CN106298604A - A kind of wafer transmission method and device - Google Patents
A kind of wafer transmission method and device Download PDFInfo
- Publication number
- CN106298604A CN106298604A CN201510354973.XA CN201510354973A CN106298604A CN 106298604 A CN106298604 A CN 106298604A CN 201510354973 A CN201510354973 A CN 201510354973A CN 106298604 A CN106298604 A CN 106298604A
- Authority
- CN
- China
- Prior art keywords
- subtask
- wafer
- processing chamber
- module
- posterior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a kind of wafer transmission method and device, described wafer transmission method includes step: S10, the wafer with identical traffic path is divided into a subtask, and described subtask arranges according to the order of film trap；The use states in parallel of S20, basis each processing chamber current performs each subtask.The wafer transmission plan provided by the present invention, each PM of semiconductor equipment can therefore, it can effectively shorten the process time of Job, improve the treatment effeciency of Job with executed in parallel technique.
Description
Technical field
The present invention relates to technical field of semiconductors, particularly relate to a kind of wafer transmission method and device.
Background technology
At present, along with developing rapidly of semiconductor technology, semiconductor equipment have also been obtained widely should
With.Such as: magnetron sputtering apparatus, etching machine etc., a semiconductor equipment often has multiple technique
Chamber, etching machine as shown in Figure 1.This etching machine comprises four processing chambers, three loading wafers
Container, mechanical hand (comprising atmospheric mechanical hand and vacuum mechanical-arm), two forevacuum chambers i.e.
LoadLock.Wafer transmission path in etching machine is: load the container → atmospheric mechanical hand of wafer
→ forevacuum chamber → vacuum mechanical-arm → processing chamber → vacuum mechanical-arm → forevacuum chamber → air
The container of mechanical hand → loading wafer.
In prior art, when technologist needs to carry out wafer semiconductor technology making, such as: spatter
When penetrating technique, etching technics, it is necessary first to select to enter in the software control system of semiconductor equipment
The wafer of row technique, and be each wafer setting wafer transmission path i.e. Wafer flow selected, then,
The task i.e. Job clicking on the most whole setting of Start starts to perform.
Every wafer can arrange different Wafer flow in a Job, wafer is according to respective
Wafer flow transmits and carries out corresponding technique.Shared by Wafer flow set by the most each wafer
PM (Process Module, processing chamber) and differ, such as: wafer 1,2,3 is corresponding
The processing chamber shared by Wafer flow be PM1, the Wafer flow institute of wafer 4,5,6 correspondence
The processing chamber taken is PM2.The control system of existing semiconductor equipment, is processing above-mentioned situation
Job time, be only according to wafer order in the container loading wafer, take the 1st to 6 platelet successively
Sheet transmits in board and carries out technique.Further, when every time obtaining next wafer, it is intended to guarantee previous
Wafer has processed.Visible, existing Job processing method is the longest, treatment effeciency is low.
In a word, the technical problem needing those skilled in the art urgently to solve is exactly: existing Job
Processing method is the longest, treatment effeciency is low.
Summary of the invention
In view of the above problems, the present invention proposes a kind of wafer transmission method and device, solving or
Solve the problem that existing Job processing method is the longest, treatment effeciency is low at least in part.
In order to solve the problems referred to above, the invention discloses a kind of wafer transmission method, including step:
S10, the wafer with identical traffic path being divided into a subtask, described subtask is according to film trap
Order arrangement；The use states in parallel of S20, basis each processing chamber current performs each subtask.
Preferably, if there is a processing chamber of coincidence each subtask, described step S20, including:
S201, judge whether processing chamber is completely superposed, the most then perform step S202；Otherwise perform step
Rapid S203；S202, take wafer successively according to the order of film trap and carry out technique；S203, each subtask are divided
Not starting to take sheet, the processing chamber of the former setting in preceding subtask of sorting carries out technique, and sequence is rear
The subtask processing chamber with former setting in remove and be sorted the process cavity that preceding subtask takies
Room carries out technique.
Preferably, if each subtask does not have a processing chamber of coincidence, described step S20, including:
Each described subtask is taken wafer respectively, and each subtask carries out technique each with corresponding processing chamber.
Preferably, in step S203, after preceding subtask of sorting is terminated, if sorting posterior son
Task does not terminates, then the processing chamber overlapped sorting preceding subtask with posterior subtask of sorting
Discharge and be continuing with to posterior subtask of sorting.
In order to solve the problems referred to above, the invention also discloses a kind of wafer transmission set, including:
Subtask editor module, for dividing a subtask, described son by the wafer with identical traffic path
Task arranges according to the order of film trap；Perform module, for the use according to each processing chamber current
States in parallel performs each subtask.
Preferably, described execution module, including: judge submodule, if having coincidence for each subtask
Processing chamber, it is judged that whether processing chamber is completely superposed, the most then call the first implementation sub-module；
Otherwise call the second implementation sub-module；Described first implementation sub-module, for the order according to film trap successively
Take wafer and carry out technique；Described second implementation sub-module, for each subtask is started to take sheet respectively, will
The processing chamber of the former setting in preceding subtask of sorting carries out technique, and posterior subtask of sorting is with former
The processing chamber set removes and is sorted the processing chamber that preceding subtask takies and carries out technique.
Preferably, described execution module, also include: the 3rd performs module, if for each subtask not
Having the processing chamber of coincidence, each described subtask is taken wafer respectively, each subtask is each with correspondence
Processing chamber carry out technique.
Preferably, described second implementation sub-module, after preceding subtask of sorting is terminated, if sequence exists
After subtask do not terminate, then by preceding subtask and the work that overlaps of the posterior subtask of sequence of sorting
Skill chamber discharges and is continuing with to posterior subtask of sorting.
Compared with prior art, the invention have the advantages that
The wafer transmission plan that the present invention provides, by multiple having in the container loading wafer in Job
The technological process that multiple wafers in identical wafer transmission path are corresponding is defined as a subtask, with
Time, also can determine whether the sequence of each subtask.Next, it is determined whether there is corresponding same process chamber
Subtask, if not comprising, the most each subtask starts to take sheet respectively, utilizes different processing chambers to carry out
Technique.The wafer transmission plan provided by the present invention, each PM of semiconductor equipment can be with executed in parallel
Technique, therefore, it can effectively shorten the process time of Job, improve the treatment effeciency of Job.
That is, it is assumed that Job comprises 6 wafer corresponding wafer transmission path, wherein, 1,
2,3 taking PM1,4,5,6 take PM2, then the technological process of 1,2,3 correspondences be defined as
First subtask, is defined as second subtask, the two by the technological process of 4,5,6 correspondences
There is not identical processing chamber in task, therefore, it can be transmitted to PM1 by wafer 1, by wafer 4
Transmission is to PM2, and so, two PM with executed in parallel technique, and can not interfere with each other.Therefore, it can
Effectively shorten the time that processes of Job, improve the treatment effeciency of Job.
Accompanying drawing explanation
Fig. 1 is the structure chart of existing a kind of etching machine；
Fig. 2 is the flow chart of steps of a kind of wafer transmission method of according to embodiments of the present invention；
Fig. 3 is the flow chart of steps of a kind of wafer transmission method of according to embodiments of the present invention two；
Fig. 4 is the flow chart of steps of a kind of wafer transmission method of according to embodiments of the present invention three；
Fig. 5 is the structured flowchart of a kind of wafer transmission set of according to embodiments of the present invention four；
Fig. 6 is the structured flowchart of a kind of wafer transmission set of according to embodiments of the present invention five.
Detailed description of the invention
Understandable for enabling the above-mentioned purpose of the present invention, feature and advantage to become apparent from, below in conjunction with attached
The present invention is further detailed explanation with detailed description of the invention for figure.
Embodiment one
With reference to Fig. 2, it is shown that the flow chart of steps of a kind of wafer transmission method of the embodiment of the present invention one.
The wafer transmission method of the present embodiment specifically includes following steps:
Step S10, the wafer with identical traffic path being divided into a subtask, each subtask is pressed
The order arrangement of photo groove.
The use states in parallel of step S20, basis each PM current performs each subtask.
During it should be noted that the present embodiment performs technique in every wafer PM in a transmission path,
Only a PM in a transmission path can perform technique.It is assumed that the corresponding PM1 in transmission path one and
PM3, every wafer of transmission path one correspondence, when carrying out technique, selects PM1 or PM3 to carry out work
Skill.Wherein, when each subtask of executed in parallel, if there is not weight in the processing chamber used in each subtask
Close, then different processing chambers can be utilized to carry out technique wafer corresponding for each subtask simultaneously.
The wafer transmission method provided by the present embodiment, by the container loading wafer in whole task
Technological process corresponding to multiple multiple wafers with identical wafer transmission path be defined as a son
Task, meanwhile, also can determine whether the sequence of each subtask.Next, it is determined whether there is corresponding identical work
The subtask of skill chamber, if not comprising, the most each subtask starts to take sheet respectively, utilizes different technique
Chamber carries out technique.The wafer transmission method provided by the present embodiment, each technique of semiconductor equipment
Chamber can therefore, it can effectively shorten the process time of Job, improve Job's with executed in parallel technique
Treatment effeciency.
Embodiment two
With reference to Fig. 3, it is shown that the flow chart of steps of a kind of wafer transmission method of the embodiment of the present invention two.
The wafer transmission method of the present embodiment comprises the following steps:
Step S101: before whole task (i.e. Job) starts, technologist needs pending work
Wafer transmission path (i.e. wafer flow) of each wafer of skill operation is configured.
Wherein, at least corresponding PM in each wafer transmission path.Wherein, PM is for being responsible for wafer
Perform the processing chamber of semiconductor technology.
Such as: needing to set three wafer transmission paths one, two, three, wafer transmission path one is corresponding
PM1 and PM2, wafer transmission corresponding PM2 and PM3 in path two, the corresponding PM4 in wafer transmission path three
And PM5.
Wherein, the setting to wafer transmission path includes: in wafer transmission path, shared PM's sets
Put.Those skilled in the art are it will be clearly understood that arranging of wafer transmission path removes the PM needing setting to take
Outward, in addition it is also necessary to wafer is obtained container, the wafer atmospheric mechanical hand used in transmitting procedure,
Forevacuum chamber, vacuum mechanical-arm etc. are arranged.
Step S102: definition subtask (the most sub-job).
Technological process that is multiple and that have multiple wafers in identical wafer transmission path corresponding is one
Subtask.In this step, technologist transmits road according to the wafer of each wafer of pending technological operation
Footpath, determines each subtask that whole Job comprises.
Step S103: determine the sequence of each subtask, and transmit road according to the wafer that each subtask is corresponding
Footpath determines that what PM corresponding to each subtask (be ranked up according to respectively？).
In the present embodiment, when each subtask is ranked up, according to wafer corresponding to subtask at film trap
Order arrangement is ranked up.
Such as: in whole task, need 10 wafer are carried out technique, suitable in groove of 10 wafer
Sequence is 1-10, and wherein, first three wafer has identical transmission path and is divided into subtask one, the
4-5 wafer has identical transmission path and is divided into subtask two, and 6-10 wafer has identical
Transmission path is divided into subtask three, then being specifically ordered as of each subtask: subtask one is positioned at son
Before task two, before subtask two is positioned at subtask three.
After the setup, the software control system in semiconductor equipment can determine comprise according to arranging
The number of subtask, the sequence of each subtask, and according to each subtask corresponding wafer transmission road
Footpath determines the PM that each subtask is corresponding respectively.
Such as: wafer transmission path 1 can be contoured to correspond to PM1 and PM2, it is also possible to is only arranged to
Corresponding PM3.The number of the PM that wafer transmission path is corresponding and the concrete PM of correspondence can be by these
Skilled person is configured according to the actual requirements.
Step S104: for each subtask, judges current subtask and preceding subtask of sorting respectively
Whether use the processing chamber of coincidence, if using the processing chamber of coincidence, then using current subtask as
First kind subtask, performs step S106 afterwards；If not using the processing chamber of coincidence, then will
Current subtask, as Second Type subtask, performs step S105 afterwards.
This step is to judge whether each subtask uses the PM of coincidence.
It should be noted that first kind subtask and Second Type subtask are merely to distinguish each
Whether individual subtask uses the PM of coincidence, there is no essence implication.
Such as: wafer transmission path correspondence PM1 of subtask one correspondence and PM2, subtask two correspondence
Wafer transmission corresponding PM2 and PM3 in path two, subtask three correspondence wafer transmission path three corresponding
PM4 and PM5.Then, subtask one is first kind subtask, subtask two appoints for first kind
Business, subtask three is Second Type subtask, accordingly, it is determined that the most all Equations of The Second Kinds in each subtask
Type subtask, accordingly, it is desirable to perform step S106.
And if the wafer of subtask one correspondence transmission path correspondence PM1 and PM2, subtask two correspondence
Wafer transmission path correspondence PM3 and PM4, wafer transmission path correspondence PM5 of subtask three correspondence
And PM6, it is determined that each subtask is Second Type subtask, accordingly, it would be desirable to perform step
S105。
Step S105: if all Second Types subtask, each subtask, the most each subtask starts respectively
Take sheet, utilize different processing chambers to carry out technique simultaneously.
Such as: 2 subtasks comprised in whole Job are respectively subtask one, two, a pair, subtask
Answer PM1 and PM2, subtask two correspondence PM3 and PM4, and each subtask comprises multiple wafer
Technological process.By the judgement in above-mentioned steps S104, subtask one and subtask two all second
The subtask of type, then subtask one and subtask two start to take sheet respectively, by subtask one correspondence
First wafer transmits to PM1, transmits to PM2, the second wafer of subtask one correspondence by son
The first wafer transmission of task two correspondence is to PM3, by the second wafer transmission of subtask two correspondence
To PM4.
Step S106: if comprising first kind subtask in each subtask, then judge each first kind
Whether the processing chamber that task is used is completely superposed, the most then perform step S107；If it is not, then hold
Row step S108.
Such as: wafer transmission path correspondence PM1 of subtask one correspondence and PM2, subtask two correspondence
Wafer transmission path correspondence PM2 and PM3, then understand subtask one, two and be the son of the first kind
Task, at this time, it may be necessary to judge that the PM of subtask two correspondence is corresponding with preceding subtask one of sorting
Whether PM is completely superposed, if being completely superposed, then performing step S107, if not exclusively overlapping, then performing
Step S108.
If corresponding PM1 and PM2 in subtask one, subtask two also corresponding PM1 and PM2, then two sons
PM corresponding to task is completely superposed, accordingly, it would be desirable to perform step S107.
Step S107: if the PM that each first kind subtask is used is completely superposed, semiconductor equipment is then
In the PM that each subtask is used, regular transmission is set according to first successively each according to the sequence of each subtask
The wafer that subtask is corresponding.
Wherein, set according to first in the PM that each subtask is used successively according to the sequence of each subtask
Wafer corresponding to each subtask of regular transmission i.e. takes wafer successively according to the order of film trap and carries out technique.
The mode that a kind of preferred foundation first sets regular transmission wafer is as follows:
In the processing chamber that each subtask is corresponding, each subtask is transmitted successively according to the sequence of each subtask
Corresponding wafer, in wafer transmitting procedure, if before the PM that currently subtask is corresponding is ordered in
With current subtask, the subtask that should have the PM being completely superposed is taken, then current son wouldn't be appointed
Business processes.When judging that PM corresponding to front subtask is the most idle, by corresponding for current subtask not
The wafer processed transmits to idle PM.
Such as: subtask one corresponding PM1 and PM2, subtask two also corresponding PM1 and PM2, son are appointed
Corresponding PM3 and PM4 of business three.In the case, each subtask of regular transmission is set according to first corresponding
Wafer time: first, respectively the wafer of subtask one correspondence is transmitted to PM1 and PM2；Due to son
Task two is also required to take PM1 and PM2, therefore, does not processes subtask two, but directly
Subtasking three, transmits the wafer of subtask three correspondence to PM3 and PM4.When subtask two is right
After PM1 and the PM2 free time answered, the wafer of subtask two correspondence is transmitted to idle PM1 and/
Or PM2.
It should be noted that during implementing, first sets rule can be by art technology
Personnel are configured according to the actual requirements.
Such as: can be arranged to have processed that sequence is preceding and current subtask is identical to having
After the partial task of the subtask of PM, then current subtask is processed, until front subtask is complete
Portion has processed.
Can also be arranged to: processed sequence preceding with current subtask to there being the PM being completely superposed
Subtask partial task after, then current subtask is processed, treats the portion of current subtask
After point task has processed, then to sequence preceding with current subtask to having the PM's that is completely superposed
The remainder task of subtask processes.
Step S108: if the PM that each first kind subtask is used partially overlaps, semiconductor equipment is then
In the PM that each subtask is used, regular transmission is set according to second successively each according to the sequence of each subtask
The wafer that subtask is corresponding.
The mode that a kind of preferred foundation second sets regular transmission wafer is as follows:
In the PM that each subtask is corresponding, each subtask is transmitted successively corresponding according to the sequence of each subtask
Wafer, in wafer transmitting procedure, if PM part corresponding to current subtask be sorted preceding,
With current subtask, the subtask that should have the PM partially overlapped is taken, then posterior subtask of sorting
Corresponding wafer transmission is corresponding to posterior subtask of sorting, in other PM in addition to the PM overlapped.
When the PM judging coincidence corresponding to current subtask is the most idle, by corresponding for current subtask, not by
The wafer processed transmits to idle PM.
Such as: corresponding PM1 and PM2 in subtask one, subtask two corresponding PM2 and PM3, subtask
Three corresponding PM4 and PM5, then during according to the wafer that the second setting each subtask of regular transmission is corresponding,
First, respectively the wafer of subtask one correspondence is transmitted to PM1 and PM2；Owing to subtask two is corresponding
PM2 be sorted shared by preceding subtask one, therefore, first by the wafer of subtask two correspondence
Transmit to PM3, the wafer of subtask three correspondence is transmitted to PM4 and PM5.When subtask two is corresponding
The PM2 free time after, then by the untreated complete wafer transmission of subtask two correspondence to idle
PM2。
Second sets rule it should be noted that above-mentioned is the feelings transmitting the corresponding multiple PM in path
Condition, when there is first kind subtask in an only corresponding PM in transmission path and each subtask
Time, then in the PM that each subtask is corresponding, transmit each subtask successively respectively according to the sequence of each subtask
Corresponding wafer, in wafer transmitting procedure, if before the corresponding PM of current subtask is ordered in
There is the subtask of identical PM with current subtask and take, then current subtask wouldn't be carried out
Process.
The wafer transmission method provided by the present embodiment, by many in the container loading wafer in Job
The technological process that individual multiple wafers with identical wafer transmission path are corresponding is defined as a son and appoints
Business, meanwhile, also can determine whether the sequence of each subtask.Next, it is determined whether have corresponding identical PM's
Subtask, when the PM corresponding in each subtask is misaligned, then appoints to each son according to the sequence of each subtask
The PM that business is corresponding transmits the wafer that each subtask is corresponding respectively.The crystalline substance provided by the embodiment of the present invention
Sheet transmission method, each PM of semiconductor equipment can therefore, it can effectively shorten with executed in parallel technique
The time that processes of Job, the treatment effeciency of raising Job, also improve the use of semiconductor equipment simultaneously
Rate.
Embodiment three
With reference to Fig. 4, it is shown that the flow chart of steps of a kind of wafer transmission method of the embodiment of the present invention three.
As a example by the present embodiment comprises in Job two the most sub-Job in subtask, the wafer of the present invention is passed
Transmission method illustrates, and specifically includes following steps:
Step S201: before whole task (i.e. Job) starts, technologist needs pending work
Wafer transmission path (i.e. wafer flow) of each wafer of skill operation is configured.
Wherein, at least corresponding PM in each wafer transmission path.Wherein, PM is for being responsible for wafer
Perform the processing chamber of semiconductor technology.
Each wafer may select different Wafer flow i.e. wafer transmission paths, and each Waferflow may select
Different PM.
Step S202: editor Job.
Can comprise many sub-Job i.e. subtasks in Job, every sub-Job comprises multi-disc Wafer i.e. wafer.
In whole Job, i.e. load the groove i.e. order of Slot in the container of wafer according to Foup, if
Several Wafer with identical Wafer flow, are then defined as a sub-Job.
In the present embodiment, when editing Job, sub-Job1 is compiled as Slot (m1)-Slot (m2) and uses
PMxCarrying out technique, sub-Job2 is compiled as Slot (n1)-Slot (n2) and uses PMyCarry out technique.Son
Job1 is the posterior sub-Job that sorts for sequence preceding sub-Job, sub-Job2.PMxAnd PMyRefer to respectively
For one or more PM.
Step S203: judge whether each sub-Job has the PM of coincidence；If no, then performing step
S204, if having, then performs step S205.
Step S204: when judged result is the PM that each sub-Job does not have coincidence, Job starts to hold
OK, perform each sub-Job and start respectively to take sheet, utilize different PM to carry out technique simultaneously, until Job
Terminate.
Whole Job starts to perform, and performs sub-Job1 and takes wafer Slot (m1)-Slot corresponding for sub-Job1
(m2) is to PMx, perform sub-Job2 and take wafer Slot (n1)-Slot (n2) corresponding for sub-Job2
To PMy, two sub-Job apply no PM to carry out technique respectively simultaneously.
Step S205: when judged result is the PM that each sub-Job has coincidence, it is judged that each sub-Job pair
Whether the PM answered is completely superposed；If being completely superposed, then perform step S206, if partially overlapping, then
Perform step S207.
Step S206: when judged result be each PM corresponding for sub-Job be completely superposed time, according to Slot
Order is taken out wafer successively and is carried out technique, until Job terminates.
I.e.: first take wafer corresponding to sub-Job1, after the wafer that Job1 is corresponding has processed, take son
The wafer that Job2 is corresponding.
Step S207: when judged result be each PM corresponding for sub-Job partially overlap time, perform son
Job1, obtains wafer Slot (m1)-Slot (m2) application PM successivelyxCarry out technique, perform simultaneously
Sub-Job2, obtains Partial wafer corresponding for sub-Job2 successively to PMy-PMzCarry out technique.Perform afterwards
Step S208.
This step sets PM that sub-Job1 and sub-Job2 overlaps as PMz, PMzRefer to one or more
PM。PMy-PMzFor remaining after the PM that sub-Job2 is corresponding removes the part overlapped with sub-Job1
PM。
Step S208: sub-Job1 terminates to discharge PMz, now by untreated wafer corresponding for sub-Job2
Transmit to PMz, it is continuing with, until Job terminates for sub-Job2.
In the present embodiment, when two PM corresponding for sub-Job partially overlap, perform each sub-Job and divide
Do not start to take sheet, come sub-Job in front and carry out technique with oneself set PM, the son of back
In the Job PM with former setting, remove the PM that taken by the sub-Job in front and carry out technique.In front
Sub-Job terminate after, the PM of sub-for back Job is discharged and is continuing with to the sub-Job of back.
It should be noted that the wafer transmission method that the present invention provides can apply to make on etching machine
With.
The wafer transmission method that the present embodiment provides, according in the Wafer flow that each Wafer is selected be
No have parallel process module to determine whether Job takes sheet according to Wafer order in slot after starting successively
And technique.When running into shared by the Wafer flow of wafer 1,2,3 correspondence that background section is previously mentioned
Processing chamber be PM1, the processing chamber shared by Wafer flow of wafer 4,5,6 correspondence is
During the situation of PM2, Wafer1 in PM1 while technique, Wafer4 can in PM2 technique.
The like, Wafer2 and Wafer5, Wafer3 and Wafer6 are carried out the most simultaneously, PM1 and
PM2 can work asynchronously, and does not interfere with each other.During total technique when a length of PM1 technique duration and PM2 technique
Bigger in length one, so that the total time needed for Job also can reduce accordingly, substantially increases
The treatment effeciency of Job.
With an instantiation, the wafer transmission method in the present embodiment is illustrated below.
In this instantiation, it is assumed that when editing Job, the wafer 1 to 5 will deposited in slot1 to 5
Technique be divided into three sub-Job.Specifically, wafer corresponding for sub-Job1 is wafer 1,3 and 5, its
Corresponding PM is PM1 and PM3；Wafer corresponding for sub-Job2 is wafer 2, and the PM of its correspondence is
PM2；Wafer corresponding for sub-Job3 is wafer 4, and the PM of its correspondence is PM1 and PM2.
After each subtask is carried out editor's division, perform each according to the use states in parallel of current each PM
During sub-Job, owing to sub-Job1 and sub-Job2 does not exist the PM overlapped, therefore, upon execution, incite somebody to action
Sub-Job1 and sub-Job2 executed in parallel.Wafer 1 is transmitted to PM1 or PM3 and carry out technique, by crystalline substance
Sheet 3 transmits and carries out technique to another PM not taken by wafer 1, transmits wafer 2 to PM2 simultaneously
Carry out technique.And sub-Job1 and sub-Job3 has the PM partially overlapped, sub-Job3 and also has with sub-Job2
Having the PM partially overlapped, therefore, sub-Job3 is upon execution, although can with sub-Job1, Job2 also
Row performs, but, owing to the wafer 1 or 3 in sub-Job1 occupies PM1, the wafer in sub-Job2
2 occupy PM2, accordingly, it would be desirable to when PM2 or the PM1 free time, could be by crystalline substance corresponding for sub-Job3
Sheet 4 transmission carries out technique to idle PM2 or PM1.
Embodiment four
With reference to Fig. 5, it is shown that the structured flowchart of a kind of wafer transmission set of the embodiment of the present invention four.
The wafer transmission set of the present embodiment is arranged on the semiconductor equipment with multiple PM, and wafer passes
Defeated device includes: subtask editor module 201, for will have the wafer in identical traffic path or be divided into
One subtask, subtask arranges according to the order of film trap；Perform module 202, for according to current each
The use states in parallel of individual processing chamber performs each subtask.
Preferably, perform module 202 and include following submodule: judge submodule 2021, if for each
There is the processing chamber of coincidence subtask, it is judged that whether processing chamber is completely superposed, the most then call first
Implementation sub-module；If otherwise calling the second implementation sub-module；First implementation sub-module 2022, for according to
The order of film trap takes wafer successively and carries out technique；Second implementation sub-module 2023, for dividing each subtask
Not starting to take sheet, by sorting, the preceding subtask processing chamber of former setting carries out technique, sorts
After the subtask processing chamber with former setting in remove and be sorted the technique that preceding subtask takies
Chamber carries out technique.
Preferably, perform module 202 and also include: the 3rd implementation sub-module 2024, if appointing for each height
Business does not have the processing chamber of coincidence, and each subtask takes wafer respectively, and each subtask is each with correspondence
Processing chamber carry out technique.
Preferably, the second implementation sub-module 2023, after preceding subtask of sorting is terminated, if sequence exists
After subtask do not terminate, then by preceding subtask and the work that overlaps of the posterior subtask of sequence of sorting
Skill chamber discharges and is continuing with to posterior subtask of sorting.
The wafer transmission set provided by the present embodiment, by the container loading wafer in whole task
Technological process corresponding to multiple multiple wafers with identical wafer transmission path be defined as a son
Task, meanwhile, also can determine whether the sequence of each subtask.Next, it is determined whether there is corresponding identical work
The subtask of skill chamber, if not comprising, the most each subtask starts to take sheet respectively, utilizes different technique
Chamber carries out technique.The wafer transmission set provided by the present embodiment, each technique of semiconductor equipment
Chamber can therefore, it can effectively shorten the process time of Job, improve Job's with executed in parallel technique
Treatment effeciency.
Embodiment five
With reference to Fig. 6, it is shown that the structured flowchart of a kind of wafer transmission set of the embodiment of the present invention five.
The wafer transmission set of the present embodiment is arranged on the semiconductor equipment with multiple PM, specifically wraps
Include: receiver module 301, for receiving technologist, the wafer of each wafer of pending technological operation is passed
(i.e. wafer flow) is configured in defeated path；Definition module 302, is used for defining subtask；Determine
Module 303, for determining the sequence of each subtask, and transmits path according to the wafer that each subtask is corresponding
Determine the PM that each subtask is corresponding respectively, wherein, multiple in brilliant former feeder and have identical
The technological process that multiple wafers in wafer transmission path are corresponding is a subtask, each wafer transmission road
At least corresponding PM in footpath；First judge module 304, for for each subtask, judges to work as respectively
Whether front subtask uses, with preceding subtask of sorting, the PM overlapped；If using the PM of coincidence, then
Using current subtask as first kind subtask；If not using the PM of coincidence, then current son is appointed
Business is as Second Type subtask；First performs module 305, if sentencing for the first judge module 304
Disconnected result is all Second Types subtask, each subtask, and the most each subtask starts to take sheet respectively, with
PM different for Shi Liyong carries out technique.
Preferably, the corresponding multiple PM in each wafer transmission path, the wafer transmission set of the present embodiment is also
Including: the second judge module 306, is each subtask for the judged result at the first judge module 304
In when comprising first kind subtask, it is judged that whether the PM that each first kind subtask is used is completely superposed.
Second performs module 307, if the judged result for the second judge module 306 is that each first kind is appointed
The PM that business is used is completely superposed, then the PM used to each subtask successively according to the sequence of each subtask
Middle foundation first sets the wafer that each subtask of regular transmission is corresponding；3rd performs module 308, if for
The judged result of the second judge module 306 is that the PM that each first kind subtask is used partially overlaps, then
In the PM that each subtask is corresponding, regular transmission is set according to second successively each according to the sequence of each subtask
The wafer that subtask is corresponding.
Preferably, the second execution module 307 is corresponding to each subtask successively according to the sequence of each subtask
Time in PM according to the wafer that the first setting each subtask of regular transmission is corresponding: according to the sequence of each subtask
The wafer that each subtask is corresponding is transmitted successively, in wafer transmitting procedure in the PM that each subtask is corresponding
In, if the corresponding PM of current subtask has been sorted preceding and described current subtask to having
The subtask of identical PM takies, then wouldn't process current subtask；Before judging
PM corresponding to subtask is the most idle, by untreated wafer transmission corresponding for current subtask to idle
PM.
Preferably, the 3rd execution module 308 is corresponding to each subtask successively according to the sequence of each subtask
Time in PM according to the wafer that the second setting each subtask of regular transmission is corresponding: according to the sequence of each subtask
The wafer that each subtask is corresponding is transmitted successively, in wafer transmitting procedure in the PM that each subtask is corresponding
In, if the PM part that currently subtask is corresponding has been sorted preceding and current subtask to there being portion
The subtask of the PM that split-phase is same takies, then by wafer transmission corresponding for posterior subtask of sorting to sequence
Posterior subtask is corresponding, in other PM in addition to identical PM；When judging current subtask pair
The identical PM answered is the most idle, and by current subtask, wafer corresponding, not processed transmission is to empty
Not busy PM.
The wafer transmission set of the present embodiment is used for realizing previous embodiment one, embodiment two and embodiment
Corresponding wafer transmission method in three, and there is the beneficial effect of corresponding embodiment of the method, at this
Repeat no more.
Each embodiment in this specification all uses the mode gone forward one by one to describe, and each embodiment emphasis is said
Bright is all the difference with other embodiments, and between each embodiment, identical similar part is mutual
See.For system embodiment, due to itself and embodiment of the method basic simlarity, so retouching
That states is fairly simple, and relevant part sees the part of embodiment of the method and illustrates.
Above to a kind of wafer transmission method provided by the present invention and device, it is described in detail,
Principle and the embodiment of the present invention are set forth by specific case used herein, above enforcement
The explanation of example is only intended to help to understand method and the core concept thereof of the present invention；Simultaneously for ability
The those skilled in the art in territory, according to the thought of the present invention, the most all
Will change, in sum, this specification content should not be construed as limitation of the present invention.
Claims (8)
1. a wafer transmission method, it is characterised in that include step:
S10, the wafer with identical traffic path is divided into a subtask, described subtask according to
The order arrangement of film trap；
The use states in parallel of S20, basis each processing chamber current performs each subtask.
Wafer transmission method the most according to claim 1, it is characterised in that if each subtask
There is a processing chamber of coincidence, described step S20, including:
S201, judge whether processing chamber is completely superposed, the most then perform step S202；Otherwise hold
Row step S203；
S202, take wafer successively according to the order of film trap and carry out technique；
S203, each subtask start to take sheet respectively, and sort the preceding subtask process cavity with former setting
Room carries out technique, removes before being ordered in the posterior subtask processing chamber with former setting that sorts
The processing chamber that takies of subtask carry out technique.
Wafer transmission method the most according to claim 1, it is characterised in that if each subtask
Not there is the processing chamber of coincidence, described step S20, including:
Each described subtask is taken wafer respectively, and each subtask is carried out each with corresponding processing chamber
Technique.
Wafer transmission method the most according to claim 2, it is characterised in that in step S203
In,
Sort after preceding subtask terminates, if posterior subtask of sorting is not terminated, then sequence is existed
The processing chamber that front subtask overlaps with posterior subtask of sorting discharges appoints to the posterior son that sorts
Business is continuing with.
5. a wafer transmission set, it is characterised in that including:
Subtask editor module, for dividing a subtask, institute by the wafer with identical traffic path
State subtask to arrange according to the order of film trap；
Perform module, appoint for performing each height according to the use states in parallel of each processing chamber current
Business.
Wafer transmission set the most according to claim 5, it is characterised in that described execution module,
Including:
Judge submodule, if there is the processing chamber of coincidence for each subtask, it is judged that processing chamber whether
It is completely superposed, the most then calls the first implementation sub-module；Otherwise call the second implementation sub-module；
Described first implementation sub-module, carries out technique for taking wafer successively according to the order of film trap；
Described second implementation sub-module, for starting respectively to take sheet to each subtask, will sort preceding son
The task processing chamber of former setting carries out technique, and sort the posterior subtask process cavity with former setting
Room removes and has been sorted the processing chamber that preceding subtask takies and carries out technique.
Wafer transmission set the most according to claim 5, it is characterised in that described execution module,
Also include:
3rd performs module, if not having the processing chamber of coincidence for each subtask, by each described son
Task takes wafer respectively, and each subtask carries out technique each with corresponding processing chamber.
Wafer transmission set the most according to claim 5, it is characterised in that described second performs
Submodule, after preceding subtask of sorting is terminated, if posterior subtask of sorting is not terminated, then will row
The processing chamber that the preceding subtask of sequence overlaps with posterior subtask of sorting discharges to sequence posterior
Subtask is continuing with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510354973.XA CN106298604A (en) | 2015-06-24 | 2015-06-24 | A kind of wafer transmission method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510354973.XA CN106298604A (en) | 2015-06-24 | 2015-06-24 | A kind of wafer transmission method and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106298604A true CN106298604A (en) | 2017-01-04 |
Family
ID=57650302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510354973.XA Pending CN106298604A (en) | 2015-06-24 | 2015-06-24 | A kind of wafer transmission method and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106298604A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113073312A (en) * | 2021-03-25 | 2021-07-06 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment |
| US11495602B1 (en) | 2021-08-12 | 2022-11-08 | Changxin Memory Technologies, Inc. | Method and device for determining fabrication chamber |
| WO2023015582A1 (en) * | 2021-08-12 | 2023-02-16 | 长鑫存储技术有限公司 | Method and apparatus for determining preparation chamber |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050221596A1 (en) * | 2004-04-06 | 2005-10-06 | James You | Job queue management system and method thereof |
| CN101179043A (en) * | 2006-11-10 | 2008-05-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Scheduling method in silicon chip working process |
| CN101459098A (en) * | 2007-12-14 | 2009-06-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method and device for wafer optimized scheduling |
| CN101751025A (en) * | 2008-12-12 | 2010-06-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Silicon slice optimal scheduling method and device |
| CN101872191A (en) * | 2010-05-20 | 2010-10-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Process task scheduling method and device for production line equipment |
| US20130011939A1 (en) * | 2011-07-06 | 2013-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Techniques Providing Semiconductor Wafer Grouping In A Feed Forward Process |
| CN103972129A (en) * | 2013-02-05 | 2014-08-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Process control method, process control system and semiconductor equipment |
-
2015
- 2015-06-24 CN CN201510354973.XA patent/CN106298604A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050221596A1 (en) * | 2004-04-06 | 2005-10-06 | James You | Job queue management system and method thereof |
| CN101179043A (en) * | 2006-11-10 | 2008-05-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Scheduling method in silicon chip working process |
| CN101459098A (en) * | 2007-12-14 | 2009-06-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method and device for wafer optimized scheduling |
| CN101751025A (en) * | 2008-12-12 | 2010-06-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Silicon slice optimal scheduling method and device |
| CN101872191A (en) * | 2010-05-20 | 2010-10-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Process task scheduling method and device for production line equipment |
| US20130011939A1 (en) * | 2011-07-06 | 2013-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Techniques Providing Semiconductor Wafer Grouping In A Feed Forward Process |
| CN103972129A (en) * | 2013-02-05 | 2014-08-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Process control method, process control system and semiconductor equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113073312A (en) * | 2021-03-25 | 2021-07-06 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment |
| US11495602B1 (en) | 2021-08-12 | 2022-11-08 | Changxin Memory Technologies, Inc. | Method and device for determining fabrication chamber |
| WO2023015582A1 (en) * | 2021-08-12 | 2023-02-16 | 长鑫存储技术有限公司 | Method and apparatus for determining preparation chamber |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102044039B1 (en) | Systems and methods for dynamic semiconductor process scheduling | |
| KR100978974B1 (en) | Software sequencer for integrated substrate processing system | |
| KR101449782B1 (en) | Substrate processing apparatus, substrate processing method, and storage medium | |
| EP0679972A1 (en) | An apparatus and method for controlling and scheduling processing machines | |
| CN106298604A (en) | A kind of wafer transmission method and device | |
| JP2008192866A (en) | Substrate processing device | |
| JP2009200475A (en) | Method of determining mounting condition | |
| US10001773B2 (en) | Optimal one-wafer scheduling of single-arm multi-cluster tools with tree-like topology | |
| JPH0950948A (en) | System coping with failure of semiconductor manufacturing apparatus | |
| Zhu et al. | Scheduling single-arm multi-cluster tools with lower bound cycle time via Petri nets | |
| Lee et al. | Cleaning plan optimization for dual-armed cluster tools with general chamber cleaning periods | |
| WO2019246588A1 (en) | Using graphics processing unit for substrate routing and throughput modeling | |
| CN109976883A (en) | A kind of processing method and its system of task | |
| Shikalgar et al. | 300 mm wafer fabrication line simulation model | |
| CN115794506B (en) | Wafer scheduling method and electronic equipment | |
| CN112670217B (en) | Chip manufacturing flow prediction method and chip manufacturing flow prediction device | |
| JP2010251507A (en) | System and method for control of semiconductor manufacturing apparatus | |
| Chung et al. | The integrated room layout for a semiconductor facility plan | |
| Kim et al. | Cyclic scheduling of sequentially connected cluster tools with a single I/O module | |
| US9411235B2 (en) | Coating and developing apparatus, method of operating the same and storage medium | |
| Wu et al. | Modeling, analysis, scheduling, and control of cluster tools in semiconductor fabrication | |
| Jung et al. | Efficient scheduling method based on an assignment model for robotized cluster tools | |
| Tajan et al. | Control of a single batch processor with incompatible job families and future job arrivals | |
| JP2007059764A (en) | Substrate processing apparatus | |
| JP2003173204A (en) | Allocating method for processor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Beijing, Wenchang Road, No. 8, No. Applicant before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |