conduction geometry it is additionally provided with between porcelain substrate；Preparation Meta Materials is treated with heat such that connection preparation layers forms articulamentum,
And make glass substrate, articulamentum and ceramic substrate be cascading formation Meta Materials.
By glass substrate and ceramic substrate are formed Meta Materials in above-mentioned preparation method, and glass has compactness height, intensity
Height, dielectric constant is big, and the performance of moisture resistance, and pottery to have compactness low, intensity is relatively low, and dielectric constant is less, and
The easily performance of the moisture absorption, so that the Meta Materials formed can scavenge effectively, decreases the Organic substance of residual in Meta Materials,
Reduce Meta Materials water absorption, and improve the corrosion stability of Meta Materials, and then make Meta Materials have low-loss, improve Meta Materials
Wave transparent performance.
The exemplary embodiment party of preparation method of the Meta Materials provided according to the present invention is provided below in conjunction with Fig. 1 to 3
Formula.But, these illustrative embodiments can be implemented by multiple different form, and should not be construed to be limited solely to
Embodiments set forth herein.It should be appreciated that these embodiments are provided so that disclosure herein thoroughly and
Completely, and by the design of these illustrative embodiments it is fully conveyed to those of ordinary skill in the art.
First, stack gradually to form preparation Meta Materials, glass substrate by glass substrate 10, connection preparation layers and ceramic substrate 20
Conduction geometry 40 it is additionally provided with between 10 and ceramic substrate 20.Wherein, conduction geometry 40 is constituted by metal is micro-
There is plane or the stereochemical structure of certain geometrical shape, such as I shape, snowflake type etc..Conduction geometry 40 enhances formation
The wave transparent performance of Meta Materials.Conduction geometry 40 is not limited only to said structure, it is also possible to be that electromagnetic wave is made other is corresponding
Conduction geometry, e.g. strengthen absorbing property.
The technique forming above-mentioned connection preparation layers can have a variety of, and in a preferred embodiment, it is viscous for connecting preparation layers
Knot agent, the step forming preparation Meta Materials includes: in a binder, the surface of glass substrate 10 or the surface of ceramic substrate 20
Formed conduction geometry 40, afterwards binding agent is placed between glass substrate 10 and ceramic substrate 20, then by glass substrate 10,
Connect preparation layers and ceramic substrate 20 carries out pressing to form preparation Meta Materials.Further, in the step of pressing, pressure can
Think 5～20mpa.Above-mentioned preferably pressing pressure can make glass substrate 10, more cause between connection preparation layers and ceramic substrate 20
Close is attached.
Being preferably carried out in mode above-mentioned, the preparation technology of binding agent can be set according to prior art.Preferably, viscous
Knot agent is by the slurry formed after aluminium oxide, zirconium oxide and phosphoric acid hybrid reaction.Aluminium oxide and zirconium oxide and phosphoric acid react to each other shape
Become there is aluminum phosphate and the zirconium phosphate of Binder Phase.It is further preferable that the granule that aluminium oxide is particle diameter 5～50nm, zirconium oxide is particle diameter
The granule of 5～50nm, the concentration of phosphoric acid is 50～85wt%, and specification is analytical pure.Above-mentioned preferred material character can make system
For the binding agent gone out, there is higher adhesive property, and the sintering under higher temperature can be born.
In the step forming above-mentioned connection preparation layers, another kind of preferred implementation is: connecting preparation layers can be cast sheet,
The step forming preparation Meta Materials includes: form conduction geometry on the surface of glass substrate 10, ceramic substrate 20 or cast sheet
40, stack gradually glass substrate 10, cast sheet and ceramic substrate 20 afterwards to form preparation Meta Materials.Wherein, cast sheet is
Ceramic powders and organic polymer being mixed merga pass the tape casting be prepared from, wherein organic polymer solvent can be to have epoxy
The resinae solvent of resin.Cast sheet prepared by above-mentioned material can be compatible with Ag-Pd slurry sintering such that it is able to ensures conduction
The integrity of geometry, prevents Ag-Pd pulp flow, ruptures, permeates or melt.Further, above-mentioned cast sheet can also
Bonding with the base of glass substrate 10 and ceramic substrate 20 or combine.
Complete to stack gradually to form preparation Meta Materials, glass substrate by glass substrate 10, connection preparation layers and ceramic substrate 20
After being additionally provided with the step of conduction geometry 40 between 10 and ceramic substrate 20, preparation Meta Materials is treated with heat such that
Connect preparation layers formed articulamentum 30, and make glass substrate 10, articulamentum 30 and ceramic substrate 20 be cascading formation institute
State Meta Materials.
According to being formed, the technique connecting preparation layers is different, and the technique forming above-mentioned articulamentum 30 can also have a variety of, excellent in one
Choosing embodiment in, be treated with heat such that binding agent solidify to form articulamentum 30.The temperature and time of above-mentioned heat treatment can
To be set according to the actual requirements.Preferably, treatment temperature is 800～900 DEG C, and the process time is 5～30 minutes.The most excellent
Selection of land, above-mentioned heat treatment includes heat treatment and second time heat treatment for the first time, and wherein, the temperature of heat treatment can be for the first time
800～850 DEG C, the time of heat treatment can be 5～15 minutes for the first time；The temperature of heat treatment can be 850～900 DEG C for the second time,
The time of heat treatment can be 5～15 minutes for the first time.Twice intensification can make to make the mixture in binding agent react further
Formation combines phase.
In the step forming above-mentioned articulamentum 30, another kind of preferred implementation is: be treated with heat such that to obtain cast sheet sintering
Form articulamentum 30.The temperature and time of above-mentioned heat treatment can also be set according to the actual requirements.Preferably, treatment temperature
Being 800 DEG C～920 DEG C, the process time is 5～30 minutes.It is further preferable that above-mentioned heat treatment includes heat treatment and second for the first time
Secondary heat treatment, wherein, the temperature of heat treatment can be 800～850 DEG C for the first time, and the time of heat treatment can be 5～15 for the first time
Minute；The temperature of heat treatment can be 850～920 DEG C for the second time, and the time of heat treatment can be 5～15 minutes for the first time.Twice
Intensification can make powder (containing glass or other low melting point oxides) densified sintering product in cast sheet further.
The preparation method of the Meta Materials that the application provides is further illustrated below in conjunction with embodiment.
Embodiment 1
The step of the preparation method of the Meta Materials that the present embodiment provides includes:
First, by aluminium oxide, zirconium oxide and phosphoric acid hybrid reaction to form binding agent, and by adhesive-coated at glass substrate and
As connecting preparation layers between ceramic substrate, wherein glass baseplate surface is provided with conduction geometry, glass substrate, conduct electricity several
What structure, connection preparation layers and ceramic substrate constitute preparation Meta Materials；Then, at 800 DEG C, preparation Meta Materials is carried out 5 minutes
Heat treatment make connection preparation layers form articulamentum, wherein glass substrate, articulamentum and ceramic substrate stack gradually connection and are formed super
Material, is provided with conduction geometry in Meta Materials.
Embodiment 2
The step of the preparation method of the Meta Materials that the present embodiment provides includes:
First, by aluminium oxide, zirconium oxide and phosphoric acid hybrid reaction to form binding agent, and adhesive-coated is being set gradually
As connecting preparation layers between glass substrate, ceramic substrate and glass substrate, wherein the inside of binding agent is placed with conduction geometry knot
Structure, glass substrate, conduction geometry, connection preparation layers and ceramic substrate constitute preparation Meta Materials；Then, right at 900 DEG C
The heat treatment that preparation Meta Materials is carried out 30 minutes makes connection preparation layers form articulamentum, wherein glass substrate, articulamentum and ceramic base
Plate stacks gradually connection and forms Meta Materials, is provided with conduction geometry in Meta Materials.
Embodiment 3
The step of the preparation method of the Meta Materials that the present embodiment provides includes:
First, cast sheet is arranged between glass substrate, ceramic substrate, glass substrate and the ceramic substrate set gradually as
Connecting preparation layers, wherein cast sheet is ceramic powders and epoxy resin to be mixed merga pass the tape casting be prepared from, and cast sheet table
Face is provided with conduction geometry, and glass substrate, conduction geometry, connection preparation layers and ceramic substrate constitute preparation Meta Materials；
Then, the preparation heat treatment that carries out 5 minutes of Meta Materials makes at 800 DEG C connection preparation layers form articulamentum, wherein glass substrate,
Articulamentum and ceramic substrate stack gradually connection and form Meta Materials, are provided with conduction geometry in Meta Materials.
Embodiment 4
The step of the preparation method of the Meta Materials that the present embodiment provides includes:
First, cast sheet is arranged on set gradually glass substrate, two pre-as connecting between ceramic substrate and glass substrate
Standby layer, wherein cast sheet is ceramic powders and epoxy resin to be mixed merga pass the tape casting be prepared from, and glass baseplate surface with
Ceramic base plate surface is provided with conduction geometry, glass substrate, conduction geometry, connection preparation layers and ceramic substrate structure
Become preparation Meta Materials；Then, the heat treatment carried out preparation Meta Materials 30 minutes at 920 DEG C makes connection preparation layers form connection
Layer, wherein glass substrate, microstructure brazing layer and ceramic substrate stack gradually connection and form Meta Materials, be provided with and lead in Meta Materials
Electricity geometry.
Comparative example 1
The step of the preparation method of the Meta Materials that the present embodiment provides includes:
First, aluminium oxide, zirconium oxide and phosphoric acid hybrid reaction are to form binding agent, and by adhesive-coated at two ceramic substrates
Between as connecting preparation layers, wherein ceramic base plate surface is provided with conduction geometry, ceramic substrate, conduction geometry and
Connect preparation layers and constitute preparation Meta Materials；Then, the heat treatment carried out preparation Meta Materials 5 minutes at 800 DEG C makes connection preparation
Layer forms articulamentum, and wherein ceramic substrate, articulamentum and ceramic substrate stack gradually connection and form Meta Materials, arrange in Meta Materials
There is conduction geometry, and the Meta Materials prepared by this comparative example has identical phase with the Meta Materials prepared by embodiment 1 to 4
Same physical size.
The Meta Materials providing above-described embodiment 1 to 4 and comparative example 1 carries out the test of wave transmission rate performance, test result such as following table
Shown in:
As can be seen from the above table, Meta Materials prepared by the application is in 3～5.5GHz frequency ranges, and wave transmission rate has and promotes significantly.
It is the comparison diagram of embodiment 1 and the wave transparent test result of comparative example 1 as shown in Figure 10.
As can be seen from the above description, the present invention includes English glass substrate, ceramic substrate and company by providing one
Connect the Meta Materials of the articulamentum of glass substrate and ceramic substrate, owing to Meta Materials including glass substrate and ceramic substrate, and glass
It is high that glass has compactness, and intensity is high, and dielectric constant is big, and the performance of moisture resistance, and it is low that pottery has compactness, and intensity is relatively low,
Dielectric constant is less, and the performance of the easy moisture absorption, so that the Meta Materials formed can scavenge effectively, decreases super material
In material, the Organic substance of residual, reduces Meta Materials water absorption, and improves the corrosion stability of Meta Materials, and then it is low to make Meta Materials have
Loss, improves the wave transparent performance of Meta Materials.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for those skilled in the art
For, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, any amendment of being made, etc.
With replacement, improvement etc., should be included within the scope of the present invention.
Claims (11)
1. a Meta Materials, it is characterised in that described Meta Materials includes glass substrate (10), ceramic substrate (20) and connects institute
State the articulamentum (30) of glass substrate (10) and described ceramic substrate (20), described glass substrate (10) and described pottery
Conduction geometry (40) it is additionally provided with between porcelain substrate (20).
Meta Materials the most according to claim 1, it is characterised in that the marginal portion of described glass substrate (10) and described pottery
It is formed with, between the surface corresponded to each other of the marginal portion of porcelain substrate (20), the periphery being positioned at described articulamentum (30)
The sunk structure in outside.
Meta Materials the most according to claim 1, it is characterised in that the thickness range of described glass substrate (10) is 0.5～30mm,
The thickness range of described ceramic substrate (20) is 0.5～30mm, and the thickness range of described articulamentum (30) is 10～300 μm.
Meta Materials the most according to any one of claim 1 to 3, it is characterised in that
Described Meta Materials includes at least glass substrate (10) described in two-layer and at least ceramic substrate (20) described in two-layer, described
Glass substrate (10) and described ceramic substrate (20) interval are arranged, each adjacent described glass substrate (10) and described pottery
Described articulamentum (30) it is provided with between substrate (20), and the adjacent described glass substrate (10) of least one set and described
Described conduction geometry (40) it is provided with between ceramic substrate (20)；Or,
Described Meta Materials includes ceramic substrate (20), described pottery described in glass substrate described in two-layer (10) and at least one of which
Substrate (20) is arranged between described glass substrate (10), each adjacent described glass substrate (10) and described ceramic base
Described articulamentum (30) it is provided with between plate (20), and the adjacent described glass substrate (10) of least one set and described pottery
Described conduction geometry (40) it is provided with between porcelain substrate (20).
Meta Materials the most according to any one of claim 1 to 3, it is characterised in that
Described conduction geometry (40) is arranged at described glass substrate (10) or the surface of described ceramic substrate (20),
And described conduction geometry (40) is connected with described articulamentum (30)；Or
Described conduction geometry (40) is arranged at the inside of described articulamentum (30), and described conduction geometry (40)
It is not connected with described glass substrate (10) or described ceramic substrate (20).
6. the preparation method of a Meta Materials, it is characterised in that described preparation method comprises the following steps:
Glass substrate (10), connection preparation layers and ceramic substrate (20) are stacked gradually to form preparation Meta Materials, described
Conduction geometry (40) it is additionally provided with between glass substrate (10) and described ceramic substrate (20)；
Described preparation Meta Materials is treated with heat such that, and described connection preparation layers forms articulamentum (30), and makes described glass
Substrate (10), described articulamentum (30) and described ceramic substrate (20) are cascading and form described Meta Materials.
Preparation method the most according to claim 6, it is characterised in that described connection preparation layers is binding agent, is formed described pre-
The step of standby Meta Materials includes: in described binding agent, the surface of described glass substrate (10) or described ceramic substrate (20)
Surface form described conduction geometry (40), afterwards described binding agent is placed in described glass substrate (10) and described
Between ceramic substrate (20), more described glass substrate (10), connection preparation layers and ceramic substrate (20) are carried out pressing
To form described preparation Meta Materials.
Preparation method the most according to claim 7, it is characterised in that described binding agent is by aluminium oxide, zirconium oxide and phosphoric acid
The slurry formed after hybrid reaction.
Preparation method the most according to claim 7, it is characterised in that carry out described heat treatment so that described binding agent solidifies
Form described articulamentum (30).
Preparation method the most according to claim 6, it is characterised in that described connection preparation layers is cast sheet, is formed described pre-
The step of standby Meta Materials includes: on described glass substrate (10), described ceramic substrate (20) or the surface of described cast sheet
Form described conduction geometry (40), afterwards by described glass substrate (10), described cast sheet and described ceramic substrate
(20) stack gradually to form described preparation Meta Materials.
11. preparation methoies according to claim 10, it is characterised in that carry out described heat treatment so that described cast sheet sinters
Form described articulamentum (30).
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480053A (en) * | 2011-09-05 | 2012-05-30 | 深圳光启高等理工研究院 | Preparation method of meta-material and meta-material |
| CN102731102A (en) * | 2012-05-30 | 2012-10-17 | 深圳光启创新技术有限公司 | Harmonic oscillator and preparation method thereof |
| CN104557053A (en) * | 2013-10-29 | 2015-04-29 | 深圳光启创新技术有限公司 | Ceramic-based metamaterial and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480053A (en) * | 2011-09-05 | 2012-05-30 | 深圳光启高等理工研究院 | Preparation method of meta-material and meta-material |
| CN102731102A (en) * | 2012-05-30 | 2012-10-17 | 深圳光启创新技术有限公司 | Harmonic oscillator and preparation method thereof |
| CN104557053A (en) * | 2013-10-29 | 2015-04-29 | 深圳光启创新技术有限公司 | Ceramic-based metamaterial and preparation method thereof |
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