CN106270961A - A kind of low-frequency test instrument panel assembly welding method - Google Patents
A kind of low-frequency test instrument panel assembly welding method Download PDFInfo
- Publication number
- CN106270961A CN106270961A CN201610793401.6A CN201610793401A CN106270961A CN 106270961 A CN106270961 A CN 106270961A CN 201610793401 A CN201610793401 A CN 201610793401A CN 106270961 A CN106270961 A CN 106270961A
- Authority
- CN
- China
- Prior art keywords
- welding
- panel assembly
- counter plate
- low
- test instrument
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
- B23K9/16—Arc welding or cutting making use of shielding gas
- B23K9/167—Arc welding or cutting making use of shielding gas and of a non-consumable electrode
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/08—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for flash removal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
- B23K9/235—Preliminary treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Butt Welding And Welding Of Specific Article (AREA)
Abstract
The invention provides a kind of low-frequency test instrument panel assembly welding method, comprise the steps: 1. to clean: with gasoline cleaning surface board component, the most naturally dry；2. heat treatment: put into by panel assembly to the baking oven of 350～370 DEG C, is incubated 3 hours, and then stove is cooled to room temperature；3. pickling: carry out pickling with injection acid wash counter plate assembly；4. welding: counter plate assembly welds, welding current 80～90A；5. milling scar: carry out preliminary treatment with the welding cicatrix at the mode counter plate components welding position of Milling Machining；6. file scar is repaiied: carry out fine processing with the welding cicatrix at the mode counter plate components welding position of file processing.The present invention, by improving technique, can effectively eliminate the internal stress that assembly mechanical processing process produces, and eliminates processing hardening, reduce hardness, improve plasticity, thus effectively control welding deformation, reduce weld crack occurrence probability, improve solder yield, reach more than 90%.
Description
Technical field
The present invention relates to a kind of low-frequency test instrument panel assembly welding method.
Background technology
Low-frequency test instrument panel is used for installing low-frequency test instrument, it is ensured that tester is stable, does not affect test operation.Pass through argon
Arc-welding, is attached forming by panel assembly and stud.
But in prior art, for the welding of panel assembly, welding deformation is big, and occurs facial cleft stricture of vagina around weld seam, this
It is exhausted unallowed weld defect, can not remedy, process can only be scrapped, thus cause solder yield low, only about 50%.
Summary of the invention
For solving above-mentioned technical problem, the invention provides a kind of low-frequency test instrument panel assembly welding method, this low frequency
Tester panel assembly welding method, by improving technique, can effectively eliminate the internal stress that assembly mechanical processing process produces, disappear
Except processing hardening, reduce hardness, improve plasticity, thus effectively control welding deformation, reduce weld crack occurrence probability, improve
Solder yield, reaches more than 90%.
The present invention is achieved by the following technical programs.
A kind of low-frequency test instrument panel assembly welding method that the present invention provides, comprises the steps:
1. clean: with gasoline cleaning surface board component, the most naturally dry；
2. heat treatment: put into by panel assembly to the baking oven of 350～370 DEG C, is incubated 3 hours, and then stove is cooled to room temperature；
3. pickling: carry out pickling with injection acid wash counter plate assembly；
4. welding: counter plate assembly welds, welding current 80～90A；
5. milling scar: carry out preliminary treatment with the welding cicatrix at the mode counter plate components welding position of Milling Machining；
6. file scar is repaiied: carry out fine processing with the welding cicatrix at the mode counter plate components welding position of file processing.
Described panel assembly material is aluminium alloy 2A12, T4 state.
Described step 4. in, welding welding wire used uses HS311, and tungsten filament uses WCe-20.
Described step completes in 4. after 3. step completes 24 hours.
The beneficial effects of the present invention is: by improving technique, can effectively eliminate the interior of assembly mechanical processing process generation
Stress, eliminates processing hardening, reduces hardness, improve plasticity, thus effectively control welding deformation, reduces weld crack and occurs several
Rate, improves solder yield, reaches more than 90%.
Detailed description of the invention
Technical scheme is described further below, but claimed scope is not limited to described.
The invention provides a kind of low-frequency test instrument panel assembly welding method, comprise the steps:
1. clean: with gasoline cleaning surface board component, the most naturally dry；
2. heat treatment: put into by panel assembly to the baking oven of 350～370 DEG C, is incubated 3 hours, and then stove is cooled to room temperature；
3. pickling: carry out pickling with injection acid wash counter plate assembly；
4. welding: counter plate assembly welds, welding current 80～90A；
5. milling scar: carry out preliminary treatment with the welding cicatrix at the mode counter plate components welding position of Milling Machining；
6. file scar is repaiied: carry out fine processing with the welding cicatrix at the mode counter plate components welding position of file processing.
Described step 4. in, welding welding wire used uses HS311, and tungsten filament uses WCe-20.
Described step completes in 4. after 3. step completes 24 hours.
Described panel assembly material is aluminium alloy 2A12, T4 state.
Thus, heat treatment can soften panel assembly, eliminates the internal stress that mechanical processing process produces, and eliminates processing hardening,
Reduce hardness, improve plasticity.
Claims (4)
1. a low-frequency test instrument panel assembly welding method, it is characterised in that: comprise the steps:
1. clean: with gasoline cleaning surface board component, the most naturally dry；
2. heat treatment: put into by panel assembly to the baking oven of 350～370 DEG C, is incubated 3 hours, and then stove is cooled to room temperature；
3. pickling: carry out pickling with injection acid wash counter plate assembly；
4. welding: counter plate assembly welds, welding current 80～90A；
5. milling scar: carry out preliminary treatment with the welding cicatrix at the mode counter plate components welding position of Milling Machining；
6. file scar is repaiied: carry out fine processing with the welding cicatrix at the mode counter plate components welding position of file processing.
2. low-frequency test instrument panel assembly welding method as claimed in claim 1, it is characterised in that: described step 4. in, weldering
Connecing welding wire used and use HS311, tungsten filament uses WCe-20.
3. low-frequency test instrument panel assembly welding method as claimed in claim 1, it is characterised in that: described step is 4. in step
3. complete in 24 hours after completing.
4. low-frequency test instrument panel assembly welding method as claimed in claim 1, it is characterised in that: described panel assembly material
For aluminium alloy 2A12, T4 state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610793401.6A CN106270961A (en) | 2016-08-31 | 2016-08-31 | A kind of low-frequency test instrument panel assembly welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610793401.6A CN106270961A (en) | 2016-08-31 | 2016-08-31 | A kind of low-frequency test instrument panel assembly welding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106270961A true CN106270961A (en) | 2017-01-04 |
Family
ID=57673029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610793401.6A Pending CN106270961A (en) | 2016-08-31 | 2016-08-31 | A kind of low-frequency test instrument panel assembly welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106270961A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108000063A (en) * | 2017-11-30 | 2018-05-08 | 贵州航天电子科技有限公司 | A kind of airtight component protecgulum welding method |
| CN114248070A (en) * | 2021-12-07 | 2022-03-29 | 贵州航天电子科技有限公司 | Processing method of tester frame |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3944006B2 (en) * | 2002-06-25 | 2007-07-11 | 三菱重工業株式会社 | How to remove welding distortion |
| CN202060304U (en) * | 2011-05-10 | 2011-12-07 | 苏彬亮 | Ornamental engraving handle |
| CN103447678A (en) * | 2012-06-05 | 2013-12-18 | 东莞市好的照明科技有限公司 | Automatic butt-joint welder for panels of lock sets |
| CN103506742A (en) * | 2013-07-02 | 2014-01-15 | 国家电网公司 | Device and technology for welding aluminum alloy plate |
| CN104741746A (en) * | 2015-03-11 | 2015-07-01 | 南京理工大学 | Aluminum alloy stud welding method to remove oxidation film with vapor state brazing flux |
-
2016
- 2016-08-31 CN CN201610793401.6A patent/CN106270961A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3944006B2 (en) * | 2002-06-25 | 2007-07-11 | 三菱重工業株式会社 | How to remove welding distortion |
| CN202060304U (en) * | 2011-05-10 | 2011-12-07 | 苏彬亮 | Ornamental engraving handle |
| CN103447678A (en) * | 2012-06-05 | 2013-12-18 | 东莞市好的照明科技有限公司 | Automatic butt-joint welder for panels of lock sets |
| CN103506742A (en) * | 2013-07-02 | 2014-01-15 | 国家电网公司 | Device and technology for welding aluminum alloy plate |
| CN104741746A (en) * | 2015-03-11 | 2015-07-01 | 南京理工大学 | Aluminum alloy stud welding method to remove oxidation film with vapor state brazing flux |
Non-Patent Citations (1)
| Title |
|---|
| 刘云龙: "《焊工（技师、高级技师）》", 31 July 2015, 机械工业出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108000063A (en) * | 2017-11-30 | 2018-05-08 | 贵州航天电子科技有限公司 | A kind of airtight component protecgulum welding method |
| CN114248070A (en) * | 2021-12-07 | 2022-03-29 | 贵州航天电子科技有限公司 | Processing method of tester frame |
| CN114248070B (en) * | 2021-12-07 | 2024-04-09 | 贵州航天电子科技有限公司 | Processing method of tester frame |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |