CN106268971A - Many empty formula photocatalyst ceramic wafers - Google Patents
Many empty formula photocatalyst ceramic wafers Download PDFInfo
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- CN106268971A CN106268971A CN201610858867.XA CN201610858867A CN106268971A CN 106268971 A CN106268971 A CN 106268971A CN 201610858867 A CN201610858867 A CN 201610858867A CN 106268971 A CN106268971 A CN 106268971A
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- photocatalyst
- empty formula
- many empty
- ceramic wafers
- wafers
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- 239000000919 ceramic Substances 0.000 title claims abstract description 116
- 235000012431 wafers Nutrition 0.000 title claims abstract description 116
- 239000011941 photocatalyst Substances 0.000 title claims abstract description 109
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 69
- 239000000463 material Substances 0.000 claims abstract description 34
- 239000006193 liquid solution Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 238000002360 preparation method Methods 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims description 41
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 28
- 239000010936 titanium Substances 0.000 claims description 28
- 229910052719 titanium Inorganic materials 0.000 claims description 28
- 239000010408 film Substances 0.000 claims description 25
- 229920003225 polyurethane elastomer Polymers 0.000 claims description 19
- 239000004408 titanium dioxide Substances 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 229910021645 metal ion Inorganic materials 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 150000002739 metals Chemical class 0.000 claims description 7
- 239000002994 raw material Substances 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 7
- HGWOWDFNMKCVLG-UHFFFAOYSA-N [O--].[O--].[Ti+4].[Ti+4] Chemical compound [O--].[O--].[Ti+4].[Ti+4] HGWOWDFNMKCVLG-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- 229910052692 Dysprosium Inorganic materials 0.000 claims description 2
- 229910052691 Erbium Inorganic materials 0.000 claims description 2
- 229910052693 Europium Inorganic materials 0.000 claims description 2
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 2
- 229910052689 Holmium Inorganic materials 0.000 claims description 2
- 229910052779 Neodymium Inorganic materials 0.000 claims description 2
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 2
- 229910052772 Samarium Inorganic materials 0.000 claims description 2
- 229910052771 Terbium Inorganic materials 0.000 claims description 2
- 229910052775 Thulium Inorganic materials 0.000 claims description 2
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 2
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 2
- 229910052789 astatine Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 229910052741 iridium Inorganic materials 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052746 lanthanum Inorganic materials 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000003054 catalyst Substances 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229920006311 Urethane elastomer Polymers 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 2
- 229910052573 porcelain Inorganic materials 0.000 description 8
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 241000790917 Dioxys <bee> Species 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 230000000844 anti-bacterial effect Effects 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000004332 deodorization Methods 0.000 description 2
- 229940079593 drug Drugs 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000796 flavoring agent Substances 0.000 description 2
- 235000019634 flavors Nutrition 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- 239000002594 sorbent Substances 0.000 description 2
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 235000021168 barbecue Nutrition 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002927 oxygen compounds Chemical class 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 239000003053 toxin Substances 0.000 description 1
- 231100000765 toxin Toxicity 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J35/00—Catalysts, in general, characterised by their form or physical properties
- B01J35/50—Catalysts, in general, characterised by their form or physical properties characterised by their shape or configuration
- B01J35/56—Foraminous structures having flow-through passages or channels, e.g. grids or three-dimensional monoliths
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J21/00—Catalysts comprising the elements, oxides, or hydroxides of magnesium, boron, aluminium, carbon, silicon, titanium, zirconium, or hafnium
- B01J21/06—Silicon, titanium, zirconium or hafnium; Oxides or hydroxides thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/10—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of rare earths
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/16—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of arsenic, antimony, bismuth, vanadium, niobium, tantalum, polonium, chromium, molybdenum, tungsten, manganese, technetium or rhenium
- B01J23/32—Manganese, technetium or rhenium
- B01J23/34—Manganese
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
- B01J23/40—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals of the platinum group metals
- B01J23/42—Platinum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
- B01J23/48—Silver or gold
- B01J23/50—Silver
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/70—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the iron group metals or copper
- B01J23/72—Copper
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- B01J35/00—Catalysts, in general, characterised by their form or physical properties
- B01J35/30—Catalysts, in general, characterised by their form or physical properties characterised by their physical properties
- B01J35/39—Photocatalytic properties
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- B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
- B01J37/02—Impregnation, coating or precipitation
- B01J37/024—Multiple impregnation or coating
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
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- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
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Abstract
The invention discloses the many empty formula photocatalyst ceramic wafers of one, including many empty formula ceramic wafers, in tridimensional network inside described many empty formula ceramic wafers, its surface is provided with multiple concave groove, the surface of described many empty formula ceramic wafers is provided with nano-titania photocatalyst material layer, the surface inserting of described nano-titania photocatalyst material layer has metallic, its preparation method to include step one: make many empty formula ceramic wafers；Step 2: make the liquid solution of photocatalyst；Step 3: make many empty formula photocatalyst ceramic wafers；Step 4: the interpolation of metal object.Processing technology of the present invention is simple, by being attached to the metallic on nano-titania photocatalyst film, is greatly improved the respond of photocatalyst.
Description
Technical field
The present invention relates to ceramic wafer technical field, particularly relate to the many empty formula photocatalyst ceramic wafers of one.
Background technology
Existing activated charcoal strainer carries out deodorization, but this mode is material frowzy, holding of physical property
Surface in activated charcoal strainer.The most not only affected by environment such as temperature and humidities, it is possible to also can be holding
Foul smell and abnormal flavour release again.Because activated charcoal strainer holds limited in one's ability, need when holding ability and being saturated to change in time, this
Sample can increase the burden of cost.
With the sorbent of chemical formula, chemical drugs is used to carry out.The sorbent of chemical formula, it is anti-by oxidoreduction
Harmful gas should be converted into innoxious.But because using medicine, itself is as consumable goods, it is necessary to regularly exchange,
Cost is high.Chemical drugs can not by product process, waste disposal is also a difficult problem.
Photocatalyst at the sun, fluorescent lamp etc. is irradiated by light, its surface can produce strong oxidizing force, promote with
Touched foul smell, the material such as antibacterial carries out chemical reaction.Antibacterial, some harmful substances such as foul smell, major part is by charcoal aquation
The organic compound of compound composition, under the effect of photocatalyst, oxidation Decomposition becomes carbon dioxide packing and water.
To the compound of the only a few containing sulfur and nitrogen, by photocatalyst oxidation, be transformed into sulphuric acid, nitrate, attachment
On the surface of photocatalyst.But these materials can clean with water or barbecue just can simply be removed, and recover or regenerating photocatalyst
Characteristic, the problem that there is not frequent exchange, so can lower a lot of cost.
Summary of the invention
The invention aims to solve shortcoming present in prior art, and a kind of offer high efficiency proposed is carried out
The how empty formula photocatalyst ceramic wafer of deodorize easily maintenance management.
To achieve these goals, present invention employs following technical scheme:
Much a kind of empty formula photocatalyst ceramic wafer, including many empty formula ceramic wafers, its thickness between 5-20mm, described many empty formulas
The whole inside of ceramic wafer is connected with each other in tridimensional network by the aperture that size is 50-100 μm, its many empty formula ceramic wafers
Porosity is more than 90%, and the surface of many empty formula ceramic wafers is provided with multiple concave groove, and the surface of described many empty formula ceramic wafers is provided with
Nano-titania photocatalyst material layer, the surface inserting of described nano-titania photocatalyst material layer has metallic.
Preferably, the thickness of described nano-titania photocatalyst material layer is between 1-5 μm.
Preferably, the particle diameter of the TiO 2 particles in described nano-titania photocatalyst material layer is 5-20nm.
The preparation method of a kind of many empty formula photocatalyst ceramic wafers, comprises the steps:
Step one: making many empty formula ceramic wafers, using Alumina powder is that raw material is modulated into mud, is poured into by mud and shapes
Polyurethane rubber mould in, then on high temperature roast, after the at high temperature scorification of polyurethane rubber mould, remaining mud
Skeleton is just fired becomes many empty formula ceramic wafers；The mud that Alumina powder is made, when forming by a firing, produces gas and is formed multiple little
Hole, many empty whole inside of formula ceramic wafer are connected with each other in tridimensional network by the aperture that size is 50-100 μm.
Step 2: make the liquid solution of photocatalyst, by size at the titanium dioxide particle 15g of 5-20nm, put
Enter inside 100L pure water stirring, by ultrasonic dispersing machine, by the titanium dioxide particle of nm regime, be evenly distributed on pure
In water, prepare photocatalyst liquid solution；
Step 3: make many empty formula photocatalyst ceramic wafers, is dipped into step by the how empty formula ceramic wafer prepared in step one
In photocatalyst liquid solution in two, when the titanium deoxid film thickness of surface mount of many empty formula ceramic wafers is in 1-5 μm, take
Go out many empty formula ceramic wafers and under temperature is 50-300 degree environment, carries out heat treatment is dried, making many empty formula ceramic wafer surface mount two
Thin film of titanium oxide, obtains many empty formula photocatalyst ceramic wafers；
Step 4: the interpolation of metal object, the how empty formula photocatalyst pottery pasting titanium deoxid film that will prepare in step 3
Porcelain plate, immerses in metal ion solution, takes out superfluous metal ion solution, in the hydrogen environment that temperature is 300-800 DEG C
Reduce, make part metals particle be embedded on titanium deoxid film.
Preferably, the cylinder being shaped as different-thickness of polyurethane rubber mould or rectangle or just in described step one
Square, its surface is equipped with groove, makes the surface of many empty formula ceramic wafers form multiple concave groove.
Preferably, the metallic in described step 4 be Pt, Ir, Rh, Ru, Pd, Au, Ag, Cu, Zn, V, Cr, Mn, Fe,
At least one in Co, Ni, Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb.Such as with Ag, Cu
As a example by, silver nitrate and copper sulphate powder are put into inside deionized water, and the most ready-made many empty formula photocatalyst ceramic wafer leachings
Take out after being placed on inside this solution, with heat treatment 2 to 4 hours in 500 degree of hydrogen environments, it is possible to Ag, or Cu particle is inlayed
On the titanium deoxid film surface of many empty formula ceramic wafers.
The irradiation of light makes photocatalyst be activated, and the Oxidation of photocatalyst, makes metal ion be converted into metal or metal oxygen
Compound, for exciting the activation capacity of photocatalyst of titanium dioxide preferably to irradiate with the wavelength of below 380nm.
In the present invention, it is attached to the metallic on nano-titania photocatalyst film or metal oxide particle or metal
Ion, is greatly improved the respond of photocatalyst, and nano-titania photocatalyst film, under the effect of ultraviolet, produces strong
Catalytic degradation function: toxic and harmful in air of effectively degrading；Can effectively kill various bacteria, and can be by antibacterial or true
The toxin that bacterium discharges decomposes and harmless treatment；It is also equipped with except functions such as formaldehyde, deodorization, anti-soil, purification air, not only simultaneously
Easy to clean, also contribute to decompose abnormal flavour, prevent dirt from adhering to.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of many empty formula photocatalyst ceramic wafers that the present invention proposes；
Fig. 2 is the experimental result picture in the embodiment of the present invention 1.
In figure: empty formula ceramic wafer, 2 nano-titania photocatalyst material layers more than 1.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Describe, it is clear that described embodiment is only a part of embodiment of the present invention rather than whole embodiments wholely.
The model of the ultrasonic dispersing machine used in the present embodiment is FS-300C.
Embodiment 1
With reference to Fig. 1, a kind of many empty formula photocatalyst ceramic wafers, including many empty formula ceramic wafers 1, its thickness is 5mm, many empty formula potteries
The whole inside of porcelain plate 1 is connected with each other in tridimensional network by the aperture that size is 50 μm, the hole of its many empty formula ceramic wafers 1
Rate is 91%, and its surface is provided with multiple concave groove, and the surface of many empty formula ceramic wafers 1 is provided with nano-titania photocatalyst material layer
2, the surface inserting of nano-titania photocatalyst material layer 2 has metallic.
The thickness of nano-titania photocatalyst material layer is 1 μm, the dioxy in nano-titania photocatalyst material layer
The particle diameter changing titanium particle is 5nm.
Its preparation method, comprises the steps:
Step one: making many empty formula ceramic wafers, using Alumina powder is that raw material is modulated into mud, is poured into by mud and shapes
Polyurethane rubber mould in, then on high temperature roast, after the at high temperature scorification of polyurethane rubber mould, remaining mud
Skeleton is just fired becomes many empty formula ceramic wafers；
Step 2: make the liquid solution of photocatalyst, by size at the titanium dioxide particle 15g of 5nm, put into
Stir inside 100L pure water, by ultrasonic dispersing machine, by the titanium dioxide particle of nm regime, be evenly distributed on pure water
In, prepare photocatalyst liquid solution；
Step 3: make many empty formula photocatalyst ceramic wafers, is dipped into step by the how empty formula ceramic wafer prepared in step one
In photocatalyst liquid solution in two, when the titanium deoxid film thickness of surface mount of many empty formula ceramic wafers is in 1 μm, take out
Many empty formula ceramic wafers also carry out heat treatment under temperature is 50 degree of environment and are dried, and make many empty formula ceramic wafer surface mount titanium dioxide
Thin film, obtains many empty formula photocatalyst ceramic wafers；
Step 4: the interpolation of metal object, the how empty formula photocatalyst pottery pasting titanium deoxid film that will prepare in step 3
Porcelain plate, immerses in metal ion solution, discharges superfluous metal ion solution, reduce in the hydrogen environment that temperature is 300 DEG C,
Part metals particle is made to be embedded on titanium deoxid film.
Preferably, the cylinder being shaped as different-thickness of polyurethane rubber mould or rectangle or pros in step one
Shape, its surface is equipped with groove, and the metallic in described step 4 is Ag.
Many empty formula photocatalyst ceramic wafers are put into volume 30m3Container in, inject acetaldehyde in container, air quantity is set as
20m3/ min, the acetaldehyde concentration measured in container over time, as in figure 2 it is shown, add after Ag particle under the concentration of acetaldehyde
Reduction of speed rate is substantially accelerated, and illustrates can have well with photocatalyst of titanium dioxide at titanium deoxid film surface inserting metal Ag particle
Synergism, be greatly improved the respond of photocatalyst.
Embodiment 2
With reference to Fig. 1, a kind of many empty formula photocatalyst ceramic wafers, including many empty formula ceramic wafers 1, its thickness is 8mm, many empty formula potteries
The whole inside of porcelain plate 1 is connected with each other in tridimensional network by the aperture that size is 60 μm, the hole of its many empty formula ceramic wafers 1
Rate is 93%, and its surface is provided with multiple concave groove, and the surface of many empty formula ceramic wafers 1 is provided with nano-titania photocatalyst material layer
2, the surface inserting of nano-titania photocatalyst material layer 2 has metallic.
The thickness of nano-titania photocatalyst material layer is 2 μm, the dioxy in nano-titania photocatalyst material layer
The particle diameter changing titanium particle is 8nm.
Its preparation method, comprises the steps:
Step one: making many empty formula ceramic wafers, using Alumina powder is that raw material is modulated into mud, is poured into by mud and shapes
Polyurethane rubber mould in, then on high temperature roast, after the at high temperature scorification of polyurethane rubber mould, remaining mud
Skeleton is just fired becomes many empty formula ceramic wafers；
Step 2: make the liquid solution of photocatalyst, by size at the titanium dioxide particle 15g of 8nm, put into
Stir inside 100L pure water, by ultrasonic dispersing machine, by the titanium dioxide particle of nm regime, be evenly distributed on pure water
In, prepare photocatalyst liquid solution；
Step 3: make many empty formula photocatalyst ceramic wafers, is dipped into step by the how empty formula ceramic wafer prepared in step one
In photocatalyst liquid solution in two, when the titanium deoxid film thickness of surface mount of many empty formula ceramic wafers is in 2 μm, take out
Many empty formula ceramic wafers also carry out heat treatment under temperature is 150 degree of environment and are dried, and make many empty formula ceramic wafer surface mount titanium dioxide
Titanium thin film, obtains many empty formula photocatalyst ceramic wafers；
Step 4: the interpolation of metal object, the how empty formula photocatalyst pottery pasting titanium deoxid film that will prepare in step 3
Porcelain plate, immerses in metal ion solution, discharges superfluous metal ion solution, reduce in the hydrogen environment that temperature is 400 DEG C,
Part metals particle is made to be embedded on titanium deoxid film.
Preferably, the cylinder being shaped as different-thickness of polyurethane rubber mould or rectangle or pros in step one
Shape, its surface is equipped with groove, and the metallic in described step 4 is Sc.
Embodiment 3
With reference to Fig. 1, a kind of many empty formula photocatalyst ceramic wafers, including many empty formula ceramic wafers 1, its thickness is 12mm, many empty formulas
The whole inside of ceramic wafer 1 is connected with each other in tridimensional network by the aperture that size is 70 μm, the hole of its many empty formula ceramic wafers
Gap rate is 95%, and its surface is provided with multiple concave groove, and the surface of many empty formula ceramic wafers 1 is provided with nano-titania photocatalyst material
Layer 2, the surface inserting of nano-titania photocatalyst material layer 2 has metallic.
The thickness of nano-titania photocatalyst material layer is 3 μm, the dioxy in nano-titania photocatalyst material layer
The particle diameter changing titanium particle is 12nm.
Its preparation method, comprises the steps:
Step one: making many empty formula ceramic wafers, using Alumina powder is that raw material is modulated into mud, is poured into by mud and shapes
Polyurethane rubber mould in, then on high temperature roast, after the at high temperature scorification of polyurethane rubber mould, remaining mud
Skeleton is just fired becomes many empty formula ceramic wafers；
Step 2: make the liquid solution of photocatalyst, by size at the titanium dioxide particle 15g of 12nm, put into
Stir inside 100L pure water, by ultrasonic dispersing machine, by the titanium dioxide particle of nm regime, be evenly distributed on pure water
In, prepare photocatalyst liquid solution；
Step 3: make many empty formula photocatalyst ceramic wafers, is dipped into step by the how empty formula ceramic wafer prepared in step one
In photocatalyst liquid solution in two, when the titanium deoxid film thickness of surface mount of many empty formula ceramic wafers is in 3 μm, take out
Many empty formula ceramic wafers also carry out heat treatment under temperature is 200 degree of environment and are dried, and make many empty formula ceramic wafer surface mount titanium dioxide
Titanium thin film, obtains many empty formula photocatalyst ceramic wafers；
Step 4: the interpolation of metal object, the how empty formula photocatalyst pottery pasting titanium deoxid film that will prepare in step 3
Porcelain plate, immerses in metal ion solution, discharges superfluous metal ion solution, reduce in the hydrogen environment that temperature is 500 DEG C,
Part metals particle is made to be embedded on titanium deoxid film.
Preferably, the cylinder being shaped as different-thickness of polyurethane rubber mould or rectangle or pros in step one
Shape, its surface is equipped with groove, and the metallic in described step 4 is Cu.
Embodiment 4
With reference to Fig. 1, a kind of many empty formula photocatalyst ceramic wafers, including many empty formula ceramic wafers 1, its thickness is 16mm, many empty formulas
The whole inside of ceramic wafer 1 is connected with each other in tridimensional network by the aperture that size is 80 μm, the hole of its many empty formula ceramic wafers
Gap rate is 97%, and its surface is provided with multiple concave groove, and the surface of many empty formula ceramic wafers 1 is provided with nano-titania photocatalyst material
Layer 2, the surface inserting of nano-titania photocatalyst material layer 2 has metallic.
The thickness of nano-titania photocatalyst material layer is 4 μm, the dioxy in nano-titania photocatalyst material layer
The particle diameter changing titanium particle is 16nm.
Its preparation method, comprises the steps:
Step one: making many empty formula ceramic wafers, using Alumina powder is that raw material is modulated into mud, is poured into by mud and shapes
Polyurethane rubber mould in, then on high temperature roast, after the at high temperature scorification of polyurethane rubber mould, remaining mud
Skeleton is just fired becomes many empty formula ceramic wafers；
Step 2: make the liquid solution of photocatalyst, by size at the titanium dioxide particle 15g of 16nm, put into
Stir inside 100L pure water, by ultrasonic dispersing machine, by the titanium dioxide particle of nm regime, be evenly distributed on pure water
In, prepare photocatalyst liquid solution；
Step 3: make many empty formula photocatalyst ceramic wafers, is dipped into step by the how empty formula ceramic wafer prepared in step one
In photocatalyst liquid solution in two, when the titanium deoxid film thickness of surface mount of many empty formula ceramic wafers is in 4 μm, take out
Many empty formula ceramic wafers also carry out heat treatment under temperature is 250 degree of environment and are dried, and make many empty formula ceramic wafer surface mount titanium dioxide
Titanium thin film, obtains many empty formula photocatalyst ceramic wafers；
Step 4: the interpolation of metal object, the how empty formula photocatalyst pottery pasting titanium deoxid film that will prepare in step 3
Porcelain plate, immerses in metal ion solution, discharges superfluous metal ion solution, reduce in the hydrogen environment that temperature is 600 DEG C,
Part metals particle is made to be embedded on titanium deoxid film.
Preferably, the cylinder being shaped as different-thickness of polyurethane rubber mould or rectangle or pros in step one
Shape, its surface is equipped with groove, and the metallic in described step 4 is Mn.
Embodiment 5
With reference to Fig. 1, a kind of many empty formula photocatalyst ceramic wafers, including many empty formula ceramic wafers 1, its thickness is 20mm, many empty formulas
The whole inside of ceramic wafer 1 is connected with each other in tridimensional network by the aperture that size is 100 μm, the hole of its many empty formula ceramic wafers
Gap rate is 99%, and its surface is provided with multiple concave groove, and the surface of many empty formula ceramic wafers 1 is provided with nano-titania photocatalyst material
Layer 2, the surface inserting of nano-titania photocatalyst material layer 2 has metallic.
The thickness of nano-titania photocatalyst material layer is 5 μm, the dioxy in nano-titania photocatalyst material layer
The particle diameter changing titanium particle is 20nm.
Its preparation method, comprises the steps:
Step one: making many empty formula ceramic wafers, using Alumina powder is that raw material is modulated into mud, is poured into by mud and shapes
Polyurethane rubber mould in, then on high temperature roast, after the at high temperature scorification of polyurethane rubber mould, remaining mud
Skeleton is just fired becomes many empty formula ceramic wafers；
Step 2: make the liquid solution of photocatalyst, by size at the titanium dioxide particle 15g of 20nm, put into
Stir inside 100L pure water, by ultrasonic dispersing machine, by the titanium dioxide particle of nm regime, be evenly distributed on pure water
In, prepare photocatalyst liquid solution；
Step 3: make many empty formula photocatalyst ceramic wafers, is dipped into step by the how empty formula ceramic wafer prepared in step one
In photocatalyst liquid solution in two, when the titanium deoxid film thickness of surface mount of many empty formula ceramic wafers is in 5 μm, take out
Many empty formula ceramic wafers also carry out heat treatment under temperature is 300 degree of environment and are dried, and make many empty formula ceramic wafer surface mount titanium dioxide
Titanium thin film, obtains many empty formula photocatalyst ceramic wafers；
Step 4: the interpolation of metal object, the how empty formula photocatalyst pottery pasting titanium deoxid film that will prepare in step 3
Porcelain plate, immerses in metal ion solution, discharges superfluous metal ion solution, reduce in the hydrogen environment that temperature is 800 DEG C,
Part metals particle is made to be embedded on titanium deoxid film.
Preferably, the cylinder being shaped as different-thickness of polyurethane rubber mould or rectangle or pros in step one
Shape, its surface is equipped with groove, and the metallic in described step 4 is Pt.
The above, the only present invention preferably detailed description of the invention, but protection scope of the present invention is not limited thereto,
Any those familiar with the art in the technical scope that the invention discloses, according to technical scheme and
Inventive concept equivalent or change in addition, all should contain within protection scope of the present invention.
Claims (6)
1. empty formula photocatalyst ceramic wafer more than a kind, it is characterised in that include many empty formula ceramic wafers, its thickness between 5-20mm,
The whole inside of described many empty formula ceramic wafers is connected with each other in tridimensional network by the aperture that size is 50-100 μm, and how empty it is
The porosity of formula ceramic wafer is more than 90%, and the surface of many empty formula ceramic wafers is provided with multiple concave groove, described many empty formula ceramic wafers
Surface be provided with nano-titania photocatalyst material layer, the surface inserting of described nano-titania photocatalyst material layer has gold
Belong to particle.
The many empty formula photocatalyst ceramic wafers of one the most according to claim 1, it is characterised in that: described nano titanium oxide light
The thickness of catalyst material layer is between 1-5 μm.
The many empty formula photocatalyst ceramic wafers of one the most according to claim 1, it is characterised in that: described nano titanium oxide light
The particle diameter of the TiO 2 particles in catalyst material layer is 5-20nm.
4. the preparation method of empty formula photocatalyst ceramic wafer more than a kind, it is characterised in that comprise the steps:
Step one: make many empty formula ceramic wafers, using Alumina powder is that raw material is modulated into mud, and mud pours into gathering of shape
In urethane rubber mold, then roast on high temperature, after the at high temperature scorification of polyurethane rubber mould, remaining mud skeleton
Just fire and become many empty formula ceramic wafers；
Step 2: make the liquid solution of photocatalyst, by size at the titanium dioxide particle 15g of 5-20nm, put into
Stir inside 100L pure water, by ultrasonic dispersing machine, by the titanium dioxide particle of nm regime, be evenly distributed on pure water
In, prepare photocatalyst liquid solution；
Step 3: make many empty formula photocatalyst ceramic wafers, is dipped into the how empty formula ceramic wafer prepared in step one in step 2
Photocatalyst liquid solution in, when the titanium deoxid film thickness of surface mount of many empty formula ceramic wafers is in 1-5 μm, taking-up is many
Empty formula ceramic wafer also carries out heat treatment under temperature is 50-300 degree environment and is dried, and makes many empty formula ceramic wafer surface mount titanium dioxide
Titanium thin film, obtains many empty formula photocatalyst ceramic wafers；
Step 4: the interpolation of metal object, the how empty formula photocatalyst ceramic wafer pasting titanium deoxid film that will prepare in step 3,
Immerse in metal ion solution, discharge superfluous metal ion solution, reduce in the hydrogen environment that temperature is 300-800 DEG C,
Part metals particle is made to be embedded on titanium deoxid film.
The many empty formula photocatalyst ceramic wafers of one the most according to claim 4, it is characterised in that: polyurethane in described step one
The cylinder being shaped as different-thickness of rubber mold or rectangle or square, its inner surface is equipped with groove.
The many empty formula photocatalyst ceramic wafers of one the most according to claim 4, it is characterised in that: the metal in described step 4
Particle is Pt, Ir, Rh, Ru, Pd, Au, Ag, Cu, Zn, V, Cr, Mn, Fe, Co, Ni, Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu,
At least one in Gd, Tb, Dy, Ho, Er, Tm, Yb.
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| CN201610858867.XA CN106268971A (en) | 2016-09-28 | 2016-09-28 | Many empty formula photocatalyst ceramic wafers |
| CN201720363160.1U CN206886971U (en) | 2016-09-28 | 2017-04-07 | More empty formula photocatalyst ceramic wafer |
| CN201710222276.8A CN107043277A (en) | 2016-09-28 | 2017-04-07 | Many sky formula photocatalyst ceramic wafers |
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| CN2747221Y (en) * | 2004-09-09 | 2005-12-21 | 北京通达隆盛工贸有限公司 | Porous ceramic plate used as carrier of photocatalyst |
| CN1775347A (en) * | 2005-11-02 | 2006-05-24 | 刘应希 | Nano composite photo catalyst and its preparing method |
| TWI317301B (en) * | 2006-06-08 | 2009-11-21 | Univ Nat Central | Photocatalyst for reduction of carbon dioxide to produce methanol and its process thereof |
| CN100560534C (en) * | 2007-06-19 | 2009-11-18 | 西安交通大学 | A kind of manufacture method of alumina based ceramic core |
| TW200927988A (en) * | 2007-12-19 | 2009-07-01 | Ind Tech Res Inst | Method for manufacturing high performance photocatalytic filter |
| CN101480624B (en) * | 2008-01-08 | 2011-09-14 | 财团法人工业技术研究院 | Production method of photocatalyst filter medium |
| CN102010025B (en) * | 2010-10-15 | 2012-12-26 | 华南农业大学 | Photocatalysis degradation sewage device and sewage degradation method |
| CN102728412A (en) * | 2012-06-07 | 2012-10-17 | 江苏恒智纳米科技有限公司 | Porous ceramic plate photocatalyst carrier |
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| CN104174395B (en) * | 2014-08-04 | 2016-05-11 | 南昌大学 | The rare earth modified carried noble metal integer catalyzer of eliminating formaldehyde at room temperature preparation method |
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