CN106255307A - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN106255307A CN106255307A CN201610153149.2A CN201610153149A CN106255307A CN 106255307 A CN106255307 A CN 106255307A CN 201610153149 A CN201610153149 A CN 201610153149A CN 106255307 A CN106255307 A CN 106255307A
- Authority
- CN
- China
- Prior art keywords
- groove
- link slot
- tipper
- difference signal
- wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A kind of circuit board, including a signals layer and a ground plane, a Difference signal pair has been laid on described signals layer, the corresponding described Difference signal pair of described ground plane is provided with a defect grounding structure, and described defect grounding structure position on described ground plane is corresponding with described Difference signal pair position on described signals layer.
Description
Technical field
The present invention relates to a kind of circuit board having laid Difference signal pair.
Background technology
Differential signal transmission is a kind of signal transmission technology, it the most all transmits signal, the amplitude of the two signal is equal, opposite in phase, time on circuit boards with Difference signal pair transmission signal, can produce common mode noise on the transmission line, these common mode noises can affect the timing of signal transmission, reduce integrity and the intensity of differential signal, and common mode noise also results in electromagnetic interference.
Summary of the invention
In view of the foregoing, it is necessary to a kind of circuit board that can effectively suppress common mode noise is provided.
A kind of circuit board, including a signals layer and a ground plane, a Difference signal pair has been laid on described signals layer, the corresponding described Difference signal pair of described ground plane is provided with a defect grounding structure, and described defect grounding structure position on described ground plane is corresponding with described Difference signal pair position on described signals layer.
Compared to prior art, foregoing circuit plate is by arranging defect grounding structure at ground plane, thus reduces the electromagnetic interference caused because of the common mode noise on Difference signal pair.
Accompanying drawing explanation
Fig. 1 is a schematic diagram of a preferred embodiment of circuit board of the present invention.
Fig. 2 is an axonometric chart of the circuit board in Fig. 1.
Fig. 3 is a schematic diagram of a first embodiment of the defect grounding structure in the circuit board of Fig. 2.
Fig. 4 is the schematic diagram of the defect grounding structure in the circuit board of Fig. 3 and Difference signal pair.
Fig. 5 is a schematic diagram of one second embodiment of the defect grounding structure in the circuit board of Fig. 2.
Fig. 6 is a schematic diagram of one the 3rd embodiment of the defect grounding structure in the circuit board of Fig. 2.
Fig. 7 is a schematic diagram of one the 4th embodiment of the defect grounding structure in the circuit board of Fig. 2.
Fig. 8 is a schematic diagram of one the 5th embodiment of the defect grounding structure in the circuit board of Fig. 2.
Main element symbol description
| Circuit board | 10 |
| Insulating barrier | 13 |
| Solder mask | 15 |
| Signals layer | 21 |
| Ground plane | 23 |
| Difference signal pair | 30 |
| First holding wire | 31 |
| Secondary signal line | 32 |
| Defect grounding structure | 50、60、70、80、90 |
| Hollow out district | 51、61、71、81、91 |
| First groove | 511、611、911 |
| Second groove | 515、615、915 |
| First wave-shaped groove | 5111 |
| Second wave-shaped groove | 5112 |
| Link slot | 5113、6113、7113、8113、9113 |
| First straight trough | 6111、7111 |
| Second straight trough | 6112、7112 |
| Groove | 711、811 |
| First tipper | 8111、9111 |
| Second tipper | 8112、9112 |
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Refer to Fig. 1, it is a schematic diagram of circuit board 10 of the present invention, this circuit board 10 includes multiple dielectric layer, these dielectric layers include insulating barrier 13 and a solder mask 15, this insulating barrier 13 is generally made up of insulant such as polypropylene, circuit board 10 is respectively provided on two sides with signals layer 21 and a ground plane 23 at insulating barrier 13, and a Difference signal pair 30 is laid on this signals layer 21, and this Difference signal pair 30 includes one first holding wire 31 and the secondary signal line 32 being parallel to each other.
Referring to Fig. 2, this ground plane 23 can be a ground connection conductive plate, such as one Copper Foil, this ground plane 23 offers a defect grounding structure 50, thus is used for reducing the electromagnetic interference that Difference signal pair 30 produces.
nullRefer to Fig. 3，This defect grounding structure 50 includes that two hollow out district 51，Described two hollow out district 51 relatively between a centrage symmetrical，Each district 51 that hollows out includes first generally " C " shaped groove 511 and two second grooves 515，This two second groove 515 connects with this first groove 511 respectively，These two two first grooves 511 hollowing out district 51 are symmetrical arranged in opposite directions，And the opening of two " C " word of first groove 511 of two " C " shape is relative，First groove 511 of each " C " shape includes one first wave-shaped groove 5111、One second wave-shaped groove 5112 and a link slot 5113，This link slot 5113 connects between this first wave-shaped groove 5111 and the second wave-shaped groove 5112，This first wave-shaped groove 5111 centrage between the two relative with the second wave-shaped groove 5112 is symmetrical arranged，One second groove 515 in this two second groove 515 is communicated to the junction of this first wave-shaped groove 5111 and this link slot 5113，Another second groove 515 is communicated to the junction of this second wave-shaped groove 5112 and this link slot 5113；The bearing of trend of two second grooves 515 was contrary with the opening direction of first groove 511 of this " C " shape with this, and a centrage that two second between groove 515 relative first signal line 31 and secondary signal line 32 is symmetrical, this whole defect grounding structure 50 also centrage symmetry between this first holding wire 31 and secondary signal line 32 relatively.
Referring to Fig. 4, this Difference signal pair 30 is almost parallel with this first wave-shaped groove 5111 and the second wave-shaped groove 5112, and the Difference signal pair 30 orthographic projection on ground plane 23 covers the first wave-shaped groove 5111 and adjoining region of the second wave-shaped groove 5112.
nullRefer to Fig. 5，It is the schematic diagram of the second embodiment of this defect grounding structure，Defect grounding structure 60 in this second embodiment also includes that two hollow out district 61，Each district 61 that hollows out includes first generally " C " shaped groove 611 and two second grooves 615，This two second groove 615 connects with this first groove 611 respectively，These two two first grooves 611 hollowing out district 61 are symmetrical arranged in opposite directions，And the opening of two " C " word of first groove 611 of two " C " shape is relative，First groove 611 of each " C " shape includes one first straight trough 6111、One second straight trough 6112 and a link slot 6113，This link slot 6113 connects between this first straight trough 6111 and the second straight trough 6112，This first straight trough 6111 and the second straight trough 6112 are parallel to each other，Link slot 6113 is substantially vertical with the first straight trough 6111 and the second straight trough 6112，First holding wire 31 of Difference signal pair 30 and secondary signal line 32 align with the first straight trough 6111 and the second straight trough 6112 respectively，One second groove 615 in this two second groove 615 is communicated to the junction of this first straight trough 6111 and this link slot 6113，Another second groove 615 is communicated to the junction of this second straight trough 6112 and this link slot 6113；The bearing of trend of two second grooves 615 is contrary with the opening direction of the first groove 611 being somebody's turn to do " C " shape.
nullRefer to Fig. 6，It is the schematic diagram of the 3rd embodiment of this defect grounding structure，Defect grounding structure 70 in 3rd embodiment also includes that two hollow out district 71，Each district 71 that hollows out includes a generally " C " shaped groove 711，This groove 711 includes one first straight trough 7111、One second straight trough 7112 and a link slot 7113，This link slot 7113 connects between this first straight trough 7111 and the second straight trough 7112，This first straight trough 7111 and the second straight trough 7112 are parallel to each other，Link slot 7113 is substantially vertical with the first straight trough 7111 and the second straight trough 7112，First holding wire 31 of Difference signal pair 30 and secondary signal line 32 align with the first straight trough 7111 and the second straight trough 7112 respectively，This link slot 7113 is substantially vertical with Difference signal pair 30.
Refer to Fig. 7, it is the schematic diagram of the 4th embodiment of this defect grounding structure, defect grounding structure 80 in 4th embodiment also includes that two hollow out district 81, each district 81 that hollows out includes a generally " C " shaped groove 811, this groove 811 includes one first tipper 8111,1 second tipper 8112 and a link slot 813, link slot 813 is connected between the first tipper 8111 and the second tipper 8112, this Difference signal pair 30 this first tipper 8111 relative and the second tipper 8112 are obliquely installed, and this link slot 8113 is approximately perpendicular to this Difference signal pair 30.
nullRefer to Fig. 8，It is the schematic diagram of the 5th embodiment of this defect grounding structure，Defect grounding structure 90 in 5th embodiment also includes that two hollow out district 91，This each district 91 that hollows out includes first generally " C " shaped groove 911 and two second grooves 915，This two second groove 915 connects with this first groove 911 respectively，First groove 911 of each " C " shape includes one first tipper 9111、One second tipper 9112 and a link slot 9113，This link slot 9113 connects between this first tipper 9111 and the second tipper 9112，This Difference signal pair 30 this first tipper 9111 relative and the second tipper 9112 are obliquely installed，This link slot 9113 is approximately perpendicular to this Difference signal pair 30，One second groove 915 in this two second groove 915 is communicated to the junction of this first tipper 9111 and this link slot 9113，Another second groove 915 is communicated to the junction of this second tipper 9112 and this link slot 9113；The bearing of trend of two second grooves 915 is contrary with the opening direction of the first groove 911 being somebody's turn to do " C " shape.
In the above-described embodiments, this defect grounding structure leads to overetched mode and is formed on this ground plane 23, thus the electromagnetic interference caused because of the common mode noise on Difference signal pair can be reduced, especially for the low frequency signal less than 2.5GHz, the effect reducing electromagnetic interference is the most obvious.
Claims (9)
1. a circuit board, including a signals layer and a ground plane, a Difference signal pair has been laid on described signals layer, it is characterized in that: the corresponding described Difference signal pair of described ground plane is provided with a defect grounding structure, and described defect grounding structure position on described ground plane is corresponding with described Difference signal pair position on described signals layer.
2. circuit board as claimed in claim 1, it is characterised in that: described defect grounding structure includes that two hollow out district, described two hollow out district relatively between a centrage symmetrical.
3. circuit board as claimed in claim 2, it is characterised in that: the subregion of described ground plane is etched to form described defect grounding structure.
4. circuit board as claimed in claim 2, it is characterized in that: described in hollow out district and include one first groove, described first groove includes one first wave channel, one second wave channel and a link slot, described first wave channel is parallel with described second wave channel, described link slot connects between described first wave-shaped groove and described second wave-shaped groove, and a described first wave-shaped groove centrage between the two relative with described second wave-shaped groove is symmetrical arranged.
5. circuit board as claimed in claim 4, it is characterized in that: described in hollow out district and also include two second grooves, one second groove in this two second groove described is communicated to described first wave-shaped groove and the junction of described link slot, and another second groove is communicated to described second wave-shaped groove and the junction of described link slot.
6. circuit board as claimed in claim 5, it is characterised in that: the orthographic projection on described ground plane of the described Difference signal pair covers described first wave-shaped groove and the adjoining region of described second wave-shaped groove.
7. circuit board as claimed in claim 2, it is characterized in that: each district that hollows out includes a groove, described groove includes one first straight trough, one second straight trough and a link slot, described link slot connects between described first straight trough and described second straight trough, described first straight trough and the second straight trough are parallel to each other, described link slot is substantially vertical with described first straight trough and the second straight trough, and described Difference signal pair aligns with described first straight trough and the second straight trough, and described link slot is vertical with described Difference signal pair.
8. circuit board as claimed in claim 2, it is characterized in that: each district that hollows out includes a groove, described groove includes one first tipper, one second tipper and a link slot, described link slot is connected between described first tipper and the second tipper, the most described first tipper of described Difference signal pair and the second tipper are obliquely installed, and described link slot is perpendicular to described Difference signal pair.
9. circuit board as claimed in claim 2, it is characterized in that: each district that hollows out includes one first groove and two second grooves, described first groove includes one first tipper, one second tipper and a link slot, described link slot connects between described first tipper and the second tipper, the most described first tipper of described Difference signal pair and the second tipper are obliquely installed, described link slot is perpendicular to described Difference signal pair, one second groove in described two second grooves is communicated to described first tipper and the junction of described link slot, another second groove is communicated to described second tipper and the junction of described link slot.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562175403P | 2015-06-14 | 2015-06-14 | |
| US62/175403 | 2015-06-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106255307A true CN106255307A (en) | 2016-12-21 |
Family
ID=57626514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610153149.2A Withdrawn CN106255307A (en) | 2015-06-14 | 2016-03-17 | Circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106255307A (en) |
| TW (1) | TW201707522A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018236443A1 (en) * | 2017-06-23 | 2018-12-27 | Western Digital Technologies, Inc. | Patterned ground structure filter designs with improved performance |
| US10244618B2 (en) | 2015-10-29 | 2019-03-26 | Western Digital Technologies, Inc. | Patterned ground structure filter designs with improved performance |
| CN110267480A (en) * | 2018-03-12 | 2019-09-20 | 丰田自动车株式会社 | Electrical equipment |
| US11160162B1 (en) | 2020-06-29 | 2021-10-26 | Western Digital Technologies, Inc. | Via-less patterned ground structure common-mode filter |
| JP2023010560A (en) * | 2021-07-09 | 2023-01-20 | 廣達電腦股▲ふん▼有限公司 | Multi-band emission reduction filter for high-speed differential signal trace |
| US11659650B2 (en) | 2020-12-18 | 2023-05-23 | Western Digital Technologies, Inc. | Dual-spiral common-mode filter |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11259400B1 (en) * | 2020-09-26 | 2022-02-22 | Htc Corporation | Circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110273245A1 (en) * | 2010-05-04 | 2011-11-10 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board and common mode filter thereof |
| CN103219963A (en) * | 2013-04-16 | 2013-07-24 | 南京理工大学 | Common mode filter based on C type coupling defected ground structure |
| US20140062611A1 (en) * | 2012-08-31 | 2014-03-06 | National Taiwan University | Filtering device with slotted ground structure |
| CN104319473A (en) * | 2014-10-22 | 2015-01-28 | 西安电子科技大学 | Ultra-wideband tri-trap antenna |
-
2016
- 2016-03-17 CN CN201610153149.2A patent/CN106255307A/en not_active Withdrawn
- 2016-03-22 TW TW105108893A patent/TW201707522A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110273245A1 (en) * | 2010-05-04 | 2011-11-10 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board and common mode filter thereof |
| US20140062611A1 (en) * | 2012-08-31 | 2014-03-06 | National Taiwan University | Filtering device with slotted ground structure |
| CN103219963A (en) * | 2013-04-16 | 2013-07-24 | 南京理工大学 | Common mode filter based on C type coupling defected ground structure |
| CN104319473A (en) * | 2014-10-22 | 2015-01-28 | 西安电子科技大学 | Ultra-wideband tri-trap antenna |
Non-Patent Citations (1)
| Title |
|---|
| 夏彬等: "基于缺陷地结构的差分线宽带共模抑制滤波器设计", 《2011年全国微波毫米波会议论文集（上册）》 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10244618B2 (en) | 2015-10-29 | 2019-03-26 | Western Digital Technologies, Inc. | Patterned ground structure filter designs with improved performance |
| WO2018236443A1 (en) * | 2017-06-23 | 2018-12-27 | Western Digital Technologies, Inc. | Patterned ground structure filter designs with improved performance |
| CN110267480A (en) * | 2018-03-12 | 2019-09-20 | 丰田自动车株式会社 | Electrical equipment |
| CN110267480B (en) * | 2018-03-12 | 2021-03-30 | 丰田自动车株式会社 | Electrical device |
| US11160162B1 (en) | 2020-06-29 | 2021-10-26 | Western Digital Technologies, Inc. | Via-less patterned ground structure common-mode filter |
| US11659650B2 (en) | 2020-12-18 | 2023-05-23 | Western Digital Technologies, Inc. | Dual-spiral common-mode filter |
| JP2023010560A (en) * | 2021-07-09 | 2023-01-20 | 廣達電腦股▲ふん▼有限公司 | Multi-band emission reduction filter for high-speed differential signal trace |
| JP7368526B2 (en) | 2021-07-09 | 2023-10-24 | 廣達電腦股▲ふん▼有限公司 | Multiband radiation reduction filter for high-speed differential signal traces |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201707522A (en) | 2017-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20161221 |