CN106289536A - A kind of infrared temperature measurement apparatus for optical mirror plane - Google Patents
A kind of infrared temperature measurement apparatus for optical mirror plane Download PDFInfo
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- CN106289536A CN106289536A CN201610948496.4A CN201610948496A CN106289536A CN 106289536 A CN106289536 A CN 106289536A CN 201610948496 A CN201610948496 A CN 201610948496A CN 106289536 A CN106289536 A CN 106289536A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 33
- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 15
- 230000005855 radiation Effects 0.000 claims abstract description 60
- 239000000523 sample Substances 0.000 claims abstract description 29
- 238000005516 engineering process Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 5
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- 238000009738 saturating Methods 0.000 claims description 2
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- 238000013461 design Methods 0.000 description 6
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- 238000005057 refrigeration Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000004313 glare Effects 0.000 description 4
- 238000012634 optical imaging Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
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- 238000003379 elimination reaction Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
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- 206010037660 Pyrexia Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0806—Focusing or collimating elements, e.g. lenses or concave mirrors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J2005/065—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by shielding
Abstract
The invention discloses a kind of infrared temperature measurement apparatus for optical mirror plane, solve existing infrared measurement of temperature instrument and can not accurately measure a difficult problem for the optical mirror plane temperature that infrared band emissivity is low, reflectance is high.This infrared temperature measurement apparatus includes detecting module, poly-radiation lens, gathers radiation case and for connecting detecting module and the case seat of poly-radiation case；Described case seat includes the connecting plate being connected and fixed on detecting module end, is positioned at connecting plate side and the connection seat of connecting plate one；Described poly-radiation case is taper type, and the less one end of its diameter arranges and is connected the ring part that seat connects；Described poly-radiation lens is installed in poly-radiation case；The center of described case seat has the corresponding through hole of probe shape with detecting module, and the probe of detecting module stretches in the through hole connecting seat；The light end of described probe is concordant with the bottom surface being connected base inner surface.The present invention can effectively put forward the precision that mirror temperature is measured.
Description
Technical field
The present invention relates to infrared temperature-test technology field, particularly relate to a kind of infrared temperature measurement apparatus for optical mirror plane.
Background technology
Temperature is one of key factor affecting optical device image quality, and the impact on picture element specifically includes that optical frames
Face forms one layer of turbulent flow in the temperature difference meeting of the fluctuating air up of air, produces minute surface seeing (mirror seeing)；Light
Learn thermal deformation and variations in refractive index that the change of mirror temperature causes, make the corrugated after reflection or transmission deviate from preferable corrugated, produce
Heat causes aberration；The change of other performance parameter of optical element that temperature causes.Study and eliminate temperature to optical imaging apparatus
Impact, the temperature of optical mirror particularly optical mirror plane accurately measures the ring being to lack.Optical mirror plane temperature at present
Measurement method has contact thermography and indirect thermometric two kinds, but both has certain limitation: contact thermography is by arranging at minute surface
Temperature probe obtains temperature.In actual thermal environment, mirror temperature distribution is more complicated, it is necessary to having enough thermometrics to count could be anti-
Reflect Temperature Distribution.Superelevation requirement due to optical frames face mask layer and surface figure accuracy, it is impossible to arrange a lot of temperature probes at minute surface.Between
Connecing thermometric is based on minute surface back contact thermometric, is indirectly reflected mirror temperature by numerical computations.The thermal environment parameter of mirror body is difficult
With actual measurement, including mirror body and the complicated conduction of heat of supporting construction, convection current complicated and changeable and radiation heat transfer etc., cause calculating
Mirror temperature is inaccurate.
Non-contact temperature measuring does not interferes with mirror film layer dough-making powder shape, has obvious advantage compared with contact thermography.Noncontact is surveyed
Temperature technique is of a great variety, mainly includes being applicable to the near-infrared thermometric of high temp objects, color comparison temperature measurement, brightness thermometric and multispectral spoke
Penetrate thermometric etc., laser interference thermometric based on distortion measurement and holographic interference thermometry etc..The optical mirror plane of imaging device
Temperature is in room temperature scope more, be suitable for room temperature object non-contact temperature measuring instrument be in, LONG WAVE INFRARED temperature measuring equipment.Optical mirror plane plates
Having various for improving reflection or the film layer of transmission capacity, the infrared band reflectance of minute surface is high and thermal emissivity is the least, periphery
Environment has strong reflected radiation at minute surface, severe jamming temperature measurement accuracy.Infrared temperature-test technology can be (bright to unrestrained emitter at present
Primary body) carry out accurate thermometric, the infrared measurement of temperature of reflectivity surface contour to optical mirror plane is inaccurate.Tradition medium wave, long wave
Infrared measurement of temperature equipment and temp measuring method are difficult to accurately measure the reason of mirror temperature and are mainly reflected in three below aspect:
1) optical mirror plane self heat radiation is less than the environmental radiation of its reflection.The room temperature minute surface that infrared band reflectance is high, it is certainly
Fever of the body radiation is less than the reflection at minute surface of the surrounding enviroment even Downward atmospheric long-wave radiation.Traditional infrared temperature measuring equipment carries out minute surface thermometric
Time, the infra-red radiation that Infrared Detectors accepts is mainly the environmental radiation and non-specular surface self heat radiation reflected.
2) optical mirror plane thermal emissivity is low, and self heat radiation of room temperature minute surface is weak, self of part ultra-high reflectivity minute surface
The actinometry lower limit that heat radiation is demarcated less than traditional infrared temperature measuring equipment.
3) traditional infrared temperature measuring equipment, can only collect minute surface self heat radiation becoming little angle with minute surface normal, with normal
Minute surface directional heat emissivity in little angle is less, less than its mitre directional heat emissivity.The minute surface that infrared radiation thermometer is collected
Heat radiation only accounts for the total thermal-radiating sub-fraction of minute surface.
In order to improve the precision of infrared measurement of temperature, German National metering institute (PTB) C.Monte, B.Gutschwager,
The S.P.Morozova co-design of J.Hollandt and full Russia optical physics academy (VNIIOFI) one possesses high accuracy
Infrared measurement of temperature and the equipment of emissivity measurement, represent the forward position level of current infrared measurement of temperature.In order to eliminate the anti-of surrounding enviroment
Penetrating radiation interference, equipment key component and light path have all carried out liquid nitrogen cooling, light path and chamber and have been in vacuum environment.This equipment is made
Valency is extremely expensive and can only carry out thermometric to being positioned over the minute surface measuring intracavity, can not be to the minute surface temperature measured under running status
Degree.Vacuum infrared temperature standard equipment (VRTSF) that China National Measuring Science Research Inst. develops, succeeded in developing in 2015.Equipment
Internal employing liquid nitrogen refrigerating and vacuum design, be built-in with Fourier's red-light spectrum instrument (BrukerVERTEX80V).VRTSF represents
The forward position level of domestic infrared radiation measurement, but can only measure and be positioned over its mirror temperature measuring intracavity, be unsatisfactory for running
Minute surface thermometric requirement under state.The low-launch-rates such as optical mirror plane, high reflectance body surface are always treated as traditional infrared and survey
Blind area in temperature field, current open source literature not yet finds precisely survey the mirror temperature of room temperature scope under running status
Quantifier elimination is reported.
Summary of the invention
Instant invention overcomes existing infrared temperature-test technology shortcoming in minute surface thermometric, it is provided that a kind of high-precision for
The infrared temperature measurement apparatus of optical mirror plane.
In order to solve problem during traditional infrared temperature measuring equipment minute surface thermometric, the present invention is to be achieved through the following technical solutions
:
A kind of infrared temperature measurement apparatus for optical mirror plane, including detecting module, poly-radiation lens, gathers radiation case and for even
Connect detecting module and the case seat of poly-radiation case；Described case seat includes the connecting plate being connected and fixed on detecting module end,
It is positioned at connecting plate side and the connection seat of connecting plate one；Described poly-radiation case is taper type, and the less one end of its diameter is arranged
With the ring part being connected seat connection；Described poly-radiation lens is installed in poly-radiation case, the center of described case seat have with
The corresponding through hole of probe shape of detecting module, the probe of detecting module stretches in the through hole connecting seat；The light of described probe
Incidence end is concordant with the bottom surface being connected base inner surface.
Described detecting module is the detecting module of refrigeration mode thermal infrared imager.
Described poly-radiation lens is to have single element lens or the battery of lens of infra-red radiation aggregate capabilities；Described poly-radiation lens
It is mounted in poly-radiation case by lens locating ring and trim ring；Described poly-radiation lens plated surface anti-reflection film.
The material of described poly-radiation case, case seat, lens locating ring and trim ring is to have the metal material of high thermal conductivity coefficient
Matter, poly-radiation case inner surface, the connection bottom surface of base inner surface, lens locating ring and trim ring surface are all coated with infrared band
The film layer that radiant reflectance is high.
Described lens locating ring uses integrated design processing with poly-radiation case.
The gap filling that described trim ring, poly-radiation case are formed with poly-radiation lens three has heat conductive silica gel.
The outer surface of described poly-radiation case and connection seat is provided with temperature control layer based on semiconductor temperature technology.
The present invention does not has the optical imaging lens of traditional infrared temperature measuring equipment, by poly-radiation case reflecting and collecting during measurement
Minute surface radiates, and reflects converging lenses surface radiation by poly-radiation lens.Compared with prior art, present invention have the advantage that
(1) present invention can improve minute surface radiation collection ability.Traditional infrared temperature measuring equipment directly falls in camera lens in collecting visual field
Minute surface radiates, as it is shown in fig. 7, equipment collects the minute surface radiation that subtended angle at field of view center is ψ.In traditional infrared temperature measuring equipment light path
After adding poly-radiation case, by case secondary reflection, the minute surface radiation that former center subtended angle is θ, as shown in Figure 8, θ can be collected
More than ψ, other position minute surface radiation subtended angle of collection also has similar increase.The present invention is on traditional infrared temperature measuring equipment basis
On, replace optical imaging lens by poly-radiation case and poly-radiation lens, as shown in Figure 1.The present invention can collect through poly-radiation shield
The minute surface radiation of the more large angle entering detector is converged in the reflection of shell inner surface and lens refraction.Invention measurement apparatus utilizes lens
Convergence radianting capacity, do not consider the temperature space resolution of tested mirror sections, can be selected for converging good short Jiao of radioactivity saturating
Mirror.Owing to there being poly-radiation case between lens and probe, even if the aberration of poly-radiation lens is very big, through after lens with optical axis in
The minute surface radiation of mitre, also can be reflected entrance detector.The minute surface radiation collection ability of the present invention is much larger than traditional infrared
Temperature measuring equipment.Illustrating, the photo640 movement that F number is 1 that FLIR company of the U.S. produces is a short burnt thermal infrared imager
Movement, for collecting one of the strongest model of testee surface emissivity ability in photo series movement.Calculate display, select poly-
The F number of radiation germainium lens is 0.5, germainium lens is 99% in the transmitance of photo640 service band, poly-radiation case inner surface film
The infrared band reflectance of layer is 95%, the port surface of poly-radiation shield roof end is equal to the distance of probe light end
During photo640 movement minimum focusing distance, the minute surface radiation collection ability of temperature measuring equipment is about 16.1 times of photo640.
(2) present invention has the ability of cancellation element self heat radiation interference of stray light.Hot spoke in device thermometric light path
Penetrating veiling glare to be mainly derived from poly-radiation encloser inner wall, connect the bottom surface of base inner surface, lens locating ring and trim ring, heat radiation is miscellaneous
Astigmatism can be directly incident or be reflected entrance detector and affect minute surface thermometric.For weakening heat radiation veiling glare, poly-radiation case
Inner surface, the connection bottom surface of base inner surface, locating ring and trim ring are coated with the film layer high to infrared band radiant reflectance, film layer
Thermal emissivity is the lowest, and film layer heat radiation is less than original case inner surface, connection base inner surface, locating ring and the warm on trim ring surface
Radiation.Optical mirror plane particularly reflective optic minute surface is coated with the film layer such as gold, silver, aluminum, minute surface thermal emissivity and poly-radiation shield more
The thermal emissivity of institute's film plating layers such as shell is more or less the same, and the heat radiation on institute's film plating layer surface can not be ignored.In order to eliminate film layer self
Heat radiation disturbs, and uses semiconductor temperature technology that the outer surface of poly-radiation case and connection seat is carried out temperature control.Lens locating ring,
Trim ring and poly-radiation case are high thermal conductivity coefficient metal material, and locating ring uses integrated design processing with poly-radiation case.
Trim ring, poly-radiation gap filling between case, poly-radiation lens have heat conductive silica gel, to reduce between trim ring and poly-radiation case
Thermal contact resistance.Poly-radiation case and connect seat by after temperature control, the temperature of case inner surface film layer and locating ring and temperature control value base
This is equal and stablizes constant, and lens trim ring temperature is the most basicly stable, and caloradiance and the spatial distribution of film layer are basicly stable.Plating
After anti-reflection film, germainium lens is in the transmitance of detecting module service band up to more than 99%, and germainium lens self heat radiation level is little, its
Heat radiation fluctuations is the faintest.The heat radiation veiling glare that temperature measuring equipment detector is collected (includes film layer heat radiation and lens
Heat radiation) basicly stable constant, it is a constant, the minute surface radiation of collection then becomes with mirror temperature.One constant, a change
Number, allows temperature measuring equipment of the present invention be provided with the ability eliminating heat radiation interference of stray light.Use following thermometric calibrating method, can
The elimination heat radiation veiling glare impact on minute surface thermometric:
Step 1, the sample mirror calibration of measurement apparatus
The upper surface of cylinder sample mirror and the optical mirror plane treating thermometric be coated with film layer, the thickness of sample mirror less than diameter 1/
50, mirror material is high thermal conductivity metal；Sample mirror post side and bottom surface are provided with height temperature control equipment accurately, are used for controlling sample
Mirror temperature.Temperature control equipment has rational temperature control scope, and temperature control scope covers the range of temperature of optical mirror plane to be measured；
Before the calibration of sample mirror, the temperature control value of the temperature control of the poly-radiation case of measurement apparatus and connection seat is that T_s, T_s are permissible
Freely arranging, for the ease of temperature control, T_s may be configured as the operating ambient temperature average of optical mirror plane to be measured；Gathering of measurement apparatus
The spacing of radiation case and sample mirror minute surface is set to constant space H_s, and on the premise of ensureing touchless minute surface risk, H_s should
The least, e.g., less than the 1/50 of case opening surface diameter；
During the calibration of sample mirror, regulate sample mirror temperature control value with fixing temperature variation T and record the calibration survey that detection device is corresponding
Value；The detector of detection device is infrared focal plane array seeker, and described calibration measured value is that infrared focal plane array is visited
Survey the meansigma methods of device each pixel output valve；Set up based on sample mirror temperature and the calibration data storehouse of calibration measured value, every in data base
Individual sample mirror temperature value T(i) a corresponding calibration measured value Y(i)；
Step 2: measurement apparatus surveys optics of telescope minute surface
Choosing the tested region of optical mirror plane, the poly-radiation case of measurement apparatus is near this mirror sections, and spacing is H_s；Poly-spoke
The temperature penetrating case and connection seat controls as T_s；After poly-radiation case and connection seat constant temperature, measurement apparatus starts to measure minute surface temperature
Degree, obtains measured value；According to measured value and calibration data storehouse, obtain corresponding mirror temperature value T(i)；Measured value is positioned at data
Time between two calibration measured values in storehouse, linear interpolation method is utilized to obtain corresponding temperature value.
(3) this invention removes the environment infra-red radiation reflection interference at minute surface of minute surface periphery.It uses poly-radiation shield
Shell presses close to the thermometric design of minute surface, can effectively shield environment heat radiation.During thermometric, the poly-radiation case of device presses close to measured lens
Face, on the premise of not touching minute surface, gap between the two should be the least, the most poly-radiation shield roof end opening face
The 1/50 of diameter.Overwhelming majority ambient heat radiation is shielded in outside poly-radiation case, and small part environmental radiation is by poly-spoke
Penetrate the gap between case and minute surface and enter poly-radiation case, absorbed by poly-radiation case after multiple reflections.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to
Other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the structural representation of case seat in Fig. 1.
Fig. 3 is the structural representation of detecting module in Fig. 1.
Fig. 4 is the structural representation of poly-radiation case in Fig. 1.
Fig. 5 is the enlarged drawing of part A in Fig. 4.
Fig. 6 is the sectional schematic diagram of poly-radiation case, and the sectional drawing connecting seat is same.
Fig. 7 is the principle schematic that tradition temperature measuring equipment collects minute surface radiation.
Fig. 8 is the principle schematic collecting minute surface radiation after tradition temperature measuring equipment installs poly-radiation case additional.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.Based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under not paying creative work premise
Embodiment, broadly falls into the scope of protection of the invention.
For the infrared temperature measurement apparatus of optical mirror plane shown in Fig. 1-6, including detecting module 1, poly-radiation lens 3, poly-radiation
Case 2 and for connecting detecting module 1 and the case seat 4 of poly-radiation case 2；Described case seat 2 includes being connected and fixed on detection
The connecting plate 5 of module 1 end, is positioned at connecting plate 5 side and the connection seat 6 of connecting plate 5 one；Described poly-radiation case 2 is in cone
Platform shape, the less one end of its diameter arranges and is connected the ring part 8 that seat 6 connects；Described poly-radiation lens 3 is installed on poly-radiation case
In 2, the center of described case seat 4 has the probe 7 corresponding through hole of shape with detecting module 1, and the probe 7 of detecting module 1 is stretched
Enter to connect in the through hole of seat, the light end 11 of described probe 7 concordant with the bottom surface of the inner surface being connected seat (connect seat towards
One end of poly-radiation case is referred to as bottom surface).
The outer wall of described probe is not more than 0.05 with the gap being connected block hole, it is to avoid connect seat 6 through-hole inner surface
Self heat radiation enters in probe 7, disturbs minute surface infrared measurement of temperature.
Described detecting module is the detecting module of refrigeration mode thermal infrared imager.Refrigeration mode infrared radiation thermometer is a kind of maturation
Industrial products, described detecting module 1 refers to deduct in refrigeration mode infrared radiation thermometer the remainder of optical imaging lens, mainly by
Infrared Detectors, control circuit, imaging circuit, reading circuit, refrigeration machine etc. are constituted.
Described poly-radiation lens is to have single element lens or the battery of lens of infra-red radiation aggregate capabilities, by lens locating ring
12 and trim ring 13 be installed in poly-radiation case.
Described lens locating ring and poly-radiation case use integration fabrication design.
The gap filling that described trim ring, poly-radiation case are formed with poly-radiation lens three has heat conductive silica gel.
Described poly-radiation lens plating anti-reflection film is to improve infrared radiation transmissivity.
The wave band of described infra-red radiation is the service band of detecting module 1.
Described poly-radiation case, case seat material and lens support structure are to have the metal material of high thermal conductivity coefficient, poly-
Radiation case inner surface, the connection bottom surface of base inner surface, lens locating ring and trim ring are all coated with infra-red radiation reflectance high
Film layer 10, as gold film, silverskin.
The outer surface of described poly-radiation case and connection seat is provided with temperature control layer 9 based on semiconductor temperature technology.According to
The overall dimensions customization semiconductor temperature layer of poly-radiation case 2 and connection seat 4.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention
Within god and principle, any modification, equivalent substitution and improvement etc. made, should be included within the scope of the present invention.
Claims (5)
1. the infrared temperature measurement apparatus for optical mirror plane, it is characterised in that: include detecting module, poly-radiation lens, poly-spoke
Penetrate case and for connecting detecting module and the case seat of poly-radiation case；Described case seat includes being connected and fixed on detecting module
The connecting plate of end, is positioned at connecting plate side and the connection seat of connecting plate one；Described poly-radiation case is taper type, and it is straight
Less one end, footpath arranges and is connected the ring part that seat connects；Described poly-radiation lens is installed in poly-radiation case；Described case
The center of seat has the corresponding through hole of probe shape with detecting module, and the probe of detecting module stretches in the through hole connecting seat；
The light end of described probe is concordant with the bottom surface being connected base inner surface.
The most according to claim 1 for the infrared temperature measurement apparatus of optical mirror plane, it is characterised in that: described detecting module is system
The detecting module of cold mould thermal infrared imager.
Infrared temperature measurement apparatus for optical mirror plane the most according to claim 1 or claim 2, it is characterised in that: described poly-radiation is saturating
Mirror is single element lens or the battery of lens with infra-red radiation aggregate capabilities；Described poly-radiation lens passes through lens locating ring and trim ring
It is mounted in poly-radiation case；Described poly-radiation lens plated surface anti-reflection film.
The most according to claim 3 for the infrared temperature measurement apparatus of optical mirror plane, it is characterised in that: described poly-radiation case,
The material of case seat, lens locating ring and trim ring is to have the metal material of high thermal conductivity coefficient, poly-radiation case inner surface, company
The bottom surface of joint chair inner surface, lens locating ring and trim ring surface are all coated with the film layer high to infrared band radiant reflectance.
Infrared temperature measurement apparatus for optical mirror plane the most according to claim 1 or claim 2, it is characterised in that: described poly-radiation shield
The outer surface of shell and connection seat is provided with temperature control layer based on semiconductor temperature technology.
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| CN201610948496.4A CN106289536A (en) | 2016-10-26 | 2016-10-26 | A kind of infrared temperature measurement apparatus for optical mirror plane |
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| CN201610948496.4A CN106289536A (en) | 2016-10-26 | 2016-10-26 | A kind of infrared temperature measurement apparatus for optical mirror plane |
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| WO2011137713A1 (en) * | 2010-05-06 | 2011-11-10 | Yuan Guobing | Optical system and focusing structure for infrared thermometer |
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