CN102480053A - Preparation method of meta-material and meta-material - Google Patents

Preparation method of meta-material and meta-material Download PDF

Info

Publication number
CN102480053A
CN102480053A CN2011102611186A CN201110261118A CN102480053A CN 102480053 A CN102480053 A CN 102480053A CN 2011102611186 A CN2011102611186 A CN 2011102611186A CN 201110261118 A CN201110261118 A CN 201110261118A CN 102480053 A CN102480053 A CN 102480053A
Authority
CN
China
Prior art keywords
micro
dielectric material
substrate
dielectric
structural
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2011102611186A
Other languages
Chinese (zh)
Other versions
CN102480053B (en
Inventor
刘若鹏
赵治亚
缪锡根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kuang Chi Institute of Advanced Technology
Kuang Chi Innovative Technology Ltd
Original Assignee
Kuang Chi Institute of Advanced Technology
Kuang Chi Innovative Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuang Chi Institute of Advanced Technology, Kuang Chi Innovative Technology Ltd filed Critical Kuang Chi Institute of Advanced Technology
Priority to CN 201110261118 priority Critical patent/CN102480053B/en
Publication of CN102480053A publication Critical patent/CN102480053A/en
Application granted granted Critical
Publication of CN102480053B publication Critical patent/CN102480053B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Producing Shaped Articles From Materials (AREA)
  • Micromachines (AREA)

Abstract

The embodiment of the invention provides a preparation method of a meta-material. The preparation method comprises the following steps of: fixing a template with a first microstructure groove on a substrate; injecting a first liquid dielectric material into the first microstructure groove; preheating the substrate and the template together to cure the first dielectric material; further injecting a second liquid dielectric material into the first microstructure groove; curing the second dielectric material at a preset temperature to integrate the substrate, the first dielectric material and the second dielectric material, and demolding to obtain a dielectric substrate with a second microstructure groove; and injecting a material with an electromagnetic property into the second microstructure groove to obtain the meta-material. In the embodiment of the invention, a preparation process of the meta-material is simple, and accuracy is high.

Description

A kind of ultra preparation methods and ultra material
[technical field]
The present invention relates to the artificial composite material technical field, relate in particular to a kind of preparation side and ultra material of ultra material.
[background technology]
Along with the fast development of new and high technologies such as radar detection, satellite communication, Aero-Space, and the rise of research field such as anti-electromagnetic interference, stealth technique, microwave dark room, the research of microwave absorbing material more and more receives people's attention.Because very marvellous galvanomagnetic effect can appear in ultra material, can be used for fields such as absorbing material and stealth material, becomes the focus of absorbing material area research.The character of ultra material and function mainly come from its inner structure, therefore through changing the internal structure of material, can reach required electromagnetic property.
In the prior art, PCB preparation technology is mainly adopted in the preparation of ultra material, promptly through on dielectric substrate, forming layer of metal, on metal level, forms micro-structural then and realizes ultra material preparation.But the correlation technique based on the ultra material preparation of medium substrate with micro-structural is not arranged yet in the prior art.
[summary of the invention]
Technical problem to be solved by this invention provides a kind of ultra preparation methods and ultra material, can realize the preparation of the ultra material of full dielectric, and technological process is simple.
For solving the problems of the technologies described above, one embodiment of the invention provides a kind of ultra preparation methods, comprising:
The template that will have the first micro-structural groove is fixed on the substrate;
In the said first micro-structural groove, inject the first liquid dielectric material;
To said substrate and the preheating together of said template, said first dielectric material is solidified;
In the said first micro-structural groove, further inject the second liquid dielectric material;
Under preset temperature, said second dielectric material is cured, substrate, first dielectric material and second dielectric material are integrally formed, obtain to have the medium substrate of the second micro-structural groove after the demoulding;
In the said second micro-structural groove, inject material, obtain ultra material with electromagnetic property.
Another embodiment of the present invention also provides a kind of ultra material, comprising: substrate; Be positioned at the composite layer that has micro-structural on the substrate, this composite layer is made up of second dielectric materials layer that is positioned at first dielectric materials layer on the substrate and be positioned on first dielectric materials layer; And be embedded in the material that has electromagnetic property in the said composite layer micro-structural.
Technique scheme has the following advantages: be fixed on the substrate through the template that will have the first micro-structural groove; In the first micro-structural groove, inject first liquid dielectric material and the second liquid dielectric material respectively; Make first dielectric material, second dielectric material and substrate form an integral body then; Acquisition has the medium substrate of the second micro-structural groove, in the second micro-structural groove, injects the material with electromagnetic property, thereby obtains ultra material; The preparation process is simple, and accuracy is high.
[description of drawings]
In order to be illustrated more clearly in the technical scheme in the embodiment of the invention; The accompanying drawing of required use is done to introduce simply in will describing embodiment below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is a kind of ultra preparation methods flow chart that the embodiment of the invention one provides;
Fig. 2 is a kind of ultra preparation methods flow chart that the embodiment of the invention two provides;
Fig. 3 is the structural representation of a kind of ultra material of providing of the embodiment of the invention three.
[embodiment]
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making all other embodiment that obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
Embodiment one,
Referring to Fig. 1, be a kind of ultra preparation methods flow chart that the embodiment of the invention one provides, this preparation method comprises:
S11: the template that will have the first micro-structural groove is fixed on the substrate.
Among them, the first micro-structure the shape of the groove axis symmetry, for example: "workers" fonts, "large" font; or non-axial symmetry, such as: "swastika" shape, parallelogram.
S12: in the first micro-structural groove, inject the first liquid dielectric material.
Wherein, the first liquid dielectric material is a glass paste, comprises glassy phase, water base, binding agent.
S13:, first dielectric material is solidified to substrate and template preheating together.
First dielectric material and substrate after the curing link together, and obtain semi-finished product.
S14: in the first micro-structural groove, further inject the second liquid dielectric material.
Wherein, the second liquid dielectric material is water base ceramic size.
Wherein, the height of the thickness of first dielectric material≤1/2 first micro-structural groove; The height of the thickness of the thickness of first dielectric material+second dielectric material=first micro-structural groove.
S15: under preset temperature, second dielectric material is cured, substrate, first dielectric material and second dielectric material are integrally formed, obtain to have the medium substrate of the second micro-structural groove after the demoulding.
Concrete, can adopt the mode of high temperature sintering, second dielectric material is solidified.
It is understandable that the groove of second micro-structural is corresponding with the protruding tooth of first micro-structural.
S16: in the second micro-structural groove, fill material, obtain ultra material with electromagnetic property.
Concrete, can adopt the mode of vapor deposition or wire mark, in the second micro-structural groove, filling material with electromagnetic property.
Wherein, the material with electromagnetic property is: electric conducting material, like Ag-Pd slurry, copper, aluminium etc.; Ferroelectric material is like BaTiO 3, SrTiO 3, Ba XSr 1-XTiO 3Deng; Perhaps Ferrite Material is like Fe 2O 3, CuO, ZnO etc.
In the present embodiment, be fixed on the substrate, in the first micro-structural groove, inject first liquid dielectric material and the second liquid dielectric material respectively through the template that will have the first micro-structural groove; Make first dielectric material, second dielectric material and substrate form an integral body then; Acquisition has the medium substrate of the second micro-structural groove, in the second micro-structural groove, injects the material with electromagnetic property, thereby obtains ultra material; The preparation process is simple, and accuracy is high.
Embodiment two,
Referring to Fig. 2, be a kind of ultra preparation methods flow chart that the embodiment of the invention two provides, this preparation method comprises:
S21: adopt the method preparation of laser engraving to have the template of the first micro-structural groove.
Among them, the first micro-structure the shape of the groove axis symmetry, for example: "workers" fonts, "large" font; or non-axial symmetry, such as: "swastika" shape, parallelogram.In concrete implementation process, select suitable figure according to concrete demand.
S22: the template that will have the first micro-structural groove is fixed on the substrate.
Among them, the first micro-structure the shape of the groove axis symmetry, for example: "workers" fonts, "large" font; or non-axial symmetry, such as: "swastika" shape, parallelogram.
S23: in the first micro-structural groove, inject glass paste.
Wherein, glass paste comprises glassy phase, water base, binding agent and dispersant.
S24:, glass paste is solidified to substrate and template preheating together.
Glass paste and substrate after the curing link together, and obtain semi-finished product.
S25: in the first micro-structural groove, further inject water base ceramic size.
Wherein, the height of the thickness of glass paste≤1/2 first micro-structural groove; The height of the thickness of the thickness of glass paste+water base ceramic size=first micro-structural groove.
S26: under preset temperature, water base ceramic size is cured, make substrate, the glass paste after solidifying and solidify after water base ceramic size be integrally formed, obtain to have the medium substrate of the second micro-structural groove after the demoulding.
Concrete, can adopt the mode of high temperature sintering, make water base ceramic slurry curing.
It is understandable that the groove of second micro-structural is corresponding with the protruding tooth of first micro-structural.
S27: in the second micro-structural groove, fill material, obtain ultra material with electromagnetic property.
Concrete, can adopt the mode of vapor deposition or wire mark to fill.
Wherein, the material with electromagnetic property is: electric conducting material, like Ag-Pd slurry, copper, aluminium etc.; Ferroelectric material is like BaTiO 3, SrTiO 3, Ba XSr 1-XTiO 3Deng; Perhaps Ferrite Material is like Fe 2O 3, CuO, ZnO etc.
Present embodiment at first adopts the method preparation of laser engraving to have the template of the first micro-structural groove with respect to embodiment one.
Embodiment three,
Referring to Fig. 3, be the structural representation of a kind of ultra material of providing of the embodiment of the invention three, this ultra material comprises:
Comprise: substrate 31; Be positioned at the composite layer that has micro-structural on the substrate 31, this composite layer is made up of second dielectric materials layer 33 that is positioned at first dielectric materials layer 32 on the substrate and be positioned on first dielectric materials layer 32; And be embedded in the material 34 that has electromagnetic property in the composite layer micro-structural.
Wherein, first dielectric material comprises: glassy phase, water base, binding agent; Second dielectric material is water base pottery.
Wherein, the thickness of the thickness of first dielectric materials layer 32≤second dielectric materials layer 33.
Wherein, micro-structural be shaped as zhou duicheng tuxing or non-zhou duicheng tuxing, the figure of deriving of " recessed " font has been shown among the figure.
Wherein, the material with electromagnetic property is: electric conducting material, like Ag-Pd slurry, copper, aluminium etc.; Ferroelectric material is like BaTiO 3, SrTiO 3, Ba XSr 1-XTiO 3Deng; Perhaps Ferrite Material is like Fe 2O 3, CuO, ZnO etc.
In the present embodiment, substrate 31; First dielectric materials layer 32 and second dielectric materials layer 33 with micro-structural shape constitute the medium substrate with micro mechanism groove, obtain ultra material through in the micro-structural groove, filling the material with electromagnetic property, and simple in structure, accuracy is high.
First dielectric material also comprises dispersant in another embodiment of the present invention, so that each component in first dielectric material evenly distributes, the practical implementation process repeats no more here.
More than the embodiment of the invention has been carried out detailed introduction, used concrete example among this paper principle of the present invention and execution mode set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.

Claims (15)

1. a ultra preparation methods is characterized in that, comprising:
The template that will have the first micro-structural groove is fixed on the substrate;
In the said first micro-structural groove, inject the first liquid dielectric material;
To said substrate and the preheating together of said template, said first dielectric material is solidified;
In the said first micro-structural groove, further inject the second liquid dielectric material;
Under preset temperature, said second dielectric material is cured, substrate, first dielectric material and second dielectric material are integrally formed, obtain to have the medium substrate of the second micro-structural groove after the demoulding;
In the said second micro-structural groove, fill material, obtain ultra material with electromagnetic property.
2. method according to claim 1 is characterized in that, also comprises before the said method:
Adopt the method preparation of laser engraving to have the template of the first micro-structural groove.
3. method according to claim 1 is characterized in that, said first dielectric material comprises: glassy phase, water base, binding agent.
4. method according to claim 3 is characterized in that, said first dielectric material also comprises dispersant.
5. method according to claim 1 is characterized in that, said second dielectric material is water base pottery.
6. method according to claim 1 is characterized in that, the height of the thickness of said first dielectric material≤1/2 first micro-structural groove; The height of the thickness of the thickness of said first dielectric material+second dielectric material=first micro-structural groove.
7. method according to claim 1 is characterized in that, the said first micro-structural groove be shaped as zhou duicheng tuxing or non-zhou duicheng tuxing.
8. method according to claim 1 is characterized in that, said material with electromagnetic property is: electric conducting material, ferroelectric material or Ferrite Material.
9. a ultra material is characterized in that, comprising: substrate; Be positioned at the composite layer that has micro-structural on the substrate, this composite layer is made up of second dielectric materials layer that is positioned at first dielectric materials layer on the substrate and be positioned on first dielectric materials layer; And be embedded in the material that has electromagnetic property in the said composite layer micro-structural.
10. ultra material according to claim 9 is characterized in that, said first dielectric material comprises: glassy phase, water base, binding agent.
11. ultra material according to claim 10 is characterized in that, said first dielectric material also comprises dispersant.
12. ultra material according to claim 9 is characterized in that, said second dielectric material is water base pottery.
13. ultra material according to claim 9 is characterized in that, the thickness of the thickness of said first dielectric materials layer≤second dielectric materials layer.
14. ultra material according to claim 9 is characterized in that, said micro-structural be shaped as zhou duicheng tuxing or non-zhou duicheng tuxing.
15. ultra material according to claim 9 is characterized in that, said material with electromagnetic property is: electric conducting material, ferroelectric material or Ferrite Material.
CN 201110261118 2011-09-05 2011-09-05 Preparation method of meta-material Active CN102480053B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201110261118 CN102480053B (en) 2011-09-05 2011-09-05 Preparation method of meta-material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201110261118 CN102480053B (en) 2011-09-05 2011-09-05 Preparation method of meta-material

Publications (2)

Publication Number Publication Date
CN102480053A true CN102480053A (en) 2012-05-30
CN102480053B CN102480053B (en) 2013-04-24

Family

ID=46092590

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201110261118 Active CN102480053B (en) 2011-09-05 2011-09-05 Preparation method of meta-material

Country Status (1)

Country Link
CN (1) CN102480053B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103717044A (en) * 2012-09-29 2014-04-09 深圳光启创新技术有限公司 Wave absorbing material
CN106299714A (en) * 2015-05-18 2017-01-04 深圳光启高等理工研究院 Meta Materials and preparation method thereof
CN109659704A (en) * 2019-01-07 2019-04-19 内蒙古大学 A kind of ultrabroad band wave absorbing device and its manufacturing method based on combination resonance structure
CN112277346A (en) * 2020-10-23 2021-01-29 航天特种材料及工艺技术研究所 Frequency-adjustable intelligent wave-absorbing metamaterial and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050272179A1 (en) * 2004-05-24 2005-12-08 Andrew Frauenglass Three-dimensional lithographic fabrication technique
WO2009078596A1 (en) * 2007-12-14 2009-06-25 Electronics And Telecommunications Research Institute Metamaterial structure having negative permittivity, negative permeability, and negative refractivity
CN101662055A (en) * 2009-09-28 2010-03-03 浙江大学 Broadband metamaterial and preparation method thereof
US20100078203A1 (en) * 2008-09-30 2010-04-01 Lockheed Martin Corporation Low index metamaterial
CN101702067A (en) * 2009-10-29 2010-05-05 电子科技大学 Terahertz plane adsorbing material
US20100314040A1 (en) * 2009-06-10 2010-12-16 Toyota Motor Engineering & Manufacturing North America, Inc. Fabrication of metamaterials

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050272179A1 (en) * 2004-05-24 2005-12-08 Andrew Frauenglass Three-dimensional lithographic fabrication technique
WO2009078596A1 (en) * 2007-12-14 2009-06-25 Electronics And Telecommunications Research Institute Metamaterial structure having negative permittivity, negative permeability, and negative refractivity
US20100078203A1 (en) * 2008-09-30 2010-04-01 Lockheed Martin Corporation Low index metamaterial
US20100314040A1 (en) * 2009-06-10 2010-12-16 Toyota Motor Engineering & Manufacturing North America, Inc. Fabrication of metamaterials
CN101662055A (en) * 2009-09-28 2010-03-03 浙江大学 Broadband metamaterial and preparation method thereof
CN101702067A (en) * 2009-10-29 2010-05-05 电子科技大学 Terahertz plane adsorbing material

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
林洁; 万国宾; 万伟; 周卫来;: "双层介质周期漏波天线的辐射特性分析", 《现代雷达》 *
潘顺康; 刘慧; 成丽春: "介质涂层对导体目标电磁散射影响研究", 《广西物理》 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103717044A (en) * 2012-09-29 2014-04-09 深圳光启创新技术有限公司 Wave absorbing material
CN103717044B (en) * 2012-09-29 2018-05-22 深圳光启创新技术有限公司 A kind of absorbing material
CN106299714A (en) * 2015-05-18 2017-01-04 深圳光启高等理工研究院 Meta Materials and preparation method thereof
CN109659704A (en) * 2019-01-07 2019-04-19 内蒙古大学 A kind of ultrabroad band wave absorbing device and its manufacturing method based on combination resonance structure
CN112277346A (en) * 2020-10-23 2021-01-29 航天特种材料及工艺技术研究所 Frequency-adjustable intelligent wave-absorbing metamaterial and preparation method thereof
CN112277346B (en) * 2020-10-23 2022-08-12 航天特种材料及工艺技术研究所 Frequency-adjustable intelligent wave-absorbing metamaterial and preparation method thereof

Also Published As

Publication number Publication date
CN102480053B (en) 2013-04-24

Similar Documents

Publication Publication Date Title
CN102480053B (en) Preparation method of meta-material
SI2310491T1 (en) Self-assembling tissue modules
CN102480001B (en) Preparation method of metamaterial
Wang et al. Selectively metalizable low-temperature cofired ceramic for three-dimensional electronics via hybrid additive manufacturing
CN104519726A (en) Honeycomb core material, compound wave-absorbing material and honeycomb enhanced metamaterial
CN102480020A (en) Metamaterial and preparation method thereof
CN102544747A (en) Preparing method of metamaterials
CN101800348A (en) TM membrane dielectric resonator
CN104597563A (en) Waveguide type memristor based on metamaterial
CN103334021B (en) Manufacturing process of micro-channel core body
CN102480037B (en) Metamaterial preparation method and metamaterial
CN102768375A (en) Photonic crystal material and design method of photonic crystal material
CN103208587A (en) Method for preparing piezoelectric fiber composite
CN101662055B (en) Broadband metamaterial and preparation method thereof
CN102476956B (en) Metamaterial and preparation method thereof
CN101882703A (en) Communication equipment, cavity filter, resonating tube and manufacturing method thereof
CN103296461A (en) Method for preparing three-dimensional metamaterial sheet layer and metamaterial
CN102544746B (en) Packaging method of metamaterials
CN102520480A (en) Multi-medium-coupling three-dimensional photonic crystal and method for designing and manufacturing multi-medium-coupling three-dimensional photonic crystal
CN102751582A (en) Preparation method of metamaterials
CN102476459B (en) Manufacturing method of dielectric substrate and metamaterial
CN102909872A (en) Preparation method of inhomogeneous-media substrate
CN102904047B (en) The preparation method of three-dimensional structure metamaterial and three-dimensional structure metamaterial
CN102896782B (en) Preparation method of medium substrate
CN102480841A (en) Method for preparing dielectric substrate

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant