CN106290395A - A kind of wafer detecting apparatus based on image procossing and method - Google Patents
A kind of wafer detecting apparatus based on image procossing and method Download PDFInfo
- Publication number
- CN106290395A CN106290395A CN201610893962.3A CN201610893962A CN106290395A CN 106290395 A CN106290395 A CN 106290395A CN 201610893962 A CN201610893962 A CN 201610893962A CN 106290395 A CN106290395 A CN 106290395A
- Authority
- CN
- China
- Prior art keywords
- micro
- wafer
- camera
- cylinder mirror
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 20
- 238000013519 translation Methods 0.000 claims description 7
- 229910052724 xenon Inorganic materials 0.000 claims description 7
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 5
- 238000001228 spectrum Methods 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000010408 sweeping Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 210000001367 artery Anatomy 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 210000003462 vein Anatomy 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 235000008429 bread Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000007499 fusion processing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000026676 system process Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/068—Optics, miscellaneous
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The present invention relates to a kind of wafer detecting apparatus based on image procossing, including computer, fixing device, camera, the micro-cylinder mirror being arranged on camera, light source, three-dimensional platform, Motor controlling machine case and the microcobjective arranged bottom micro-cylinder mirror, camera is positioned at the top of micro-cylinder mirror, and camera and micro-cylinder mirror are connected and fixed in fixing device and are positioned at the side of fixing device, light source is positioned at the side of micro-cylinder mirror and accesses micro-cylinder mirror, and light source is connected with camera, three-dimensional platform is positioned at the downside of micro-cylinder mirror, and microcobjective is the most right with the object stage of three-dimensional platform, camera is connected with computer, Motor controlling machine case is connected with three-dimensional platform and computer respectively.It is simple that the present invention has system, maneuverable advantage, has, compared to general image mosaic technology, the advantage that splicing precision is high.
Description
Technical field
The present invention relates to field of semiconductor processing and manufacturing, be specifically related to a kind of wafer detecting apparatus based on image procossing and
Method.
Background technology
Currently advanced integrated circuit fabrication process is general the most all by the manufacturing procedure of steps up to a hundred, any of which link small
Mistake all will cause whole chip wafer to lose efficacy, and especially with the development of science and technology, the critical size of circuit is constantly reducing,
So the control adding technique in man-hour is required increasingly stricter, so in the production process of wafer in order to enable to find in technique in time
Upper defective chip wafer also processes.
The wafer detection of image processing techniques, its operation principle is the movement by three-dimensional platform and the bat of COMS camera
Taking the photograph, obtain each image of whole wafer image, these images are processed by the method then carrying out image procossing,
After obtain a complete wafer image.So, image acquisition is more, complex steps, operation complexity, cost of idleness.
Summary of the invention
It is an object of the invention to for above-mentioned present situation, it is provided that a kind of laboratory operation easily, low cost and resolution high
Wafer detecting apparatus based on image procossing and method.
The technical solution used in the present invention: a kind of wafer detecting apparatus based on image procossing, including computer, fixing dress
Put, camera, the micro-cylinder mirror being arranged on described camera, light source, three-dimensional platform, Motor controlling machine case and arrange described aobvious
Microcobjective bottom micro-mirror, described camera is positioned at the top of described micro-cylinder mirror, and described camera and micro-cylinder mirror connect
And it being fixed in described fixing device and is positioned at the side of described fixing device, described light source is positioned at the side of described micro-cylinder mirror
And access described micro-cylinder mirror, and described light source is connected with described camera, described three-dimensional platform is positioned at described micro-cylinder mirror
Downside, and described microcobjective is the most right with the object stage of described three-dimensional platform, described camera is connected with described computer, described
Motor controlling machine case is connected with described three-dimensional platform and computer respectively.
The effect of the present invention is: have system simple, maneuverable advantage, compared to general image mosaic technology tool
There is the advantage that splicing precision is high.
Further, described light source is flicker xenon lamp, and this flicker xenon lamp is by intelligent acess to described micro-cylinder mirror.
Further, described light source is connected by firing line and described camera.
Further, described micro-cylinder mirror has three interfaces, the interface of the most described camera, imports for described light source
Guide-lighting interface and the interface of described microcobjective.
Further, the focussing distance of described micro-cylinder mirror is 1-7 times.
Further, described fixing device is portal frame.
Further, described camera is COMS camera.
The technical solution used in the present invention: the micro-imaging of the wafer detection of a kind of wafer detecting apparatus and image procossing
Method, comprises the following steps:
S1, is placed on wafer sample to be measured on the object stage of described three-dimensional platform, makes described microcobjective to sweep
Retouch whole described wafer sample；
S2, obtains the picture that described wafer sample becomes on described camera on described computer, focuses image,
To clearly wafer image；
S3, mobile described wafer sample to coordinate (0,0), is opened described light source, is controlled by described computer described
Three-dimensional platform moves in X-direction, and the most described computer accepts the image that described camera photographs；
S4, X-axis surface sweeping completes, and controls described three-dimensional platform by described computer and moves a ken in Y direction, so
Rear continuation is moved the most described computer in X-direction and is accepted the image that described camera photographs, by that analogy, until wafer is swept
Retouch；
S5, the wafer image utilizing step and step to obtain, utilize the crosspower spectrum of adjacent two width wafer image to obtain arteries and veins
Rush function, obtain translation parameters further.
The effect of the present invention is: have system simple, maneuverable advantage, compared to general image mosaic technology tool
There is the advantage that splicing precision is high.
Accompanying drawing explanation
Fig. 1 show the structural representation of the wafer detecting apparatus based on image procossing that one embodiment of the invention provides.
Fig. 2 is two width figures adjacent in wafer in the method for the embodiment of the present invention.
Fig. 3 be the embodiment of the present invention method in two width figures process after design sketch.
In accompanying drawing, the list of parts representated by each label is as follows:
1, computer, 2, fixing device, 3, camera, 4, micro-cylinder mirror, 5, light source, 6, three-dimensional platform, 7, Motor controlling machine
Case, 8, microcobjective.
Detailed description of the invention
Being described principle and the feature of the present invention below in conjunction with accompanying drawing, example is served only for explaining the present invention, and
Non-for limiting the scope of the present invention.
Referring to Fig. 1, the wafer detecting apparatus based on image procossing provided for the present invention includes computer 1, consolidates
Determine device 2, camera 3, the micro-cylinder mirror 4 being arranged on camera 3, light source 5, three-dimensional platform 6, Motor controlling machine case 7 and arrange
Microcobjective 8 bottom micro-cylinder mirror 4.
Computer 1 can be notebook computer, it is possible to for desktop computer.
Fixing device 2 is portal frame, and centre bread board links.
Camera 3 and micro-cylinder mirror 4 are connected and fixed in fixing device 2, and camera 3 and micro-cylinder mirror 4 are positioned at fixing dress
Put the side of the bread board of 2.Camera 3 is positioned at the top of micro-cylinder mirror 4.In the present embodiment, camera 3 is COMS camera, and with
Computer 1 is connected.Micro-cylinder mirror 4 have three interfaces, respectively camera 3 interface, for light source 5 import guide-lighting interface with
And the interface of microcobjective 8.Micro-cylinder mirror 4 can regulate amplification, and amplification is between 1X to 7X.
Light source 5 is positioned at the side of micro-cylinder mirror 4 and corresponding with the guide-lighting interface on micro-cylinder mirror 4.In the present embodiment,
Light source 5 is flicker xenon lamp, and this flicker xenon lamp is by intelligent acess to micro-cylinder mirror 4, and light source 5 passes through firing line and camera 3
Connect, during flicker, send shutter signal to camera 3, control camera 3 synchronous photo taking.
Three-dimensional platform 6 is positioned at camera 3, the downside of micro-cylinder mirror 4, and three-dimensional platform 6 and has an object stage.
Motor controlling machine case 7 is connected with three-dimensional platform 6 and computer 1 respectively.
Microcobjective 8 is positioned at the bottom of micro-cylinder mirror 4, and corresponding with the object stage of three-dimensional platform 6.
Please refer to Fig. 2 and Fig. 3, when being embodied as, wafer sample to be measured is positioned over the object stage of three-dimensional platform 6
On, focused by the Z axis of three-dimensional platform 6, open light source 5 and the wafer sample on object stage is illuminated, by calculating
Machine 1 controls Motor controlling machine case 7 makes three-dimensional platform 6 move along X-axis and Y direction, and meanwhile, camera 3 carries out adopting of image
Collection, the direction that wherein movement of three-dimensional platform 6 has identical lap according to every width wafer image moves, camera 3 institute
The wafer image input computer 1 with lap gathered processes, thus obtains the wafer spliced map that a width is complete
Picture.
The micro-imaging of the wafer detection of present invention wafer detecting apparatus based on image procossing and the method for image procossing,
Step is as follows:
S1, is placed on wafer sample to be measured on the object stage of three-dimensional platform 6, makes microcobjective 8 to scan whole
Wafer sample；
S2, obtains the picture that this wafer sample becomes on camera 3 on computer 1, focuses image, obtain clearly
Wafer image；
S3, this wafer sample mobile, to coordinate (0,0), is opened light source 5, is controlled three-dimensional platform 6 at X by computer 1
Direction of principal axis moves, and simultaneous computer 1 accepts the image that camera 3 photographs；
S4, X-axis surface sweeping completes, and controls three-dimensional platform 6 by computer 1 and moves a ken in Y direction, then proceedes to
Move simultaneous computer 1 in X-direction and accept the image that camera 3 photographs, by that analogy, until wafer-scanning completes；
S5, the wafer image utilizing step S3 and S4 to obtain, utilize the crosspower spectrum of adjacent two width wafer image to obtain arteries and veins
Rush function, obtain translation parameters further.
In step s 5, adjacent two width wafer image are respectively f1 (x, y) (x, y), wherein (x y) are figure to image f2 with f2
As f1 (x, y) image obtained after translation (x0, y0): (x, y)=f1 (x-x0, y-y0), by Fourier's time shifting property pair for f2
The relation answering F1 and F2 that Fourier transformation obtains is as follows: and F2 (u, v)=exp (-j*2*pi (ux0+vy0)) * F1 (u, v), right
The frequency translation crosspower spectrum answered:
In formula, (u v) is F2 (u, complex conjugate v) to F1*；The Fourier inversion of e-j (ux0+vy0) is a two-dimentional arteries and veins
Rush function
δ(x-x0,y-y0).Then carry out Fourier inversion, find peak to determine translation parameters x0, y0.
The present invention is that the wafer image utilizing image procossing to obtain microscopic system processes, first with microscopic system
Light source and COMS camera obtain the single image of wafer, then utilize the frequency translation crosspower spectrum that adjacent 2 width figures are corresponding, pass through
Fourier inversion is a Two-dimensional Pulsed function, extracts the peak value of Two-dimensional Pulsed function and then carries out image mosaic and fusion
Process, finally obtain the wafer figure that a width is complete.Therefore, the invention provides the device of a kind of new wafer detection, the method
Based on image processing techniques, overcome the feature that characteristic point between wafer is few, it is thus achieved that the complete image spliced.
Composite geophysical methods and the light source used, the firing line between flicker xenon lamp and COMS connects, can be more same
Walking and be readily obtained the image of wafer, the integration of micro-cylinder mirror is operation and assembles convenient, and system uses
More stable.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all spirit in the present invention and
Within principle, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (8)
1. a wafer detecting apparatus based on image procossing, it is characterised in that: include computer (1), fixing device (2), phase
Machine (3), the micro-cylinder mirror (4) being arranged on described camera (3), light source (5), three-dimensional platform (6), Motor controlling machine case (7) with
And the microcobjective (8) arranged bottom described micro-cylinder mirror (4), described camera (3) is positioned at the top of described micro-cylinder mirror (4)
Hold, and described camera (3) and micro-cylinder mirror (4) are connected and fixed to described fixing device (2) and above and are positioned at described fixing device
(2) side, described light source (5) is positioned at the side of described micro-cylinder mirror (4) and accesses described micro-cylinder mirror (4), and described light
Source (5) is connected with described camera (3), and described three-dimensional platform (6) is positioned at the downside of described micro-cylinder mirror (4), and described micro-
Object lens (8) are the most right with the object stage of described three-dimensional platform (6), and described camera (3) is connected with described computer (1), described electricity
Machine controls cabinet (7) and is connected with described three-dimensional platform (6) and computer (1) respectively.
2. wafer detecting apparatus based on image procossing as claimed in claim 1, it is characterised in that: described light source (5) is for dodging
Bright xenon lamp, this flicker xenon lamp is by intelligent acess to described micro-cylinder mirror (4).
3. wafer detecting apparatus based on image procossing as claimed in claim 2, it is characterised in that: described light source (5) passes through
Firing line and described camera (3) connect.
4. wafer detecting apparatus based on image procossing as claimed in claim 1, it is characterised in that: described micro-cylinder mirror (4)
There are three interfaces, the interface of the most described camera (3), the guide-lighting interface imported for described light source (5) and described micro-
The interface of object lens (8).
5. wafer detecting apparatus based on image procossing as claimed in claim 1, it is characterised in that: described micro-cylinder mirror (4)
Focussing distance be 1-7 times.
6. wafer detecting apparatus based on image procossing as claimed in claim 1, it is characterised in that: described fixing device (2)
For portal frame.
7. wafer detecting apparatus based on image procossing as claimed in claim 1, it is characterised in that: described camera (3) is
COMS camera.
8. wafer based on the wafer detecting apparatus based on image procossing described in any one of a claim 1-7 detection is aobvious
Micro-imaging and the method for image procossing, it is characterised in that comprise the following steps:
S1, is placed on wafer sample to be measured on the object stage of described three-dimensional platform (6), makes described microcobjective (8) permissible
Scan whole described wafer sample；
S2, obtains the picture that described wafer sample becomes on described camera (3) on described computer (1), focuses image,
Obtain clearly wafer image；
S3, mobile described wafer sample, to coordinate (0,0), is opened described light source (5), is controlled institute by described computer (1)
Stating three-dimensional platform (6) to move in X-direction, the most described computer (1) accepts the image that described camera (3) photographs；
S4, X-axis surface sweeping completes, and controls described three-dimensional platform (6) by described computer (1) and moves a ken in Y direction,
Then proceed to move the most described computer (1) in X-direction and accept the image that described camera (3) photographs, by that analogy, directly
Complete to wafer-scanning；
S5, the wafer image utilizing step 3 and step 4 to obtain, utilize the crosspower spectrum of adjacent two width wafer image to obtain pulse
Function, obtains translation parameters further.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610893962.3A CN106290395A (en) | 2016-10-12 | 2016-10-12 | A kind of wafer detecting apparatus based on image procossing and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610893962.3A CN106290395A (en) | 2016-10-12 | 2016-10-12 | A kind of wafer detecting apparatus based on image procossing and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106290395A true CN106290395A (en) | 2017-01-04 |
Family
ID=57717642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610893962.3A Pending CN106290395A (en) | 2016-10-12 | 2016-10-12 | A kind of wafer detecting apparatus based on image procossing and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106290395A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108760766A (en) * | 2018-05-25 | 2018-11-06 | 哈尔滨工业大学 | A kind of image split-joint method of large-aperture optical plane of crystal microdefect detection |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427502A (en) * | 2011-10-01 | 2012-04-25 | 麦克奥迪实业集团有限公司 | Scanning method and device for microscopic section |
| US20130027543A1 (en) * | 2011-06-24 | 2013-01-31 | Kla-Tencor Corporation | Method and apparatus for inspection of light emitting semiconductor devices using photoluminescence imaging |
| CN104634792A (en) * | 2013-11-07 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | PSS yield online monitoring system and detection method thereof |
| CN206095984U (en) * | 2016-10-12 | 2017-04-12 | 湖北器长光电股份有限公司 | Wafer detecting device based on image processing |
-
2016
- 2016-10-12 CN CN201610893962.3A patent/CN106290395A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130027543A1 (en) * | 2011-06-24 | 2013-01-31 | Kla-Tencor Corporation | Method and apparatus for inspection of light emitting semiconductor devices using photoluminescence imaging |
| CN103765567A (en) * | 2011-06-24 | 2014-04-30 | 科磊股份有限公司 | Method and apparatus for inspection of light emitting semiconductor devices using photoluminescence imaging |
| CN102427502A (en) * | 2011-10-01 | 2012-04-25 | 麦克奥迪实业集团有限公司 | Scanning method and device for microscopic section |
| CN104634792A (en) * | 2013-11-07 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | PSS yield online monitoring system and detection method thereof |
| CN206095984U (en) * | 2016-10-12 | 2017-04-12 | 湖北器长光电股份有限公司 | Wafer detecting device based on image processing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108760766A (en) * | 2018-05-25 | 2018-11-06 | 哈尔滨工业大学 | A kind of image split-joint method of large-aperture optical plane of crystal microdefect detection |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106525865A (en) | Wafer image analysis device and method based on image processing | |
| CN102854615B (en) | Full-automatic scanning system and method for microscopic section | |
| CN104097402B (en) | Laser marking machine and marking method thereof | |
| CN111554601B (en) | Wafer front end transfer system | |
| TWI285045B (en) | Method and apparatus for flat patterned media inspection | |
| CN105136044A (en) | Workpiece height intelligent measuring apparatus and measuring method | |
| CN104713883B (en) | Large area space solar battery array defect quick detection and automatic identifying method | |
| CN202256172U (en) | Micropore detector used for ceramic substrate | |
| CN103398669A (en) | Multi-axis linkage visual inspection method and equipment used for measuring free-form surface | |
| CN104637041A (en) | Wide fabric image acquiring and splicing method based on reference characteristics | |
| CN203069151U (en) | Three-dimensional hole form detection system based on optical coherence tomography scanning | |
| CN109406527A (en) | A kind of miniature video camera module group lens subtle appearance defect detecting system and method | |
| CN111554591A (en) | Semiconductor chip processing apparatus | |
| CN110044921A (en) | Lithium battery open defect detection system and method | |
| CN102621152A (en) | Surface defect detecting system of crystalline silicon polished wafer | |
| CN103247548B (en) | A kind of wafer defect checkout gear and method | |
| CN106018415A (en) | System for detecting quality of small parts based on micro-vision | |
| CN106290395A (en) | A kind of wafer detecting apparatus based on image procossing and method | |
| US20100308205A1 (en) | Method for auto focus searching of optical microscope | |
| CN113031242B (en) | Short-exposure high-speed surface scanning rigid splicing microscopic imaging system and method | |
| CN206095984U (en) | Wafer detecting device based on image processing | |
| CN117555126A (en) | Automatic searching method and device for metaphase chromosome image based on lens-free imaging | |
| CN105321152B (en) | A kind of image split-joint method and system | |
| CN206095985U (en) | Wafer detecting device based on image processing | |
| CN102313524B (en) | Image acquiring device and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170104 |